CN111040649B - PTFE composite glue-resistant film for LCP high-temperature lamination and production process thereof - Google Patents
PTFE composite glue-resistant film for LCP high-temperature lamination and production process thereof Download PDFInfo
- Publication number
- CN111040649B CN111040649B CN201911110242.5A CN201911110242A CN111040649B CN 111040649 B CN111040649 B CN 111040649B CN 201911110242 A CN201911110242 A CN 201911110242A CN 111040649 B CN111040649 B CN 111040649B
- Authority
- CN
- China
- Prior art keywords
- temperature
- layer
- glue
- lcp
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/245—Vinyl resins, e.g. polyvinyl chloride [PVC]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
- C09J7/243—Ethylene or propylene polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
- C09J2423/046—Presence of homo or copolymers of ethene in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2427/00—Presence of halogenated polymer
- C09J2427/006—Presence of halogenated polymer in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
- C09J2483/006—Presence of polysiloxane in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a PTFE composite glue-resistant film for LCP high-temperature lamination, which is characterized by sequentially comprising a first release film layer, a first adhesive layer, a high-temperature glue-resistant layer, a second adhesive layer and a second release film layer from top to bottom; the first adhesive layer and the second adhesive layer are formed by high-temperature adhesives independently; the high-temperature glue-resisting layer is a PTFE/PE/hydroxyl-terminated methyl vinyl fluorosilicone oil blended film layer. The invention also provides a production process of the PTFE composite glue-blocking film for LCP high-temperature lamination. The PTFE composite glue-resistant film for LCP high-temperature lamination disclosed by the invention has the advantages of obvious release and glue-resistant effects, excellent mechanical properties, long service life and good high-temperature resistance.
Description
Technical Field
The invention relates to the technical field of membrane materials, in particular to a PTFE composite glue-blocking membrane for LCP high-temperature lamination and a production process thereof.
Background
With the rapid development of information technology, various types of multilayer boards with a hybrid structure are designed and applied in order to meet the requirements of high frequency and high speed of signal transmission, rapidness of heat dissipation and heat conduction and lowest production cost. Particularly, in recent years, 5G technology has entered the millimeter wave age, and 5G materials represented by liquid crystal polymer LCP materials have entered the sight of people, and these materials have good high frequency characteristics and physical characteristics, low moisture absorption rate, are not easily denatured, and have stable dielectric constant and high frequency performance, and are suitable for use as packaging materials and substrate materials.
LCP materials can be processed by multilayer stacking, lamination. The high temperature lamination is a common method used for multi-layer LCP lamination, which requires vacuum hot pressing temperatures of 350 ℃ to 380 ℃ or higher. In the LCP laminating process, a high-temperature-resistant glue-resistant film needs to be used to play a role in releasing and resisting glue. The glue-blocking film in the prior art mainly adopts PE, nylon or copper foil as a buffer layer, the glue-blocking layer has over-high fluidity and insufficient glue-blocking performance, glue residues overflowing from gaps are difficult to remove from the surface of a base material in the pressing process, interference is caused on the reliability of LCP circuits, and the product performance is further influenced.
The Polytetrafluoroethylene (PTFE) has excellent high and low temperature resistance, chemical resistance and corrosion resistance, better weather property, high lubricity and non-adhesiveness, is called 'plastic king', is widely applied to the industries of atomic energy, national defense, aerospace, electronics, electricity, chemical industry, machinery, instruments, buildings, textiles, metal surface treatment, pharmacy, medical treatment, textiles, food, metallurgy smelting and the like, meets the using performance requirements of the glue-resisting film, and is expected to be widely applied to the glue-resisting film. However, the creep resistance and bending resistance of the material need to be further improved, which affects the service life of the material, and how to further prolong the service life of the PTFE becomes the premise of successful application of the PTFE on the film-blocking film.
Therefore, the development of the PTFE composite glue-resistant film for LCP high-temperature lamination with moderate fluidity and good glue resistance is very important, and the PTFE composite glue-resistant film has a remarkable significance for promoting the development of LCP 5G materials.
Disclosure of Invention
The invention mainly aims to provide the PTFE composite glue-resistant film for LCP high-temperature lamination and the production process thereof, the process is simple, the implementation is convenient, the process is easy to control, the energy consumption is low, the production efficiency and the finished product qualification rate are high, and the PTFE composite glue-resistant film is suitable for continuous industrial production; the prepared PTFE composite glue-blocking film for LCP high-temperature lamination has the advantages of obvious release and glue-blocking effects, excellent mechanical property, long service life and good high-temperature resistance.
In order to achieve the above purpose, the invention provides a PTFE composite glue-resistant film for LCP high-temperature lamination, which is characterized by sequentially comprising a first release film layer, a first adhesive layer, a high-temperature glue-resistant layer, a second adhesive layer and a second release film layer from top to bottom; the first adhesive layer and the second adhesive layer are formed by high-temperature adhesives independently; the high-temperature glue-resisting layer is a PTFE/PE/hydroxyl-terminated methyl vinyl fluorosilicone oil blended film layer.
Further, the release film layer is one of a PE release film layer, a PET release film layer and an OPP release film layer; and the release film is coated with a low-silicon release agent.
Further, the high-temperature adhesive is at least one of a polyimide adhesive, a polybenzimidazole adhesive and a silicone adhesive.
Further, the preparation method of the high-temperature glue resisting layer comprises the following steps: uniformly mixing PTFE resin, polyethylene resin, hydroxyl-terminated methyl vinyl fluorosilane and an initiator to obtain a mixture, adding the mixture into an extruder, sequentially performing extrusion, rolling by a roller, cooling and curing, and sintering at high temperature to obtain the high-temperature glue resisting layer.
Further, the mass ratio of the PTFE resin, the polyethylene resin, the hydroxyl-terminated methyl vinyl fluorosilane and the initiator is 1:0.1 (0.2-0.3) to 0.01-0.02.
Further, the initiator is at least one of azobisisobutyronitrile and azobisisoheptonitrile.
Further, the temperature of the high-temperature sintering is 350-400 ℃, and the sintering time is 5-10 seconds.
Further, the thickness of the high temperature glue resisting layer is 10-30 μm, and preferably 12-20 μm.
Further, the thickness of the first release film layer is 10-20 μm, preferably 12-15 μm.
Further, the thickness of the second release film layer is 10-20 μm, preferably 12-15 μm.
Further, the production process of the PTFE composite glue-blocking film for LCP high-temperature lamination comprises the following steps: uniformly coating the first adhesive layer and the second adhesive layer on the upper surface and the lower surface of the high-temperature adhesive resistant layer independently from each other, laminating the first release film layer on the first adhesive layer, laminating the second release film layer on the second adhesive layer, pressing, and hardening to obtain the PTFE composite adhesive resistant film for LCP high-temperature lamination.
Preferably, the hardening treatment is specifically: hardening at 65-85 deg.c for 25-35 min and then at room temperature for 18-24 hr.
Preferably, the pressure of the pressing is 0.5MPa to 1.2 MPa.
Due to the application of the technical scheme, the invention has the following beneficial effects:
(1) the PTFE composite glue-resistant film for LCP high-temperature lamination disclosed by the invention has the advantages of simple production process, convenience in implementation, easiness in process control, low energy consumption, high production efficiency and finished product qualification rate, and suitability for continuous industrial production.
(2) The PTFE composite glue-blocking film for LCP high-temperature lamination disclosed by the invention overcomes the defects that the traditional glue-blocking film has overhigh fluidity and insufficient glue-blocking property, glue residues overflowing from gaps are difficult to remove on the surface of a base material in the lamination process, the reliability of LCP circuits is interfered, and the performance of products is further influenced, and has the advantages of remarkable release and glue-blocking effects, excellent mechanical property, long service life and good high-temperature resistance.
(3) The PTFE composite glue-resisting film for LCP high-temperature lamination disclosed by the invention has the advantages that the high-temperature glue-resisting layer is formed by a PTFE/PE/hydroxyl-terminated methyl vinyl fluorosilicone oil blending film layer, the blending film has good high-temperature resistance and good mechanical property due to the existence of a siloxane structure and a silicon-carbon structure, the LCP high-temperature lamination process is simplified by using the film, surface bubbles are effectively reduced, the release property and the glue-resisting property are improved, and the yield is improved.
(4) According to the PTFE composite glue-resistant film for LCP high-temperature lamination, PTFE/PE/hydroxyl-terminated methyl vinyl fluorosilicone oil are blended, and the PTFE and the PE have good compatibility due to polyolefin structures, and the vinyl on the terminated methyl vinyl fluorosilicone oil is easy to have a grafting reaction with the PTFE and the PE under the action of an initiator, so that the PTFE and the PE form an organic whole, the comprehensive performance of the PTFE composite glue-resistant film is improved, the defects that the creep resistance and the bending resistance of pure PTFE need to be further improved are effectively avoided, and the service life of the PTFE composite glue-resistant film is effectively prolonged; on the other hand, through modification, due to the existence of active hydroxyl of hydroxyl-terminated methyl vinyl fluorosilicone oil, the surface activity of PTFE is improved, so that the PTFE is more easily bonded with a binder, and the risk of delamination is reduced; secondly, the processing fluidity of the material can be improved; the components have synergistic effect, so that the prepared composite membrane has better comprehensive performance.
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art.
In the embodiment of the invention, the raw materials are all purchased commercially; the hydroxyl-terminated methyl vinyl fluorosilicone oil is prepared in advance, and the preparation method refers to Chinese patent invention example 1 with the application publication number of 201910370815.1; the PTFE is PTFE Japan Dajin F-L2 which is purchased from Mite plastic Co., Ltd, Shenzhen city; the PE is available from Shanghai super cyclone chemical technology Co., Ltd., No. MB 9500.
Example 1
The PTFE composite glue-resistant film for LCP high-temperature lamination is characterized by sequentially comprising a first release film layer, a first adhesive layer, a high-temperature glue-resistant layer, a second adhesive layer and a second release film layer from top to bottom; the first adhesive layer and the second adhesive layer are formed by high-temperature adhesives independently; the high-temperature glue-resisting layer is a PTFE/PE/hydroxyl-terminated methyl vinyl fluorosilicone oil blended film layer.
The release film layer is a PE release film layer; coating a low-silicon release agent on the release film; the high-temperature adhesive is a polyimide adhesive.
The preparation method of the high-temperature glue resisting layer comprises the following steps: 1kg of PTFE resin, 0.1g of polyethylene resin, 0.2kg of hydroxyl-terminated methyl vinyl fluorosilane and 0.01kg of azodiisobutyronitrile are uniformly mixed to obtain a mixture, the mixture is added into an extruder and sequentially subjected to extrusion, roller calendering, cooling solidification and high-temperature sintering to obtain a high-temperature glue resisting layer; the high-temperature sintering temperature is 350 ℃, and the sintering time is 5 seconds.
The thickness of the high-temperature glue resisting layer is 10 micrometers; the thickness of the first release film layer is 10 micrometers; the thickness of the second release film layer is 10 mu m.
The production process of the PTFE composite glue-blocking film for LCP high-temperature lamination comprises the following steps: uniformly coating the first adhesive layer and the second adhesive layer on the upper surface and the lower surface of the high-temperature glue-resisting layer independently, then respectively laminating the first release film layer on the first adhesive layer and the second release film layer on the second adhesive layer, pressing, and hardening to obtain the PTFE composite glue-resisting film for LCP high-temperature lamination; the hardening treatment specifically comprises the following steps: hardening at 65 ℃ for 25 minutes and then at room temperature for 18 hours; the pressing pressure is 0.5 MPa.
Example 2
The PTFE composite glue-resistant film for LCP high-temperature lamination is characterized by sequentially comprising a first release film layer, a first adhesive layer, a high-temperature glue-resistant layer, a second adhesive layer and a second release film layer from top to bottom; the first adhesive layer and the second adhesive layer are formed by high-temperature adhesives independently; the high-temperature glue-resisting layer is a PTFE/PE/hydroxyl-terminated methyl vinyl fluorosilicone oil blended film layer.
The release film layer is a PET release film layer; coating a low-silicon release agent on the release film; the high-temperature adhesive is a polybenzimidazole adhesive.
The preparation method of the high-temperature glue resisting layer comprises the following steps: 1kg of PTFE resin, 0.1kg of polyethylene resin, 0.23kg of hydroxyl-terminated methyl vinyl fluorosilane and 0.012kg of azodiisoheptanonitrile are uniformly mixed to obtain a mixture, the mixture is added into an extruder and sequentially subjected to extrusion, rolling by a roller, cooling and curing, and high-temperature sintering to obtain a high-temperature glue resisting layer; the temperature of the high-temperature sintering is 360 ℃, and the sintering time is 6 seconds.
The thickness of the high-temperature glue resisting layer is 15 micrometers; the thickness of the first release film layer is 13 mu m; the thickness of the second release film layer is 13 μm.
The production process of the PTFE composite glue-blocking film for LCP high-temperature lamination comprises the following steps: uniformly coating the first adhesive layer and the second adhesive layer on the upper surface and the lower surface of the high-temperature glue-resisting layer independently, then respectively laminating the first release film layer on the first adhesive layer and the second release film layer on the second adhesive layer, pressing, and hardening to obtain the PTFE composite glue-resisting film for LCP high-temperature lamination; the hardening treatment specifically comprises the following steps: hardening at 70 ℃ for 27 minutes and then at room temperature for 20 hours; the pressing pressure is 0.7 MPa.
Example 3
The PTFE composite glue-resistant film for LCP high-temperature lamination is characterized by sequentially comprising a first release film layer, a first adhesive layer, a high-temperature glue-resistant layer, a second adhesive layer and a second release film layer from top to bottom; the first adhesive layer and the second adhesive layer are formed by high-temperature adhesives independently; the high-temperature glue-resisting layer is a PTFE/PE/hydroxyl-terminated methyl vinyl fluorosilicone oil blended film layer.
The release film layer is an OPP release film layer; coating a low-silicon release agent on the release film; the high-temperature adhesive is a silicone adhesive.
The preparation method of the high-temperature glue resisting layer comprises the following steps: 1kg of PTFE resin, 0.1kg of polyethylene resin, 0.25kg of hydroxyl-terminated methyl vinyl fluorosilane and 0.015kg of azodiisobutyronitrile are uniformly mixed to obtain a mixture, the mixture is added into an extruder and sequentially subjected to extrusion, roller rolling, cooling solidification and high-temperature sintering to obtain a high-temperature glue resisting layer; the temperature of the high-temperature sintering is 375 ℃, and the sintering time is 8 seconds.
The thickness of the high-temperature glue resisting layer is 20 micrometers; the thickness of the first release film layer is 15 mu m; the thickness of the second release film layer is 15 mu m.
The production process of the PTFE composite glue-blocking film for LCP high-temperature lamination comprises the following steps: uniformly coating the first adhesive layer and the second adhesive layer on the upper surface and the lower surface of the high-temperature glue-resisting layer independently, then respectively laminating the first release film layer on the first adhesive layer and the second release film layer on the second adhesive layer, pressing, and hardening to obtain the PTFE composite glue-resisting film for LCP high-temperature lamination; the hardening treatment specifically comprises the following steps: hardening at 75 ℃ for 30 minutes and then at room temperature for 21 hours; the pressing pressure is 0.9 MPa.
Example 4
The PTFE composite glue-resistant film for LCP high-temperature lamination is characterized by sequentially comprising a first release film layer, a first adhesive layer, a high-temperature glue-resistant layer, a second adhesive layer and a second release film layer from top to bottom; the first adhesive layer and the second adhesive layer are formed by high-temperature adhesives independently; the high-temperature glue-resisting layer is a PTFE/PE/hydroxyl-terminated methyl vinyl fluorosilicone oil blended film layer.
The release film layer is a PE release film layer; coating a low-silicon release agent on the release film; the high-temperature adhesive is formed by mixing a polyimide adhesive, a polybenzimidazole adhesive and a silicone adhesive in a mass ratio of 1:2: 2.
The preparation method of the high-temperature glue resisting layer comprises the following steps: 1kg of PTFE resin, 0.1kg of polyethylene resin, 0.28kg of hydroxyl-terminated methyl vinyl fluorosilane and 0.018kg of initiator are uniformly mixed to obtain a mixture, the mixture is added into an extruder and sequentially subjected to extrusion, roller calendering, cooling solidification and high-temperature sintering to obtain a high-temperature glue resisting layer; the initiator is formed by mixing azodiisobutyronitrile and azodiisoheptonitrile according to the mass ratio of 3: 5; the temperature of the high-temperature sintering is 390 ℃, and the sintering time is 9 seconds.
