CN102865838B - Printed circuit board (PCB) borehole test method - Google Patents
Printed circuit board (PCB) borehole test method Download PDFInfo
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- CN102865838B CN102865838B CN201210370819.8A CN201210370819A CN102865838B CN 102865838 B CN102865838 B CN 102865838B CN 201210370819 A CN201210370819 A CN 201210370819A CN 102865838 B CN102865838 B CN 102865838B
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Abstract
The invention discloses a printed circuit board (PCB) borehole test method which comprises the following steps of: making test material, and arranging a circular copper-covered point on the inner layer corresponding to a silk-screen positioning hole; drilling the silk-screen positioning hole; and judging whether a uniform black shadow exists around the copper-covered point, and if so, determining that the borehole is qualified, otherwise, determining that the borehole is unqualified. By the test method, a test hole is added on the silk-screen positioning hole on the inner layer; the quality of the test hole can be checked by analyzing the proportion of the shadow exposed from a copper PAD image on the inner layer; and therefore, whether a film on the inner layer is zoomed and whether a borehole drilling band needs to be proportionally adjusted can be judged.
Description
Technical field
The present invention relates to printed circuit board (pcb) technical field, refer to the confirmation method that a kind of pcb board is holed especially.
Background technology
Pcb board is widely used in the middle of electronic equipment, and except fixing various little electronic component, the major function of pcb board provides the mutual electrical connection of various electronic component in addition.Along with the development of infotech, electronic equipment also becomes increasingly complex, and the part of needs gets more and more, the circuit on pcb board and part also more and more intensive.
Pcb board is in manufacturing process, no matter be single sided board, dual platen or multilayer board all need to use drilling operating, boring is exactly get out required via hole and pilot hole in copper-clad plate or the good central layer of lamination, via hole mainly provides the fixing of electrical connection and device, or plays location in PCB production run.How to prevent from boring inclined problem and grasp internal layer film convergent-divergent problem in printed circuit board boring is a difficult problem in pcb board part machining always, particularly for high multilayer board, and the extraordinary plates such as blind buried via hole plate, the off normal produced after the off normal after lamination and harmomegathus.The convergent-divergent of current industry to the method for the boring drilling inspection mainly logical internal layer film determines the scaling of holing, and by utilizing the ability on X-RAY take-through plate surface to check after boring whole blocks twist drill hole, whether internal layer PAD has bores inclined phenomenon.The method needs to have bored the borehole drilling inclined hole problem that hole could find because internal layer film harmomegathus causes, and can not find potential problem effectively in advance.
Summary of the invention
In view of this, the object of the invention is to propose a kind of pcb board borehole test method, find the problem that borehole drilling is inclined in advance.
Based on above-mentioned purpose a kind of pcb board borehole test method provided by the invention, comprise the following steps:
A makes test data, and the internal layer paving circle corresponding at silk-screen pilot hole covers copper point;
B holes to silk-screen pilot hole;
Whether the surrounding covering copper point described in C judges has uniform shadow, if having, then described boring is qualified; Otherwise described boring is defective.
Optionally, after described C, also comprise: measure described deflection of borehole amount.
Optionally, after described C, also comprise: checking boring drilling coordinate data, if described boring is qualified, hole according to described test data; If described boring is defective, then need adjustment ectonexine shift ratio.
Optionally, the number of described silk-screen pilot hole is 5.
Optionally, the diameter of described silk-screen pilot hole is 3.175mm.
Optionally, described circle covers the diameter of copper point is 3.375mm.
As can be seen from above, the confirmation method of pcb board boring provided by the invention, at establishment drilling coordinate time, the silk-screen of subdrilling jigsaw edges of boards is arranged to determine position, hole, then the mode checked by X-RAY adjusts the convergent-divergent of drilling, in advance by the problem in the inclined hole of borehole drilling that pilot hole finds and prevention causes because of internal layer film harmomegathus of jigsaw edges of boards, can also check the harmomegathus problem of the printed board internal layer film, to adjust inner cord film zoom factor in time simultaneously.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of a kind of pcb board borehole test method of the embodiment of the present invention;
Fig. 2 is a kind of silk-screen pilot hole schematic diagram of the embodiment of the present invention;
Fig. 3 is a kind of internal layer instrument connection schematic diagram of the embodiment of the present invention;
Fig. 4 is that a kind of instrument connection of the embodiment of the present invention detects schematic diagram;
Fig. 5 is that a kind of instrument connection of the embodiment of the present invention detects schematic diagram.
