CN202712256U - LED packaging structure - Google Patents
LED packaging structure Download PDFInfo
- Publication number
- CN202712256U CN202712256U CN2012202686252U CN201220268625U CN202712256U CN 202712256 U CN202712256 U CN 202712256U CN 2012202686252 U CN2012202686252 U CN 2012202686252U CN 201220268625 U CN201220268625 U CN 201220268625U CN 202712256 U CN202712256 U CN 202712256U
- Authority
- CN
- China
- Prior art keywords
- conductive hole
- wiring board
- copper foil
- circuit board
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
Abstract
The utility model relates to the LED field, particularly to an LED packaging structure. The LED packaging structure comprises a circuit board distributed with electronic circuits, wafers arranged upon the circuit board, and a lead electrically connecting the wafers with the electronic circuit upon the circuit board. The circuit board is further provided with conductive holes, wherein the inner wall of the conductive hole is provided with a copper foil; the copper foil extends to the periphery of the upper edge of the conductive hole to connect with the electronic circuit upon the circuit board; the copper foil extends to the periphery of the lower edge of the conductive hole to connect with a pad arranged at the bottom of the circuit board; and the conductive hole is plugged with resin. The LED packaging structure of the utility model makes an improvement for the conventional LED packaging structure which conductive hole is a through hole. Therefore, the problem that the colloid overflows to the pad position at the back side of the circuit board via the conductive hole during the process of injection moulding glues and pouring packaging of the wafer and the lead can be avoided, thereby ensuring the welding stability of the pad.
Description
Technical field
The utility model belongs to the LED field, relates in particular to a kind of LED encapsulating structure.
Background technology
Existing LED encapsulating structure, it is the electrode of LED wafer by the electronic circuit on lead-in wire and the wiring board to be connected being provided with on the wiring board of electronic circuit that a kind of mode is arranged, and then pass through in the circuit board fluid die compression technology injection moulding encapsulating with wafer, the coatings such as lead-in wire are encapsulated, form monomer LED, this kind encapsulating structure does not arrange special leg to be come and other substrate welding, but come and the substrate welding by the pad that is arranged on the wiring board bottom, and the conducting of the electronic circuit on pad and the wiring board is to finish by the conductive hole of being located on the wiring board, the conductive hole inwall is with one deck Copper Foil, and the Copper Foil that this Copper Foil extends to around the top edge of conductive hole with the wiring board upper surface joins, the lower limb and the pad that extend to conductive hole join.But the conductive hole of existing encapsulating structure is through-hole structure, and this is in this operation of injection moulding encapsulating encapsulated wafer, lead-in wire, and colloid can overflow to pad locations then by conductive hole overflow to the wiring board back side, then will have influence on the welding of LED and substrate.
The utility model content
The purpose of this utility model is to overcome above-mentioned the deficiencies in the prior art, and a kind of LED encapsulating structure of filling holes with resin is provided, and can prevent that colloid from passing through conductive hole overflow to pad locations and affecting welding.
The utility model is achieved in that a kind of LED encapsulating structure, comprise a wiring board that is furnished with electronic circuit, be located at wafer on the described wiring board, be electrically connected the lead-in wire of the electronic circuit on described wafer and the described wiring board, also be provided with conductive hole on this wiring board, described conductive hole inwall is provided with Copper Foil, described Copper Foil extends to the top edge location about of conductive hole and is connected with electronic circuit on the described wiring board, the lower limb location about that described Copper Foil extends to conductive hole is connected with the pad of being located at the wiring board bottom, is plugged with resin in the described conductive hole.
Particularly, described wafer is three kinds of wafers of red, green, blue, and three kinds of wafers of described red, green, blue are in one line.
Particularly, also be provided with the colloid coating layer that described wafer, lead-in wire are coated on the described wiring board.
Particularly, its upper surface and lower surface all were coated with copper foil layer after described conductive hole clogged with resin.
The LED encapsulating structure that the utility model provides, it is by clogging conductive hole, can prevent the colloid overflow to the wiring board back side then overflow affect welding to pad locations, thereby improved the welding stability of LED, and then guarantee the stability of the use of LED lamp.
Description of drawings
Fig. 1 is the LED encapsulating structure front view that the utility model embodiment provides;
Fig. 2 is the LED encapsulating structure upward view that the utility model embodiment provides;
Fig. 3 is the LED encapsulating structure rearview that the utility model embodiment provides;
Fig. 4 is the conductive hole part-structure schematic diagram that the utility model embodiment provides.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explaining the utility model, and be not used in restriction the utility model.
Shown in Fig. 1-4, the LED encapsulating structure that provides for the utility model embodiment, comprise a wiring board 1 that is furnished with electronic circuit, be located at wafer 2 on the wiring board 1, be electrically connected the lead-in wire 3 of the electronic circuit on wafer 2 and the wiring board 1, also be provided with conductive hole 11 on the wiring board 1, conductive hole 11 inwalls are provided with Copper Foil 110,1 electronic circuit is connected on the top edge location about that Copper Foil 110 extends to conductive hole 11 and the wiring board, the lower limb location about that Copper Foil extends to conductive hole is connected with the pad 12 of being located at wiring board 1 bottom, is plugged with resin 111 in the conductive hole 11.The LED encapsulating structure that the present embodiment provides, because conductive hole is blocked and clogs, therefore when carrying out the injection moulding encapsulating with this procedure of wafer, lead packages, colloid can not overflow to the position of the pad 12 at wiring board 1 back side, therefore the stability in the time of can guaranteeing LED with the substrate welding that needs welding.