The thickness of the high-temperature glue resisting layer is 27 mu m; the thickness of the first release film layer is 18 mu m; the thickness of the second release film layer is 18 μm.
The production process of the PTFE composite glue-blocking film for LCP high-temperature lamination comprises the following steps: uniformly coating the first adhesive layer and the second adhesive layer on the upper surface and the lower surface of the high-temperature glue-resisting layer independently, then respectively laminating the first release film layer on the first adhesive layer and the second release film layer on the second adhesive layer, pressing, and hardening to obtain the PTFE composite glue-resisting film for LCP high-temperature lamination; the hardening treatment specifically comprises the following steps: hardening at 83 ℃ for 33 minutes and then at room temperature for 23 hours; the pressing pressure is 1.1 MPa.
Example 5
The PTFE composite glue-resistant film for LCP high-temperature lamination is characterized by sequentially comprising a first release film layer, a first adhesive layer, a high-temperature glue-resistant layer, a second adhesive layer and a second release film layer from top to bottom; the first adhesive layer and the second adhesive layer are formed by high-temperature adhesives independently; the high-temperature glue-resisting layer is a PTFE/PE/hydroxyl-terminated methyl vinyl fluorosilicone oil blended film layer.
The release film layer is a PET release film layer; coating a low-silicon release agent on the release film; the high-temperature adhesive is a polyimide adhesive.
The preparation method of the high-temperature glue resisting layer comprises the following steps: 1kg of PTFE resin, 0.1kg of polyethylene resin, 0.3kg of hydroxyl-terminated methyl vinyl fluorosilane and 0.02kg of azodiisobutyronitrile are uniformly mixed to obtain a mixture, the mixture is added into an extruder and sequentially subjected to extrusion, roller calendering, cooling solidification and high-temperature sintering to obtain a high-temperature glue resisting layer; the temperature of the high-temperature sintering is 400 ℃, and the sintering time is 10 seconds.
The thickness of the high-temperature glue resisting layer is 30 micrometers; the thickness of the first release film layer is 20 micrometers; the thickness of the second release film layer is 20 μm.
The production process of the PTFE composite glue-blocking film for LCP high-temperature lamination comprises the following steps: uniformly coating the first adhesive layer and the second adhesive layer on the upper surface and the lower surface of the high-temperature glue-resisting layer independently, then respectively laminating the first release film layer on the first adhesive layer and the second release film layer on the second adhesive layer, pressing, and hardening to obtain the PTFE composite glue-resisting film for LCP high-temperature lamination; the hardening treatment specifically comprises the following steps: hardening at 85 ℃ for 35 minutes and then at room temperature for 24 hours; the pressing pressure is 1.2 MPa.
Comparative example 1
The invention provides a PTFE composite glue-resisting film for LCP high-temperature lamination, the formula and the production process of the PTFE composite glue-resisting film are basically the same as those of the embodiment 1, and the difference is that the high-temperature glue-resisting film is a PTFE film layer.
Comparative example 2
The invention provides a PTFE composite glue-resisting film for LCP high-temperature lamination, the formula and the production process of the PTFE composite glue-resisting film are basically the same as those of the embodiment 1, except that hydroxyl-terminated methyl vinyl fluorosilane is not added in the preparation process of the high-temperature glue-resisting film.
Comparative example 3
The invention provides a PTFE composite glue-resisting film for LCP high-temperature lamination, the formula and the production process of the PTFE composite glue-resisting film are basically the same as those in the embodiment 1, except that PE is not added in the preparation process of the high-temperature glue-resisting film.
Comparative example 4
The invention provides a high-temperature glue-resistant film, and the formula and the preparation method thereof are the same as those in embodiment 1 of the Chinese patent CN 110193982A.
