CN104152874A - Printed circuit board chemical copper plating activation solution - Google Patents
Printed circuit board chemical copper plating activation solution Download PDFInfo
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- CN104152874A CN104152874A CN201410343987.7A CN201410343987A CN104152874A CN 104152874 A CN104152874 A CN 104152874A CN 201410343987 A CN201410343987 A CN 201410343987A CN 104152874 A CN104152874 A CN 104152874A
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- parts
- circuit board
- printed circuit
- sodium
- liquid
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- 230000004913 activation Effects 0.000 title claims abstract description 42
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 38
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 38
- 239000010949 copper Substances 0.000 title claims abstract description 38
- 238000007747 plating Methods 0.000 title abstract description 7
- 239000000126 substance Substances 0.000 title abstract description 7
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims abstract description 38
- 239000007788 liquid Substances 0.000 claims abstract description 32
- 239000011780 sodium chloride Substances 0.000 claims abstract description 19
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 claims abstract description 14
- 239000000654 additive Substances 0.000 claims abstract description 10
- 239000002994 raw material Substances 0.000 claims abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052708 sodium Inorganic materials 0.000 claims description 17
- 239000011734 sodium Substances 0.000 claims description 17
- 235000011150 stannous chloride Nutrition 0.000 claims description 17
- DPDMMXDBJGCCQC-UHFFFAOYSA-N [Na].[Cl] Chemical compound [Na].[Cl] DPDMMXDBJGCCQC-UHFFFAOYSA-N 0.000 claims description 14
- 230000036571 hydration Effects 0.000 claims description 12
- 238000006703 hydration reaction Methods 0.000 claims description 12
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- 230000002829 reductive effect Effects 0.000 claims description 10
- 238000003756 stirring Methods 0.000 claims description 10
- WZUODJNEIXSNEU-UHFFFAOYSA-N 2-Hydroxy-4-methoxybenzaldehyde Chemical compound COC1=CC=C(C=O)C(O)=C1 WZUODJNEIXSNEU-UHFFFAOYSA-N 0.000 claims description 7
- 230000000996 additive effect Effects 0.000 claims description 6
- 239000004202 carbamide Substances 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 6
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 6
- XSQUKJJJFZCRTK-UHFFFAOYSA-N urea group Chemical group NC(=O)N XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 6
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 5
- 239000012153 distilled water Substances 0.000 claims description 5
- 238000001132 ultrasonic dispersion Methods 0.000 claims description 5
- 238000010792 warming Methods 0.000 claims description 5
- 239000003643 water by type Substances 0.000 claims description 5
- MWOOGOJBHIARFG-UHFFFAOYSA-N vanillin Chemical compound COC1=CC(C=O)=CC=C1O MWOOGOJBHIARFG-UHFFFAOYSA-N 0.000 claims description 4
- KCDXJAYRVLXPFO-UHFFFAOYSA-N syringaldehyde Chemical compound COC1=CC(C=O)=CC(OC)=C1O KCDXJAYRVLXPFO-UHFFFAOYSA-N 0.000 claims description 3
- COBXDAOIDYGHGK-UHFFFAOYSA-N syringaldehyde Natural products COC1=CC=C(C=O)C(OC)=C1O COBXDAOIDYGHGK-UHFFFAOYSA-N 0.000 claims description 3
- FGQOOHJZONJGDT-UHFFFAOYSA-N vanillin Natural products COC1=CC(O)=CC(C=O)=C1 FGQOOHJZONJGDT-UHFFFAOYSA-N 0.000 claims description 3
- JVTZFYYHCGSXJV-UHFFFAOYSA-N isovanillin Chemical compound COC1=CC=C(C=O)C=C1O JVTZFYYHCGSXJV-UHFFFAOYSA-N 0.000 claims description 2
- 150000003841 chloride salts Chemical class 0.000 claims 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 abstract description 8
- 230000008901 benefit Effects 0.000 abstract description 4
- 239000000615 nonconductor Substances 0.000 abstract description 4
- 239000003381 stabilizer Substances 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 238000003912 environmental pollution Methods 0.000 abstract description 3
- FWPIDFUJEMBDLS-UHFFFAOYSA-L tin(II) chloride dihydrate Chemical compound O.O.Cl[Sn]Cl FWPIDFUJEMBDLS-UHFFFAOYSA-L 0.000 abstract 4
- 239000003638 chemical reducing agent Substances 0.000 abstract 3
- 230000003213 activating effect Effects 0.000 abstract 2
- SFXJSNATBHJIDS-UHFFFAOYSA-N disodium;dioxido(oxo)tin;trihydrate Chemical compound O.O.O.[Na+].[Na+].[O-][Sn]([O-])=O SFXJSNATBHJIDS-UHFFFAOYSA-N 0.000 abstract 2
- 239000008367 deionised water Substances 0.000 abstract 1
- 229910021641 deionized water Inorganic materials 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 150000001805 chlorine compounds Chemical class 0.000 description 4
- 239000002585 base Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000002525 ultrasonication Methods 0.000 description 2