Wafer 2 is three kinds of wafers of red, green, blue, and these three kinds of wafers are in one line, and by three former primary colours principles, these three kinds of wafers can derive multiple different glow color.
Also be provided with colloid coating layer 4 on the wiring board 1, colloid coating layer 4 envelopes described wafer, lead-in wire, and the material of colloid coating layer 4 can be selected epoxide-resin glue or silica gel etc.
Its upper surface and lower surface all were coated with copper foil layer 112 after conductive hole 11 usefulness resins clogged.Copper foil layer 112 separates to prevent the colloid adhesion in the melting colloid and conductive hole when encapsulating encapsulated wafer, the lead-in wire with the resin in the conductive hole and affects the optical parameter of LED.
The above only is preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of within spirit of the present utility model and principle, doing, be equal to and replace or improvement etc., all should be included within the protection range of the present utility model.
Claims (4)
1. LED encapsulating structure, it is characterized in that: comprise a wiring board that is furnished with electronic circuit, be located at wafer on the described wiring board, be electrically connected the lead-in wire of the electronic circuit on described wafer and the described wiring board, also be provided with conductive hole on this wiring board, described conductive hole inwall is provided with Copper Foil, described Copper Foil extends to the top edge location about of conductive hole and is connected with electronic circuit on the described wiring board, the lower limb location about that described Copper Foil extends to conductive hole is connected with the pad of being located at the wiring board bottom, is plugged with resin in the described conductive hole.
2. LED encapsulating structure as claimed in claim 1 is characterized in that, described wafer is three kinds of wafers of red, green, blue, and three kinds of wafers of described red, green, blue are in one line.
3. LED encapsulating structure as claimed in claim 1 is characterized in that, also is provided with the colloid coating layer that described wafer, lead-in wire are coated on the described wiring board.
4. LED encapsulating structure as claimed in claim 1 is characterized in that, its upper surface and lower surface all were coated with copper foil layer after described conductive hole clogged with resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202686252U CN202712256U (en) | 2012-06-08 | 2012-06-08 | LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202686252U CN202712256U (en) | 2012-06-08 | 2012-06-08 | LED packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202712256U true CN202712256U (en) | 2013-01-30 |
Family
ID=47592528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012202686252U Expired - Lifetime CN202712256U (en) | 2012-06-08 | 2012-06-08 | LED packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202712256U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106195659A (en) * | 2016-07-27 | 2016-12-07 | 佛山市国星光电股份有限公司 | A kind of COB light source and integration module and light fixture |
-
2012
- 2012-06-08 CN CN2012202686252U patent/CN202712256U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106195659A (en) * | 2016-07-27 | 2016-12-07 | 佛山市国星光电股份有限公司 | A kind of COB light source and integration module and light fixture |
| CN106195659B (en) * | 2016-07-27 | 2020-03-20 | 佛山市国星光电股份有限公司 | COB light source, integrated module and lamp |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104282698A (en) | Two-stage packaging method for image sensor | |
| CN102916112A (en) | Large power LED and manufacturing method thereof | |
| CN104919586A (en) | Module and method for producing same | |
| CN208158980U (en) | A kind of welt double step groove pcb board structure for bare chip test | |
| CN202712256U (en) | LED packaging structure | |
| CN103762200B (en) | Chip package and method for packing thereof | |
| CN206341477U (en) | A kind of wiring board for being used to plate sectional golden finger | |
| CN107833960A (en) | A kind of LED support and its manufacture method with overflow ducts and overflow launder | |
| CN207868224U (en) | A kind of more glasss of LED COB display screen modules | |
| CN103022327B (en) | LED encapsulation structure and preparation method thereof | |
| CN205385603U (en) | MEMS microphone | |
| CN205211727U (en) | Fingerprint identification multi -chip packaging structure | |
| CN104600175B (en) | Flip LED substrate component and flip LED packing component | |
| CN209981213U (en) | LED device | |
| CN107681037A (en) | A kind of method for packing of the close display LED light source component of achievable superelevation | |
| CN204375733U (en) | A kind of Double-lead-frame | |
| CN210628280U (en) | Integrated chip packaging structure | |
| CN106952990A (en) | A kind of chip-scale LED package device and its manufacture craft | |
| CN202308021U (en) | Circuit board type surface mounted light emitting diode | |
| CN207637774U (en) | A kind of novel semi-conductor encapsulating structure, SAW filter and terminal device | |
| CN203118983U (en) | Lens forming facilitated LED lamp bead | |
| CN207217587U (en) | A kind of indoor display LED component encapsulating structure of high-contrast | |
| CN203104949U (en) | Double-sided PCB (Printed Circuit Board) | |
| CN203562420U (en) | A semiconductor package piece | |
| CN205828419U (en) | A kind of stereoscopic circuit board encapsulation module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130130 |