CN103369852B - Containing metal blind slot coated plate top layer pattern-producing method - Google Patents
Containing metal blind slot coated plate top layer pattern-producing method Download PDFInfo
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- CN103369852B CN103369852B CN201310168345.3A CN201310168345A CN103369852B CN 103369852 B CN103369852 B CN 103369852B CN 201310168345 A CN201310168345 A CN 201310168345A CN 103369852 B CN103369852 B CN 103369852B
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- blind slot
- top layer
- peelable glue
- containing metal
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Abstract
The invention provides a kind of containing metal blind slot coated plate top layer pattern-producing method, comprise: first step: on the substrate being formed with gold-plated dish, form hole and blind slot, and hole and blind slot are carried out metallizing and electroplating, subsequently top layer clean is carried out to substrate; Second step: utilize protective tapes to be protected by the outer surface that substrate and blind slot have a common boundary, fill peelable glue subsequently in blind slot, to make peelable glue packed height consistent with the plate face horizontal plane of substrate; Third step: remove protective tapes; 4th step: solidification peelable glue; 5th step: perform outer graphics transfer and electroplated Ni/Au process; 6th step: peel off peelable glue.The invention provides a kind of containing metal blind slot coated plate top layer pattern-producing method being solved top layer Graphic transitions and electroplated Ni/Au process metallization blind slot protection problem by good reliability, simple mode.
Description
Technical field
The present invention relates to printed circuit board and manufacture field, more particularly, the present invention relates to a kind of containing metal blind slot coated plate top layer pattern-producing method.
Background technology
Along with electronic product is to the short and small frivolous and integrated future development of multifunction modularization, as the motherboard of mounting related components---PCB(printed circuit board) also require that circuit is meticulousr more intensive, requirement simultaneously more can mount space to components and parts are reserved.
In this context, metallization or non-metallic blind slot is made on printing board PCB surface, discrete device is fixed on blind slot inside so that the technology in the thickness after reducing the attachment of whole printing board PCB or space grows up gradually, especially communication class product gets more and more, and this technology is developed to adapt to the miniaturization of electronic product and multi-functional needs.
Being easier to realize for making containing non-metallic blind slot at present, before usual finished product, adopting the dark blind milling of control; The metallization blind slot level and smooth for regular edges, size is less realizes also very simple, and outer graphics transfer process adopts dry film protection blind slot.
But, in the transfer process of the metallization blind slot coated plate top layer figure comparatively large in size, edge is irregular or gold-plated dish distance blind slot edge is too near, the safeguard measure that there is no.The transfer of the metallization blind slot coated plate top layer figure comparatively large for size, edge is irregular or gold-plated dish distance blind slot edge is too near; employing modes such as protection of taping are infeasible; in fact; current conventional 40 μm of thick dry films can cover regular through hole (groove) or the blind hole (groove) of about 6.0 ~ 8.0mm, cannot cover that size is larger, the irregular through hole of profile (groove) or blind hole (groove).
In the prior art, during the modes such as protection of taping in employing, blind slot usually can be contaminated in the process of electroplated Ni/Au, or in etching process, make blind slot sidewall or bottom copper face disappearance.
Summary of the invention
Technical problem to be solved by this invention is the defect that comparatively large for the size existed in prior art, that edge is irregular or gold-plated dish distance blind slot edge is too near metallization blind slot dry film cannot normally seal, and provides a kind of containing metal blind slot coated plate top layer pattern-producing method being solved top layer Graphic transitions and electroplated Ni/Au process metallization blind slot protection problem by good reliability, simple mode.
According to the present invention, provide a kind of containing metal blind slot coated plate top layer pattern-producing method, it comprises:
First step: form hole and blind slot on the substrate being formed with gold-plated dish, and hole and blind slot are carried out metallizing and electroplating, subsequently top layer clean is carried out to substrate;
Second step: utilize protective tapes to be protected by the outer surface that substrate and blind slot have a common boundary, fill peelable glue subsequently in blind slot, to make peelable glue packed height consistent with the plate face horizontal plane of substrate;
Third step: remove protective tapes;
4th step: solidification peelable glue;
5th step: perform outer graphics transfer and electroplated Ni/Au process;
6th step: peel off peelable glue.
Preferably, in the second step, the peelable glue of filling tangles the sidewall of blind slot, thus the peelable glue of filling is bonding with the sidewall of blind slot.
Preferably, described protective tapes is can not the adhesive tape of cull.
Preferably, described protective tapes is the blue adhesive tape of plating.
Preferably, in the 4th step, according to peelable glue property settings cure parameter.
Preferably, according to the material setting cure parameter of peelable glue spy.
Preferably, in the execution outer graphics transfer of the 5th step and the process of electroplated Ni/Au process, when walking horizontal line, one of the peelable glue that is filled with of substrate is faced up placement.
