CN104924725B - Blind slot plate compression method - Google Patents
Blind slot plate compression method Download PDFInfo
- Publication number
- CN104924725B CN104924725B CN201510383418.XA CN201510383418A CN104924725B CN 104924725 B CN104924725 B CN 104924725B CN 201510383418 A CN201510383418 A CN 201510383418A CN 104924725 B CN104924725 B CN 104924725B
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- CN
- China
- Prior art keywords
- blind slot
- glue
- slot plate
- plate
- filaments
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
Abstract
The invention provides a kind of blind slot plate compression method, including：Step 1, a resistance glue buffer film is placed respectively in the both sides up and down of blind slot plate so as to obtain the first nonwoven fabric from filaments, and resistance glue buffer film includes successively compound the first mould release membrance, epoxide-resin glue and the second mould release membrance from top to bottom；Step 2, the first nonwoven fabric from filaments is pressed using press, so that the epoxide-resin glue in two resistance glue buffer films fills the blind slot on blind slot plate after melting and curing molding is to reach the purpose of resistance glue, makes to overflow without glue mark in blind slot；Step 3, the first nonwoven fabric from filaments after pressing is taken out, tears the resistance glue buffer film on blind slot plate upper and lower surface.The present invention can effectively prevent High Flowability PP and not flow PP glue overflow amount, effective improving production efficiency.
Description
Technical field
The present invention relates to circuit board manufacturing area, more particularly to a kind of blind slot plate compression method.
Background technology
In PCB industries, when blind slot plate, Rigid Flex open window making, all need to use and do not flow PP, but do not flow PP and exist
It is always difficult point in the industry the problem of glue overflow amount size in bonding processes, the persistent ailment that can not thoroughly effect a radical cure.Prior art is present
Following shortcoming：(1) processing is cumbersome, and blind slot edge can not effectively control excessive glue problem；(2) high processing costs, batch production are difficult.
The content of the invention
The invention provides one kind can effectively prevent glue overflow amount, the blind slot plate compression method of improving production efficiency.
To solve the above problems, as one aspect of the present invention, there is provided a kind of blind slot plate compression method, including：Step
Rapid 1, a resistance glue buffer film is placed respectively in the both sides up and down of blind slot plate so as to obtain the first nonwoven fabric from filaments, and resistance glue buffer film includes
From top to bottom compound the first mould release membrance, epoxide-resin glue and the second mould release membrance successively；Step 2, using press to the first stratiform
Thing is pressed, so that the blind slot on blind slot plate is filled and be solidified into after melting by the epoxide-resin glue in two resistance glue buffer films
Type makes to overflow without glue mark in blind slot to reach the purpose of resistance glue；Step 3, the first nonwoven fabric from filaments after pressing is taken out, tears blind slot plate
Resistance glue buffer film on upper and lower surface.
Preferably, also include before step 1 on the chassis of press, put brown paper and steel plate well, placed on steel plate
One copper foil, the first nonwoven fabric from filaments are placed on copper foil.
Preferably, also include between step 1 and 2, a copper foil is placed in the top of blind slot plate.
Preferably, " the first nonwoven fabric from filaments is pressed using press " in step 2 is included：Copper foil in the top of blind slot plate
Steel plate is placed above, covers the lid on chassis, the chassis sequenced is sent into press, carries out high temperature, high pressure pressing.
The present invention can effectively prevent High Flowability PP and not flow PP glue overflow amount, effective improving production efficiency.
Brief description of the drawings
Fig. 1 schematically shows the structural representation of resistance glue buffer film；
Fig. 2 schematically shows the structural representation of the first nonwoven fabric from filaments before pressing.
Reference in figure：1st, blind slot plate；2nd, glue buffer film is hindered；3rd, the first mould release membrance；4th, epoxide-resin glue；5th, second from
Type film；6th, blind slot；7th, the first core plate；8th, PP plates；9th, the second core plate.
Embodiment
Embodiments of the invention are described in detail below in conjunction with accompanying drawing, but the present invention can be defined by the claims
Implement with the multitude of different ways of covering.
Fig. 1 please be provide to Fig. 2, there is provided a kind of blind slot plate compression method, including：Step 1, up and down the two of blind slot plate 1
A resistance glue buffer film 2 is placed so as to obtain the first nonwoven fabric from filaments in side respectively, and resistance glue buffer film includes compound from top to bottom successively
First mould release membrance 3, the mould release membrance 5 of epoxide-resin glue 4 and second；Step 2, the first nonwoven fabric from filaments is pressed using press, so that
Epoxide-resin glues 4 in two resistance glue buffer films fill the blind slot 6 on blind slot plate 1 after melting and curing molding is to reach resistance glue
Purpose, make to overflow without glue mark in blind slot；Step 3, the first nonwoven fabric from filaments after pressing is taken out, is torn on the upper and lower surface of blind slot plate 1
Resistance glue buffer film.
Because the upper and lower surface for hindering glue buffer film is mould release membrance, it is only necessary to gently one tear and can take off, thus, on the one hand
It can reach buffering, balance pressure, it is often more important that may also function as the effect of resistance glue, reach the effect finally wanted.
In blind slot plate or Rigid Flex bonding processes, hinder the chance high temperature of the epoxy resin in glue buffer film and start to melt,
And flowed at blind slot.Under ambient pressure, resin can be filled up completely with blind slot part, and solidify under continuous high temperature,
It has been finally reached the effect of resistance glue.Need to ensure after pressing to overflow without glue mark in blind slot, and figure is complete in groove, and blind slot is due to outer
Layer has mould release membrance, therefore, can be separated with blind slot plate, does not stick to together, with journey is simple, workable, production cost is low
The characteristics of.