- 241000370738 Chlorion Species 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Abstract
The invention discloses a printed circuit board chemical copper plating activation solution. The printed circuit board chemical copper plating activation solution comprises the following raw materials in parts by mass: 100-300 parts of stannous chloride dihydrate, 2-6 parts of palladium chloride, 150-180 parts of sodium chloride, 4-8 parts of sodium stannate trihydrate, 20-30 parts of additives, 0.5-2 parts of a reducing agent and 500-600 parts of deionized water. By adopting a sodium chloride solution, palladium chloride is prepared into liquid A, and stannous chloride dihydrate and the reducing agent are prepared into liquid B; under an ultrasonic action, the liquid A is dispersed into the liquid B, and sodium stannate trihydrate, the additives and the reducing agent are assisted as auxiliary stabilizing agents to prepare the chemical copper plating activation solution. The chemical copper plating activation solution disclosed by the invention is used for activating a printed circuit board before chemical copper plating, can achieve the effects of activating the non-conductor surface of the printed circuit board and performing hole activation on the printed circuit board, and has the advantages of achieving low hydrochloric acid content and high stability, saving the raw materials and reducing the environmental pollution without damaging a substrate of the printed circuit board.
Description
Technical field
The present invention relates to electroless copper technical field, espespecially a kind of printed circuit board electroless copper activation solution.
Background technology
Electroless copper is widely used in electronic industry; after the Nonconductor surface of activation being conducted electricity with electroless copper, can manufacture the two-sided of through hole or multiaspect printed circuit board; printed circuit board is " mother of electronic system product "; on electroless copper basis, electroplate thickening copper layer; can guarantee its weldability, protectiveness, electroconductibility, wear resistance; before printed circuit board electroless copper, matrix need be carried out to activation treatment.Surface uniform activatable is the prerequisite that obtains uniform electroless copper and uniformly-coating, and electroless copper is a critical process, and activation treatment before electroless copper is the key that guarantees chemical plating copper layer quality.Salt acidic group activation solution; in process for preparation; need a large amount of hydrochloric acid;, there is environmental protection problem in severe operational environment, and its stability is also affected; in hole metallization process; because hole wall exposes, denseer hydrochloric acid has certain erosion to hole wall resin, causes the bonding force of body material to decline.The activation solution of alkali is without above-mentioned shortcoming, and easily prepares compared with salt acidic group activation solution activation solution, and the consumption of palladium also suitably reduces simultaneously, and activity does not subtract.
Summary of the invention
A kind of printed-wiring board (PWB) electroless copper of the present invention activation solution, it is characterized in that, take sodium-chlor as main stablizer, adopt sodium chloride solution that Palladous chloride is made to A liquid, two hydrated stannous chlorides and reductive agent are made to B liquid, under ultrasonication, A liquid is scattered in B liquid, be aided with three hydration sodium stannates, additive, reductive agent is as auxiliary stabilizer, make electroless copper activation solution, for printed circuit board, carry out the activation treatment before electroless copper, realize the object of activation and the interior activation of printed wiring plate hole of printed-wiring board (PWB) Nonconductor surface, there is stability high, reduce environmental pollution and do not damage the advantage of printed wiring base board
To achieve these goals, technical solution of the present invention is: a kind of printed-wiring board (PWB) electroless copper activation solution comprises the raw material of following mass parts: two 100～300 parts of hydrated stannous chlorides, 2～6 parts of Palladous chlorides, 150～180 parts, sodium-chlor, 4～8 parts of three hydration sodium stannates, 20～30 parts of additives, 0.5～2 part of reductive agent, 500～600 parts of deionized waters;
Further, described additive is urea or thiocarbamide;
Described reductive agent is any in 3-methoxy-4-hydroxybenzaldehyde, 3-hydroxyl-4-methoxybenzaldehyde, 4-methoxysalicylaldehyde, syringaldehyde.
The preparation method of a kind of printed-wiring board (PWB) electroless copper of the present invention activation solution is: to adding mass parts in the container with agitator, be the distilled water that the sodium-chlor of 150～180 parts and mass parts are 500～600 parts, open and stir, after sodium to be chlorinated dissolves completely, stop stirring, make sodium chloride solution; Get 10% of the sodium chloride solution quality made, adding mass parts is the Palladous chloride of 2～6 parts, is stirred to Palladous chloride and dissolves completely, makes A liquid; Two hydrated stannous chlorides that are 100～300 parts by mass parts join in the remaining sodium chloride solution of making, then to add mass parts be the reductive agent of 0.5～2 part, are stirred to two hydrated stannous chlorides and dissolve completely, make B liquid; Under the ul-trasonic irradiation of 550KHz, at 27～30 ℃ of temperature, A liquid is slowly joined in B liquid, solution to be mixed becomes after brownish black, continues ultrasonic wave and disperses 10 minutes, and finally adding mass parts is the additive that the three hydration sodium stannates of 4～8 parts and mass parts are 20～30 parts, ultrasonic dispersion makes it to dissolve completely, be warming up to 45～60 ℃, slaking 3～5 hours, obtains printed-wiring board (PWB) electroless copper activation solution.
Advantage and disadvantage of the present invention is: adopt sodium chloride solution that Palladous chloride is made to A liquid, two hydrated stannous chlorides and reductive agent are made to B liquid, under ultrasonication, A liquid is scattered in B liquid, be aided with three hydration sodium stannates, additive, reductive agent as auxiliary stabilizer, make electroless copper activation solution, for printed circuit board, carry out the activation treatment before electroless copper, reach the effect of activation and the interior activation of printed wiring plate hole of printed-wiring board (PWB) Nonconductor surface.This activation solution be take sodium-chlor as main stabilizer, can be referred to as sodium-chlor base activation solution, with the chlorion in sodium-chlor, makes activation solution keep stable, there is content of hydrochloric acid low, stability is high, saves starting material, reduces environmental pollution and does not damage the advantage of printed wiring base board.
Embodiment
Embodiment 1
A kind of printed-wiring board (PWB) electroless copper activation solution comprises the raw material of following mass parts: two 2000 grams of hydrated stannous chlorides, 40 grams of Palladous chlorides, 1600 grams, sodium-chlor, 50 grams of three hydration sodium stannates, 250 grams, urea, 10 grams of 3-methoxy-4-hydroxybenzaldehydes, 5500 grams of deionized waters;
Its preparation method is: to adding mass parts in the container with agitator, be the distilled water that the sodium-chlor of 1600 grams and mass parts are 5500 grams, open and stir, after sodium to be chlorinated dissolves completely, stop stirring, make sodium chloride solution; Get 710 grams of the sodium chloride solutions made, adding mass parts is the Palladous chloride of 40 grams, is stirred to Palladous chloride and dissolves completely, makes A liquid; Two hydrated stannous chlorides that are 2000 grams by mass parts join in 6390 grams of remaining sodium chloride solutions of making, then to add mass parts be the 3-methoxy-4-hydroxybenzaldehyde of 10 grams, are stirred to two hydrated stannous chlorides and dissolve completely, make B liquid; Under the ul-trasonic irradiation of 550KHz, at 28 ℃ of temperature, A liquid is slowly joined in B liquid, solution to be mixed becomes after brownish black, continues ultrasonic wave and disperses 10 minutes, and finally adding mass parts is the urea that the three hydration sodium stannates of 50 grams and mass parts are 250 grams, ultrasonic dispersion makes it to dissolve completely, be warming up to 50 ℃, slaking 5 hours, obtains printed-wiring board (PWB) electroless copper activation solution.
Embodiment 2,
A kind of printed-wiring board (PWB) electroless copper activation solution comprises the raw material of following mass parts: two 1000 grams of hydrated stannous chlorides, 20 grams of Palladous chlorides, 1500 grams, sodium-chlor, 40 grams of three hydration sodium stannates, 300 grams of thiocarbamides, 5 grams of 4-methoxysalicylaldehydes, 5000 grams of deionized waters;
Its preparation method is: to adding mass parts in the container with agitator, be the distilled water that the sodium-chlor of 1500 grams and mass parts are 5000 grams, open and stir, after sodium to be chlorinated dissolves completely, stop stirring, make sodium chloride solution; Get 650 grams of the sodium chloride solutions made, adding mass parts is the Palladous chloride of 20 grams, is stirred to Palladous chloride and dissolves completely, makes A liquid; Two hydrated stannous chlorides that are 1000 grams by mass parts join in 5850 grams of remaining sodium chloride solutions of making, then to add mass parts be the 4-methoxysalicylaldehyde of 5 grams, are stirred to two hydrated stannous chlorides and dissolve completely, make B liquid; Under the ul-trasonic irradiation of 550KHz, at 27 ℃ of temperature, A liquid is slowly joined in B liquid, solution to be mixed becomes after brownish black, continues ultrasonic wave and disperses 10 minutes, and finally adding mass parts is the thiocarbamide that the three hydration sodium stannates of 40 grams and mass parts are 300 grams, ultrasonic dispersion makes it to dissolve completely, be warming up to 60 ℃, slaking 3 hours, obtains printed-wiring board (PWB) electroless copper activation solution.
Embodiment 3
A kind of printed-wiring board (PWB) electroless copper activation solution comprises the raw material of following mass parts: two 3000 grams of hydrated stannous chlorides, 60 grams of Palladous chlorides, 1800 grams, sodium-chlor, 80 grams of three hydration sodium stannates, 200 grams, urea, 20 grams of syringaldehydes, 6000 grams of deionized waters;
Its preparation method is: to adding mass parts in the container with agitator, be the distilled water that the sodium-chlor of 1800 grams and mass parts are 6000 grams, open and stir, after sodium to be chlorinated dissolves completely, stop stirring, make sodium chloride solution; Get 10% of the sodium chloride solution quality made, adding mass parts is the Palladous chloride of 60 grams, is stirred to Palladous chloride and dissolves completely, makes A liquid; Two hydrated stannous chlorides that are 3000 grams by mass parts join in the remaining sodium chloride solution of making, then to add mass parts be the syringaldehyde of 20 grams, are stirred to two hydrated stannous chlorides and dissolve completely, make B liquid; Under the ul-trasonic irradiation of 550KHz, at 30 ℃ of temperature, A liquid is slowly joined in B liquid, solution to be mixed becomes after brownish black, continues ultrasonic wave and disperses 10 minutes, and finally adding mass parts is the urea that the three hydration sodium stannates of 80 grams and mass parts are 200 grams, ultrasonic dispersion makes it to dissolve completely, be warming up to 45 ℃, slaking 4 hours, obtains printed-wiring board (PWB) electroless copper activation solution.
The above; embodiment is only that the preferred embodiment of the present invention is described; not scope of the present invention is limited; under the prerequisite of spirit that does not depart from the technology of the present invention; various distortion and improvement that this area engineering technical personnel make technical scheme of the present invention, all should fall in the definite protection domain of claims of the present invention.
Claims (3)
1. a printed circuit board electroless copper activation solution, is characterized in that: described a kind of printed circuit board electroless copper activation solution comprises the raw material of following mass parts: two 100～300 parts of hydrated stannous chlorides, 2～6 parts of Palladous chlorides, 150～180 parts, sodium-chlor, 4～8 parts of three hydration sodium stannates, 20～30 parts of additives, 0.5～2 part of reductive agent, 500～600 parts of deionized waters.
2. a kind of printed circuit board electroless copper activation solution according to claim 1, it is characterized in that: the preparation method of described a kind of printed circuit board electroless copper activation solution is: to adding mass parts in the container with agitator, be the distilled water that the sodium-chlor of 150～180 parts and mass parts are 500～600 parts, open and stir, after sodium to be chlorinated dissolves completely, stop stirring, make sodium chloride solution; Get 10% of the sodium chloride solution quality made, adding mass parts is the Palladous chloride of 2～6 parts, is stirred to Palladous chloride and dissolves completely, makes A liquid; Two hydrated stannous chlorides that are 100～300 parts by mass parts join in the remaining sodium chloride solution of making, then to add mass parts be the reductive agent of 0.5～2 part, are stirred to two hydrated stannous chlorides and dissolve completely, make B liquid; Under the ul-trasonic irradiation of 550KHz, at 27～30 ℃ of temperature, A liquid is slowly joined in B liquid, solution to be mixed becomes after brownish black, continues ultrasonic wave and disperses 10 minutes, and finally adding mass parts is the additive that the three hydration sodium stannates of 4～8 parts and mass parts are 20～30 parts, ultrasonic dispersion makes it to dissolve completely, be warming up to 45～60 ℃, slaking 3～5 hours, obtains printed-wiring board (PWB) electroless copper activation solution.
3. a kind of printed circuit board electroless copper activation solution according to claim 1, is characterized in that: described additive is urea or thiocarbamide; Described reductive agent is any in 3-methoxy-4-hydroxybenzaldehyde, 3-hydroxyl-4-methoxybenzaldehyde, 4-methoxysalicylaldehyde, syringaldehyde.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410343987.7A CN104152874B (en) | 2014-07-20 | 2014-07-20 | A kind of printed wiring board electroless copper activating solution |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410343987.7A CN104152874B (en) | 2014-07-20 | 2014-07-20 | A kind of printed wiring board electroless copper activating solution |
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| Publication Number | Publication Date |
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| CN104152874A true CN104152874A (en) | 2014-11-19 |
| CN104152874B CN104152874B (en) | 2017-06-09 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106149018A (en) * | 2016-08-09 | 2016-11-23 | 安徽广德威正光电科技有限公司 | A kind of process for pcb board electro-coppering |
| CN106591809A (en) * | 2016-12-26 | 2017-04-26 | 长沙理工大学 | Low-concentration colloid palladium activation solution for printed circuit board electroless copper |
| CN109023316A (en) * | 2018-07-31 | 2018-12-18 | 广东利尔化学有限公司 | A kind of wiring board activating solution and its activation method |
| CN113151812A (en) * | 2021-04-20 | 2021-07-23 | 广东工业大学 | Tin activating solution, preparation method thereof and chemical nickel plating method |
| CN117385345A (en) * | 2023-10-17 | 2024-01-12 | 江苏贺鸿电子有限公司 | Preparation method and application of electroless nickel gold activator |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106149018A (en) * | 2016-08-09 | 2016-11-23 | 安徽广德威正光电科技有限公司 | A kind of process for pcb board electro-coppering |
| CN106591809A (en) * | 2016-12-26 | 2017-04-26 | 长沙理工大学 | Low-concentration colloid palladium activation solution for printed circuit board electroless copper |
| CN109023316A (en) * | 2018-07-31 | 2018-12-18 | 广东利尔化学有限公司 | A kind of wiring board activating solution and its activation method |
| CN113151812A (en) * | 2021-04-20 | 2021-07-23 | 广东工业大学 | Tin activating solution, preparation method thereof and chemical nickel plating method |
| CN117385345A (en) * | 2023-10-17 | 2024-01-12 | 江苏贺鸿电子有限公司 | Preparation method and application of electroless nickel gold activator |
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| CN104152874B (en) | 2017-06-09 |
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Effective date of registration: 20190806 Address after: 519000 No.8 Workshop No.3, Liangang Industrial Pioneering West Road, Hongqi Town, Jinwan District, Zhuhai City, Guangdong Province Patentee after: Zhuhai Weizhihua New Materials Co.,Ltd. Address before: The national high tech Zone Xinqing Technology Industrial Park chicken chicken Tsui Tsui Village Road 519180 Guangdong city of Zhuhai Province, No. 10 North (plant) Patentee before: Zhuhai Weihua Chemical Co.,Ltd. |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: An activation solution for electroless copper plating on printed circuit boards Granted publication date: 20170609 Pledgee: Postal Savings Bank of China Limited Zhuhai Gongbei Branch Pledgor: Zhuhai Weizhihua New Materials Co.,Ltd. Registration number: Y2024980011865 |