CN203788550U - Structure for realizing inner interlayer positioning - Google Patents
Structure for realizing inner interlayer positioning Download PDFInfo
- Publication number
- CN203788550U CN203788550U CN201420060544.2U CN201420060544U CN203788550U CN 203788550 U CN203788550 U CN 203788550U CN 201420060544 U CN201420060544 U CN 201420060544U CN 203788550 U CN203788550 U CN 203788550U
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- Prior art keywords
- layer
- interlayer
- copper ring
- interior
- ring group
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model discloses a structure for realizing inner interlayer positioning. The structure comprises shaping lines arranged on the periphery of an inner layer circuit board; four corners of a region formed by an upper shaping line, a lower shaping line, a left shaping line and a right shaping line are respectively provided with an interlayer checking copper ring group; the interlayer checking copper ring group on the inner layer circuit board of each layer is concentric; interlayer checking copper rings on the inner layer circuit board of the first layer are solid dots; and starting from the first layer, diameters of the interlayer checking copper rings on the inner layer circuit board of each layer are larger than those of the former layer. According to the structure for realizing inner interlayer positioning, interlayer offset of an initial piece of product can be timely found out, batch unqualified problems can be prevented, scrapping of products and manpower and material resource waste can be reduced, the production cost is reduced and saved, the product yield can be improved, customer delivery time can be improved, and company benefits can be improved.
Description
Technical field
The utility model relates to board production, specifically refers to a kind of location structure between interior-layer layer of realizing.
Background technology
When multilayer circuit board production operation, every one deck internal layer circuit plate all needs accurate positioning, and particularly first version must be wanted accurate positioning, if misalignment between interior-layer layer while production occurs that skew is difficult to timely discovery, causes product just to scrap and replenish to follow-up flow process.This process can cause the great man power and material's of enterprise loss, also causes very large economic loss.
Utility model content
The purpose of this utility model is to provide a kind of multilayer internal layer circuit plate of realizing and accurately locates, saves location structure between the interior-layer layer of production cost, raising product yield.
To achieve these goals, the one of designing the utility model realizes location structure between interior-layer layer, it comprises the form wire that is arranged on internal layer circuit plate surrounding periphery, and on four jiaos of positions in the region forming at upper and lower, left and right form wire, interlayer of each design checks copper ring group.
Interlayer on described every one deck internal layer circuit plate checks that copper ring group is concentric.
Interlayer on described ground floor internal layer circuit plate checks that copper ring is black circle, from ground floor,
Interlayer on every one deck internal layer circuit plate checks that the diameter of copper ring is all large than front one deck.
Between described interior-layer layer, check that copper ring group designs centered by ground floor, the solid copper round dot of designed size 80mill, the second layer, the 3rd layer, n layer outwards strengthen 40mil successively.
The utility model is realized location structure between interior-layer layer and is checked copper ring group by the interlayer being made up of multiple inspection copper rings, can find to be in time offset between initial workpiece gas producing formation, there is the bad problem of property in batches in prevention, can reduce product rejection and manpower and materials waste, reduction saves production cost, can improve product yield, improve client and hand over the phase, improve company's benefit.
brief description of the drawings:
Fig. 1 is the structural representation that the utility model is realized location structure between interior-layer layer.
Embodiment
For the ease of those skilled in the art's understanding, below in conjunction with specific embodiment and accompanying drawing, structural principle of the present utility model is described in further detail.
As shown in Figure 1, one realizes location structure between interior-layer layer, and it comprises the form wire 5 that is arranged on internal layer circuit plate surrounding periphery, and on four jiaos of positions in the region forming at upper and lower, left and right form wire 5, interlayer of each design checks copper ring group.Interlayer on described every one deck internal layer circuit plate checks that copper ring group is concentric.Interlayer on described ground floor internal layer circuit plate checks that copper ring is black circle, and from ground floor, the interlayer on every one deck internal layer circuit plate checks that the diameter of copper ring is all large than front one deck.Between described interior-layer layer, check that copper ring group designs centered by ground floor, the solid copper round dot of designed size 80mill, the second layer, the 3rd layer, n layer outwards strengthen 40mil successively.
As shown in Figure 1, now illustrate as an example of more than four layers multi-layer sheet example: more than four layers multi-layer sheet is offset as between inspection layer guarantees that Aligning degree is normal, need to adopt Aligning degree technology between interior-layer layer, outside the form wire of every one deck internal layer circuit plate, interlayer of four jiaos of each designs checks copper ring group.Described interlayer checks that copper ring group is made up of four copper rings, and dividing is the copper ring 1 that is located at ground floor, the copper ring 2 of the second layer, the copper ring 3 of the 3rd layer, the copper ring 4 of the 4th layer.Between described interior-layer layer, check that copper ring group designs centered by ground floor, the solid copper round dot of designed size 80mill, the second layer, the 3rd layer, the 4th layer outwards strengthen 40mil successively, and design copper ring size is 120 (outer shrouds) * 86 (interior ring) mil, 160*126mil 200*166mil, 240*206mil, 280*246mil.
