CN109587961A - A kind of method that copper is thinned in outer layer - Google Patents
A kind of method that copper is thinned in outer layer Download PDFInfo
- Publication number
- CN109587961A CN109587961A CN201811460809.7A CN201811460809A CN109587961A CN 109587961 A CN109587961 A CN 109587961A CN 201811460809 A CN201811460809 A CN 201811460809A CN 109587961 A CN109587961 A CN 109587961A
- Authority
- CN
- China
- Prior art keywords
- copper
- hole
- thinned
- thickness
- masking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 45
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 44
- 239000010949 copper Substances 0.000 title claims abstract description 44
- 238000000034 method Methods 0.000 title claims abstract description 38
- 238000000227 grinding Methods 0.000 claims abstract description 12
- 230000000873 masking effect Effects 0.000 claims abstract description 9
- 230000005611 electricity Effects 0.000 claims abstract description 5
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims description 2
- 230000003628 erosive effect Effects 0.000 abstract description 6
- 238000009713 electroplating Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Abstract
The object of the present invention is to provide a kind of method that copper is thinned in outer layer, method of the invention realizes that process is: plate electricity → masking hole → half erosion → grinding → outer-layer circuit using half erosion and belt-sanding technique.
Description
Technical field
The invention belongs to printed wiring board manufacture technology fields, and in particular to be hole is contained to outer layer wiring board be thinned
A kind of method of copper.
Background technique
In the manufacturing process of assist side, the bottom copper of 18um, 35um are generallyd use at present, in order to guarantee hole copper thickness foot
Enough, electroplating surface copper thickness is in 30um or more, and outer layer copper thickness is generally in 48um or more.
When using subtractive process production outer-layer circuit, etching solution plays the role of lateral erosion, is merely able to using common method
Make line width/spacing of 75um/75um or more.
In order to produce thinner route and spacing, surface copper thickness needs to be thinned to 35um or less.
Conventional thinned copper is internal layer copper to be thinned using half etching technique, but if directly subtract to outer layer now
Copper, subtracts copper etching solution also and can etch away the copper in hole, and hole copper is also thinned.
There are also a kind of methods using mechanical lapping outer layer copper is thinned, and this method needs to grind many times, and cost is very
The problems such as height, every grinding can only once eliminate the copper of 1-3um, also will cause sheet deformation, uneven thickness.
If made of graphic plating or semi-additive process, due to current distribution is uneven, and thickness can be generated
Degree is uneven, folder film, the problem of burning is electroplated.
Being carried out using filling holes with resin and half etching technique also subtracts copper, this method needs special filling holes with resin machine and again
Type ceramic grinder grind resin, cost are very high.
Summary of the invention
Method of the invention realizes that steps are as follows using half erosion and belt-sanding technique.
Step 1: plate electricity；The substrate for preparing copper to be thinned comes into effect this after reaching hole copper thickness requirement from whole plate plating
Method.
Step 2: masking hole；Dry film masking hole method is used after whole plate plating, using the conventional manufacturing method system of exposure, development
The protection figure for making masking hole protects plated through-hole copper and orifice ring with dry film.
Step 3: half loses；Using half etching technique or normal etch, it is thick to etch away the copper for needing to eliminate.
Step 4: grinding；Copper outstanding on orifice ring is eliminated using amary tape grinding machine.
Step 5: outer-layer circuit；Carry out the conventional process such as outer-layer circuit production.
Detailed description of the invention
Fig. 1 is section flow chart of the invention.
101- substrate copper foil, 102- electroplating surface copper, 201- orifice ring copper outstanding, the hole 301- copper, 302- partly lose rear surface
Copper.
Specific embodiment
To illustrate specific implementation method of the invention, present invention will be described in further detail below with reference to the accompanying drawings.
Process of the invention is: plate electricity → masking hole → half erosion → grinding → outer-layer circuit.
Plate electricity: being exactly whole plate plating, whole plate thickness 1.6mm, 101 thickness 18um of substrate copper foil, 301 electroplating thickness of hole copper
30um, 102 thickness 35um of electroplating surface copper.
Masking hole: pad pasting is carried out using the dry film of common 40um thickness；Only plated through-hole and its orifice ring are exposed, with dry
Film protects plated through-hole；Developed using the parameter normally produced.
Half loses: only with the first segment in five sections of etching machine, etching speed 5m/min, other parameters use normal condition,
The copper thickness requirement etched away is 18 ± 2um, through half erosion 302 average out to 35um of rear surface copper thickness of detection.
Grinding: orifice ring copper 201 outstanding, the parameter of grinding are as follows: sand grains mesh number 600 are ground away using two-sided amary tape grinding machine
Mesh, grinding rate: 2 m/min, grinding pressure: 0.3kg/cm2.
Outer-layer circuit；After processing above, hole copper thickness is 25um or more, surface copper thickness average out to 35um, can be with
For making line width/spacing plate of 50um/50um.
By the processing of the method for the present invention, the thickness of hole copper can be accomplished very big and surface copper thickness accomplishes very little.
Manufacturing process of the invention is simple, directlys adopt equipment possessed by general circuit board plant.
Method of the invention can also be used to be used in blind hole electroplate, on filling perforation electroplate, carry out to outer layer copper thickness
It is thinned.
The present invention is outer layer to be thinned the description of copper method, and the present invention can also be used in laminated plates, blind hole inner cord
On.
