KR20140037635A - Circuit board produced filled with a conductive paste - Google Patents
Circuit board produced filled with a conductive paste Download PDFInfo
- Publication number
- KR20140037635A KR20140037635A KR1020120104021A KR20120104021A KR20140037635A KR 20140037635 A KR20140037635 A KR 20140037635A KR 1020120104021 A KR1020120104021 A KR 1020120104021A KR 20120104021 A KR20120104021 A KR 20120104021A KR 20140037635 A KR20140037635 A KR 20140037635A
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- South Korea
- Prior art keywords
- conductive
- substrate
- circuit
- master
- board
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/12—Production of screen printing forms or similar printing forms, e.g. stencils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
The present invention relates to a method of manufacturing a printed circuit board having a microcircuit and a printed circuit board made thereby.
Conventionally, it has been widely used to constitute a circuit by printing a silver paste.
The reason for this is that not only the production cost is low, but also it is possible to easily produce a large quantity by the printing method.
When a conventional silver paste is printed to form a circuit, it is generally possible to easily produce the circuit when the line width of the circuit is large.
However, when the linewidth of the circuit is extremely small, it is difficult to control the circuit width of the silver paste.
The present invention is characterized in that it is possible to realize a circuit using a paste with a precise uniform line width regardless of the minute circuit.
The term "printed electronic circuit board" is used herein because it can be seen that the present invention is produced in the same manner as a conventional method of forming a circuit by printing a silver paste.
The present invention relates to a method of manufacturing a circuit board by filling a conductive paste and a circuit board manufactured by the method.
The present invention can be seen as a technique applied to a method which is used in screen printing.
That is, the conventional screen printing technique is to transfer pigments to paper or fiber, or to transfer the pigments to paper or fiber only through the nets.
One of the embodiments of the present invention has a technical idea such as a concept of making a filling material between paper or a printing pigment printed on a fiber by such a conventional printing method to firmly support the pigment and the filling material with each other.
In the present invention, various types of nonconductive substrates are used instead of conventional paper or fiber.
The present invention is characterized in that a pillar portion is formed on the nonconductive substrate, and the pillar portion is filled with a conductive filler to be a circuit portion.
There are many ways to fill these fillings.
The most typical method is a method such as pouring a filling on a substrate on which pillars are formed and arranging the surface with a squeeze.
Conventional printed electronic circuits are made by printing a liquid silver paste on a substrate through a mesh or net.
The printed electronic circuit fabricated by the conventional method is easily detached from the substrate, and the surface is corroded due to oxidation.
The present invention provides the advantage that the pillar portion is formed between the circuit portions so as to prevent the circuit from being detached from the substrate and to prevent oxidation.
The circuit portion formed between the column portions can have a firm bonding force because the circuit portion can be bonded to both the column portion and the substrate.
The circuit part of the present invention is not only strong against external impact but also has a great feature that an extremely fine circuit can be manufactured economically by applying the same method as the conventional printing technique.
The circuit portion formed by the present invention has an advantage that an extremely fine circuit can be formed.
In addition, in manufacturing a microcircuit, it is possible to obtain economical efficiency and precision by not using a method such as etching.
The circuit portion is formed by filling a conductive adhesive resin such as a silver paste into the space portion, and the pillar portion is bonded to the nonconductive substrate.
The column portion and the circuit portion to be manufactured in this way are bonded on the substrate and are strongly bonded to each other, so that the column portion and the circuit portion are configured to be strong against external impact.
In general, the circuit part made of silver paste tends to proceed oxidation, but the silver paste according to the present invention can prevent oxidation by forming a protective wall for preventing oxidation at the periphery.
In addition, since the height of the circuit part can be controlled by the height of the photosensitive material applied to the substrate, it is advantageous that the thickness of the circuit part can be made to a desired level.
In the present invention, a circuit board is manufactured by filling a conductive paste between pillars.
In order to make a substrate having a column portion, a conductive master die having a plating portion corresponding to the column portion is manufactured.
From the conductive master mold, a non-conductive master substrate having pillars is produced.
A circuit portion is formed by filling a conductive paste in which conductive powder and adhesive liquid resin are mixed between the pillar portions of the master substrate.
A major feature of the circuit board by filling the conductive paste of the present invention is that the circuit portion is firmly supported by the pillars.
The circuit portion formed between the column portions can have a firm bonding force because the circuit portion can be bonded to both the column portion and the substrate.
The circuit part of the present invention is not only strong against external impact but also has a great feature that an extremely fine circuit can be manufactured economically by applying the same method as the conventional printing technique.
The circuit portion formed by the present invention has an advantage that an extremely fine circuit can be formed.
In addition, in manufacturing a microcircuit, it is possible to obtain economical efficiency and precision by not using a method such as etching.
The circuit portion is formed by filling a conductive adhesive resin such as a silver paste into the space portion, and the pillar portion is bonded to the nonconductive substrate.
The column portion and the circuit portion to be manufactured in this way are bonded on the substrate and are strongly bonded to each other, so that the column portion and the circuit portion are configured to be strong against external impact.
In general, the circuit part made of silver paste tends to proceed oxidation, but the silver paste according to the present invention can prevent oxidation by forming a protective wall for preventing oxidation at the periphery.
In addition, since the height of the circuit part can be controlled by the height of the photosensitive material applied to the substrate, it is advantageous that the thickness of the circuit part can be made to a desired level.
1 is an explanatory diagram of a conductive substrate.
2 is an explanatory diagram for explaining the configuration of an exposed portion and a non-exposed portion in a photosensitive layer.
3 is an explanatory view for explaining that a plating section is formed in a space portion from which an unexposed portion is removed.
4 is an explanatory view for explaining the production of the conductive master mold by removing the exposed portion.
Fig. 5 is a process drawing for filling the space portion of the conductive master mold with a liquid non-conductive filler.
6 is an explanatory diagram of a process of bonding a non-conductive substrate to an upper portion of a liquid non-conductive filler.
7 is an explanatory view of a master substrate separated from a master mold.
8 is an explanatory diagram of a process of filling a conductive paste on a master substrate.
Fig. 9 is an explanatory view of a circuit board filled with a conductive paste.
Fig. 10 is an explanatory view of forming a plating layer on the circuit part.
Hereinafter, various embodiments of the present invention will be described in detail, but the present invention is not limited to the following embodiments unless it departs from the gist thereof.
The present invention relates to a method for manufacturing a printed electronic circuit board having a column portion using a photosensitive material and a printed electronic circuit board therefor.
The present invention relates to a method of manufacturing an electrophotographic image forming apparatus, which comprises uniformly applying a photosensitive material on a nonconductive substrate, irradiating light onto the photosensitive material through a pattern film composed of a transparent opaque portion to form an exposed portion and an unexposed portion, And the pillar portion and the circuit portion are formed in the exposed portion and the non-exposed portion, respectively.
The circuit part is formed by filling a conductive adhesive resin such as a silver paste into the space part,
The posts are joined to the non-conductive substrate.
The column portion and the circuit portion to be manufactured in this way are bonded on the substrate and are strongly bonded to each other, so that the column portion and the circuit portion are configured to be strong against external impact.
In general, the circuit part made of silver paste tends to proceed oxidation, but the silver paste according to the present invention can prevent oxidation by forming a protective wall for preventing oxidation at the periphery.
In addition, since the height of the circuit part can be controlled by the height of the photosensitive material applied to the substrate, it is advantageous that the thickness of the circuit part can be made to a desired level.
According to the present invention, a circuit board is manufactured by filling a conductive paste, and a non-conductive master board having a column portion is made, and conductive paste obtained by mixing conductive powder and adhesive liquid resin between the column portions of the master board is filled, And a circuit board is formed.
The non-conductive master substrate is made from a conductive master mold,
The master mold includes a photosensitive material coating step of uniformly applying a photosensitive material to a conductor substrate; An exposure step of irradiating light to the photosensitive material through a pattern film made of transparent opaque to form an exposed part and an unexposed part; A plating step of forming a space portion by removing the unexposed portion and forming a plating portion in the space portion; Chemically removing the exposed portion to form a space portion.
Figs. 1 to 4 illustrate the steps of manufacturing the conductive master mold used in the present invention.
1 is an explanatory diagram of a conductive substrate
The
The most representative example of such a conductive substrate is a thin stainless flat plate, and other flat plates made of metal such as copper plate.
Of course, the conductive metal can be sputtered on the nonconductive substrate to be used as the conductive substrate. In addition, a plated layer may be formed on the sputtered layer to make it more reliable as a conductive substrate.
As examples of such a nonconductive substrate, various materials such as a polyimide film, a PET film, a glass plate, a uvy resin film, an epoxy resin, and a Teflon resin can be used.
The substrate in the present invention can be used in any film or plate form.
The substrate in the present invention is not limited to a flexible substrate or a solidified substrate.
For mass production, it would be ideal to use a film-like substrate wound on a reel.
2 is an explanatory view for explaining the constitution of an exposed portion and an unexposed portion in the photosensitive layer
The photoresist is uniformly coated on the nonconductive substrate.
Thereafter, the photosensitive material is irradiated with light through a pattern film composed of a transparent opaque portion to form the exposed
The portion that receives light from the photosensitive material becomes the exposed
Since the thickness of the photosensitive material is closely related to the thickness of the circuit portion and the column portion in the present invention, the thickness of the photosensitive material may be selected to match the thickness of the circuit to be manufactured.
3 is an explanatory view for explaining that a plating section is formed in a space portion from which an unexposed portion is removed.
The unexposed portion is removed by a chemical method on the photosensitive layer composed of the exposed portion and the unexposed portion to make a space portion.
And the plating part 4 is formed by plating the space part.
It is preferable that the plating portion is plated between the exposed
The plating portion is tightly coupled with the conductive substrate.
Plating may be performed with the same metal as the conductive layer of the conductive substrate in order to further increase the bonding force.
A polishing process may be added in order to clean the surface of the exposed portion and the plating portion and to make the height the same.
In other words, it is possible to clean the height and the surface of the exposed portion and the plated portion through a polishing process.
4 is an explanatory view for explaining the production of the conductive master mold by removing the exposed portion.
The exposed portion is removed to leave only the plating portion 4 on the conductive substrate. When the exposed portion is chemically removed, a
The state in which only the conductive substrate and the plating portion are constituted is referred to as the conductive
When the conductive master mold is coated with the silicon or the release material extremely thinly, the object to be filled in the mold can easily be released.
It is preferable to form such a mold release layer in the electroconductive master metal mold | die of this invention.
FIG. 5 to FIG. 7 are explanatory views of a process for manufacturing a nonconductive master substrate.
5 is a process diagram for filling a space of a conductive master mold with a liquid non-conductive filler to fabricate a nonconductive master substrate.
The space portion of the
As the material of the resin used as the liquid filling material, a variety of materials such as polyimide resin, epoxy resin, Teflon resin, Ube resin, PET resin, silicone and the like can be selected and used.
The liquid filler is nonconductive.
It is preferable to fill the liquid filler and to match the height with the height of the exposed portion.
6 is an explanatory diagram of a process of bonding a non-conductive substrate to an upper portion of a liquid non-conductive filler.
A non-conductive substrate (8) is placed on the filler before the liquid non-conductive filler (7) is cured.
The
When the liquid non-conductive filler is filled in the master mold, it is referred to as a column portion.
The liquid filler is bonded to the non-conductive substrate and cured.
The filler, together with the cure, is firmly coupled to the substrate.
As examples of the nonconductive substrate, various materials such as a polyimide film, a PET film, a glass plate, a uvy resin film, an epoxy resin, a Teflon resin, and a silicon can be used.
The nonconductive substrate in the present invention can be used in any film or plate form.
The nonconductive substrate in the present invention is not limited to a flexible substrate or a solidified substrate.
For mass production, it would be ideal to use a film-like substrate wound on a reel.
It is preferable to use the same material so that the liquid non-conductive filler can firmly bond with the non-conductive substrate.
The nonconductive substrate may not be solidified from the beginning.
That is, there is also a method of pouring a liquid non-conductive resin in the upper part of the filler to cure the filler and the nonconductive resin at the same time.
This also belongs to the object of the present invention.
7 is an explanatory view of a nonconductive master substrate separated from a conductive master mold.
When the non-conductive substrate and the filler are cured and well bonded,
And the nonconductive master substrate is released from the conductive master mold.
It is preferable to apply or coat the release material to the mold of the conductive master in order to facilitate the detachment.
The
The
8 is an explanatory diagram of a process of filling a conductive paste on a master substrate.
A paste mixed with the conductive fine particles in a fluid resin having adhesive properties is injected and cured between the columnar portions of the master substrate to form the
Among the pastes, silver paste is the most preferable material.
After the step of forming the circuit part, the step may further include a step of polishing the surface so as to clean the surface and to make the height of the pillar part and the circuit part the same.
The circuit portion formed between the column portions has a firm bonding force because the circuit portion can be bonded to both the column portion and the substrate.
The circuit part of the present invention is not only strong against external impact but also has a great feature that an extremely fine circuit can be manufactured economically by applying the same method as the conventional printing technique.
Fig. 9 is an explanatory view of a circuit board filled with a conductive paste.
The
Fig. 10 is an explanatory view of forming a plating layer on the circuit part.
The
After the conductive circuit part forming step, the
The plating is advantageous in that the oxidation of the circuit part can be prevented.
A main object of the present invention is to fabricate a non-conductive master substrate in a conductive master mold and to form a circuit portion in the master substrate.
It is general that the master substrate described in the present invention is manufactured from the conductive master mold shown in the present invention and then the circuit board of the present invention is sequentially formed.
However, the above non-conductive master substrate can be fabricated although it is inefficient by other general methods without manufacturing from the master mold disclosed in the present invention.
In view of this point, it is also an object of the present invention to use a non-conductive master having a pillar portion, and to form a circuit portion by filling a conductive paste mixed with conductive powder and an adhesive liquid resin between the pillar portions.
In addition, the present invention is a matter of course that the circuit board, characterized in that the production method by the above manufacturing method and the production method described above.
It will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. It is not.
1: conductive substrate
2: Exposure section
3: Non-visible area
4:
5: space portion
6: Conductive master mold
7: Non-conductive packing
8: Non-conductive substrate
9: Master substrate
10: Grinding machine
11: Conductive paste
12: microcircuit substrate
13: Plating layer
Claims (11)
A circuit board is manufactured by making a non-conductive master board having pillars and filling the conductive paste in which conductive powder and adhesive liquid resin are mixed between the pillars of the master board to constitute a circuit part. Production method.
The non-conductive master substrate is made from a conductive master mold,
Wherein the master mold comprises:
A photosensitive material applying step of uniformly applying a photosensitive material to a conductor substrate;
An exposure step of irradiating light to the photosensitive material through a pattern film made of transparent opaque to form an exposed part and an unexposed part;
A plating step of forming a space portion by removing the unexposed portion and forming a plating portion in the space portion;
Wherein the exposed portion is chemically removed to form a space portion.
The non-conductive master substrate includes a column portion forming step of filling a space portion of the conductive master mold with a liquid resin to form a column portion;
A bonding step of placing the substrate on the columnar portion of the liquid resin, and bonding the columnar portion and the substrate;
And a step of separating the pillar portion and the substrate from each other, from the master mold.
Wherein a polishing step is additionally performed to clean the surface of the exposed portion and the plating portion of the master mold and to make them equal in height.
Wherein a plating process for forming a plating layer is further provided on the paste.
And a polishing step is performed on the paste and the pillar part through a polishing step.
Wherein the pillar portion and the substrate are made of the same material.
Wherein the substrate is made of a polyimide resin, an epoxy resin, a Teflon resin, or a Ube resin.
Wherein the conductive master mold is coated with an extremely thin layer of silicon or a release material to form a thin release layer.
And a plating layer is formed on the circuit portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020120104021A KR102008985B1 (en) | 2012-09-19 | 2012-09-19 | Circuit board produced filled with a conductive paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020120104021A KR102008985B1 (en) | 2012-09-19 | 2012-09-19 | Circuit board produced filled with a conductive paste |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20140037635A true KR20140037635A (en) | 2014-03-27 |
| KR102008985B1 KR102008985B1 (en) | 2019-08-08 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020120104021A KR102008985B1 (en) | 2012-09-19 | 2012-09-19 | Circuit board produced filled with a conductive paste |
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| Country | Link |
|---|---|
| KR (1) | KR102008985B1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160085041A (en) * | 2015-01-07 | 2016-07-15 | 성낙훈 | Fine circuit board and its manufacturing method |
| WO2016137264A1 (en) * | 2015-02-26 | 2016-09-01 | 제이엔씨 주식회사 | Method for manufacturing flexible circuit board having microcircuit, characterized by demolding from master mold, and product obtained thereby |
| CN107219648A (en) * | 2017-06-08 | 2017-09-29 | 京东方科技集团股份有限公司 | A kind of exposure machine board, exposure system and its exposure method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006269557A (en) * | 2005-03-22 | 2006-10-05 | Fuji Photo Film Co Ltd | Method of forming circuit pattern, circuit pattern formed by using same, and laminate |
-
2012
- 2012-09-19 KR KR1020120104021A patent/KR102008985B1/en active IP Right Grant
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006269557A (en) * | 2005-03-22 | 2006-10-05 | Fuji Photo Film Co Ltd | Method of forming circuit pattern, circuit pattern formed by using same, and laminate |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20160085041A (en) * | 2015-01-07 | 2016-07-15 | 성낙훈 | Fine circuit board and its manufacturing method |
| WO2016137264A1 (en) * | 2015-02-26 | 2016-09-01 | 제이엔씨 주식회사 | Method for manufacturing flexible circuit board having microcircuit, characterized by demolding from master mold, and product obtained thereby |
| CN107219648A (en) * | 2017-06-08 | 2017-09-29 | 京东方科技集团股份有限公司 | A kind of exposure machine board, exposure system and its exposure method |
| CN107219648B (en) * | 2017-06-08 | 2020-03-31 | 京东方科技集团股份有限公司 | Exposure machine table, exposure system and exposure method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102008985B1 (en) | 2019-08-08 |
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