CN208093540U - Packaging body - Google Patents
Packaging body Download PDFInfo
- Publication number
- CN208093540U CN208093540U CN201721849374.6U CN201721849374U CN208093540U CN 208093540 U CN208093540 U CN 208093540U CN 201721849374 U CN201721849374 U CN 201721849374U CN 208093540 U CN208093540 U CN 208093540U
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- China
- Prior art keywords
- plastic
- sheet metal
- jig
- packaging
- plastic packaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
Abstract
The utility model provides a kind of packaging body, the packaging body includes the chip of a carrier and at least one setting on the carrier, one plastic-sealed body coats the chip, it is covered with sheet metal on the surface of the plastic-sealed body, the sheet metal is previously formed on the jig of a flexible electrodepositable, and is transferred to the plastic-sealed body surface from the flexible electrodepositable jig.Advantage is to save the process flow, and cost-effective, sheet metal not only acts as electromagnetic shielding action.It is also used as conductive layer use, while sheet metal has heat sink functionality, in addition, metallic pattern can be formed on sheet metal, is used as wiring layer.
Description
Technical field
The utility model is related to field of semiconductor package more particularly to a kind of packaging bodies.
Background technology
With the development of electronic product, semiconductor technologies be widely used in manufacture memory, central processing unit (CPU),
Liquid crystal display device (LCD), light emitting diode (LED), laser diode and other devices or chipset etc..Due to semiconductor
The electronic building bricks such as component, electric component of microcomputer (MEMS) or photoelectric subassembly have small fine circuit and construction, therefore to avoid
Dust, acid-base material, moisture and oxygen etc. pollute or corrode electronic building brick, and then influence its reliability and service life, are needed in technique
The related electric energy transmission (PowerDistribution) of above-mentioned electronic building brick, signal transmission (Signal are provided by encapsulation technology
Distribution), heat loss (HeatDissipation), and protection and support (ProtectionandSupport)
Etc. functions.
Semiconductor chip it is packed form packaging body after, according to the difference of service condition, which also wants and it
He connects electric elements or assembling.For example, in certain situations it is desirable to form patterned conductive layer on packaging body surface, with
Convenient for the progress of the techniques such as subsequent plating.The mode that existing packaging body forms conductive layer is complicated, such as passes through ion sputtering
Technique forms conductive layer, can increase manufacture craft, extend the production time of product, and be unfavorable for cost-effective.
Therefore, the packaging body prepared there is an urgent need for a kind of novel plastic package method and using the plastic package method, overcomes above-mentioned encapsulation
The shortcomings that body.
Utility model content
Technical problem to be solved by the utility model is to provide a kind of packaging bodies, packaging technology can be utilized one
Sheet metal cover does not increase additional step on packaging body surface, has saved technological process, cost-effective, and in plastic packaging
Directly there is sheet metal to be formed in packaging body surface afterwards, the sheet metal can play the role of electromagnetic shielding.
To solve the above-mentioned problems, the utility model provides a kind of packaging body, including a carrier and at least one setting in institute
The chip on carrier is stated, a plastic-sealed body coats the chip, sheet metal, the metal are covered on the surface of the plastic-sealed body
Thin slice is previously formed on the jig of a flexible electrodepositable, and is transferred to the plastic packaging body surface from the flexible electrodepositable jig
Face.
Further, the sheet metal be described in the surface of plastic-sealed body be with multiple pits, in plastic packaging step, institute
It states plastic packaging material to be filled in the pit, so that after removing plastic package die, the sheet metal is combined simultaneously with the plastic-sealed body
It is covered in the plastic-sealed body surface.
Further, the sheet metal is one layer or multilayer.