Assist side manufacturing field, the present invention will change in specific embodiment and application range, so
The contents of this specification are not to be construed as limiting the invention.
Claims (7)
1. a kind of method that copper is thinned in outer layer, it is characterised in that realized using following steps:
Step 1: plate electricity；
Step 2: masking hole；
Step 3: half loses；
Step 4: grinding；
Step 5: outer-layer circuit.
2. method according to claim 11 step 1, it is characterised in that the substrate for preparing copper to be thinned is reached from whole plate plating
This method is come into effect after requiring to hole copper thickness.
3. method according to claim 11 step 2, it is characterised in that use dry film masking hole method after whole plate plating, use
The protection figure of masking hole is produced in exposure, the conventional manufacturing method to develop, protects plated through-hole copper and orifice ring with dry film.
4. method according to claim 11 step 3, it is characterised in that use half etching technique or normal etch, etch away
The copper for needing to eliminate is thick.
5. method according to claim 11 step 4, it is characterised in that eliminated using amary tape grinding machine outstanding on orifice ring
Copper.
6. method according to claim 11 step 5, it is characterised in that carry out the conventional process such as outer-layer circuit production.
7. according to the method described in claim 1, it is characterized in that laminated plates can also be used in, on blind hole inner cord.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811460809.7A CN109587961A (en) | 2018-12-01 | 2018-12-01 | A kind of method that copper is thinned in outer layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811460809.7A CN109587961A (en) | 2018-12-01 | 2018-12-01 | A kind of method that copper is thinned in outer layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109587961A true CN109587961A (en) | 2019-04-05 |
Family
ID=65925751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811460809.7A Pending CN109587961A (en) | 2018-12-01 | 2018-12-01 | A kind of method that copper is thinned in outer layer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109587961A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113163605A (en) * | 2021-04-21 | 2021-07-23 | 深圳市祺利电子有限公司 | Manufacturing method of high-heat-dissipation aluminum-based circuit board and high-heat-dissipation aluminum-based circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102510668A (en) * | 2011-11-08 | 2012-06-20 | 景旺电子（深圳）有限公司 | Super thick copper PCB plate production method and its circuit board |
| CN106211568A (en) * | 2016-09-20 | 2016-12-07 | 四会富士电子科技有限公司 | A kind of extra thin copper foil material |
| CN108260303A (en) * | 2017-12-05 | 2018-07-06 | 深圳崇达多层线路板有限公司 | The production method that laser drill and back drill hole are filled out in a kind of while plating |
-
2018
- 2018-12-01 CN CN201811460809.7A patent/CN109587961A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102510668A (en) * | 2011-11-08 | 2012-06-20 | 景旺电子（深圳）有限公司 | Super thick copper PCB plate production method and its circuit board |
| CN106211568A (en) * | 2016-09-20 | 2016-12-07 | 四会富士电子科技有限公司 | A kind of extra thin copper foil material |
| CN108260303A (en) * | 2017-12-05 | 2018-07-06 | 深圳崇达多层线路板有限公司 | The production method that laser drill and back drill hole are filled out in a kind of while plating |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113163605A (en) * | 2021-04-21 | 2021-07-23 | 深圳市祺利电子有限公司 | Manufacturing method of high-heat-dissipation aluminum-based circuit board and high-heat-dissipation aluminum-based circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103997862B (en) | Method for manufacturing low-stress low-warping-degree ultrathin odd-layer coreless plate | |
| CN102651946B (en) | Manufacturing process for step circuit of PCB (Printed Circuit Board) | |
| CN104244616B (en) | A kind of preparation method of centreless thin base sheet | |
| CN108617104B (en) | Method for manufacturing printed circuit board with thickened copper local pattern | |
| EP3557957B1 (en) | Wiring substrate, multilayer wiring substrate, and method for manufacturing wiring substrate | |
| CN102523692A (en) | Stepped circuit board manufacturing process | |
| CN104602452B (en) | A kind of preparation method of circuit board | |
| CN103188875A (en) | Super-thick copper diagram manufacturing method and printed circuit board (PCB) provided with super-thick copper diagram | |
| CN104244597B (en) | A kind of preparation method of the coreless substrate of symmetrical structure | |
| US8535546B2 (en) | Method of manufacturing multilayer wiring substrate | |
| CN104837304B (en) | A kind of preparation method of circuit board | |
| CN104902696A (en) | Method of manufacturing copper column on printed circuit board based on wire embedding structure | |
| CN107124830A (en) | A kind of preparation method of FPC soft boards circuit | |
| CN104219876A (en) | Circuit board and manufacture method thereof | |
| CN109587961A (en) | A kind of method that copper is thinned in outer layer | |
| CN205595327U (en) | Centreless package substrate | |
| CN103813637A (en) | Circuit board capable of bearing large currents and processing method thereof | |
| CN103369852B (en) | Containing metal blind slot coated plate top layer pattern-producing method | |
| CN106028682B (en) | A kind of PCB plated hole method | |
| CN102523694B (en) | Method for avoiding substrate exposure during pattern transfer of step circuit boards | |
| CN105530769A (en) | Processing method of printed circuit board and printed circuit board | |
| CN203523145U (en) | Pcb | |
| CN104105354A (en) | Method of manufacturing high-aperture ratio fine printed circuit board | |
| CN104735926B (en) | A kind of filling holes with resin method for circuit board | |
| CN108156770B (en) | A kind of production method and PCB of PCB |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |