CN107723689A - A kind of ionic palladium activator - Google Patents

A kind of ionic palladium activator Download PDF

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Publication number
CN107723689A
CN107723689A CN201610661920.7A CN201610661920A CN107723689A CN 107723689 A CN107723689 A CN 107723689A CN 201610661920 A CN201610661920 A CN 201610661920A CN 107723689 A CN107723689 A CN 107723689A
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CN
China
Prior art keywords
activator
palladium
sodium hydroxide
polyethylene glycol
surplus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610661920.7A
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Chinese (zh)
Inventor
潘恒金
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huizhou Dayawan Jinsheng Science And Technology Co Ltd
Original Assignee
Huizhou Dayawan Jinsheng Science And Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huizhou Dayawan Jinsheng Science And Technology Co Ltd filed Critical Huizhou Dayawan Jinsheng Science And Technology Co Ltd
Priority to CN201610661920.7A priority Critical patent/CN107723689A/en
Publication of CN107723689A publication Critical patent/CN107723689A/en
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Agricultural Chemicals And Associated Chemicals (AREA)

Abstract

The invention belongs to the activating agent technical field for wiring board through hole electroless copper, more particularly to a kind of ionic palladium activating agent.The technical problems to be solved by the invention are to provide that a kind of stability is good, spreadability is good and to base material without attack, in the activator of copper face noresidue.In order to solve the above problems, technical scheme provided by the present invention is：A kind of ionic palladium activator, the activator component and content are palladium bichloride 0.15g 0.65g, the 12g of aminopyridine 4, the 55g of polyethylene glycol 5 in every liter of activator, sodium hydroxide 5 25g, surplus H2O.The beneficial effects of the present invention are：Stability of solution is good.Palladium ion spreadability at glass fibre and resin is intact, base material is not attacked.Palladium ion is very low in the adsorption rate of copper face, in copper face noresidue.

Description

A kind of ionic palladium activator
Technical field
The invention belongs to the activating agent technical field for wiring board through hole electroless copper, more particularly to a kind of ionic palladium to live Property agent.
Background technology
Electroless copper is a kind of technique in circuit board fabrication, is generally also heavy or Hu Konghua, is a kind of their catalytic Redox reaction.The activator used in electroless copper is colloid palladium at present, but colloid palladium exists many as activator Shortcoming, as stability of solution is poor, easily to base material cause attack, easily copper face formed residue the shortcomings of, have a strong impact on production Quality.Therefore it is particularly important to develop a kind of high-quality activator.
The content of the invention
The technical problems to be solved by the invention be to provide that a kind of stability is good, spreadability is good and to base material without attack, The activator of copper face noresidue.
In order to solve the above problems, technical scheme provided by the present invention is：
A kind of ionic palladium activator, the activator component and content are palladium bichloride 0.15g-0.65g in every liter of activator, Aminopyridine 4-12g, polyethylene glycol 5-55g, sodium hydroxide 5-25g, surplus H2O.
Optionally, the activator component and content are palladium bichloride 0.30g-0.50g, aminopyridine 5- in every liter of activator 10g, polyethylene glycol 5-50g, sodium hydroxide 5-15g, surplus H2O.
Optionally, the activator component and content are palladium bichloride 0.15g-0.35g, aminopyridine 4- in every liter of activator 7g, polyethylene glycol 5-20g, sodium hydroxide 5-10g, surplus H2O.
Optionally, the activator component and content are palladium bichloride 0.35g-0.55g, aminopyridine 7- in every liter of activator 10g, polyethylene glycol 20-45g, sodium hydroxide 10-20g, surplus H2O.
Optionally, the activator component and content are palladium bichloride 0.55g-0.65g in every liter of activator, aminopyridine 10-12g, polyethylene glycol 45-55g, sodium hydroxide 20-25g, surplus H2O.
The beneficial effects of the present invention are：Stability of solution is good.It is stable, palladium at normal temperatures because body is solution Ion will not precipitate.Palladium ion spreadability at glass fibre and resin is intact, base material is not attacked.Carried on the back in subsequent deposition layers of copper During light detection, backlight is 10 grades, and without light leak spot, from micro- section, sedimentary is fine and close, and base material is intact.Palladium ion exists The adsorption rate of copper face is very low, in copper face noresidue, because in the basic conditions, palladium ion and PCB surface layers of copper are not changed Displacement reaction is learned, so there is no palladium metal to separate out layer on copper surface.
Embodiment
In order to become apparent from, completely illustrate present disclosure, optimal embodiment is provided below to illustrate present inventive concept. Certainly, the design that embodiment is intended to illustrate invention is provided, is not the whole of design of the present invention, less should It is considered as the limitation of design content of the present invention.Under the enlightenment of the embodiment provided, made any scheme belongs to this The protection domain of invention.
Embodiment 1
A kind of ionic palladium activator, the activator component and content are palladium bichloride 0.15g in every liter of activator, amino pyrrole Pyridine 4g, polyethylene glycol 5g, sodium hydroxide 5g, surplus H2O.
In the present embodiment, the effect of palladium bichloride is to provide metal ion palladium, and aminopyridine is used to adjust pH value, polyethylene glycol For moistening the hole wall of wiring board, sodium hydroxide is the complexing agent of metal ion palladium, Metal Palladium can be dispersed stably in In solution, H2O is lytic agent.In remaining embodiment provided by the present invention, each component in the function and the present embodiment of each component Function it is consistent.
The preparation method for the activating agent that the present embodiment is provided is (by taking 1 liter of solvent as an example)：Take a medicine that can be stirred Water vat, H2O is added, H2O is less than 0.8L, adds palladium bichloride, aminopyridine, polyethylene glycol, sodium hydroxide according to quantity successively, and stirring is equal It is even, it is further continued for adding water to 1L, stirs.The preparation method of In remaining embodiment activating agent and the one of the present embodiment offer Cause.
Embodiment 2
A kind of ionic palladium activator, the activator component and content are palladium bichloride 0.65g in every liter of activator, amino pyrrole Pyridine 12g, polyethylene glycol 55g, sodium hydroxide 25g, surplus H2O.
Embodiment 3
A kind of ionic palladium activator, the activator component and content are palladium bichloride 0.30g in every liter of activator, amino pyrrole Pyridine 5g, polyethylene glycol 5g, sodium hydroxide 5g, surplus H2O.
Embodiment 4
A kind of ionic palladium activator, the activator component and content are palladium bichloride 0.50g in every liter of activator, amino pyrrole Pyridine 10g, polyethylene glycol 50g, sodium hydroxide 15g, surplus H2O.
Embodiment 5
A kind of ionic palladium activator, the activator component and content are palladium bichloride 0.15g in every liter of activator, amino pyrrole Pyridine 4g, polyethylene glycol 5g, sodium hydroxide 5g, surplus H2O.
Embodiment 6
A kind of ionic palladium activator, the activator component and content are palladium bichloride 0.35g in every liter of activator, amino pyrrole Pyridine 7g, polyethylene glycol 20g, sodium hydroxide 10g, surplus H2O.
Embodiment 7
A kind of ionic palladium activator, the activator component and content are palladium bichloride 0.55g in every liter of activator, amino pyrrole Pyridine 10g, polyethylene glycol 45g, sodium hydroxide 20g, surplus H2O.

Claims (5)

1. a kind of ionic palladium activator, it is characterised in that the activator component and content are palladium bichloride in every liter of activator 0.15g-0.65g, aminopyridine 4-12g, polyethylene glycol 5-55g, sodium hydroxide 5-25g, surplus H2O.
2. a kind of ionic palladium activator according to claim 1, it is characterised in that the activator component and content are every Palladium bichloride 0.30g-0.50g, aminopyridine 5-10g, polyethylene glycol 5-50g in activator, sodium hydroxide 5-15g are risen, surplus is H2O。
3. a kind of ionic palladium activator according to claim 1, it is characterised in that the activator component and content are every Palladium bichloride 0.15g-0.35g, aminopyridine 4-7g, polyethylene glycol 5-20g in activator, sodium hydroxide 5-10g are risen, surplus is H2O。
4. a kind of ionic palladium activator according to claim 1, it is characterised in that the activator component and content are every Rise palladium bichloride 0.35g-0.55g, aminopyridine 7-10g, polyethylene glycol 20-45g in activator, sodium hydroxide 10-20g, surplus For H2O.
5. a kind of ionic palladium activator according to claim 1, it is characterised in that the activator component and content are every Rise palladium bichloride 0.55g-0.65g, aminopyridine 10-12g, polyethylene glycol 45-55g in activator, sodium hydroxide 20-25g, surplus For H2O.
CN201610661920.7A 2016-08-12 2016-08-12 A kind of ionic palladium activator Pending CN107723689A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610661920.7A CN107723689A (en) 2016-08-12 2016-08-12 A kind of ionic palladium activator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610661920.7A CN107723689A (en) 2016-08-12 2016-08-12 A kind of ionic palladium activator

Publications (1)

Publication Number Publication Date
CN107723689A true CN107723689A (en) 2018-02-23

Family

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CN201610661920.7A Pending CN107723689A (en) 2016-08-12 2016-08-12 A kind of ionic palladium activator

Country Status (1)

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CN (1) CN107723689A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113133225A (en) * 2021-04-13 2021-07-16 广州皓悦新材料科技有限公司 Horizontal copper deposition process for multilayer board and HDI board
CN115491664A (en) * 2022-09-13 2022-12-20 广东利尔化学有限公司 Ionic palladium activator for vertical copper deposition wire and preparation method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1740390A (en) * 2005-09-09 2006-03-01 清华大学 Chemical plating activating process and metal depositing process therewith
CN101736330A (en) * 2008-11-25 2010-06-16 比亚迪股份有限公司 Method for metalizing polyimide surface
CN102146557A (en) * 2010-02-05 2011-08-10 芝普企业股份有限公司 Method of preparing solar cell and electrode by electroless nickel plating and activating solution used
CN102286734A (en) * 2011-06-22 2011-12-21 沈阳理工大学 Pretreatment technology of surface metal plating of titanium alloy and metal plating method
CN102677027A (en) * 2012-05-25 2012-09-19 广州市天承化工有限公司 Activating solution composition for nonmetallic material electroless plating
CN105420700A (en) * 2014-09-18 2016-03-23 比亚迪股份有限公司 Polyimide circuit board and manufacturing method thereof

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1740390A (en) * 2005-09-09 2006-03-01 清华大学 Chemical plating activating process and metal depositing process therewith
CN101736330A (en) * 2008-11-25 2010-06-16 比亚迪股份有限公司 Method for metalizing polyimide surface
CN102146557A (en) * 2010-02-05 2011-08-10 芝普企业股份有限公司 Method of preparing solar cell and electrode by electroless nickel plating and activating solution used
CN102286734A (en) * 2011-06-22 2011-12-21 沈阳理工大学 Pretreatment technology of surface metal plating of titanium alloy and metal plating method
CN102677027A (en) * 2012-05-25 2012-09-19 广州市天承化工有限公司 Activating solution composition for nonmetallic material electroless plating
CN105420700A (en) * 2014-09-18 2016-03-23 比亚迪股份有限公司 Polyimide circuit board and manufacturing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113133225A (en) * 2021-04-13 2021-07-16 广州皓悦新材料科技有限公司 Horizontal copper deposition process for multilayer board and HDI board
CN115491664A (en) * 2022-09-13 2022-12-20 广东利尔化学有限公司 Ionic palladium activator for vertical copper deposition wire and preparation method thereof

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Application publication date: 20180223