One of the utility model is not the advantage is that have a sheet metal cover on packaging body surface using packaging technology
Have and increase additional step, has saved technological process, it is cost-effective, and directly there is sheet metal to be formed in packaging body after plastic packaging
Surface, the sheet metal can play the role of electromagnetic shielding.In addition, the sheet metal for being covered in packaging body surface can conduct
It can be used as conductive layer in other techniques of packaging body, for example, in subsequent electroplating technology, the graphical metal
Thin slice, forms metal pattern, and the metal pattern can be used as conductive layer use.In addition, forming metal on the packaging body surface
After thin slice, in the subsequent process, the techniques such as plating, chemical plating, sputtering may be used and thicken the sheet metal, so that the gold
Belong to the function that thin slice has cooling fin.At the same time it can also form it on sheet metal with techniques such as plating, chemical plating, sputterings
His metallic pattern.
The utility model another advantage is that in the prior art, when carrying out plastic packaging using plastic package die, in order to prevent
Plastic packaging material sticks in the inner surface of the plastic packaging slot, it usually needs a release film (release is arranged in the inner surface of plastic packaging slot
Film), the release film can prevent plastic packaging material from sticking in the inner surface of plastic package die, and be easy to packaging body and plastic package die point
From.And the application places the sheet metal of a covering plastic packaging slot inner surface, the metal foil in the plastic packaging slot inner surface
Piece can play the role of preventing plastic packaging material from sticking in plastic packaging slot inner surface, and then can be not provided in the inner surface of the plastic package die
Release film, it is cost-effective, and shorten the process time.
The another advantage of the utility model is, sheet metal is pre-formed on the jig, will have sheet metal
Jig as in plastic package die, to avoid to plastic package die to be formed the operation of sheet metal, method is simple, and is easy to
Implement.
Description of the drawings
Fig. 1 is the step schematic diagram of the utility model plastic package method；
Fig. 2A~Fig. 2 F are the process flow charts of the first specific implementation mode of the utility model plastic package method；
Fig. 3 A~Fig. 3 G are the process flow charts of the second specific implementation mode of the utility model plastic package method；
Fig. 4 is the structural schematic diagram of the utility model packaging body；
Fig. 5 is flip-chip schematic diagram.
Specific implementation mode
It elaborates below in conjunction with the accompanying drawings to a kind of specific implementation mode of packaging body provided by the utility model.
The utility model provides a kind of plastic package method.Fig. 1 is the step schematic diagram of the utility model plastic package method, is referred to
Shown in Fig. 1, the utility model plastic package method includes the following steps：Step S10, one product to be packaged, the production to be packaged are provided
Product include a carrier, are provided at least one chip on the carrier, the chip is electrically connected with the carrier；Step S11,
A plastic package die is provided, the plastic package die has a plastic packaging slot；Step S12, one jig, the shape of the jig and institute are provided
The shape for stating plastic packaging slot is identical, and the jig covers the inner wall of the plastic packaging slot, and a metal is formed in the jig inner surface
Thin slice；Step S13, in plastic package die side plastic packaging material or in product to be packaged there is the side of chip to place plastic packaging material, and will
The product to be packaged and the plastic packaging slot fasten, wherein the product to be packaged has the surface of chip towards the plastic packaging
In slot；Step S14, plastic packaging, the plastic packaging material forms plastic-sealed body, and coats the chip, forms packaging body；Step S15, it removes
The plastic package die, the jig are removed together with the plastic package die, and the sheet metal cover is in the plastic packaging body surface
Face.
Fig. 2A~Fig. 2 F are the process flow charts of the first specific implementation mode of the utility model plastic package method.
It refers to shown in step S10 and Fig. 2A, a product 20 to be packaged is provided, the product 20 to be packaged includes a carrier
21, at least one chip 22 is provided on the carrier 21, the chip 22 is connect with the carrier 21.Wherein, the load
Body 21 can be the structures well known in the art such as lead frame, in this embodiment, in order to clearly illustrate that this practicality is new
Type technical solution, on the carrier 21 setting there are two chip, the utility model to the number of chips on carrier 21 without
Limitation.The chip 21 can be pasted on the carrier by binder, and the chip 22 can be drawn by conducting resinl or metal
Line is connect with the carrier 21.The chip 22 is arranged by the way of formal dress or upside-down mounting on the carrier 21.In this tool
In body embodiment, 22 formal dress of the chip is arranged on the carrier 21.In another specific implementation mode of the utility model,
22 upside-down mounting of the chip is arranged on the carrier 21, please refers to Fig. 5.Wherein, chip formal dress mode and upside-down mounting mode are ability
Domain conventional structure, mounting means of the chip 22 on carrier 21 have no effect on the technical solution of the utility model.
Step S11 and Fig. 2 B is referred to, a plastic package die 30 is provided, the plastic package die 30 has a plastic packaging slot 31.Institute
It is the traditional dies in semiconductor packages to state plastic package die 30.The plastic packaging slot 31 provides encapsulation sky for follow-up for chip package
Between.
Step S12 and Fig. 2 C is referred to, a jig 60, the shape of the shape of the jig 60 and the plastic packaging slot 31 are provided
It is identical, and the jig 60 covers the inner wall of the plastic packaging slot 31.I.e. the jig 60 is fitted in the interior table of the plastic packaging slot 31
Face.The jig 60 can advance comprising.
A sheet metal 40 is formed in 60 inner surface of the jig.The material of the sheet metal 40 can be copper, nickel or
This fields such as person's stainless steel common metal.The jig 60 is flexible electrodepositable jig, such as steel disc.The sheet metal 40 can
60 inner surface of the jig is formed in using electric plating method.The sheet metal 40 can be one layer or multilayer.In this tool
In body embodiment, it is schematically painted one layer of sheet metal 40.Due to placed jig 60 and gold in 31 inner surface of plastic packaging slot
Belonging to thin slice 40, the jig 60 and sheet metal 40 can prevent subsequent plastic packaging material from sticking in the inner surface of the plastic packaging slot 3, and
Be also easy to packaging body to detach with plastic package die, therefore, release film can be not provided in the inner surface of the plastic packaging slot, so save at
This, and shorten the process time.
If in addition, directly forming sheet metal 40 on 31 surface of plastic packaging slot, need to operate plastic package die, and it is right
Plastic package die carries out operation and has difficulties, and is not easy to carry out.And in this step, the jig 60 can advance comprising, and in institute
It states and is placed into the plastic packaging slot 31 after forming sheet metal 40 in jig 60, and then avoid directly carrying out the plastic package die
Operation, method are simple and practicable.
Preferably, the sheet metal 40 formed in the jig 60, surface can be rough surface, described in reinforcement
Sheet metal 40 subsequently with the binding force of packaging body.
Step S13 and Fig. 2 D is referred to, plastic packaging material 50 is placed in 30 side of plastic package die or is had in product 20 to be packaged
Plastic packaging material is placed in the side of chip 22, and the product 20 to be packaged is fastened with the plastic packaging slot 31, wherein described to be packaged
Product 20 has the surface of chip 22 towards in the plastic packaging slot 31.Shown in Fig. 2 D, in this embodiment, in institute
It states side of the product 20 to be packaged with chip 22 and places plastic packaging material 50, the plastic packaging material is solid states.The plastic packaging material 50
For the material of this field routine, such as epoxy resin.In this embodiment, the plastic package die 30 waits sealing positioned at described
The top of product 20 is filled, the plastic packaging slot 31 is directed at the product to be packaged 20 downward.When needing plastic packaging, the plastic sealed mould is moved down
Tool 30 moves up the product to be packaged 20, so that there is the product to be packaged 20 surface of chip 22 to be located at the plastic packaging
Inside slot 31, and then the product to be packaged 20 is made to be fastened with the plastic packaging slot 31.
It refers to shown in step S14 and Fig. 2 E, plastic packaging, the plastic packaging material 50 forms plastic-sealed body 51, and coats the chip
22, form packaging body, wherein and the plastic-sealed body 51 can also coat the carrier 21, in this embodiment, the modeling
Seal the only coating chip 22 of body 51.Further, in the plastic packaging step, the plastic package die 30 heats, so that the plastic packaging material 50
Fusing, the cooling plastic package die 30, so that the plastic packaging material 50 is formed by curing plastic-sealed body 51.In this step, the plastic packaging
The pressure of mold 30 makes the sheet metal 40 be combined with the plastic-sealed body 51, in step S15, after removing plastic package die,
The sheet metal 40 is combined with the packaging body and is covered in the packaging body surface, and the jig 60 is then adsorbed on the modeling
31 inner wall of plastic packaging slot for sealing mold, is removed together with the plastic package die 30.Further, it can be controlled in shape on the jig 60
At sheet metal 40 roughness, if the roughness of the sheet metal 40 is relatively low, the sheet metal 40 is controlled with described
The conjugation of tool 60 is low, and the sheet metal 40 is easy to detach with the jig 60.
It refers to shown in step S15 and Fig. 2 F, removes the plastic package die 30, the sheet metal 40 is covered in the modeling
Seal 51 surface of body.Since in plastic packaging step, the pressure of the plastic package die makes the sheet metal 40 and the plastic-sealed body
51 combine, and therefore, in this step, after removing the plastic package die 30, the sheet metal 40 is not in company with plastic package die 30
It removes together, but is covered in the surface of the plastic-sealed body 51, the jig 60 is then adsorbed on the plastic packaging slot of the plastic package die
31 inner walls are removed together with the plastic package die 30.
After 50 surface of the plastic-sealed body forms sheet metal 40, when there is demand, the methods of plating may be used and thicken
The sheet metal 40, so that the sheet metal 40 has the function of cooling fin.At the same time it can also with plating, chemical plating, splash
It the techniques such as penetrates and forms other metallic patterns on sheet metal.
The utility model plastic package method also provides one second specific implementation mode.Fig. 3 A~Fig. 3 G are the utility model plastic packagings
The process flow chart of the second specific implementation mode of method.
The second specific implementation mode of the utility model plastic package method and the first specific implementation mode difference lies in jig 60,
The relative position of sheet metal 40, the setting of plastic packaging material 50 and plastic package die 30 and product 20 to be packaged, is described as follows.
It refers to shown in Fig. 3 A, provides a product 20 to be packaged, the product 20 to be packaged includes a carrier 21, described
At least one chip 22 is provided on carrier 21, the chip 22 is electrically connected with the carrier 21.Wherein, the carrier 21 can be with
For the structure well known in the art such as lead frame, in this embodiment, in order to clearly illustrate the utility model technical side
Case, there are two chips, the utility model to be not limited to the number of chips on carrier 21 for setting on the carrier 21.It is described
Chip 21 can be pasted on the carrier by binder, and the chip 22 can pass through conducting resinl or metal lead wire and the load
Body 21 is electrically connected.
It refers to shown in Fig. 3 B, a plastic package die 30 is provided, the plastic package die 30 has a plastic packaging slot 31.The plastic packaging
Mold 30 is the traditional dies in semiconductor packages.The plastic packaging slot 31 provides encapsulated space for follow-up for chip package.
It referring to shown in Fig. 3 C, a jig 60 is provided, the shape of the jig 60 is identical as the shape of the plastic packaging slot 31,
And the jig 60 covers the inner wall of the plastic packaging slot 31.I.e. the jig 60 is fitted in the inner surface of the plastic packaging slot 31.Institute
Stating jig 60 can advance comprising.
