CN109575831A - Low bounce-back power cover film and preparation method thereof - Google Patents
Low bounce-back power cover film and preparation method thereof Download PDFInfo
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- CN109575831A CN109575831A CN201811382537.3A CN201811382537A CN109575831A CN 109575831 A CN109575831 A CN 109575831A CN 201811382537 A CN201811382537 A CN 201811382537A CN 109575831 A CN109575831 A CN 109575831A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
- C09J109/02—Copolymers with acrylonitrile
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
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- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2409/00—Presence of diene rubber
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- C09J2433/00—Presence of (meth)acrylic polymer
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- C09J2463/00—Presence of epoxy resin
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Abstract
The present invention provides a kind of low bounce-back power cover film, PI film including low bounce-back power and set on the release film of one side, and the gluing oxidant layer of low bounce-back power between the two, the other side of the PI film are equipped with pet vector film, and resistance glue-line is equipped between the PI film and the pet vector film；The PI film be greater than by molecular weight 100,000, polyamic acid solution of the solid content less than 25% be directly cast it is dry, without biaxial tension formed with a thickness of 1~7 μm of film layer, the elongation at break of the PI film is greater than 60%, tensile strength is less than 150MPa, and separation temperature is lower than 390 DEG C；The present invention saves the process in the FPC bending independent green oil printing in region, substantially increases the efficiency that comes into force, and reduces production cost, meanwhile, the defect rate for artificially printing fault and generation is avoided, product yield is substantially increased.
Description
Technical field
The present invention relates to FPC printed circuit fields, more particularly, to a kind of low bounce-back power cover film and preparation method thereof.
Background technique
Printed wiring board (abbreviation FPC) is material indispensable in electronic product, is widely used in computer at present
And its in peripheral equipment, communication product and consumer electrical product.FPC generally use fit over the mode of film to route into
Row protection, still, the bending region of FPC is to the more demanding of bending, can be because of cover film if being bonded existing cover film
Bounce is too big, makes easily to rebound after bending region bending, so as to cause swiping, influences the service life of electronic product.
In the prior art, low bounce-back power is solved the problems, such as using the technique in FPC bending region green oil printing, but presence with
Lower disadvantage: (1) green oil printing needs individual silk-screen process, the process for increasing production processing, that is, reduces production effect
Rate；(2) silk-screen is artificial progress green oil printing, is not only taken time and effort, but also the thickness that the operating error of worker easily prints green oil
It is thin uneven, cause the bounce for bending region not of uniform size, to influence to cause route easy the protecting effect of route
It is disconnected, reduce the yield of product；Moreover, silk-screen aligning accuracy is poor, the quality of product is reduced；(3) coating that silk-screen process uses
There is certain toxicity, it is big to the pollution of environment, working environment is poor, or even will affect the health of worker；(4) with user couple
The pursuit that mobile electronic product is lightening, display surface is big, the size that FPC bends region is also more and more narrow, to protect to this region
The requirement of sheath low bounce-back power is higher and higher, and existing green oil printing may not be met the requirements.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of low bounce-back power cover films and preparation method thereof, save in FPC
The process for bending the independent green oil printing in region substantially increases the efficiency that comes into force, and reduces production cost, meanwhile, it avoids artificially printing
The defect rate of fault and generation, substantially increases product yield.
In order to solve the above technical problem, the present invention provides a kind of low bounce-back power cover film, the PI film including low bounce-back power
PET is equipped with the other side of the gluing oxidant layer of the release film and low bounce-back power between the two that are set to one side, the PI film
Carrier film is equipped with resistance glue-line between the PI film and the pet vector film；
The PI film be greater than by molecular weight 100,000, polyamic acid solution of the solid content less than 25% be directly cast it is dry,
Without biaxial tension formed with a thickness of 1~7 μm of film layer, the elongation at break of the PI film is greater than 60%, and tensile strength is small
In 150MPa, separation temperature is lower than 390 DEG C；
The polyamic acid solution is grouped as by following each group by weight: 4,4- diaminodiphenyl ether is (referred to as
ODA), one or more of 2,2 '-diamino biphenoxyl ethanes (abbreviation BAPE), triphen diether diamino (abbreviation APB): N,
One or more of N- dimethyl acetamide, N,N-dimethylformamide, N-Methyl pyrrolidone: pyromellitic acid anhydride
(abbreviation PMDA) is according to molar ratio 1:1:1.
It is preferred that the gluing oxidant layer with a thickness of 2~20 μm；It is described resistance glue-line with a thickness of 5~50 μm；Institute
The thickness for stating pet vector film is 50 μm.
It is preferred that the adhesive block film is to be grouped as rear lamination in pet vector film by following each group by weight
On form: poly- 4- methylpentene or 60~90 parts of polybutylene terephthalate (PBT), ethylene-butyl acrylate copolymer 5~20
Part, 5~10 parts of one or more of 5~10 parts of the one or more of polypropylene or polyethylene, titanium dioxide or colour carbon black.
It is preferred that the adhesive block film is in acrylic resin soln or rubber solutions or polyurethane solutions by weight
It measures to be coated on pet vector film 5 after following group of score addition is grouped as and form: the one or more of titanium dioxide or colour carbon black
3~5%, polyurethane curing agent 1~3%.
It is preferred that the acrylic resin soln is to be grouped as the molecule made by each group following by weight
Amount for 30~500,000 acrylic resin is dissolved in ethyl acetate after broken or butyl acetate be made 5~20% acrylic resin
Solution: 30~50 parts of butyl methacrylate, 10~30 parts of butyl acrylate, 10~20 parts of methyl acrylate, acrylic acid hydroxyl second
5~10 parts of ester.
It is preferred that the rubber solutions are by base nitrile rubber, carboxylic styrene-butadiene rubber, carboxylated nbr, hydroxyl
Base butadiene-styrene rubber it is one or more it is broken after be dissolved in ethyl acetate or butyl acetate be made 5~20% rubber solutions.
It is preferred that the polyurethane solutions are after being crushed by polyurethane rubber with ethyl acetate or dimethylbenzene N, N-
Dimethyl acetamide dissolution, obtains 5~20% polyurethane solutions.
It is preferred that the gluing oxidant layer uses acrylic resin or epoxyn.
The present invention provides a kind of preparation method of low bounce-back power cover film, comprising the following steps:
Step 1 prepares PI film；
Step 2, lamination or coating resistance glue-line on high temperature resistant pet vector film；
Step 3, above-mentioned pet vector film and the PI film of low bounce-back power is compound；
Step 4 is coated with the gluing oxidant layer of low bounce-back power, then compound release film on above-mentioned PI film.
It is preferred that the preparation method of the PI film the following steps are included:
By polyamic acid solution coating curtain coating on mirror surface steel band, steel band with 1~3m/min speed by 160~
380 DEG C of ladder-elevating temperature baking ovens, then remove polyimide film from steel band, and without biaxial tension, winding obtains low bounce-back power
PI film, the elongation at break of the PI film are greater than 60%, and tensile strength is less than 150MPa, and separation temperature is lower than 390 DEG C.
The present invention relates to a kind of low bounce-back power cover films and preparation method thereof, compared with existing design, the advantage is that: this
The PI film (polyimide film) of invention cover film has low bounce-back power, and elongation at break is greater than 60%, and tensile strength is less than
150MPa, separation temperature are lower than 390 DEG C, and the requirement of protection circuit had not only been met after pasting cover film to FPC bending region, but also
It is able to satisfy the requirement of bending.
In terms of production technology, when fitting over film on FPC, can directly full page paste, reduce and bend region in FPC
The process of independent green oil printing, reduces silk-screen process, production efficiency can be improved 20% or more.
In terms of production cost, the human cost in silk-screen process is reduced, reduces production cost.
In terms of product quality, because reducing artificial silk-screen process, realizes mechanization production, avoid making mistakes because of manual operation to production
20% or more product yield can be improved in the influence of product quality.
Detailed description of the invention
Fig. 1 is the longitudinal phase diagrammatic cross-section of low bounce-back power cover film of the present invention.
Appended drawing reference is as follows:
1-PI film, 2- gluing oxidant layer, 3- release film, 4- hinder glue-line, 5-PET carrier film.
Specific embodiment
Referring to Fig. 1, low bounce-back power cover film of the present invention, PI film 1 including low bounce-back power and set on the release film of one side
3 and low bounce-back power between the two gluing oxidant layer 2, the other side of the PI film 1 is equipped with pet vector film 5, the PI film 1
Resistance glue-line 4 is equipped between the pet vector film 5；
The PI film 1 be greater than by molecular weight 100,000, polyimide solution of the solid content less than 25% be directly cast it is dry,
Imidizate without biaxial tension formed with a thickness of 1~7 μm of film layer, the elongation at break of the PI film is greater than 60%, draws
Intensity is stretched less than 150MPa, and separation temperature is lower than 390 DEG C；
The gluing oxidant layer 2 with a thickness of 2~20 μm, wherein adhesive can be acrylic resin or epoxy resin,
The adhesive strength of adhesive and PI in gluing oxidant layer is greater than 0.5kg/cm.
It is described resistance glue-line 4 with a thickness of 5~50 μm；Resistance glue-line can make the glue overflow amount of PI film be less than 0.05mm.
The thickness of the pet vector film 5 is 50 μm, using commercial product.
Below in conjunction with specific embodiment, 1~3 couple of present invention makees specific introduction, each component of Examples 1 to 3 such as one institute of table
Show；
Embodiment 1
A kind of preparation method of low bounce-back power cover film, includes the following steps:
Step 1 prepares PI film；
(1) 4,4- diaminodiphenyl ether (abbreviation ODA) is added according to molar ratio 1:1 molten into DMAC N,N' dimethyl acetamide
Solution；
(2) pyromellitic acid anhydride for being 1:1 with the molar ratio of ODA in step 1 is added into solution obtained above
(abbreviation PMDA) is synthesized and molecular weight is made greater than 100,000, polyamic acid solution of the solid content less than 25%；
(3) by the coating of above-mentioned polyamic acid solution again on mirror surface steel band, steel band with the speed of 1~3m/min by 160~
380 DEG C of ladder-elevating temperature baking ovens, then remove polyimide film from steel band, and winding obtains the low bounce-back power PI film of 3 μ m-thicks, PI
Elongation at break is greater than 60%, and tensile strength is less than 150MPa, and separation temperature is lower than 390 degree.
Step 2 prepares PET composite membrane；
By 7 parts of 75 parts of poly- 4- methylpentene, 13 parts of ethylene-butyl acrylate copolymer, 7 parts of polypropylene, titanium dioxide laminations
On 50 μm of high temperature resistant pet vector film, the resistance glue-line of 20 μ m-thicks is formed, pet vector film and resistance glue-line constitute PET composite membrane；
Step 3, the PI film 1 of above-mentioned PET composite membrane and low bounce-back power is carried out compound, and combined temp is 100~180 DEG C；
Step 4 is coated with the gluing oxidant layer 2 of low bounce-back power, then compound release film 3 on the PI film 1 in step 3.Wherein,
Adhesive in gluing oxidant layer 2 is acrylic resin, and after commercially available acrylic rubber is crushed, ethyl acetate dissolution is added, according to
The mass fraction of acrylic rubber is separately added into 10~20% silica, 10~20% aluminium hydroxides, 3~7% titanium dioxides, 7
~20% epoxy hardener, 5~15% halogen-free flame retardants, 0.5~3% anti-aging agent, obtain acrylic acid adhesive virgin rubber.
Embodiment 2
A kind of preparation method of low bounce-back power cover film, includes the following steps:
Step 1: preparation PI film；
(1) 2,2 '-diamino biphenoxyl ethanes (abbreviation BAPE) are added to N, N- dimethyl methyl according to molar ratio 1:1
It is dissolved in amide；
(2) pyromellitic acid anhydride for being 1:1 with the molar ratio of BAPE in step 1 is added in solution obtained above
(abbreviation PMDA) is synthesized and molecular weight is made greater than 100,000, polyamic acid solution of the solid content less than 25%.
(3) by the coating of above-mentioned polyamic acid solution again on mirror surface steel band, steel band with the speed of 1~3m/min by 160~
380 degree of ladder-elevating temperature baking ovens, then remove polyimide film from steel band, and winding obtains the low bounce-back power PI film of 1 μ m-thick, PI
Elongation at break is greater than 60%, and tensile strength is less than 150MPa, and separation temperature is lower than 390 degree.
Step 2: preparation PET composite membrane；
(1) acrylic resin elastomer is prepared；40 parts of butyl methacrylate, 20 parts of butyl acrylate, methyl acrylate
15 parts, 7 parts of hydroxy-ethyl acrylate obtain molecular weight 30~500,000 acrylic resins through emulsion polymerization, are demulsified, and wash, dry
After obtain acrylic resin solid；
(2) by above-mentioned acrylic resin solid be dissolved in ethyl acetate after broken or butyl acetate be made 13% acrylic acid
Resin solution；
(3) 4% colour carbon black, 2% polyurethane curing agent are added in above-mentioned acrylic resin soln, temperature 60~
Speed at 140 DEG C with 5~20m/min is coated on pet vector film, forms the resistance glue-line of 40 μ m-thicks.Pet vector film and resistance glue
Layer constitutes PET composite membrane.
Step 3, the PI film 1 of above-mentioned PET composite membrane and low bounce-back power is carried out compound, and combined temp is 80~180 DEG C；
Step 4 is coated with the gluing oxidant layer 2 of low bounce-back power, then compound release film 3 on the PI film 1 in step 3.Wherein,
Adhesive in gluing oxidant layer 2 is epoxy resin, o-cresol epoxy resin and nitrile rubber, mixes, adds in 1:1~1:4 ratio
Enter ethyl acetate dissolution, is separately added into 10~20% silica, 10~20% according to according to the mass fraction of gained mixture
Aluminium hydroxide, 3%~7% titanium dioxide, 7%~20% aniline curing agent, 5~15% halogen-free flame retardants, 0.5~3% anti-aging agent,
Obtain epoxyn virgin rubber.
Embodiment 3
The preparation method of the present embodiment low bounce-back power cover film is substantially the same manner as Example 1, except that: step 1
In, triphen diether diamino (abbreviation APB) substitutes 4,4- diaminodiphenyl ether (abbreviation ODA), and N-Methyl pyrrolidone substitutes N, N-
Dimethyl acetamide.
Embodiment 4
The preparation method of the present embodiment low bounce-back power cover film is substantially the same manner as Example 2, except that: step 2
In, acrylic elastomer is substituted using rubber elastomer, i.e., by base nitrile rubber, carboxylic styrene-butadiene rubber, carboxylated nbr, hydroxyl
Base butadiene-styrene rubber it is one or more be greater than 500,000 it is broken after be dissolved in ethyl acetate or butyl acetate be made 5% rubber it is molten
Liquid.
Embodiment 5
The preparation method of the present embodiment low bounce-back power cover film is substantially the same manner as Example 2, except that: step 2
In, substitute acrylic elastomer using polyurethane elastomer, i.e., by polyurethane rubber be greater than 300,000 it is broken after with ethyl acetate or
The dissolution of dimethylbenzene n,N-dimethylacetamide, obtains 20% polyurethane solutions.
The detection of PI film properties is shown in Table 1 in various embodiments of the present invention.
2 PI film properties testing result of table
Claims (10)
1. a kind of low bounce-back power cover film, it is characterised in that: PI film (1) including low bounce-back power and set on the release film of one side
(3) and the gluing oxidant layer (2) of low bounce-back power between the two, the other side of the PI film (1) are equipped with pet vector film (5),
Resistance glue-line (4) is equipped between the PI film (1) and the pet vector film (5)；
The PI film (1) is directly to be cast to dry, no greater than 100,000, polyamic acid solution of the solid content less than 25% by molecular weight
Through biaxial tension formed with a thickness of 1~7 μm of film layer, the elongation at break of the PI film is greater than 60%, and tensile strength is less than
150MPa, separation temperature are lower than 390 DEG C；
The polyamic acid solution is grouped as by following each group by weight: 4,4- diaminodiphenyl ether, 2,2 '-diamino
One or more of biphenoxyl ethane, triphen diether diamino: DMAC N,N' dimethyl acetamide, N,N-dimethylformamide, N-
One or more of methyl pyrrolidone: pyromellitic acid anhydride is according to molar ratio 1:1:1.
2. a kind of low bounce-back power cover film according to claim 1, which is characterized in that the thickness of the gluing oxidant layer (2)
It is 2~20 μm；It is described resistance glue-line (4) with a thickness of 5~50 μm；The thickness of the pet vector film (5) is 50 μm.
3. a kind of low bounce-back power cover film according to claim 1 or 2, which is characterized in that the adhesive block film (4) be by by
The following each group of parts by weight is grouped as rear lamination and forms on pet vector film (5): poly- 4- methylpentene or poly terephthalic acid fourth
The one or more 5~10 of 60~90 parts of diol ester, 5~20 parts of ethylene-butyl acrylate copolymer, polypropylene or polyethylene
Part, 5~10 parts of one or more of titanium dioxide or colour carbon black.
4. a kind of low bounce-back power cover film according to claim 1 or 2, which is characterized in that the adhesive block film (4) is third
In olefin(e) acid resin solution or rubber solutions or polyurethane solutions by weight score add following group be grouped as after be coated on pet vector
Film forms on (5): the one or more 3~5% of titanium dioxide or colour carbon black, polyurethane curing agent 1~3%.
5. a kind of low bounce-back power cover film according to claim 4, which is characterized in that the acrylic resin soln be by
Each group following by weight is grouped as after the acrylic resin that the molecular weight made is 30~500,000 is crushed and is dissolved in acetic acid second
Ester or butyl acetate are made 5~20% acrylic resin soln: 30~50 parts of butyl methacrylate, butyl acrylate 10~
30 parts, 10~20 parts of methyl acrylate, 5~10 parts of hydroxy-ethyl acrylate.
6. a kind of low bounce-back power cover film according to claim 4, which is characterized in that the rubber solutions are by base butyronitrile
Rubber, carboxylic styrene-butadiene rubber, carboxylated nbr, hydroxyl butadiene-styrene rubber it is one or more it is broken after be dissolved in ethyl acetate or
5~20% rubber solutions are made in butyl acetate.
7. a kind of low bounce-back power cover film according to claim 4, which is characterized in that the polyurethane solutions are by poly- ammonia
It is dissolved after ester rubber chunk with ethyl acetate or dimethylbenzene n,N-dimethylacetamide, obtains 5~20% polyurethane solutions.
8. a kind of low bounce-back power cover film according to claim 1 or 2, which is characterized in that the gluing oxidant layer (2) uses
Acrylic resin or epoxyn.
9. a kind of preparation method of low bounce-back power cover film as described in claim 1, which comprises the following steps:
Step 1 prepares PI film；
Step 2, lamination or coating resistance glue-line on high temperature resistant pet vector film；
Step 3, above-mentioned pet vector film and the PI film of low bounce-back power is compound；
Step 4 is coated with the gluing oxidant layer of low bounce-back power, then compound release film on above-mentioned PI film.
10. a kind of preparation method of low bounce-back power cover film according to claim 8, which is characterized in that the PI film
Preparation method the following steps are included:
By polyamic acid solution coating curtain coating on mirror surface steel band, steel band passes through 160~380 DEG C with 1~3m/min speed
Then ladder-elevating temperature baking oven is removed polyimide film from steel band, without biaxial tension, winding obtains low bounce-back power PI film,
The elongation at break of the PI film is greater than 60%, and tensile strength is less than 150MPa, and separation temperature is lower than 390 DEG C.
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| CN201811382537.3A CN109575831A (en) | 2018-11-20 | 2018-11-20 | Low bounce-back power cover film and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811382537.3A CN109575831A (en) | 2018-11-20 | 2018-11-20 | Low bounce-back power cover film and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111040649A (en) * | 2019-11-14 | 2020-04-21 | 苏州市新广益电子有限公司 | PTFE composite glue-resistant film for LCP high-temperature lamination and production process thereof |
| CN111842087A (en) * | 2020-07-21 | 2020-10-30 | 南通博联材料科技有限公司 | Method for preparing high-thickness polyimide film-coated metal product |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1504067A (en) * | 2001-09-28 | 2004-06-09 | 钟渊化学工业株式会社 | Polyimide film for flexible printed board and flexible printed board using same |
| CN1943285A (en) * | 2004-02-26 | 2007-04-04 | 新日铁化学株式会社 | Laminate for wiring board |
| CN105985740A (en) * | 2015-01-13 | 2016-10-05 | 台虹科技股份有限公司 | Covering film with high dimensional stability and manufacturing method of flexible printed circuit board |
-
2018
- 2018-11-20 CN CN201811382537.3A patent/CN109575831A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1504067A (en) * | 2001-09-28 | 2004-06-09 | 钟渊化学工业株式会社 | Polyimide film for flexible printed board and flexible printed board using same |
| CN1943285A (en) * | 2004-02-26 | 2007-04-04 | 新日铁化学株式会社 | Laminate for wiring board |
| CN105985740A (en) * | 2015-01-13 | 2016-10-05 | 台虹科技股份有限公司 | Covering film with high dimensional stability and manufacturing method of flexible printed circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111040649A (en) * | 2019-11-14 | 2020-04-21 | 苏州市新广益电子有限公司 | PTFE composite glue-resistant film for LCP high-temperature lamination and production process thereof |
| CN111040649B (en) * | 2019-11-14 | 2021-02-09 | 苏州市新广益电子有限公司 | PTFE composite glue-resistant film for LCP high-temperature lamination and production process thereof |
| CN111842087A (en) * | 2020-07-21 | 2020-10-30 | 南通博联材料科技有限公司 | Method for preparing high-thickness polyimide film-coated metal product |
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