CN103874328A - Multilayer circuit board and inner layer core plate thereof - Google Patents
Multilayer circuit board and inner layer core plate thereof Download PDFInfo
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- CN103874328A CN103874328A CN201410060227.5A CN201410060227A CN103874328A CN 103874328 A CN103874328 A CN 103874328A CN 201410060227 A CN201410060227 A CN 201410060227A CN 103874328 A CN103874328 A CN 103874328A
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Abstract
The invention discloses an inner layer core plate of a printed circuit board. The inner layer core plate comprises a first copper clad surface and a second copper clad surface; a line pattern is formed on each of the first copper clad surface and the second copper clad surface; at least two first marks are formed on the first copper clad surface by etching; the dimensioning scales of the two first marks are same; at least two second marks are formed on the second copper clad surface by etching; the dimensioning scales of the second marks are not different; each second mark corresponds to the first marks; the shapes of the second marks and those of the first marks are correspondingly complementary. The invention also discloses a multilayer print circuit board adopting the inner layer core plate. According to the multilayer circuit board and the inner layer core plate thereof, the current aligning precision can be more conveniently obtained, and whether the precision is suitable for the current product can be favorably and fast judged.
Description
Technical field
The present invention relates to printed-board technology field, particularly relate to the core material of a kind of multilayer board and a kind of multilayer board.
Background technology
In high multilayer board is produced, interlayer alignment technology is the Focal point and difficult point in manufacturing process, and interlayer alignment the most direct bad result is can cause the holding of high multilayer board, short circuit and then affect electric property.Wherein, the interlayer alignment precision on core material two sides is the basis of whole high multilayer board interlayer alignment.
The interlayer alignment mode on traditional high multilayer board core material two sides is, on the two sides of core material, detection module is set.The detection module on two sides is complementary butterfly PAD design, with reference to figure 1.Butterfly PAD is superimposed completely to be closed the overlapping space that has no and represents good apposition afterwards.
Quantize to distinguish but these traditional detection methods cannot realize data, also can not obtain intuitively core material interlayer to degree accuracy rating.
Summary of the invention
Based on this, be necessary to provide a kind of core material of multilayer board, it can provide aligning accuracy intuitively.
A core material for printed circuit board (PCB), comprises that first covers copper face and second and cover copper face, and described first covers copper face and second covers and on copper face, form respectively line pattern; Described first covers etching on copper face forms at least two the first marks, and the dimensioning of described at least two the first marks is identical; Described second covers etching on copper face forms at least two the second marks, and the dimensioning of described at least two the second marks is different; Described in each, the second mark is corresponding with first mark, and the shape of the second mark and the first mark corresponding complementary.
In an embodiment, the shape of described at least two the first marks is identical therein.
In an embodiment, the shape of described at least two the first marks is circle, and diameter is identical therein; The shape of described at least two the second marks is annular, and internal diameter is different.
In an embodiment, described at least two the second marks are arranged according to dimensioning size order therein, and the minimum diameter in described at least two the second marks is identical with the diameter of the first mark.
In an embodiment, the shape of described at least two the first marks is selected from circle, regular polygon and regular polygonal therein, and shape between any two the first marks is identical or different.
Therein in an embodiment, described first covers position corresponding with the first mark on copper face is provided with the difference mark between this first mark and the dimensioning of corresponding the second mark; Or second cover position corresponding with the second mark on copper face and be provided with the difference mark between this second mark and the dimensioning of corresponding the first mark.
Therein in an embodiment, described first covers copper face and second covers and on copper face, is all provided with auxiliary alignment mark.
In an embodiment, described the first mark and the first line pattern covering on copper face form simultaneously therein, and described the second mark and the second line pattern covering on copper face form simultaneously.
In an embodiment, described the first mark and the second mark are formed at the surrounding position of described core material therein.
A kind of multilayer board, comprises the inner central layer of printed circuit board as above of lamination.
Above-mentioned core material and multilayer board, can obtain current aligning accuracy more easily, contributes to judge fast whether this alignment precision is applicable to current production.
Brief description of the drawings
Fig. 1 is detection module schematic diagram used in traditional alignment detecting method;
Fig. 2 is the core material layer structure figure of the printed circuit board (PCB) of an embodiment;
Fig. 3 a is the part schematic diagram that forms first of the first mark on core material and cover copper face;
Fig. 3 b is the part schematic diagram that forms second of the second mark on core material and cover copper face;
Fig. 3 c is the graphics overlay schematic diagram on two sides on core material.
Embodiment
High multilayer board comprises the multilayer core material of lamination, and the two sides of core material is all to cover copper face, can form line pattern on its two sides.The method of shape line pattern is much the same with the method that forms line pattern covering of common single-layer printed circuit plate on copper face, and difference is that the line pattern on two sides needs to aim at.
Following simple declaration is once in the method that forms line pattern on copper face of covering of single-layer printed circuit plate.
On film paper, form the negative film figure of line pattern.
Covering the photosensitive dry film of fitting on copper face.
Film paper is covered to covering on copper face and exposing of the photosensitive dry film of having fitted.
Remove the unexposed part of photosensitive dry film.
Mask using the photosensitive dry film of exposure as line pattern carries out etching and obtains line pattern covering copper face.
Line pattern, mark and aid mark etc. related in following examples all can adopt said method to be formed at covering on copper face of core material.
As shown in Figure 2, be the core material layer structure figure of the printed circuit board (PCB) of an embodiment.This core material 10 comprises that plate body 110, first covers copper face 120 and second and covers copper face 130.First covers copper face 120 and second covers copper face 130 and is divided into the two sides of plate body 110.First covers copper face 120 and second covers and on copper face 130, forms respectively line pattern (not shown).
Fig. 3 a is the part schematic diagram that forms first of the first mark on core material and cover copper face.First covers etching on copper face 120 forms multiple the first marks 122, and the dimensioning of multiple the first marks 122 is identical.In illustrated embodiment, the first mark 122 is circular pad (pad), is formed by the first copper etching of covering of covering on copper face 120.The dimensioning of the first mark 122 represents the size in the region that this figure occupies, and for example in the present embodiment, the first mark 122 is circular, and its dimensioning can represent with its diameter, and the diameter of each the first mark 122 is 20mil(Mill).In other embodiments, if the first mark 122 is not circular, but during regular shapes such as square, regular hexagon, its dimensioning can represent with the external diameter of a circle of these regular shapes.
Multiple the first marks 122 on plate body 110 linearly, equidistantly arrange.Concrete position can be the white space in the surrounding of plate body.
Fig. 3 b is the part schematic diagram that forms second of the second mark on core material and cover copper face.Second covers etching on copper face 130 forms multiple the second marks 132, and the dimensioning of multiple the second marks 132 is different.The second mark 132 is the annulars that copper etching forms that cover that cover on copper face 130 by second.The internal diameter of multiple the second marks 132 is different.Preferably, multiple the second marks 132 are arranged according to dimensioning size order, and minimum diameter in multiple the second mark 132 is identical with the diameter of the first mark 122.In the present embodiment, the internal diameter of multiple annulus is followed successively by 20mil(Mill from small to large), 21mil, 22mil, 23mil, 24mil, 25mil, 26mil.
Each second mark 132 is corresponding with first mark 122, and the shape of the second mark 132 and the first mark 122 corresponding complementary.In the present embodiment, be by annular and circular corresponding complementary.In other embodiments, can also utilize such as regular regular polygon pad and the pad that cuts out this regular polygon and carry out corresponding complementary.
In above-described embodiment, the shape of multiple the first marks 122 is identical, is circle.In other embodiments, the first mark 122 also can take different shapes respectively, the for example shape of the first mark 122 is optional for example, from circular, regular polygon and regular polygonal (pentalpha), and shape between any two the first marks 122 is identical or different.Only need to ensure the first corresponding mark 122 and the shape corresponding complementary of the second mark 132.
Further, with reference to figure 3a, first covers position corresponding with the first mark 122 on copper face 120 is provided with the difference mark 124 between this first mark 122 and the dimensioning of corresponding the second mark 132.The for example dimensioning of the first mark 122 is 20mil, and the dimensioning of the second mark 132 is 21mil, and the two diameter differs 1mil(radius and differs 0.5mil).Can be by the numerical marker of 1mil or 0.5mil the position in corresponding the first mark 122 correspondences.
Be appreciated that this difference indicates 124 and also can be located at second and cover position corresponding with the second mark 132 on copper face 130.
Further, first covers copper face 120 and is provided with auxiliary alignment mark 126, second and covers copper face 130 and be provided with auxiliary alignment mark 134.Auxiliary alignment mark 126,134 is for auxiliary first line pattern and the second line pattern covering on copper face 130 covering on copper face 120 of aiming at.
In above-described embodiment, the first mark 122 and the first line pattern covering on copper face 120 form simultaneously, are also the negative film figure simultaneously on film paper with the first mark 122 and line pattern.Same, the second mark 132 and the second line pattern covering on copper face 130 form simultaneously.Like this, the degree of registration of the first mark 122 and the second mark 132 can reflect that first covers copper face 120 and second and cover the degree of registration of the line pattern on copper face 130.
All after the treatment steps such as exposure imaging form, core material 10, to optical test, is observed to first mark 122 on core material 10 two sides and the alignment case of the second mark 132 at line pattern and mark.In the present embodiment, specifically observe and whether have the tangent situation of ring in the circular pad of the first mark 122 and the annular of the second mark 132, with reference to figure 3c, if exist, the value of the corresponding difference mark of the second mark 132 of next dimensioning is current aligning accuracy.The interior ring of the second mark 132 that for example the first mark 122 is 23mil with corresponding internal diameter is tangent, and aligning accuracy is that internal diameter is the value of the corresponding difference mark of the second mark 132 of 24mil: 2mil(radius).
Therefore above-mentioned core material 10 can obtain current aligning accuracy more easily.
Based on the core material of above-described embodiment, can make multilayer board.This multilayer board comprises the core material of lamination.
The above embodiment has only expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a core material for printed circuit board (PCB), comprises that first covers copper face and second and cover copper face, and described first covers copper face and second covers and on copper face, form respectively line pattern;
Described first covers etching on copper face forms at least two the first marks, and the dimensioning of described at least two the first marks is identical;
Described second covers etching on copper face forms at least two the second marks, and the dimensioning of described at least two the second marks is different;
Described in each, the second mark is corresponding with first mark, and the shape of the second mark and the first mark corresponding complementary.
2. the core material of printed circuit board (PCB) according to claim 1, is characterized in that, the shape of described at least two the first marks is identical.
3. the core material of printed circuit board (PCB) according to claim 2, is characterized in that, the shape of described at least two the first marks is circle, and diameter is identical; The shape of described at least two the second marks is annular, and internal diameter is different.
4. the core material of printed circuit board (PCB) according to claim 3, is characterized in that, described at least two the second marks are arranged according to dimensioning size order, and the minimum diameter in described at least two the second marks is identical with the diameter of the first mark.
5. the core material of printed circuit board (PCB) according to claim 1, is characterized in that, the shape of described at least two the first marks is selected from circle, regular polygon and regular polygonal, and shape between any two the first marks is identical or different.
6. the core material of printed circuit board (PCB) according to claim 1, is characterized in that, described first covers position corresponding with the first mark on copper face is provided with the difference mark between this first mark and the dimensioning of corresponding the second mark; Or second cover position corresponding with the second mark on copper face and be provided with the difference mark between this second mark and the dimensioning of corresponding the first mark.
7. the core material of printed circuit board (PCB) according to claim 1, is characterized in that, described first covers copper face and second covers and on copper face, be all provided with auxiliary alignment mark.
8. the core material of printed circuit board (PCB) according to claim 1, is characterized in that, described the first mark and the first line pattern covering on copper face form simultaneously, and described the second mark and the second line pattern covering on copper face form simultaneously.
9. the core material of printed circuit board (PCB) according to claim 1, is characterized in that, described the first mark and the second mark are formed at the surrounding position of described core material.
10. a multilayer board, comprises the inner central layer of printed circuit board as described in claim 1 to 9 any one of lamination.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410060227.5A CN103874328A (en) | 2014-02-21 | 2014-02-21 | Multilayer circuit board and inner layer core plate thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410060227.5A CN103874328A (en) | 2014-02-21 | 2014-02-21 | Multilayer circuit board and inner layer core plate thereof |
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| CN103874328A true CN103874328A (en) | 2014-06-18 |
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| CN201410060227.5A Pending CN103874328A (en) | 2014-02-21 | 2014-02-21 | Multilayer circuit board and inner layer core plate thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105611752A (en) * | 2015-12-14 | 2016-05-25 | 谢兴龙 | Manufacture method adopting inner layer pattern transfer exposure |
| CN105704937A (en) * | 2015-12-31 | 2016-06-22 | 广州兴森快捷电路科技有限公司 | Circuit board screen printing alignment judging method and structure |
| CN107041063A (en) * | 2017-06-09 | 2017-08-11 | 东莞市威力固电路板设备有限公司 | The processing method and multi-layer PCB of a kind of multi-layer PCB |
| CN113473752A (en) * | 2021-09-03 | 2021-10-01 | 四川英创力电子科技股份有限公司 | Marking method for improving alignment of inner-layer plate |
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| CN102497738A (en) * | 2011-12-19 | 2012-06-13 | 景旺电子（深圳）有限公司 | Method for manufacturing inner core plate by using outer semi-automatic exposure machine |
| CN203136321U (en) * | 2013-02-28 | 2013-08-14 | 北大方正集团有限公司 | Aligning device and printed circuit board |
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| DE4231180A1 (en) * | 1992-09-17 | 1994-03-31 | Siemens Ag | Producing adjustment structure for PCB - providing structured window in solder stop mark overlying metal zone applied to circuit board surface |
| JP2005268318A (en) * | 2004-03-16 | 2005-09-29 | Cmk Corp | Method for manufacturing multilayer printed wiring board |
| CN101472405A (en) * | 2007-12-26 | 2009-07-01 | 富葵精密组件(深圳)有限公司 | Multi-layer circuit board and manufacturing method thereof |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105611752A (en) * | 2015-12-14 | 2016-05-25 | 谢兴龙 | Manufacture method adopting inner layer pattern transfer exposure |
| CN105704937A (en) * | 2015-12-31 | 2016-06-22 | 广州兴森快捷电路科技有限公司 | Circuit board screen printing alignment judging method and structure |
| CN107041063A (en) * | 2017-06-09 | 2017-08-11 | 东莞市威力固电路板设备有限公司 | The processing method and multi-layer PCB of a kind of multi-layer PCB |
| CN107041063B (en) * | 2017-06-09 | 2019-05-03 | 东莞市威力固电路板设备有限公司 | A kind of processing method and multi-layer PCB of multi-layer PCB |
| CN113473752A (en) * | 2021-09-03 | 2021-10-01 | 四川英创力电子科技股份有限公司 | Marking method for improving alignment of inner-layer plate |
| CN113473752B (en) * | 2021-09-03 | 2021-11-23 | 四川英创力电子科技股份有限公司 | Marking method for improving alignment of inner-layer plate |
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Effective date of abandoning: 20171003 |