A sheet metal 40 is formed in 60 inner surface of the jig.The material of the sheet metal 40 can be copper, nickel or
This fields such as person's stainless steel common metal.The jig 60 is flexible electrodepositable jig, such as steel disc.The sheet metal 40 can
60 inner surface of the jig is formed in using electric plating method.The sheet metal 40 can be one layer or multilayer.In this tool
In body embodiment, it is schematically painted one layer of sheet metal 40.Due to placed jig 60 and gold in 31 inner surface of plastic packaging slot
Belonging to thin slice 40, the jig 60 and sheet metal 40 can prevent subsequent plastic packaging material from sticking in the inner surface of the plastic packaging slot 3, and
Be also easy to packaging body to detach with plastic package die, therefore, release film can be not provided in the inner surface of the plastic packaging slot, so save at
This, and shorten the process time.
If in addition, directly forming sheet metal 40 on 31 surface of plastic packaging slot, need to operate plastic package die, and it is right
Plastic package die carries out operation and has difficulties, and is not easy to carry out.And in this step, the jig 60 advance comprising and can form gold
It is placed into the plastic packaging slot 31 after belonging to thin slice 40, and then avoids directly operating the plastic package die, method is simply easy
Row.Preferably, the sheet metal 40 formed in the jig 60, surface can be rough surface, to reinforce the metal
Thin slice 40 subsequently with the binding force of packaging body.
In this embodiment, plastic packaging material 50 is pre-placed in the jig 60 with sheet metal 40.The modeling
Envelope material 50 is solid states or liquid form.The plastic packaging material 50 is the material of this field routine, such as epoxy resin.
It refers to shown in Fig. 3 D, the jig 60 for being placed with plastic packaging material is put into the plastic packaging slot 31.In this specific implementation
In mode, the plastic packaging material 50 is previously positioned in the jig 60, and the jig 60 places into the plastic packaging slot 31.At it
In his specific implementation mode, after the jig 60 can also being put into the plastic packaging slot 31, then the plastic packaging material 50 placed
In the jig 60.
It refers to shown in Fig. 3 E, the product 20 to be packaged is fastened with the plastic packaging slot 31, wherein the production to be packaged
Product 20 have the surface of chip 22 towards in the plastic packaging slot 31.In this embodiment, the plastic package die 30 is located at
There is the surface of chip 22 to be directed at the plastic packaging slot downward for the lower section of the product to be packaged 20, the product 20 to be packaged.It needs
When wanting plastic packaging, moves up the plastic package die 30 or move down the product to be packaged 20, so that the product to be packaged 20 has
The surface of chip 22 is located inside the plastic packaging slot 31, and then the product to be packaged 20 is made to be fastened with the plastic packaging slot 31.
It refers to shown in Fig. 3 F, plastic packaging, the plastic packaging material 50 forms plastic-sealed body 51, and coats the chip 22, forms envelope
Fill body.Further, in the plastic packaging step, the plastic package die 30 heats, so that the plastic packaging material 50 melts, the cooling modeling
Mold 30 is sealed, so that the plastic packaging material 50 is formed by curing plastic-sealed body 51.In this step, the pressure of the plastic package die 30 makes
The sheet metal 40 is combined with the plastic-sealed body 51, then subsequently remove plastic package die after, the sheet metal 40 with it is described
Packaging body in conjunction with and be covered in the packaging body surface.Preferably due to 40 surface of the sheet metal is rough surface, then institute
It can be filled in the pit of the rough surface after stating plastic packaging material fusing, further improve the sheet metal and the plastic packaging
51 binding force of body.
It refers to shown in Fig. 3 G, removes the plastic package die 30, the sheet metal 40 is covered in 51 table of the plastic-sealed body
Face.The jig 60 is then adsorbed on 31 inner wall of plastic packaging slot of the plastic package die, is removed together with the plastic package die 30.By
In in plastic packaging step, the pressure of the plastic package die makes the sheet metal 40 be combined with the plastic-sealed body 51, therefore,
In the step, after removing the plastic package die 30, the sheet metal 40 is not removed in company with plastic package die 30 together, but is covered
It covers on the surface of the plastic-sealed body 51.Further, it is can be controlled in the roughness of the sheet metal 40 formed on the jig 60, if
The roughness of the sheet metal 40 is relatively low, then the sheet metal 40 is low with the conjugation of the jig 60, the metal foil
Piece 40 is easy to detach with the jig 60.
The utility model plastic package method utilizes packaging technology that one sheet metal cover on packaging body surface, is not increased volume
Outer step has saved technological process, cost-effective, and directly has sheet metal to be formed in packaging body surface, institute after plastic packaging
Electromagnetic shielding can be played the role of by stating sheet metal.In addition, can be used as can be for the sheet metal for being covered in packaging body surface
It is used as conductive layer in other techniques of packaging body, for example, in subsequent electroplating technology, the graphical sheet metal,
Metal pattern is formed, the metal pattern can be used as conductive layer use.
In the prior art, when carrying out plastic packaging using plastic package die, plastic packaging material sticks in the plastic packaging slot in order to prevent
Inner surface, it usually needs one release film (release film) is set in the inner surface of plastic packaging slot, the release film can prevent from moulding
Envelope material sticks in the inner surface of plastic package die, and is easy to packaging body and is detached with plastic package die.And the application is in the plastic packaging slot
The sheet metal of a covering plastic packaging slot inner surface is placed on surface, and the sheet metal, which can play, prevents plastic packaging material from sticking in modeling
The effect of sealing groove inner surface, and then it can be not provided with release film in the inner surface of the plastic package die, it is cost-effective, and shorten technique
Time.
The utility model also provides a kind of packaging body.Fig. 4 is the structural schematic diagram of the utility model packaging body, refers to figure
Shown in 4, the packaging body includes a carrier 21 and at least one chip 22 that is arranged on the carrier 21.One plastic-sealed body 51 coats
The chip 22 is covered with sheet metal 40 on the surface of the plastic-sealed body 51.It is soft that the sheet metal 40 is previously formed in one
Property electrodepositable jig on, and 51 surface of the plastic-sealed body is transferred to from the flexible electrodepositable jig, for example, the metal foil
Piece 40 is formed in using electric plating method on the flexible electrodepositable jig.Further, the hair side of the sheet metal 40 has
Multiple pits, in plastic packaging step, the plastic packaging material is filled in the pit, so that after removing plastic package die, the gold
Belong to thin slice 40 to be combined with the plastic-sealed body and be covered in the plastic-sealed body surface.The sheet metal 40 can be one or more layers.
The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art
Art personnel can also make several improvements and modifications without departing from the principle of this utility model, these improvements and modifications
Also it should be regarded as the scope of protection of the utility model.
Claims (3)
1. a kind of packaging body, which is characterized in that include the chip of a carrier and at least one setting on the carrier, a plastic-sealed body
The chip is coated, is covered with sheet metal on the surface of the plastic-sealed body, the sheet metal is previously formed in a flexibility can
On the jig of plating, and the plastic-sealed body surface is transferred to from the flexible electrodepositable jig.
2. packaging body according to claim 1, which is characterized in that the surface of the sheet metal towards the plastic-sealed body is
With multiple pits, in plastic packaging step, plastic packaging material is filled in the pit, so that after removing plastic package die, the metal
Thin slice is combined with the plastic-sealed body and is covered in the plastic-sealed body surface.
3. packaging body according to claim 1, which is characterized in that the sheet metal is one layer or multilayer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721849374.6U CN208093540U (en) | 2017-12-26 | 2017-12-26 | Packaging body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721849374.6U CN208093540U (en) | 2017-12-26 | 2017-12-26 | Packaging body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208093540U true CN208093540U (en) | 2018-11-13 |
Family
ID=64068753
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721849374.6U Active CN208093540U (en) | 2017-12-26 | 2017-12-26 | Packaging body |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208093540U (en) |
-
2017
- 2017-12-26 CN CN201721849374.6U patent/CN208093540U/en active Active
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