CN202022988U - Micropore coppering device of HDI (High Density Interconnect) circuit board - Google Patents
Micropore coppering device of HDI (High Density Interconnect) circuit board Download PDFInfo
- Publication number
- CN202022988U CN202022988U CN2011201154460U CN201120115446U CN202022988U CN 202022988 U CN202022988 U CN 202022988U CN 2011201154460 U CN2011201154460 U CN 2011201154460U CN 201120115446 U CN201120115446 U CN 201120115446U CN 202022988 U CN202022988 U CN 202022988U
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- micropore
- coppering
- groove body
- cell body
- hdi
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Abstract
The utility model relates to a micropore coppering device of an HDI (High Density Interconnect) circuit board. The micropore coppering device comprises a groove body used for containing coppering liquid, wherein a lifting device is arranged above the groove body; an ultrasonic generation device is arranged on two opposite side walls inside the groove body respectively; the upper edge of the groove body is provided with gas cap pumps which are used for vibrating the whole groove body; the two gas cap pumps are symmetrically arranged at two opposite side edges of the groove body; and inflating pipes are arranged at the bottom part of the groove body and are connected with external inflating pumps. In the utility model, the coppering device draws support from the ultrasonic generation devices to facilitate coppering liquid in side the groove body to form strong turbulent flow state for impacting and changing overflow state inside a micropore; then the gas cap pumps are vibrated to drive the whole groove body to vibrate, so as to weaken and eliminate the `laminar flow` phenomenon in the micropore; the inflating pipes are used to realize the effective circulation of chemical liquid inside the coppering groove, so as to ensure the quality of the micropore coppering by common vertical electroplate process and facilitate the micropore coppering device to meet the quality requirements on the micropore coppering of the HDI circuit board; and the micropore coppering device reduces unnecessary scrap of PCB (Printed Circuit Board) board and lowers the production cost.
Description
Technical field
The utility model relates to pcb board and makes the field, is specifically related to the micropore copper plating device that the heavy copper electroplating work procedure of a kind of pcb board uses.
Background technology
Develop rapidly along with electronic technology, electronic product is tending towards microminiaturization, lighting, highly integrated gradually, the encapsulation of semiconductor device also is tending towards many pins thin spaceization, and the pcb board that this inevitable requirement is carried semiconductor device is accordingly also wanted miniaturization and and densification.Can the PCB substrate densification depend on micropore and the circuit that interlayer connects, and decide in conjunction with the performance of electronic product, so the micropore technology becomes one of gordian technique of PCB industry.Micropore comprises through hole, buried via hole and the blind hole etc. on the printed-wiring board (PWB).Traditional rectilinear direct current electrode position is to install hanger track, making sheet angle of inclination link plate and fluidic device in copper plating groove additional, and improving the copper facing effect, but that this device still can't satisfy between the HDI(high-density layer is interconnected) the micropore copper facing specification of quality of wiring board.
Summary of the invention
The problem that the utility model need solve provides a kind of micropore copper plating device of micropore copper-plating technique of the HDI of being applicable to wiring board.
For addressing the above problem, the technical scheme that the utility model is taked is: the micropore copper plating device that a kind of HDI wiring board is provided, comprise the cell body that is used to hold copper plating bath, the cell body top is provided with lifting device, two opposite side walls is equipped with ultrasonic generator in the described cell body, the cell body upper edge is equipped with the pneumatic jack pump that is used to make whole cell body vibration
Preferably, described pneumatic jack pump is symmetricly set in edge, cell body two opposite sides.
Preferably, described cell body bottom is provided with air-inflating tube, and air-inflating tube is connected with outside inflating pump.
Preferably, on the pneumatic jack pump V-type draw-in groove is set.
Copper plating device described in the utility model makes the very strong turbulent state of copper plating bath formation in the cell body by the ultrasonic generator of cell body sidewall, thereby solution is flowed in the pcb board micropore with the intensive fluctuation, overflow situation in impact and the change hole; Drive whole cell body vibration by pneumatic jack pump vibration again, with current drainage repeatedly with fill up liquid in the hole, slacken and eliminate " laminar flow " phenomenon in the hole; By air-inflating tube copper plating groove liquid medicine is effectively circulated, further guaranteed to use the micropore copper facing quality of common vertical electroplating technology, it is interconnected that it can be satisfied between the HDI(high-density layer) the micropore copper facing specification of quality of wiring board.Reduced that pcb board is unnecessary to be scrapped, reduced production cost.
Description of drawings
Accompanying drawing 1 is that device cell body described in the utility model is formed structural representation;
Accompanying drawing 2 is device trough body structure schematic top plan view described in the utility model.
Embodiment
For the ease of those skilled in the art's understanding, the utility model structure is further described in detail below in conjunction with accompanying drawing.
As shown in Figure 1, the micropore copper plating device that the utility model disclosed adopts cell body 1, and the cell body top is provided with lifting device, lifting device control pcb board automatic lifting in cell body.Two opposite side walls is installed ultrasonic generator 10 in cell body 1, and upper edge, cell body 1 two side symmetry is installed a plurality of pneumatic jack pumps 11, and V-type draw-in groove 12 is set on the pneumatic jack pump 11, and cell body 1 bottom is provided with air-inflating tube 13.