Solve that the size that exists in prior art is comparatively large, edge is irregular according to containing metal blind slot coated plate top layer of the present invention pattern-producing method or problem that gold-plated dish distance blind slot edge is too near metallization blind slot dry film cannot normally seal, make it possible in the transfer process of comparatively large in size, that edge is irregular or gold-plated dish distance blind slot edge is too near metallization blind slot coated plate top layer figure, achieve top layer Graphic transitions and electroplated Ni/Au process by protective tapes and the good reliability coordinated of peelable glue, simple mode and to metallize blind slot protection; Under containing metal blind slot top layer trough rim partially plating gold or the gold-plated condition of whole plate, blind slot protection of metallizing in the line pattern manufacturing process of top layer can be realized thus.
Accompanying drawing explanation
By reference to the accompanying drawings, and by reference to detailed description below, will more easily there is more complete understanding to the present invention and more easily understand its adjoint advantage and feature, wherein:
Fig. 1 schematically shows the flow chart of containing metal blind slot coated plate top layer pattern-producing method according to the preferred embodiment of the invention.
Fig. 2 schematically shows the schematic top plan view of containing metal blind slot coated plate top layer pattern-producing method according to the preferred embodiment of the invention.
Fig. 3 schematically shows the schematic cross-section after the second step of containing metal blind slot coated plate top layer pattern-producing method according to the preferred embodiment of the invention.
Fig. 4 schematically shows the schematic cross-section of containing metal blind slot coated plate top layer pattern-producing method according to the preferred embodiment of the invention.
It should be noted that, accompanying drawing is for illustration of the present invention, and unrestricted the present invention.Note, represent that the accompanying drawing of structure may not be draw in proportion.Further, in accompanying drawing, identical or similar element indicates identical or similar label.
Embodiment
In order to make content of the present invention clearly with understandable, below in conjunction with specific embodiments and the drawings, content of the present invention is described in detail.
Fig. 1 schematically shows the flow chart of containing metal blind slot coated plate top layer pattern-producing method according to the preferred embodiment of the invention.
Specifically, as shown in Figure 1, containing metal blind slot coated plate top layer pattern-producing method comprises according to the preferred embodiment of the invention:
First step S1: form hole 10 and blind slot 20 on the substrate 100 being formed with gold-plated dish 30, and hole 10 and blind slot 20 are carried out metallizing and electroplating, subsequently top layer clean is carried out to substrate 100;
Specifically, such as, as shown in Figure 2, in first step S1,10 and control dark milling blind slot 20 can be holed on the substrate 100 being formed with gold-plated dish 30, then hole 10 is carried out together with blind slot 20 metallizing and electroplating thickening, subsequently top layer clean is carried out to substrate 100;
Second step S2: utilize protective tapes to be protected by the outer surface that substrate 100 and blind slot 20 are had a common boundary, fill peelable glue 50 subsequently in blind slot 20, to make the packed height of peelable glue 50 consistent with the plate face horizontal plane of substrate 100, as shown in Figure 3;
Preferably, as shown in Figure 3, in second step S2, the peelable glue 50 of filling tangles the sidewall of blind slot 20, and the peelable glue 50 of namely filling is bonding with the sidewall of blind slot 20;
In second step S2, operating process should be noted following 2 points:
(1) preferably adopt before filling out peelable glue and can not the adhesive tape (as electroplated blue adhesive tape) of cull the outer surface had a common boundary with blind slot be protected, and then print peelable glue, pollute gold-plated dish to prevent peelable glue spilling blind slot;
(2) peelable glue packed height is consistent with plate face horizontal plane, is not higher or lower than plate face, thus is conducive to follow-up pad pasting;
Wherein, peelable glue is a kind of high polymer of liquid state, and meeting curing molding after overbaking, is very easy to peel off from body surface and can not leave a trace.
Third step S3: remove protective tapes; Such as, protective tapes can be torn off;
Specifically, third step S3 is that peelable glue 50 tears protective tapes off before solidifying after print peelable glue; Thus prevent bake process protective tapes cull from staying on gold-plated dish and causing pad in follow-up electrogilding process cannot go up gold;
4th step S4: solidification peelable glue 50; Wherein preferably, cure parameter can be set according to peelable glue characteristic (such as, the material of peelable glue spy);
5th step S5: perform outer graphics transfer and electroplated Ni/Au process;
Specifically, in the 5th step S5, conventional outer graphics transfer and electroplated Ni/Au flow process can be performed.
Preferably, in the execution outer graphics transfer of the 5th step S5 and the process of electroplated Ni/Au process, the honed journey of brusher is avoided away in pad pasting pre-treatment, can walk chemical microetch process.
And, preferably in the execution outer graphics transfer of the 5th step S5 and the process of electroplated Ni/Au process, when walking horizontal line (, when substrate 100 is processed in the mode of horizontal arrangement, in other words, as shown in Figure 4, when the installed surface of the components and parts 40 of substrate 100 is in horizontal plane) one of the peelable glue that is filled with of substrate 100 is faced up placement as far as possible, thus effectively can reduce peelable glue and to come off risk;
6th step S6: peel off peelable glue 50.
Thus, to solve the size existed in prior art larger for containing metal blind slot coated plate top layer pattern-producing method according to the preferred embodiment of the invention, edge is irregular, or gold-plated dish distance blind slot edge too near the metallization blind slot dry film problem that cannot normally seal, make it possible in size larger, in the transfer process of the metallization blind slot coated plate top layer figure that edge is irregular or gold-plated dish distance blind slot edge is too near, by the good reliability that coordinate of protective tapes with peelable glue, simple mode achieves top layer Graphic transitions and electroplated Ni/Au process metallization blind slot protection, under containing metal blind slot top layer trough rim partially plating gold or the gold-plated condition of whole plate, blind slot protection of metallizing in the line pattern manufacturing process of top layer can be realized thus.
In addition, it should be noted that, unless otherwise indicated, otherwise the term " first " in specification, " second ", " the 3rd " etc. describe only for distinguishing each assembly, element, step etc. in specification, instead of for representing logical relation between each assembly, element, step or ordinal relation etc.
Be understandable that, although the present invention with preferred embodiment disclose as above, but above-described embodiment and be not used to limit the present invention.For any those of ordinary skill in the art, do not departing under technical solution of the present invention ambit, the technology contents of above-mentioned announcement all can be utilized to make many possible variations and modification to technical solution of the present invention, or be revised as the Equivalent embodiments of equivalent variations.Therefore, every content not departing from technical solution of the present invention, according to technical spirit of the present invention to any simple modification made for any of the above embodiments, equivalent variations and modification, all still belongs in the scope of technical solution of the present invention protection.
Claims (6)
1. a containing metal blind slot coated plate top layer pattern-producing method, is characterized in that comprising:
First step: form hole and blind slot on the substrate being formed with gold-plated dish, and hole and blind slot are carried out metallizing and electroplating, subsequently top layer clean is carried out to substrate;
Second step: utilize protective tapes to be protected by the outer surface that substrate and blind slot have a common boundary, fill peelable glue subsequently in blind slot, to make peelable glue packed height consistent with the plate face horizontal plane of substrate;
Third step: remove protective tapes;
4th step: solidification peelable glue;
5th step: perform outer graphics transfer and electroplated Ni/Au process;
6th step: peel off peelable glue,
In the second step, the peelable glue of filling tangles the sidewall of blind slot, thus the peelable glue of filling is bonding with the sidewall of blind slot.
2. containing metal blind slot coated plate top layer according to claim 1 pattern-producing method, is characterized in that, described protective tapes is can not the adhesive tape of cull.
3. containing metal blind slot coated plate top layer according to claim 1 pattern-producing method, is characterized in that, described protective tapes is the blue adhesive tape of plating.
4. containing metal blind slot coated plate top layer according to claim 1 pattern-producing method, is characterized in that, in the 4th step, according to peelable glue property settings cure parameter.
5. containing metal blind slot coated plate top layer according to claim 1 pattern-producing method, is characterized in that, according to the material setting cure parameter of peelable glue spy.
6. containing metal blind slot coated plate top layer according to claim 1 pattern-producing method, it is characterized in that, in the execution outer graphics transfer of the 5th step and the process of electroplated Ni/Au process, when walking horizontal line, one of the peelable glue that is filled with of substrate is faced up placement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310168345.3A CN103369852B (en) | 2013-05-08 | 2013-05-08 | Containing metal blind slot coated plate top layer pattern-producing method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310168345.3A CN103369852B (en) | 2013-05-08 | 2013-05-08 | Containing metal blind slot coated plate top layer pattern-producing method |
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| CN103369852A CN103369852A (en) | 2013-10-23 |
| CN103369852B true CN103369852B (en) | 2016-01-13 |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104968164B (en) * | 2015-07-03 | 2018-07-06 | 深圳市景旺电子股份有限公司 | A kind of rigid-flexible combination PCB plate production method |
| CN104924725B (en) * | 2015-07-03 | 2018-01-30 | 深圳市迅捷兴科技股份有限公司 | Blind slot plate compression method |
| CN107613644B (en) * | 2017-09-18 | 2019-09-17 | Oppo广东移动通信有限公司 | Circuit board, electronic equipment and packaging method |
| CN112087874B (en) * | 2020-08-24 | 2021-09-14 | 珠海杰赛科技有限公司 | Method for manufacturing blind slot plate |
| CN112969290B (en) * | 2021-02-02 | 2023-01-03 | 珠海杰赛科技有限公司 | Manufacturing process of PCB upper hole |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101662893A (en) * | 2009-09-04 | 2010-03-03 | 东莞美维电路有限公司 | Manufacturing method for printed wiring board with dense disk holes |
| CN101977486A (en) * | 2010-10-29 | 2011-02-16 | 东莞红板多层线路板有限公司 | Method for manufacturing via stubs of circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006278774A (en) * | 2005-03-29 | 2006-10-12 | Hitachi Cable Ltd | Double-sided wiring board, method for manufacturing the same and base substrate thereof |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101662893A (en) * | 2009-09-04 | 2010-03-03 | 东莞美维电路有限公司 | Manufacturing method for printed wiring board with dense disk holes |
| CN101977486A (en) * | 2010-10-29 | 2011-02-16 | 东莞红板多层线路板有限公司 | Method for manufacturing via stubs of circuit board |
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| CN103369852A (en) | 2013-10-23 |
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