The PTFE composite glue-blocking films for LCP high-temperature lamination produced in the above examples 1-5 and comparative examples 1-3 were subjected to the related performance tests, and the test results are shown in Table 1; the test method is as follows:
(1) glue resistance experiment: testing a printed circuit board with a metal copper block embedded inside, wherein the gap between the metal copper block and the core board is 0.15 mm; when a pressing test is carried out on a press, the temperature is 220 ℃, the time is 100 minutes, the pressure is 500Psi, and the laminating mode is a high-temperature glue-blocking film, a printed circuit board with a metal copper block embedded therein and a high-temperature glue-blocking film; and (4) observing whether resin residues exist on the surface of the metal copper block after pressing, if not, the metal copper block is excellent, and if not, the metal copper block is good in trace quantity, otherwise, the metal copper block is unqualified.
(2) Temperature resistance experiment: testing a printed circuit board with a metal copper block embedded inside, wherein the gap between the metal copper block and the core board is 0.15 mm; performing a pressing test on a press at 300 ℃ for 130 minutes under the pressure of 500Psi (pounds per square inch), wherein the laminating mode is a high-temperature glue-blocking film, a printed circuit board embedded with a metal copper block and a high-temperature glue-blocking film; and (4) observing whether the high-temperature glue-blocking film is cracked or not after lamination, if not, the high-temperature glue-blocking film is excellent, and if not, the trace is good, otherwise, the high-temperature glue-blocking film is unqualified.
(3) Tensile strength: according to ASTM D2240.
TABLE 1
| Item | Tensile strength | Resistance to glue | High temperature resistance |
| Unit of | MPa | — | — |
| Example 1 | 35.8 | Is excellent in | Is excellent in |
| Example 2 | 36.3 | Is excellent in | Is excellent in |
| Example 3 | 36.9 | Is excellent in | Is excellent in |
| Example 4 | 37.5 | Is excellent in | Is excellent in |
| Example 5 | 39.0 | Is excellent in | Is excellent in |
| Comparative example 1 | 34.5 | Good effect | Good effect |
| Comparative example 2 | 34.8 | Good effect | Good effect |
| Comparative example 3 | 35.0 | Good effect | Good effect |
| Comparative example 4 | 30.2 | Fail to be qualified | Fail to be qualified |
As can be seen from table 1, the PTFE composite adhesive film for LCP high-temperature lamination disclosed in the embodiments of the present invention has excellent mechanical properties, adhesive resistance and high-temperature resistance, and these properties are improved compared with the adhesive film in the prior art, which is a result of synergistic effect of each component.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are merely illustrative of the principles of the invention, but that various changes and modifications may be made without departing from the spirit and scope of the invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (8)
1. The PTFE composite glue-resistant film for LCP high-temperature lamination is characterized by sequentially comprising a first release film layer, a first adhesive layer, a high-temperature glue-resistant layer, a second adhesive layer and a second release film layer from top to bottom; the first adhesive layer and the second adhesive layer are formed by high-temperature adhesives independently; the high-temperature glue resisting layer is a PTFE/PE/hydroxyl-terminated methyl vinyl fluorosilicone oil blending film layer;
the preparation method of the high-temperature glue resisting layer comprises the following steps: uniformly mixing PTFE resin, polyethylene resin, hydroxyl-terminated methyl vinyl fluorosilane and an initiator to obtain a mixture, adding the mixture into an extruder, sequentially performing extrusion, rolling by a roller, cooling and curing, and sintering at high temperature to obtain a high-temperature glue resisting layer; the mass ratio of the PTFE resin to the polyethylene resin to the hydroxyl-terminated methyl vinyl fluorosilane to the initiator is 1:0.1 (0.2-0.3) to 0.01-0.02.
2. The PTFE composite glue-resistant film for LCP high-temperature lamination according to claim 1, wherein the release film layer is one of a PE release film layer, a PET release film layer and an OPP release film layer; and the release film is coated with a low-silicon release agent.
3. The PTFE composite glue barrier film for LCP high-temperature lamination according to claim 1, wherein the high-temperature adhesive is at least one of polyimide adhesive, polybenzimidazole adhesive and silicone adhesive.
4. The PTFE composite film resist for LCP high temperature lamination according to claim 1, wherein the initiator is at least one of azobisisobutyronitrile and azobisisoheptonitrile.
5. The PTFE composite glue-resistant film for high-temperature compression of LCP according to claim 1, wherein the temperature of the high-temperature sintering is 350-400 ℃ and the sintering time is 5-10 seconds.
6. The PTFE composite glue-resistant film for LCP high-temperature lamination according to claim 1, wherein the thickness of the high-temperature glue-resistant layer is 10-30 μm; the thickness of the first release film layer is 10-20 μm; the thickness of the second release film layer is 10-20 μm.
7. The PTFE composite film resist for LCP high temperature lamination according to any one of claims 1 to 6, wherein the production process of the PTFE composite film resist for LCP high temperature lamination comprises the following steps: uniformly coating the first adhesive layer and the second adhesive layer on the upper surface and the lower surface of the high-temperature adhesive resistant layer independently from each other, laminating the first release film layer on the first adhesive layer, laminating the second release film layer on the second adhesive layer, pressing, and hardening to obtain the PTFE composite adhesive resistant film for LCP high-temperature lamination.
8. The PTFE composite glue-resistant film for LCP high-temperature lamination according to claim 7, wherein the hardening treatment is specifically: hardening at 65-85 deg.c for 25-35 min and then at room temperature for 18-24 hr; the pressing pressure is 0.5MPa-1.2 MPa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911110242.5A CN111040649B (en) | 2019-11-14 | 2019-11-14 | PTFE composite glue-resistant film for LCP high-temperature lamination and production process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911110242.5A CN111040649B (en) | 2019-11-14 | 2019-11-14 | PTFE composite glue-resistant film for LCP high-temperature lamination and production process thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111040649A CN111040649A (en) | 2020-04-21 |
| CN111040649B true CN111040649B (en) | 2021-02-09 |
Family
ID=70232873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911110242.5A Active CN111040649B (en) | 2019-11-14 | 2019-11-14 | PTFE composite glue-resistant film for LCP high-temperature lamination and production process thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111040649B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112406217B (en) * | 2020-10-27 | 2022-04-26 | 瑞声精密制造科技(常州)有限公司 | Metal plastic composite film and preparation method and application thereof |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202192825U (en) * | 2011-06-03 | 2012-04-18 | 夏超华 | Adhesive stopping membrane for hot-pressing technology of flexible printed circuit board |
| KR20140097897A (en) * | 2013-01-30 | 2014-08-07 | 에스케이씨하스디스플레이필름(유) | Pressure-sensitive adhesive film |
| CN204296158U (en) * | 2014-07-23 | 2015-04-29 | 昆山正金电子有限公司 | For the compound adhesive block film of multilayer circuit board high temperature process |
| CN106313839A (en) * | 2015-07-08 | 2017-01-11 | 苏州泽成电子科技有限公司 | FPC (flexible printed circuit) press-fitting high-temperature-resistant composite release film and manufacturing method thereof |
| CN108221477A (en) * | 2016-12-09 | 2018-06-29 | 松本涂层科技（昆山）有限公司 | A kind of flexible circuit board pressing resistance glue release paper and preparation method thereof |
| CN109575831A (en) * | 2018-11-20 | 2019-04-05 | 深圳市弘海电子材料技术有限公司 | Low bounce-back power cover film and preparation method thereof |
| CN208883783U (en) * | 2018-06-01 | 2019-05-21 | 深圳市瑞昌星科技有限公司 | A kind of wiring board Thermal pressuring separating type film |
| CN110193982A (en) * | 2019-05-29 | 2019-09-03 | 深圳市一心电子有限公司 | High temperature adhesive block film and its manufacturing method |
-
2019
- 2019-11-14 CN CN201911110242.5A patent/CN111040649B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202192825U (en) * | 2011-06-03 | 2012-04-18 | 夏超华 | Adhesive stopping membrane for hot-pressing technology of flexible printed circuit board |
| KR20140097897A (en) * | 2013-01-30 | 2014-08-07 | 에스케이씨하스디스플레이필름(유) | Pressure-sensitive adhesive film |
| CN204296158U (en) * | 2014-07-23 | 2015-04-29 | 昆山正金电子有限公司 | For the compound adhesive block film of multilayer circuit board high temperature process |
| CN106313839A (en) * | 2015-07-08 | 2017-01-11 | 苏州泽成电子科技有限公司 | FPC (flexible printed circuit) press-fitting high-temperature-resistant composite release film and manufacturing method thereof |
| CN108221477A (en) * | 2016-12-09 | 2018-06-29 | 松本涂层科技（昆山）有限公司 | A kind of flexible circuit board pressing resistance glue release paper and preparation method thereof |
| CN208883783U (en) * | 2018-06-01 | 2019-05-21 | 深圳市瑞昌星科技有限公司 | A kind of wiring board Thermal pressuring separating type film |
| CN109575831A (en) * | 2018-11-20 | 2019-04-05 | 深圳市弘海电子材料技术有限公司 | Low bounce-back power cover film and preparation method thereof |
| CN110193982A (en) * | 2019-05-29 | 2019-09-03 | 深圳市一心电子有限公司 | High temperature adhesive block film and its manufacturing method |
Non-Patent Citations (1)
| Title |
|---|
| 耐高温丙烯酸酯压敏胶带在柔性电路板中的应用;刘波等;《电子工艺技术》;20120518;第33卷(第03期);第169-171页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111040649A (en) | 2020-04-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102029745B (en) | High-heat-conductivity metal-base copper foil coated laminated board and making method thereof | |
| CN101420820B (en) | Double side flexible copper coated board and manufacturing method thereof | |
| US6187416B1 (en) | Resin composition for copper-clad laminate, resin-coated copper foil, multilayered copper-clad laminate, and multilayered printed circuit board | |
| JP2015509113A (en) | Cyanate ester resin composition for circuit board production and flexible metal foil laminate including the same | |
| CN107466166B (en) | Heat-conducting resin copper-clad plate and preparation method thereof | |
| CN109312164B (en) | Resin composition for film, film with substrate, metal/resin laminate, cured resin, semiconductor device, and method for producing film | |
| CN110066557B (en) | Resin-coated copper foil, preparation method thereof, copper-clad plate containing resin-coated copper foil and printed circuit board | |
| KR20190003899A (en) | Composite sheet with EMI shield and heat radiation and Manufacturing method thereof | |
| CN103702511B (en) | A kind of high-thermal conductive metal base plate and preparation method thereof | |
| CN111040649B (en) | PTFE composite glue-resistant film for LCP high-temperature lamination and production process thereof | |
| CN102009515A (en) | Two-layer-method double-sided flexible CCL (Copper-Clad Laminate) and manufacture method thereof | |
| JPH115828A (en) | Resin composition for copper-clad laminate, copper foil with resin, multilayer copper-clad laminate and multilayer printed wiring board | |
| TW201024369A (en) | Bonding sheet and resin composition for preparing the same | |
| WO2016121392A1 (en) | Double-sided metal-clad laminate board and method for manufacturing same | |
| JPH0281495A (en) | Flexible double-sided metal-foil laminated sheet | |
| CN103200766A (en) | Multilayer printed wiring board and manufacturing method thereof | |
| CN114479212B (en) | Polybutadiene and epoxidized polybutadiene composition, adhesive, rubberized metal foil, prepreg, laminated board and preparation method | |
| KR20190003900A (en) | Composite sheet with EMI shield and heat radiation and Manufacturing method thereof | |
| JP2010031176A (en) | Resin composition, resin film, laminated film, and printed wiring board | |
| CN201307967Y (en) | Double-sided flexible copper-clad plate | |
| TWI388260B (en) | Single - sided soft copper foil laminated board and its manufacturing method | |
| JPS6021220A (en) | Manufacture of chemical plating laminated sheet | |
| CN214004511U (en) | Double-sided self-adhesive high-temperature bearing film | |
| CN114919253B (en) | Polytetrafluoroethylene flexible copper-clad plate containing adhesion-promoting layer and its preparation method | |
| CN1966573A (en) | Halogen-free resin composition and its uses in adhesive sheet and copper-cladded plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215156 Building 1, 289 Caofeng Road, Xukou Town, Wuzhong District, Suzhou City, Jiangsu Province Patentee after: Suzhou New Guangyi Electronics Co.,Ltd. Address before: 215156 Building 1, 289 Caofeng Road, Xukou Town, Wuzhong District, Suzhou City, Jiangsu Province Patentee before: SUZHOU XINGUANGYI ELECTRONICS Co.,Ltd. |