CN108221477A - A kind of flexible circuit board pressing resistance glue release paper and preparation method thereof - Google Patents
A kind of flexible circuit board pressing resistance glue release paper and preparation method thereof Download PDFInfo
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- CN108221477A CN108221477A CN201611130463.5A CN201611130463A CN108221477A CN 108221477 A CN108221477 A CN 108221477A CN 201611130463 A CN201611130463 A CN 201611130463A CN 108221477 A CN108221477 A CN 108221477A
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- layer
- release
- glue
- paper
- circuit board
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Classifications
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- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H23/00—Processes or apparatus for adding material to the pulp or to the paper
- D21H23/02—Processes or apparatus for adding material to the pulp or to the paper characterised by the manner in which substances are added
- D21H23/22—Addition to the formed paper
- D21H23/50—Spraying or projecting
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/10—Homopolymers or copolymers of propene
- C09J123/12—Polypropene
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H19/00—Coated paper; Coating material
- D21H19/10—Coatings without pigments
- D21H19/14—Coatings without pigments applied in a form other than the aqueous solution defined in group D21H19/12
- D21H19/20—Coatings without pigments applied in a form other than the aqueous solution defined in group D21H19/12 comprising macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- D21H19/22—Polyalkenes, e.g. polystyrene
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H25/00—After-treatment of paper not provided for in groups D21H17/00 - D21H23/00
- D21H25/04—Physical treatment, e.g. heating, irradiating
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H27/00—Special paper not otherwise provided for, e.g. made by multi-step processes
- D21H27/18—Paper- or board-based structures for surface covering
- D21H27/20—Flexible structures being applied by the user, e.g. wallpaper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a kind of flexible circuit board pressing resistance glue release papers, including original paper layer, mixed glue layer and release layer, release layer is the release layer containing TPX, mixed glue layer is the gluing oxidant layer containing EMMA, the vicat softening temperature of folded structure that mixed glue layer and release layer are formed is 150 170 DEG C, the temperature of FPC process for pressing is generally at 160 180 DEG C at present, in bonding processes, the release paper of the present invention can fully soften, and the pit and corner along PCB surface are stayed and are close to, filling and fitting effect are good, play splendid resistance glue effect, and have the advantages that levelability is good and easily removes, it is not siliceous simultaneously, plasticizer and halogen, environmental protection, removing rear flexible PCB, there is no the problem of secondary pollution.
Description
Technical field
The present invention relates to release paper and its preparing technical field, more particularly to a kind of flexible circuit board (FPC) soon use by pressing
Resistance glue release paper.
Background technology
Flexible circuit board (Flexible Printed Circuit Board) referred to as " soft board ", FPC is commonly called as in industry, is had
The advantages of not having there are many rigid printed wiring board, such as it can be with free bend, winding, folding.It can be contracted significantly using FPC
The volume of small electronic product is applicable in the needs that electronic product develops to high density, miniaturization, highly reliable direction.Therefore, FPC exists
It is obtained on the fields such as space flight, military affairs, mobile communication, laptop computer, computer peripheral equipment, palm PC and digital camera or product
It is widely applied.
FPC is mainly formed by flexible copper clad substrate and protective film through high-temperature laminating, and protective film is a kind of coated with sticker
Heat resistant resin film, for insulate and circuit protection.To avoid bonding processes center platen and flexible circuit board that bonding or damage occurs
Bad, the sticker for ensureing to melt out by high temperature does not damage flexible circuit board, and separate layer need to be set between pressing plate and flexible circuit board,
To ensure the quality of product in hot pressing, separate layer is flexible circuit board pressing release paper (film), it is desirable that in hot pressing
The middle sticker for ensureing to overflow is not bonded on flexible copper clad substrate, and detached very well with flexible circuit board after pressing.
Current release paper is mostly PET release papers, i.e., the compound thin film layer (CPP or PET) on body paper or middle layer,
One layer of silicone oil mould release of re-coating is formed, and above-mentioned described soft board is pressed soon with release paper, as depicted in figs. 1 and 2, is pressed with FPC
Afterwards, release and resistance glue poor performance is simultaneously difficult to control, and easy excessive glue is simultaneously remained on except the exposed circuit of need, causes short circuit or welding
It is bad；For above-mentioned excessive glue situation, circuit is removed by the way of chemical agent, plasma-based slagging-off or frosted removal mostly at present
The part glue on surface, not only time-consuming, increase cost, and also yield is relatively low；And the silicone oil of PET release papers A100 is release
Oxidant layer adherence is excessive, and there are residue glues when removing, and secondary pollution can be caused to wiring board, and need artificial removing, can increase
Cost, while surface is siliceous, pollutes environment.
To overcome the above disadvantages, the positive research and innovation of the designer, it is fast to create a kind of flexible circuit board (FPC)
The resistance glue release paper that ram compression shares.
Invention content
The invention mainly solves the technical problem of providing a kind of flexible circuit board pressing resistance glue release papers, not only have
The advantages of resistance colloidality can be good, glue-line flow uniformity is good and easily removes, while not siliceous, environmental protection, and flexible circuit board will not
There are problems that secondary pollution.
In order to solve the above technical problems, one aspect of the present invention is：Including original paper layer, mixed glue layer
And release layer, the mixed glue layer are formed in the body paper layer surface, the release layer is formed in the mixed glue
Layer upper surface, and the mixed glue layer is bonded the original paper layer and the release layer；
The release layer is made (by weight percentage) of following raw material：
TPX：70%-100%；
PP：0%-30%；
The mixed glue layer is made (by weight percentage) of following raw material：
TPX：10%-30%；
PP：40%-70%；
EMMA：5%-15%；
PE：5%-15%.
In order to solve the above technical problems, the further technical solution that the present invention uses is：
The vicat softening temperature of folded structure that the mixed glue layer and the release layer are formed is 150-170 DEG C.
It further says, the thickness of the mixed glue layer is 15-70 μm.
It further says, the thickness of the original paper layer is 60-180 μm.
It further says, the thickness of the release layer is 10-30 μm.
It further says, the release paper is the fast pressing release paper of flexible circuit board.
It further says, the release paper controls within 2mil the glue overflow amount of glue-line after pressing.
It further says, the original paper layer is high-gloss inkjet body paper or art paper.
It further says, a kind of preparation method of flexible circuit board pressing resistance glue release paper, using bilayer altogether
The mode of extrusion makes a side surface of original paper layer be formed simultaneously one layer of mixed glue in a side surface lamination of the original paper layer
Layer and one layer of release layer.
The beneficial effects of the invention are as follows：The present invention includes totally three layers of original paper layer, mixed glue layer and release layer, and structure is closed
Reason, and release layer and mixed glue layer formula are reasonable, therefore the present invention has at least the following advantages：
First, the vicat softening temperature for the folded structure that mixed glue layer of the invention is formed with release layer is at 150-170 DEG C, mesh
For the temperature of preceding FPC process for pressing generally at 160-180 DEG C, this vicat softening temperature of the invention is not higher than process for pressing temperature
Setting so that in bonding processes, release paper can fully soften, and pit along PCB surface and corner stay simultaneously
Be close to, fill and be bonded that effect is good, play splendid resistance glue effect, to the control of glue overflow amount up to 2mil within, can be complete
The pressure programming of competent high-precision circuit board further promotes electronic product and the miniaturization of fine equipment；Moreover, because
In pressing with certain levelability, it can prevent high-accuracy FPC from pressing unreal and bubble generation；
2nd, the present invention is due to splendid resistance colloidality energy, to the control of glue overflow amount up to 2mil within, can win completely
Appoint the pressing of high-precision circuit board, without carrying out chemical agent, plasma-based slagging-off or frosted to excessive glue as traditional release paper
Therefore the process of removal, reduces process, saves working hour and cost, improve production efficiency and yield；
3rd, release layer of the invention is mainly poly- 4- methylpentenes, and after hot pressing softening, viscosity is smaller, and release paper is easy to tear
It removes, and residue glue is free of after removing, secondary pollution will not be caused to wiring board, not need to artificially remove, reduce operational sequence, improved
Production efficiency, and be applicable to multi-layer FPC since viscosity is small and press simultaneously, further improve production efficiency；
4th, preparation of the invention is only needed using mixed glue layer and the release layer lamination mode that double-layer coextrusion goes out simultaneously
It is primary to a side surface lamination of original paper layer, then wind and get product, compared to the production technology that individual layer squeezes out, this production technology
Relatively simple, process is easily controllable, and cost is relatively low；
5th, silicate-containing oil and plasticizer, release paper will not cause wiring board secondary pollution, Er Qiehuan to the present invention after removing
It protects；
6th, the present invention has levelability, low water absorption since its outermost release layer is mainly using poly- 4- methylpentenes
And antistatic performance so that release paper of the invention prevents electrostatic, chemical resistance with preventing from mutually transferring between FPC products
The advantages such as strong and water absorption rate is low；
7th, it is halogen-free to meet environmental requirement.
Above description of the invention is only the general introduction of technical solution of the present invention, in order to better understand the skill of the present invention
Art means, and being implemented in accordance with the contents of the specification with presently preferred embodiments of the present invention and coordinate attached drawing specifically below
It is bright as after.
Description of the drawings
Fig. 1 is that the PET release papers of the prior art press structure diagram when completing not removing PET release papers；
Fig. 2 is that the PET release papers pressing of the prior art is completed and removes the structure diagram after PET release papers；
Fig. 3 is the structure diagram of the present invention；
Folded structure schematic diagram when Fig. 4 is present invention pressing；
Fig. 5 is structure diagram when present invention pressing completes not removing release paper；
Fig. 6 is that present invention pressing is completed and removes the structure diagram after release paper；
Fig. 7 is the process flow chart of the present invention；
Each section label is as follows in attached drawing：
A100-PET release papers；
100- release papers, 101- original paper layers, 102- mixed glues layer, 103- release layers；
200- top boards；300- protective films, 301- glue-lines；400- copper clad laminates, 401- copper foil circuits；500- lower platens.
Specific embodiment
Illustrate the specific embodiment of the present invention below by way of particular specific embodiment, those skilled in the art can be by this
The revealed content of specification understands advantages of the present invention and effect easily.The present invention can also other different modes give
Implement, that is, without departing substantially under the scope of disclosed, different modification and change can be given.
Embodiment 1：A kind of flexible circuit board pressing resistance glue release paper, as shown in figure 3, including original paper layer 101, epoxy glue
Adhesive layer 102 and release layer 103, the mixed glue layer 102 are formed in 101 surface of original paper layer, the release layer 103
It is formed in 102 upper surface of mixed glue layer, and the mixed glue layer 102 is bonded the original paper layer 101 and described
Release layer 103；
The release layer is made (by weight percentage) of following raw material：
TPX (poly- 4- methylpentenes)：70%；
PP (polypropylene)：30%；
The mixed glue layer is made (by weight percentage) of following raw material：
TPX (poly- 4- methylpentenes)：10%；
PP (polypropylene)：60%；
EMMA (ethylene methyl methacrylate copolymer)：15%
PE (polyethylene)：15%.
The vicat softening temperature of folded structure that the mixed glue layer 102 and the release layer 103 are formed is 150-170
℃。
The thickness of the release layer 103 is 10 μm.
The thickness of the mixed glue layer 102 is 70 μm.
The thickness of the original paper layer 101 is 90 μm.
The release paper 100 is the fast pressing release paper of flexible circuit board.
The release paper 100 controls within 2mil the glue overflow amount of glue-line after pressing, i.e., is 2mil to the control of excessive glue
Within.
The original paper layer 101 is high-gloss inkjet body paper or art paper.
A kind of flexible circuit board pressing preparation method of resistance glue release paper, includes the following steps：
Step A：The mixed glue layer raw material and release layer raw material that are prepared by proportioning are respectively fed to Multi-layer cast film machine
(such as three layers of cast film machine, five layers of cast film machine etc.), will be former by mixed glue layer raw material and release layer by screw cylinder
Material heats respectively, and A screw cylinders are parting agent layer raw material, and B screw cylinders are mixed glue layer raw material, wherein epoxy glue
Adhesive layer raw material heating temperature is 280-340 DEG C, and release layer raw material heating temperature is 260-320 DEG C, as shown in Figure 7；
Step B：Heated mixed glue layer raw material and release layer raw material are squeezed out to distributor again through die head simultaneously
To the side of original paper layer semi-finished product are made, it is 40-80 DEG C that wherein mixed glue layer raw material, which squeezes out cooling temperature, release layer in leaching
It is 40-80 DEG C that raw material, which squeezes out cooling temperature, as shown in Figure 7；
Step C：It is drawn through roller, winding is got product, as shown in Figure 7.
Embodiment 2：The present embodiment is identical with 1 structure of embodiment, does not repeat, the difference lies in：The release layer by with
Lower raw material is made (by weight percentage)：TPX：80%；PP：20%；
The mixed glue layer is made (by weight percentage) of following raw material：TPX：20%；PP：70%；EMMA：
5%；PE：5%.
The thickness of the release layer 103 is 25 μm, and the thickness of the mixed glue layer 102 is 60 μm, the original paper layer
101 thickness is 60 μm.
Embodiment 3：The present embodiment is identical with 1 structure of embodiment, does not repeat, the difference lies in：The release layer by with
Lower raw material is made (by weight percentage)：TPX：100%；
The mixed glue layer is made (by weight percentage) of following raw material：TPX：30%；PP：50%；EMMA：
8%；PE：12%.
The thickness of the release layer 103 is 30 μm, and the thickness of the mixed glue layer 102 is 50 μm, the original paper layer
101 thickness is 120 μm.
Embodiment 4：The present embodiment is identical with 1 structure of embodiment, does not repeat, the difference lies in：The release layer by with
Lower raw material is made (by weight percentage)：TPX：85%；PP：15%；
The mixed glue layer is made (by weight percentage) of following raw material：TPX：40%；PP：45%；EMMA：
5%；PE：10%.
The thickness of the release layer 103 is 20 μm, and the thickness of the mixed glue layer 102 is 15 μm, the original paper layer
101 thickness is 180 μm.
Embodiment 5：The release layer is made (by weight percentage) of following raw material：TPX：75%；PP：25%；
The mixed glue layer is made (by weight percentage) of following raw material：TPX：30%；PP：40%；EMMA：
15%；PE：15%.
The thickness of the release layer 103 is 15 μm, and the thickness of the mixed glue layer 102 is 40 μm, the original paper layer
101 thickness is 150 μm.
Embodiment 6：The release layer is made (by weight percentage) of following raw material：TPX：95%；PP：5%；
The mixed glue layer is made (by weight percentage) of following raw material：TPX：20%；PP：65%；EMMA：
10%；PE：5%.
The thickness of the release layer 103 is 18 μm, and the thickness of the mixed glue layer 102 is 45m, the original paper layer
101 thickness is 100 μm.
The operation principle and the course of work of the present invention is as follows：
Release paper is used for folded structure during flexible circuit board hot pressing process, as shown in figure 4, being followed successively by pressure from top to bottom
Plate 200, release paper 100, protective film 300, copper clad laminate 400 (upper strata of copper clad laminate 400 is copper foil circuit 401) and lower platen
500, and the original paper layer 101 of release paper 100 fits in top board 200, folds structure to this using 160-180 DEG C of temperature and presses
It closes, in bonding processes, the vicat softening temperature of folded structure formed with release layer due to the mixed glue layer of the present invention is in 150-
170 DEG C, traditional release paper hardness is high and is not easy to soften, and during hot pressing, traditional release paper is for the pit of PCB surface
And the fitting effect of corner is poor, even the release paper traditional in high-temperature laminating also can not with the pit of PCB surface and
Corner is bonded completely, there are gap, and then easy excessive glue, therefore glue poor performance is hindered, while the glue-line of protective film 300 can be caused
301 poor fluidities, easily generate bubble, influence following process and properties of product, as depicted in figs. 1 and 2；
And the vicat softening temperature of folded structure that the mixed glue layer of the present invention is formed with release layer is not higher than process for pressing
The setting of temperature so that in bonding processes, release paper can fully soften, and under pit along PCB surface and corner
Collapse and be close to, fill and be bonded that effect is good, play splendid resistance glue effect, to the control of glue overflow amount up to 2mil within, prevent
The glue-line 301 of protective film 300 flows uneven and bubble generation, can be competent at the pressure programming of high-precision circuit board completely, into
One step promotes electronic product and the miniaturization of fine equipment；It, can be with moreover, because in pressing with certain levelability
Prevent high-accuracy FPC from pressing unreal and bubble generation, as shown in Figure 5 and Figure 6.
The foregoing is merely the embodiment of the present invention, are not intended to limit the scope of the invention, every to utilize this hair
The equivalent structure that bright specification and accompanying drawing content are made directly or indirectly is used in other related technical areas, similarly
It is included within the scope of the present invention.
Claims (9)
1. a kind of flexible circuit board pressing resistance glue release paper, it is characterised in that：Including original paper layer, mixed glue layer and release
Layer, the mixed glue layer are formed in the body paper layer surface, and the release layer is formed in the mixed glue layer upper table
Face, and the mixed glue layer is bonded the original paper layer and the release layer；
The release layer is made (by weight percentage) of following raw material：
TPX：70%-100%；
PP：0%-30%；
The mixed glue layer is made (by weight percentage) of following raw material：
TPX：10%-30%；
PP：40%-70%；
EMMA：5%-15%；
PE：5%-15%.
2. a kind of flexible circuit board pressing according to claim 1 resistance glue release paper, it is characterised in that：The epoxy glue
The vicat softening temperature of folded structure that adhesive layer and the release layer are formed is 150-170 DEG C.
3. a kind of flexible circuit board pressing according to claim 1 resistance glue release paper, it is characterised in that：The epoxy glue
The thickness of adhesive layer is 15-70 μm.
4. a kind of flexible circuit board pressing according to claim 1 resistance glue release paper, it is characterised in that：The original paper layer
Thickness be 60-180 μm.
5. a kind of flexible circuit board pressing according to claim 1 resistance glue release paper, it is characterised in that：The release layer
Thickness be 10-30 μm.
6. a kind of flexible circuit board pressing according to claim 1 resistance glue release paper, it is characterised in that：The release paper
For flexible circuit board pressing release paper soon.
7. a kind of flexible circuit board pressing according to claim 1 resistance glue release paper, it is characterised in that：The release paper
The glue overflow amount of glue-line after pressing is controlled within 2mil.
8. a kind of flexible circuit board pressing according to claim 1 resistance glue release paper, it is characterised in that：The original paper layer
It is high-gloss inkjet body paper or art paper.
9. a kind of preparation method of flexible circuit board pressing resistance glue release paper according to claim 1, it is characterised in that：
In a side surface lamination of the original paper layer in a manner that double-layer coextrusion goes out, a side surface of original paper layer is made to be formed simultaneously one layer
Mixed glue layer and one layer of release layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611130463.5A CN108221477B (en) | 2016-12-09 | 2016-12-09 | Glue-blocking release paper for flexible circuit board pressing and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611130463.5A CN108221477B (en) | 2016-12-09 | 2016-12-09 | Glue-blocking release paper for flexible circuit board pressing and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN108221477A true CN108221477A (en) | 2018-06-29 |
| CN108221477B CN108221477B (en) | 2020-06-19 |
Family
ID=62638797
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109714901A (en) * | 2019-01-04 | 2019-05-03 | 珠海杰赛科技有限公司 | Wet film coating processes the method and rigid-flex combined board of the rigid-flex combined board of outer layer flexibility |
| CN111040649A (en) * | 2019-11-14 | 2020-04-21 | 苏州市新广益电子有限公司 | PTFE composite glue-resistant film for LCP high-temperature lamination and production process thereof |
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| US4959264A (en) * | 1987-01-06 | 1990-09-25 | The Wiggins Teape Group Limited | Release paper for making artificial leather |
| WO2000059720A2 (en) * | 1999-04-07 | 2000-10-12 | Honeywell International Inc. And Mitsui Chemicals, Inc. | High temperature release films |
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