The operation principle that the utility model is realized location structure between interior-layer layer is: multilayer internal layer circuit plate is pressed
After having closed, check interlayer alignment ring with X-ray machine, between every two adjacent copper rings, have interlayer skew if there is the two rings internal layer that meets representation mutually, normal if little ring is positioned at large ring intermediate representation interlayer alignment.
The above, be only preferred embodiment of the present utility model, not the utility model done to any pro forma restriction; The those of ordinary skill of all industry all can be implemented the utility model with the above shown in by specification accompanying drawing swimmingly; But all those skilled in the art are not departing within the scope of technical solutions of the utility model, can utilize disclosed above technology contents and a little change, the modification of making and the equivalent variations developing, be equivalent embodiment of the present utility model; Meanwhile, the change of any equivalent variations that all foundations essence technology of the present utility model is done above embodiment, modification and differentiation etc., within all still belonging to the protection range of the technical solution of the utility model.
Claims (4)
1. realize a location structure between interior-layer layer, comprise the form wire (5) that is arranged on internal layer circuit plate surrounding periphery, it is characterized in that: on four jiaos of positions in the region forming at upper and lower, left and right form wire (5), interlayer of each design checks copper ring group.
2. according to claim 1ly realize location structure between interior-layer layer, it is characterized in that: the interlayer on described every one deck internal layer circuit plate checks that copper ring group is concentric.
3. according to claim 2ly realize location structure between interior-layer layer, it is characterized in that: described
Interlayer on one deck internal layer circuit plate checks that copper ring is black circle, and from ground floor, the interlayer on every one deck internal layer circuit plate checks that the diameter of copper ring is all large than front one deck.
4. the method for locating between interior-layer layer according to realizing described in claim 2 or 3, it is characterized in that: between described interior-layer layer, check that copper ring group designs centered by the 1st layer, the solid copper round dot of designed size 80mill, the 2nd layer, the 3rd layer, n layer outwards strengthen 40mil successively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420060544.2U CN203788550U (en) | 2014-02-10 | 2014-02-10 | Structure for realizing inner interlayer positioning |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420060544.2U CN203788550U (en) | 2014-02-10 | 2014-02-10 | Structure for realizing inner interlayer positioning |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203788550U true CN203788550U (en) | 2014-08-20 |
Family
ID=51324698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420060544.2U Expired - Fee Related CN203788550U (en) | 2014-02-10 | 2014-02-10 | Structure for realizing inner interlayer positioning |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203788550U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105050339A (en) * | 2015-07-10 | 2015-11-11 | 东莞市科佳电路有限公司 | Method for detecting interlayer position deviation of multilayer printed circuit board |
| CN105392286A (en) * | 2015-11-10 | 2016-03-09 | 深圳崇达多层线路板有限公司 | Method for detecting circuit offset situation of core plate |
| CN107708285A (en) * | 2016-08-09 | 2018-02-16 | 北大方正集团有限公司 | The preparation method of multilayer circuit board and multilayer circuit board |
| CN109682331A (en) * | 2018-11-28 | 2019-04-26 | 惠州中京电子科技有限公司 | A kind of inclined detection method of multilayer circuit board layer |
| CN117979587A (en) * | 2024-04-02 | 2024-05-03 | 淄博芯材集成电路有限责任公司 | Alignment checking method for multilayer circuit board |
-
2014
- 2014-02-10 CN CN201420060544.2U patent/CN203788550U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105050339A (en) * | 2015-07-10 | 2015-11-11 | 东莞市科佳电路有限公司 | Method for detecting interlayer position deviation of multilayer printed circuit board |
| CN105392286A (en) * | 2015-11-10 | 2016-03-09 | 深圳崇达多层线路板有限公司 | Method for detecting circuit offset situation of core plate |
| CN105392286B (en) * | 2015-11-10 | 2018-04-24 | 深圳崇达多层线路板有限公司 | The detection method of circuit drift condition on a kind of core plate |
| CN107708285A (en) * | 2016-08-09 | 2018-02-16 | 北大方正集团有限公司 | The preparation method of multilayer circuit board and multilayer circuit board |
| CN107708285B (en) * | 2016-08-09 | 2020-10-16 | 北大方正集团有限公司 | Multilayer circuit board and method for producing multilayer circuit board |
| CN109682331A (en) * | 2018-11-28 | 2019-04-26 | 惠州中京电子科技有限公司 | A kind of inclined detection method of multilayer circuit board layer |
| CN117979587A (en) * | 2024-04-02 | 2024-05-03 | 淄博芯材集成电路有限责任公司 | Alignment checking method for multilayer circuit board |
| CN117979587B (en) * | 2024-04-02 | 2024-06-07 | 淄博芯材集成电路有限责任公司 | Alignment checking method for multilayer circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140820 Termination date: 20160210 |