Hold copper facing liquid medicine in cell body 1, start ultrasonic generator 10, pneumatic jack pump 11 and inflating pump, inflating pump continues to inflate in cell body 1 by air-inflating tube.Adopt lifting device pcb board to be immersed in the soup of cell body 1, soup flows in the pcb board micropore with the intensive fluctuation, overflow situation in impact and the change hole.Simultaneously, the vibration of pneumatic jack pump drives whole cell body vibration, and the liquid in the discharge plate hole fills up again discharges circulation repeatedly again, slackens and eliminate " laminar flow " phenomenon in the hole, guarantees hole wall copper facing.Pneumatic jack pump symmetry is installed on upper edge, cell body two side, and the interior liquid of whole cell body is evenly vibrated, and guarantees the copper facing quality.
Move downward in the intravital liquid medicine of immersion groove when lifting device drives pcb board, the lifting device two ends are stuck in the V-type draw-in groove 12 of cell body upper edge, are convenient to the copper facing operation.
Inflating pump injects new liquid medicine by air-inflating tube 13 in cell body 1, groove copper facing liquid medicine is effectively circulated, and guarantees the concentration of cupric ion in the copper facing liquid medicine.
Claims (4)
1.HDI the micropore copper plating device of wiring board, comprise the cell body (1) that is used to hold copper plating bath, the cell body top is provided with lifting device (2), it is characterized in that: the interior two opposite side walls of cell body (1) is equipped with ultrasonic generator (10), and cell body (1) upper edge is equipped with the pneumatic jack pump (11) that is used to make whole cell body vibration.
2. the micropore copper plating device of HDI wiring board according to claim 1 is characterized in that: described pneumatic jack pump (11) is symmetricly set in edge, cell body two opposite sides.
3. the micropore copper plating device of HDI wiring board according to claim 2 is characterized in that:
Described cell body (1) bottom is provided with air-inflating tube (13), and air-inflating tube is connected with outside inflating pump.
4. the micropore copper plating device of HDI wiring board according to claim 3 is characterized in that:
V-type draw-in groove (12) is set on the pneumatic jack pump (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201154460U CN202022988U (en) | 2011-04-19 | 2011-04-19 | Micropore coppering device of HDI (High Density Interconnect) circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201154460U CN202022988U (en) | 2011-04-19 | 2011-04-19 | Micropore coppering device of HDI (High Density Interconnect) circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202022988U true CN202022988U (en) | 2011-11-02 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201154460U Expired - Fee Related CN202022988U (en) | 2011-04-19 | 2011-04-19 | Micropore coppering device of HDI (High Density Interconnect) circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202022988U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103243374A (en) * | 2012-02-06 | 2013-08-14 | 昆山允升吉光电科技有限公司 | Method capable of effectively increasing quality of electroforming plate |
| CN105163521A (en) * | 2015-08-26 | 2015-12-16 | 昆山苏杭电路板有限公司 | Small-hole hole metallization processing method |
-
2011
- 2011-04-19 CN CN2011201154460U patent/CN202022988U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103243374A (en) * | 2012-02-06 | 2013-08-14 | 昆山允升吉光电科技有限公司 | Method capable of effectively increasing quality of electroforming plate |
| CN103243374B (en) * | 2012-02-06 | 2016-08-10 | 昆山允升吉光电科技有限公司 | A kind of method being effectively improved electrotyping plate quality |
| CN105163521A (en) * | 2015-08-26 | 2015-12-16 | 昆山苏杭电路板有限公司 | Small-hole hole metallization processing method |
| CN105163521B (en) * | 2015-08-26 | 2017-11-17 | 昆山苏杭电路板有限公司 | Aperture hole metallization processing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: Wang Guosheng Inventor before: Liu Dong Inventor before: Zhou Gang Inventor before: Ye Hanxiong Inventor before: Wang Yuzhou |
|
| CB03 | Change of inventor or designer information | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170515 Address after: 343900, Suichuan County, Jiangxi province Ji'an Industrial Park (East Side) Patentee after: JIANGXI ZHIBO XINYUE NEW ELECTRONIC CO.,LTD. Address before: 510000 unit 2414-2416, building, No. five, No. 371, Tianhe District, Guangdong, China Patentee before: GUANGDONG GAOHANG INTELLECTUAL PROPERTY OPERATION Co.,Ltd. Effective date of registration: 20170515 Address after: 510000 unit 2414-2416, building, No. five, No. 371, Tianhe District, Guangdong, China Patentee after: GUANGDONG GAOHANG INTELLECTUAL PROPERTY OPERATION Co.,Ltd. Address before: 516008 Guangdong province Huizhou City Road seven Lane three, eling Park in Beijing Patentee before: HUIZHOU CHINA EAGLE ELECTRONIC TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111102 Termination date: 20190419 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |