CN201544507U - Adhesive-obstructing film for fast pressing of flexible circuit boards - Google Patents
Adhesive-obstructing film for fast pressing of flexible circuit boards Download PDFInfo
- Publication number
- CN201544507U CN201544507U CN2009202838412U CN200920283841U CN201544507U CN 201544507 U CN201544507 U CN 201544507U CN 2009202838412 U CN2009202838412 U CN 2009202838412U CN 200920283841 U CN200920283841 U CN 200920283841U CN 201544507 U CN201544507 U CN 201544507U
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- China
- Prior art keywords
- adhesive
- layer
- pressing
- adhesive block
- block film
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 238000003825 pressing Methods 0.000 title abstract description 20
- 239000000853 adhesive Substances 0.000 claims abstract description 35
- 230000001070 adhesive effect Effects 0.000 claims abstract description 35
- 239000004698 Polyethylene Substances 0.000 claims abstract description 34
- 229920000573 polyethylene Polymers 0.000 claims abstract description 33
- 239000004677 Nylon Substances 0.000 claims abstract description 24
- 229920001778 nylon Polymers 0.000 claims abstract description 24
- -1 polyethylene Polymers 0.000 claims abstract description 10
- 239000007788 liquid Substances 0.000 claims abstract description 6
- 239000003292 glue Substances 0.000 description 14
- 229920000728 polyester Polymers 0.000 description 13
- 239000000463 material Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 238000007731 hot pressing Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229920006284 nylon film Polymers 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Adhesives Or Adhesive Processes (AREA)
Abstract
The utility model discloses an adhesive-obstructing film for fast pressing of flexible circuit boards. The adhesive-obstructing film is compounded by a halftone paper layer and an adhesive-resistant layer, and is characterized in that the adhesive-obstructing layer comprises a polyethylene layer, a nylon layer and a viscous liquid resistant layer adsorbed on the outer surface of the nylon layer from inside to outside in turn. The adhesive-obstructing film can be conveniently filled to obstruct adhesive during high-temperature pressing, avoids the problems of PE overflowing and unavailable filling, and is suitable for various flexible printed circuit pressing machines.
Description
Technical field
The utility model relates to the adhesive block film that uses in a kind of flexible printed circuit board process for pressing, is used for playing when the pressing diaphragm effect of the release and anti-glue that overflows, and is specifically related to a kind of adhesive block film that uses in the fast pressure process for pressing of flexible printed circuit board.
Background technology
With respect to common printed circuit board (PCB), flexible printed circuit board (Flexible Printed Circuit, abbreviation FPC) material characteristic is a pliability, and have advantages such as easy bending, in light weight, thin thickness, therefore need often to be applied to the product of thin design or movable mechanism design, as mobile phone, notebook, display, consumption electronic products and touch panel etc.
On the flexible printed circuit board product configurations by flexible copper foil substrate (FCCL) and soft insulating barrier (diaphragm, PI commonly used or PET) form with solid (glue) attaching back pressing, the number of plies and distribution situation according to copper-foil conducting electricity are divided, be divided into lamina, doubling plate, multi-layer sheet, dual platen etc., and can attach annexes such as stiffening plate according to customer requirement, with the lamina is example, its basic craft course is: adopt two parts raw material, wherein " base material+transparent adhesive tape+Copper Foil " is one group of raw material, and " diaphragm+transparent adhesive tape " is another group raw material; Technologies such as Copper Foil employing etching are handled the required circuit layout of formation; Diaphragm is holed to expose corresponding pad; The reusable heat platen press combines both after cleaning.The plate of other kinds and the stiffening plate of attached subsides also all need to adopt pressure sintering to carry out combination in manufacturing process, bonding or damage flexible printed circuit board for the hot plate (SUS) of avoiding pressing to use and flexible printed circuit board, need between hot plate and flexible printed circuit board, to add and separate bed course (adhesive block film), to satisfy the needs of hot pressing.
In heat pressing process, can be divided into traditional hot pressing and fast the pressure according to the length of hot pressing time.Wherein fast compression technology adopts 185 ℃ of 10 seconds, 185 ℃ malleations of hot plate precompressed to realize in 120 seconds usually.At present, the separation bed course that uses in fast the pressure is generally the TPX film (poly--4-methyl isophthalic acid amylene) that Mitsui company produces, and the thickness of this film is between 50um～120um.Find that in actual use the release effect of TPX film is relatively poor, that is to say, after heat pressing process finished, the TPX film was difficult to divest from the FPC plate, especially when making thin single sided board, divest and easily make single sided board generation fold in the TPX membrane process, influence FPC plate face surface smoothness; Simultaneously, the cost of TPX film is higher, thereby has strengthened the production cost of whole FPC plate.
For addressing the above problem, China utility model patent CN201015913Y discloses a kind of FPC soft board and has pressed soon and use adhesive block film, it is composited by ply of paper and release layer, and described release layer is a double-decker, comprises thin layer and the antistick characteristic liquid layer that is adsorbed on the thin layer surface.Thin layer wherein is polyethylene (PE) or polyester (PET) film.This product uses the back planarization better owing to adopted lamination layer structure.
Yet find that there is following point in it in actual the use: when adopting the PE material, part PE can take place and remain on the FPC problem that easily causes wiring board to open circuit because the PE material melting point is low, and running into high temperature can melt in (1) after the pressing; (2) this PE thickness has only 20um usually, can normally use under the more smooth situation in the surface of some single sided boards and wiring board, and be easy to PE is pulled open when the wiring board edge of opening has difference of height when running into dual platen, causes PE in the circuit board residual; (3) because the PE heatproof is not enough,, after will taking out cooling to product after the pressing, peel off again, can cause wiring board harmomegathus instability, influence follow-up boring step, cause empty broken but peel off after the cooling for avoiding residual phenomena; (4) softening point of PE is lower, easily produces after the high temperature pressing of product and curls and harmomegathus.
When adopting the PET material, (1) because the fusing point of PET material is higher, corresponding softening point height, and the resistance glue effect of overflowing is relatively poor, during especially for fast compression technology, is difficult to reach the requirement of glue amount 0.15mm of overflowing, and the glue amount of overflowing is excessive, occurs gold-plated bad in the time of gold-plated; (2) engaging force of PET and ply of paper is bad; (3) engaging force of PET and mould release is bad, is easy to cause mould release to shift, and transferring on the wiring board also is to cause gold-plated badly equally, and influences the processing procedure of wiring board back, and peel strength is not enough when causing the reinforcing plate.
Therefore, need seek new adhesive block film product, to overcome above-mentioned defective.
Summary of the invention
The utility model purpose provides a kind of flexible PCB and presses soon and use adhesive block film, and the anti-preferably glue effect of overflowing should be arranged, and guarantees the good effect of peeling off again.
For achieving the above object, the technical solution adopted in the utility model is: a kind of flexible PCB is pressed soon and is used adhesive block film, be composited by copperplate ply of paper and resistance glue-line, described resistance glue-line outwards comprises polyethylene layer, nylon layer successively and is adsorbed on the antistick characteristic liquid layer of nylon layer outer surface from the lining.
In the technique scheme, the thickness of described nylon layer is between 8 microns～250 microns, and described polyethylene layer thickness is 15 microns～50 microns.
Because the technique scheme utilization, the advantage that the utility model compared with prior art has is:
1. the softening point of nylon film is about 100 degree, and is approaching with the softening point of PI diaphragm glue on the wiring board, hinders glue fashionable can the filling into well of high-temperature high-pressure, avoided PE to overflow and fills problem that not advance;
2. the utility model carries out the compound glue-line of realizing hindering by polyethylene (PE) and nylon, because the surface tension of nylon is lower, PE becomes semi-liquid-like by high-temperature fusion, can penetrate in the nylon layer, PE just can not overflow in the middle of art paper and nylon when operation like this, has avoided the pollution of PE to circuit board; Simultaneously, art paper belongs to flatness and the reasonable paper of smoothness in paper type, be difficult to and the nylon good bond, this also is not adopt nylon to prepare the reason of adhesive block film in the prior art, the present invention creatively fits by the PE high temperature melt, solve the problems referred to above, thereby can utilize the suitable softening point of nylon, can guarantee planarization in the circuit board pressing process by art paper again;
3. adhesive block film of the present utility model goes for various flexible printed circuit board pressing machines.
Description of drawings
Fig. 1 is the structural representation of the utility model embodiment one.
Wherein: 1, copperplate ply of paper; 2, polyethylene layer; 3, nylon layer; 4, antistick characteristic liquid layer.
The specific embodiment
Below in conjunction with drawings and Examples the utility model is further described:
Embodiment one: shown in accompanying drawing 1, a kind of flexible PCB is pressed soon and is used adhesive block film, is composited by copperplate ply of paper 1 and resistance glue-line, and described resistance glue-line outwards comprises polyethylene layer 2, nylon layer 3 successively and is adsorbed on the antistick characteristic liquid layer 4 of nylon layer outer surface from the lining.
In the present embodiment, the thickness of described nylon layer is between 30 microns～200 microns, and polyethylene layer thickness is 15 microns～50 microns.
The adhesive block film that adopts present embodiment is the adhesive block film of main material and to adopt PET be that the adhesive block film of main material compares test with adopting PE respectively.
Use fast compression technology, temperature is 185+5 ℃ up and down, and pressure is 100kg/cm
2, preheating 8 seconds was shaped 120 seconds, adopted 50 times of magnifying glasses glue amount of overflowing to detect.
The result shows that adopting PE is the adhesive block film of main material, and the glue amount of overflowing is 0.1 millimeter; Adopting PET is the adhesive block film of main material, and the glue amount of overflowing is 0.15 millimeter; Adopt the adhesive block film of present embodiment, the glue amount of overflowing is below 0.06 millimeter.As seen the anti-glue that overflows of present embodiment product is effective.
The test shrinkage ratio: the taking-up back is placed cooling and is found that PE adhesive block film use harmomegathus as a result is 15/10000ths from the heat dish, and PET adhesive block film harmomegathus result is 7/10000ths, and the harmomegathus result of the nylon adhesive block film of present embodiment is in 3/10000ths.
The test off-type force: the difficult separation, the PET adhesive block film is easily separated after the pressing of PE adhesive block film, and the nylon adhesive block film is easily separated.
Check residual condition: have PE residual with PE adhesive block film pressing product surface, particularly the hollowed-out board fraction defective is the highest, serious have 80% bad; There is excessive glue residual with product surface after the pressing of PET adhesive block film; With the surface noresidue of nylon adhesive block film, meet the requirements.
With PE adhesive block film pressing fine rule road soft board bubble fraction defective is 80%; There is not bubble with the nylon adhesive block film.
From above test result, the nylon adhesive block film all than now good with PE adhesive block film, PET adhesive block film effect, and can increase substantially product percent of pass on problem aspect harmomegathus-residual-bubble etc. three, thereby greatly reduces cost.
Claims (2)
1. a flexible PCB is pressed soon and is used adhesive block film, be composited by copperplate ply of paper (1) and resistance glue-line, it is characterized in that: described resistance glue-line outwards comprises polyethylene layer (2), nylon layer (3) successively and is adsorbed on the antistick characteristic liquid layer (4) of nylon layer outer surface from the lining.
2. flexible PCB according to claim 1 is pressed soon and used adhesive block film, it is characterized in that: the thickness of described nylon layer (3) is between 8 microns～250 microns, and described polyethylene layer (2) thickness is 15 microns～50 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202838412U CN201544507U (en) | 2009-12-04 | 2009-12-04 | Adhesive-obstructing film for fast pressing of flexible circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202838412U CN201544507U (en) | 2009-12-04 | 2009-12-04 | Adhesive-obstructing film for fast pressing of flexible circuit boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201544507U true CN201544507U (en) | 2010-08-11 |
Family
ID=42599667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202838412U Expired - Lifetime CN201544507U (en) | 2009-12-04 | 2009-12-04 | Adhesive-obstructing film for fast pressing of flexible circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201544507U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108790346A (en) * | 2017-05-05 | 2018-11-13 | 松本涂层科技（昆山）有限公司 | A kind of fast pressing of flexible circuit release paper and its manufacturing process |
-
2009
- 2009-12-04 CN CN2009202838412U patent/CN201544507U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108790346A (en) * | 2017-05-05 | 2018-11-13 | 松本涂层科技（昆山）有限公司 | A kind of fast pressing of flexible circuit release paper and its manufacturing process |
| CN108790346B (en) * | 2017-05-05 | 2020-06-30 | 松本涂层科技（昆山）有限公司 | Release paper for fast pressing of flexible circuit board and manufacturing process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Suzhou Xinguangyi Electronics Co., Ltd. Assignor: Xia Chaohua Contract record no.: 2011320010095 Denomination of utility model: Adhesive-obstructing film for fast pressing of flexible circuit boards Granted publication date: 20100811 License type: Exclusive License Record date: 20110714 |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180417 Address after: 215000 1 1 Cao Feng Road, Xu Kou Town, Wuzhong District, Suzhou, Jiangsu. Patentee after: Suzhou Xinguangyi Electronics Co., Ltd. Address before: 215011 room 108, 47 Chuang Yuan District, Chuang Yuan Road, Suzhou New District, Jiangsu. Patentee before: Xia Chaohua |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100811 |