It can be seen that the present invention can effectively prevent High Flowability PP and not flow PP glue overflow amount, effective lifting production
Efficiency.
In one embodiment, blind slot plate 1 includes the first core plate 7, the core plate 9 of PP plates 8 and second, wherein, the first core plate 7
Both sides have PP plates 8 respectively, have the second core plate 9 in the outside of PP plates 8.
Preferably, also include before step 1 on the chassis of press, put brown paper and steel plate well, placed on steel plate
One copper foil, the first nonwoven fabric from filaments are placed on copper foil.So, the resin that can prevent from hindering above glue buffer film is flow on steel plate,
It is bonded together.
Preferably, also include between step 1 and 2, a copper foil is placed in the top of blind slot plate 1.
Preferably, " the first nonwoven fabric from filaments is pressed using press " in step 2 is included：Copper in the top of blind slot plate 1
Steel plate is placed above in paper tinsel, covers the lid on chassis, and the chassis sequenced is sent into press, carries out high temperature, high pressure pressing.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention, for the skill of this area
For art personnel, the present invention can have various modifications and variations.Within the spirit and principles of the invention, that is made any repaiies
Change, equivalent substitution, improvement etc., should be included in the scope of the protection.
Claims (4)
- A kind of 1. blind slot plate compression method, it is characterised in that including：Step 1, a resistance glue buffer film (2) is placed respectively in the both sides up and down of blind slot plate (1) so as to obtain the first nonwoven fabric from filaments, institute Stating resistance glue buffer film includes successively compound the first mould release membrance (3), epoxide-resin glue (4) and the second mould release membrance (5) from top to bottom, The blind slot plate (1) includes the first core plate (7), PP plates (8) and the second core plate (9), wherein, the both sides of first core plate (7) There is a PP plate (8) respectively, second core plate (9) is provided with the outside of each PP plates (8)；Step 2, first nonwoven fabric from filaments is pressed using press, so that the epoxy resin in described two resistance glue buffer films By the blind slot filling on the blind slot plate (1), simultaneously curing molding to reach the purpose of resistance glue, makes in blind slot without glue after glue (4) melts Mark overflows；Step 3, the first nonwoven fabric from filaments after pressing is taken out, tears the resistance glue buffer film on blind slot plate (1) upper and lower surface.
- 2. blind slot plate compression method according to claim 1, it is characterised in that be additionally included in press before step 1 On chassis, brown paper and steel plate being put well, a copper foil being placed on steel plate, first nonwoven fabric from filaments is placed on the copper foil.
- 3. blind slot plate compression method according to claim 2, it is characterised in that also include between step 1 and 2, in institute Place a copper foil in the top for stating blind slot plate (1).
- 4. blind slot plate compression method according to claim 3, it is characterised in that using press to described in the step 2 First nonwoven fabric from filaments, which carries out pressing, to be included：Steel plate is placed above in copper foil in the top of the blind slot plate (1), covers the lid on the chassis, the chassis sequenced is sent Enter in press, high temperature, high pressure pressing are carried out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510383418.XA CN104924725B (en) | 2015-07-03 | 2015-07-03 | Blind slot plate compression method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510383418.XA CN104924725B (en) | 2015-07-03 | 2015-07-03 | Blind slot plate compression method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104924725A CN104924725A (en) | 2015-09-23 |
| CN104924725B true CN104924725B (en) | 2018-01-30 |
Family
ID=54112286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510383418.XA Active CN104924725B (en) | 2015-07-03 | 2015-07-03 | Blind slot plate compression method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104924725B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201015913Y (en) * | 2007-01-15 | 2008-02-06 | 夏超华 | Rubber-resisted film for FPC soft board quick-pressing |
| CN101616542A (en) * | 2008-06-26 | 2009-12-30 | 华通电脑股份有限公司 | Flexible-rigid compound circuit board and manufacture method thereof with peelable protective layer |
| CN103369852A (en) * | 2013-05-08 | 2013-10-23 | 无锡江南计算技术研究所 | Manufacturing method for metallization blind slot-contained gold-plating plate surface pattern |
| CN204296158U (en) * | 2014-07-23 | 2015-04-29 | 昆山正金电子有限公司 | For the compound adhesive block film of multilayer circuit board high temperature process |
-
2015
- 2015-07-03 CN CN201510383418.XA patent/CN104924725B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201015913Y (en) * | 2007-01-15 | 2008-02-06 | 夏超华 | Rubber-resisted film for FPC soft board quick-pressing |
| CN101616542A (en) * | 2008-06-26 | 2009-12-30 | 华通电脑股份有限公司 | Flexible-rigid compound circuit board and manufacture method thereof with peelable protective layer |
| CN103369852A (en) * | 2013-05-08 | 2013-10-23 | 无锡江南计算技术研究所 | Manufacturing method for metallization blind slot-contained gold-plating plate surface pattern |
| CN204296158U (en) * | 2014-07-23 | 2015-04-29 | 昆山正金电子有限公司 | For the compound adhesive block film of multilayer circuit board high temperature process |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104924725A (en) | 2015-09-23 |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: Baoan District manhole Street sand Shenzhen city 518000 four Guangdong province Dongbao Industrial Zone No. H building, the first floor of building G, Room 203, floor two floor Applicant after: Shenzhen City Xing Xing Polytron Technologies Inc Address before: Baoan District manhole Street sand Shenzhen city Guangdong province 518000 Industrial Zone No. four Dongbao building H Applicant before: Shenzhen Xunjiexing Circuit Tech Co., Ltd. |
|
| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Zhang Rende Inventor after: Hu Xianjin Inventor after: Liu Yangyang Inventor after: Wang Yixiong Inventor before: Ma Zhuo Inventor before: Liu Yangyang Inventor before: Wang Yixiong |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |