CN202192825U - Adhesive stopping membrane for hot-pressing technology of flexible printed circuit board - Google Patents
Adhesive stopping membrane for hot-pressing technology of flexible printed circuit board Download PDFInfo
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- CN202192825U CN202192825U CN2011201870009U CN201120187000U CN202192825U CN 202192825 U CN202192825 U CN 202192825U CN 2011201870009 U CN2011201870009 U CN 2011201870009U CN 201120187000 U CN201120187000 U CN 201120187000U CN 202192825 U CN202192825 U CN 202192825U
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- flexible printed
- printed circuit
- circuit board
- film
- adhesive
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Abstract
The utility model discloses an adhesive stopping membrane for a hot-pressing technology of a flexible printed circuit board. The adhesive stopping membrane is formed by compounding a paper layer and an adhesive stopping layer, wherein the adhesive stopping layer is a polybutylene terephthalate laminating layer, and the thickness of the adhesive stopping layer is 20-180 micrometer. By adopting the adhesive stopping membrane, consumptive materials such as PE (Polyethylene) membranes, BOPP (Biaxially Oriented Polypropylene), glass fiber fabrics and the like are saved in terms of laminated structures, thereby further reducing the production cost and reaching the rock bottom for the cost reduction of flexible printed circuit board industries.
Description
Technical field
The utility model relates to the adhesive block film that uses in a kind of flexible printed circuit board heat pressing process, is used for when the pressing diaphragm, playing the effect of the release and anti-glue that overflows, and is specifically related to a kind of adhesive block film that is used for the flexible printed circuit board heat pressing process.
Background technology
Soft board (FPC) is the abbreviation of flexible printed wiring board (Flexible Printed Circuit); With respect to rigid circuit board; Soft board material characteristic is a pliability; And have advantages such as easy turnover, in light weight, thin thickness, therefore need often to be applied to the product of thin design or movable mechanism design, like mobile phone, mobile computer, display, consumption electronic products, contact panel and IC structure dress etc.
On the soft board product configurations by flexible copper foil substrate (FCCL) and soft insulating barrier (diaphragm; PI commonly used or PET) form with adhesive (glue) attaching back pressing; The number of plies according to copper-foil conducting electricity is divided; Be divided into lamina, doubling plate, multi-layer sheet, dual platen, Rigid Flex etc., and can attach annexes such as stiffening plate according to customer requirement.With the lamina is example, and its basic craft course is: adopt two parts raw material, wherein base material+transparent adhesive tape+Copper Foil is the raw material that a cover is bought, and diaphragm+transparent adhesive tape is the raw material that another kind is bought; At first, Copper Foil will carry out PROCESS FOR TREATMENT such as etching and obtain the circuit that needs, and corresponding pad will holed and expose to diaphragm, and reusable heat pressing method combines both after cleaning.The plate of other kinds and the stiffening plate that attaches subsides all need adopt hot pressing synthetic in manufacturing process; Bonding or damage soft board for the hot plate (SUS) of avoiding pressing and soft board; Need between hot plate and soft board, to add and separate bed course (being adhesive block film), to satisfy the needs of hot pressing buffering.
In heat pressing process, can be divided into traditional pressing according to the length of hot pressing time and press with fast.At present, the separation bed course that in traditional pressing, uses is a minute body structure, closes use by ply of paper, cushion and release layer three are range upon range of; When pressing; Will above-mentioned each layer be layed on the FPC plate to be laminated successively respectively, operation is comparatively loaded down with trivial details, the bad easy generation bubble of fitting; Wrinkle etc. influence the quality of FPC plate; On the other hand, because existing mould release membrance often adopts polyester material to process, its thickness is more than 38um; Because polyester material is acute (rigid) material, its filling effect is bad in the pressing process, and adhesive spillover, bubble and wrinkle etc. can take place; Use polyester material (PET) pressing of above-mentioned thickness, present spill-out all reaches more than the 0.15um usually, and the anti-glue amount of overflowing of industry standard should be controlled at below the 0.1mm; Therefore be difficult to use; And overflow glue at the FPC opening and can pollute copper foil surface, cause poor flow, open circuit etc., directly influence the yields of FPC; Simultaneously, can influence the pressing effect after the mould release membrance of this thickness uses.
Summary of the invention
The utility model purpose provides a kind of adhesive block film that is used for the flexible printed circuit board heat pressing process, can reduce the production cost of FPC soft board through using this film, improves yields.
For achieving the above object; The technical scheme that the utility model adopts is: a kind of adhesive block film that is used for the flexible printed circuit board heat pressing process; Be composited by ply of paper and resistance glue-line, said resistance glue-line is the polybutylene terephthalate (PBT) leaching membrane layer, and its thickness is 20 ~ 180 microns.
In the preceding text; Said polybutylene terephthalate (PBT); English name polybutylece terephthalate (being called for short PBT); The thickness that PBT fits is 30 ~ 180 microns, directly fits together through heat posted and paper with the mode of drenching film, thereby decides the thickness that will drench film to reach the effect of classification resistance glue by the difference of height of soft board.For example: the PBT material that the soft board difference of height of 0.2 mm need drench 50 microns of films just can play resistance glue effect; The PBT film that the soft board difference of height of 1 mm need drench 100 ~ 180 microns of films just can play the anti-glue effect of overflowing.
Mode operation PBT film with drenching film is done and is set off by paper (paper classes such as art paper or brown paper); Can be enhanced about more than once than its hot strength step-down of PBT film, the percentage elongation that normal The tape casting is produced; Heat distortion temperature significantly improves; Thereby improved the bad situation of other films thermal deformation at high temperature, the influence of thermal deformation can directly have influence on the glue amount of overflowing, because the low anti-glue that overflows of heat distortion temperature is effective; The high anti-glue weak effect that overflows of heat distortion temperature, heat distortion temperature is usually between 70 ~ 140 degree.
Owing to the PBT resin properties is mobile than very fast,, mainly be when drenching film extruding forming because of the PBT resin so be difficult to film forming with traditional pouring membrane process; Dirty speed all can be decided film-forming type from the width that mould comes out to 3 cm between the cylinder soon, and the traditional pouring film device mould and the clearance distance of cylinder be probably at 8 ~ 12 cm, and the gap that therefore will drench film die and cylinder with the utility model operation needs is adjusted into 3 ~ 4 cm and accomplishes; Be that milky is translucent to opaque, crystalline thermoplastic polyester when product comes out, have high-fire resistance, toughness, fatigue durability, self-lubricating, low-friction coefficient; Weatherability, water absorption rate are low, are merely 0.1%, in wet environment, still keep various rerum naturas (comprising electrical property); Electrical insulating property; But volume resistance, dielectric loss are big, heat-resisting water, bases, acids, oils but be subject to halogenated hydrocarbon and corrode, and hydrolytic resistance is poor; Crystallization rapidly under the low temperature, good forming ability.
Because the PBT resin itself has the release layer that can substitute traditional laminated material after good slickness is handled through the high-voltage corona of equipment; Have and to be coated with mould release and can to solve the problem of taking off plate; Thereby reduced the risk of mould release pollution plate face; Guarantee free of contamination plate face, improved the yields of soft board.
In the technique scheme, said resistance glue-line is the mixed layer of polybutylene terephthalate (PBT) and polyester, and said polyester is selected from one or more in polyethylene, polypropylene and the random polypropylene.Preferably; PBT resin with 80% is sneaked into 20% polyethylene or random polypropylene (APP) and polypropylene (PP) resin when drenching film can improve the adhesion of extruded film heat posted to the paper; Also can reach simultaneously the film hot strength step-down that drenches the film surface, percentage elongation to be improved to play and resist the glue effect of overflowing.
Optimized technical scheme, the thickness of said resistance glue-line are 30 ~ 50 microns.
Optimized technical scheme, said ply of paper are art paper, and its thickness is 80 ~ 120 grams.Can certainly adopt existing brown paper, CCK paper or Ge Laxin paper etc.
Corresponding with it another kind of technical scheme, a kind of adhesive block film that is used for the flexible printed circuit board heat pressing process, said adhesive block film are the polybutylene terephthalate (PBT) leaching membrane layer, its thickness is 20 ~ 180 microns.
In the technique scheme, said adhesive block film is the mixed layer of polybutylene terephthalate (PBT) and polyester, and said polyester is selected from one or more in polyethylene, polypropylene and the random polypropylene.Preferably, 80% PBT is sneaked into 20% polyethylene or random polypropylene (APP) and polypropylene resins such as (PP).
Because the technique scheme utilization, the advantage that the utility model compared with prior art has is:
1, the utility model is simple in structure, on folded structure, has practiced thrift consumptive materials such as PE film, BOPP, glass cloth, thereby has further reduced production cost, creates minimum point again for soft board industry cost reduces.
2, the utility model directly is attached to the PBT film on the ply of paper with the mode of drenching film; And can by the difference of drenching film thickness decide need with the buffering thick layer produce; Thereby avoided in FPC soft board hot pressing, separating the laying successively of bed course; Simplify pressing working procedure, can reduce simultaneously because of three layers and lay the interlayer bubble that causes respectively, improved the yields of FPC plate.
3, ply of paper of the utility model and PBT rete can directly be fitted through the mode operation of drenching film, thereby have improved independent supporting degree with the film operation, have reduced the effect of face coat mould release, have increased tension force, have improved the demoulding effect.
4, the utility model adhesive block film not only can use on traditional pressing machine, can also use on quick pressing machine, has good versatility, for the client has solved the uncurrent worry of consumptive material; And this adhesive block film goes for making polytype soft boards such as single sided board, dual platen, hollowed-out board, multi-layer sheet internal layer, multi-layer sheet skin, stiffening plate.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment one.
Wherein: 1, ply of paper; 2, resistance glue-line.
The specific embodiment
Below in conjunction with accompanying drawing and embodiment the utility model is further described:
Embodiment one
Referring to shown in Figure 1; A kind of adhesive block film that is used for the flexible printed circuit board heat pressing process; Be composited by ply of paper 1 and resistance glue-line 2; Said resistance glue-line is polybutylene terephthalate (PBT) and poly mixed layer, promptly sneaks into 20% polyethylene with 80% PBT, reduces thereby the cushion effect that can improve adhesion and the film surface deliquescing of PBT film and paper reaches heat distortion temperature; Said ply of paper is an art paper, adopts art paper 80 ~ 120 gram surfaces directly to drench film 30 ~ 50 micron thickness with the mode of drenching film.
In use, directly the adhesive block film with the utility model is laid on pressing between hot plate (SUS) and the FPC soft board, and hot plate is warming up to (normal open needs 150 minutes) about 185 ℃ from room temperature, through cooling, at last film is peeled off then.
Through the T.P.X test, there are not bubble, non-wrinkled, no gold-plated variable color bad phenomenon after the soft board goods pressing of the adhesive block film of use the utility model.
Embodiment two
A kind of adhesive block film that is used for the flexible printed circuit board heat pressing process; Said adhesive block film is polybutylene terephthalate (PBT) and poly mixed layer; Promptly sneak into 20% polyethylene, reduce thereby the cushion effect that can improve adhesion and the film surface deliquescing of PBT film and paper reaches heat distortion temperature with 80% PBT.
Claims (4)
1. adhesive block film that is used for the flexible printed circuit board heat pressing process is characterized in that: be composited by ply of paper (1) and resistance glue-line (2), said resistance glue-line is the polybutylene terephthalate (PBT) leaching membrane layer, and its thickness is 20～180 microns.
2. the adhesive block film that is used for the flexible printed circuit board heat pressing process according to claim 1 is characterized in that: the thickness of said resistance glue-line is 30～50 microns.
3. the adhesive block film that is used for the flexible printed circuit board heat pressing process according to claim 1 is characterized in that: said ply of paper is an art paper, and its thickness is 80～120 grams.
4. adhesive block film that is used for the flexible printed circuit board heat pressing process, it is characterized in that: said adhesive block film is the polybutylene terephthalate (PBT) leaching membrane layer, its thickness is 20～180 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201870009U CN202192825U (en) | 2011-06-03 | 2011-06-03 | Adhesive stopping membrane for hot-pressing technology of flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201870009U CN202192825U (en) | 2011-06-03 | 2011-06-03 | Adhesive stopping membrane for hot-pressing technology of flexible printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202192825U true CN202192825U (en) | 2012-04-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201870009U Expired - Lifetime CN202192825U (en) | 2011-06-03 | 2011-06-03 | Adhesive stopping membrane for hot-pressing technology of flexible printed circuit board |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103220876A (en) * | 2013-04-27 | 2013-07-24 | 上海安费诺永亿通讯电子有限公司 | Flexible printed circuit board structure |
| CN103538300A (en) * | 2012-07-16 | 2014-01-29 | 苏州维艾普新材料有限公司 | Heat-sealing composite barrier film and preparation method thereof |
| CN111040649A (en) * | 2019-11-14 | 2020-04-21 | 苏州市新广益电子有限公司 | PTFE composite glue-resistant film for LCP high-temperature lamination and production process thereof |
| CN111993708A (en) * | 2019-05-27 | 2020-11-27 | 宁波长阳科技股份有限公司 | Release film and preparation method thereof |
-
2011
- 2011-06-03 CN CN2011201870009U patent/CN202192825U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103538300A (en) * | 2012-07-16 | 2014-01-29 | 苏州维艾普新材料有限公司 | Heat-sealing composite barrier film and preparation method thereof |
| CN103220876A (en) * | 2013-04-27 | 2013-07-24 | 上海安费诺永亿通讯电子有限公司 | Flexible printed circuit board structure |
| CN111993708A (en) * | 2019-05-27 | 2020-11-27 | 宁波长阳科技股份有限公司 | Release film and preparation method thereof |
| CN111993708B (en) * | 2019-05-27 | 2023-12-05 | 宁波长阳科技股份有限公司 | Release film and preparation method thereof |
| CN111040649A (en) * | 2019-11-14 | 2020-04-21 | 苏州市新广益电子有限公司 | PTFE composite glue-resistant film for LCP high-temperature lamination and production process thereof |
| CN111040649B (en) * | 2019-11-14 | 2021-02-09 | 苏州市新广益电子有限公司 | PTFE composite glue-resistant film for LCP high-temperature lamination and production process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180425 Address after: 215000 1 1 Cao Feng Road, Xu Kou Town, Wuzhong District, Suzhou, Jiangsu. Patentee after: Suzhou Xinguangyi Electronics Co., Ltd. Address before: 215164 72 buildings of east Xu Xiang Garden, Xu Kou Town, Wuzhong District, Suzhou, Jiangsu 506 Patentee before: Xia Chaohua |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120418 |