Embodiment
For making the object, technical solutions and advantages of the present invention clearly understand, below in conjunction with specific embodiment, and with reference to accompanying drawing, the present invention is described in more detail.
Fig. 1 is the schematic flow sheet of a kind of pcb board borehole test method of the embodiment of the present invention.As shown in Figure 1, pcb board borehole test method comprises:
Step 101, making test data, the internal layer paving circle corresponding at silk-screen pilot hole covers copper point.
Step 102, silk-screen pilot hole to be holed.
Whether the surrounding covering copper point described in step 103, judgement has uniform shadow, covers copper point described in checking with X-ray.If have, then described boring is qualified; Otherwise described boring is defective.
If there is uniform shadow in the surrounding covering copper point described in step 104, then hole qualified.
If the surrounding covering copper point described in step 105 does not have uniform shadow, then hole defective.
Whether above-mentioned steps tests out inclined hole.After testing and whether having inclined hole, comprise and measure described deflection of borehole amount with X-ray; Checking drilling coordinate data, if described boring is qualified, holes according to described test data; If described boring is defective, then need by ectonexine shift ratio adjustment ectonexine drilling coordinate.
Fig. 2 is a kind of silk-screen pilot hole schematic diagram of the embodiment of the present invention.As shown in Figure 2, design 5 silk-screen pilot holes at the edges of boards of pcb board, 5 silk-screen pilot holes are ectonexine instrument connection, and in the present embodiment, the diameter of 5 silk-screen pilot holes is 3.175mm.Design 5 silk-screen pilot holes, pcb board can be positioned on screen printing table and print, if be less than 5 pilot holes, effectively can not distinguish direction and the issuable loosening location of surrounding of pcb board during silk-screen.At establishment drilling coordinate time, arrange 5 silk-screens of subdrilling edges of boards to determine position, hole, the mode then checked by X-ray adjusts drilling coordinate.
Fig. 3 is a kind of internal layer instrument connection schematic diagram of the embodiment of the present invention.As shown in Figure 3, make test data, at the internal layer silk-screen pilot hole place of pcb board edges of boards, paving circle covers copper point, this diameter covering copper point is 3.375mm, namely increase circle at 5 internal layer silk-screen pilot hole places of Fig. 1 and cover copper point, it is gummosis point that this circle covers copper point, gummosis dot center and silk-screen pilot hole center superposition.
Fig. 4 is that a kind of instrument connection of the embodiment of the present invention detects schematic diagram.As shown in Figure 4, with the drilling of X-ray radiological survey X, the internal layer copper PAD image of silk-screen pilot hole exposes shadow, and covers around copper point and gummosis point at 5 and all occur shadow, shows that instrument connection is qualified.
Fig. 5 is that a kind of instrument connection of the embodiment of the present invention detects schematic diagram.As shown in Figure 5, with X-ray radiological survey X drilling instrument connection, the internal layer copper PAD image of silk-screen pilot hole exposes shadow, gummosis dot center does not overlap with silk-screen pilot hole center, but covering around copper point and gummosis point at 5 has one side not occur shadow, show that instrument connection is defective, now ectonexine shift ratio is changed drilling coordinate according to ectonexine shift ratio.
Concrete, if the center superposition of the hole that gets out of the drilling coordinate of design and 3.375mmPAD, illustrate in drilling on-gauge plate there is no harmomegathus, need not drilling be adjusted; If the hole got out is above 3.375mmPAD, then the internal layer film is elongated, amplifies drilling ratio; If the hole got out is in the below of 3.375mmPAD, then the internal layer film shortens, and reduces drilling ratio.
As can be seen from the above analysis, a kind of pcb board borehole test method provided by the invention, by increasing test PAD at internal layer silk-screen pilot hole, whether the ratio exposing shade by internal layer copper PAD image comes checkout hole qualified, thus confirms whether the internal layer film wants convergent-divergent and boring drilling coordinate whether will make ratio adjustment.
Those of ordinary skill in the field are to be understood that: the foregoing is only specific embodiments of the invention; be not limited to the present invention; within the spirit and principles in the present invention all, any amendment made, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (5)
1. a pcb board borehole test method, is characterized in that, comprises the following steps:
A makes test data, and the internal layer paving circle corresponding at silk-screen pilot hole covers copper point;
B holes to silk-screen pilot hole; The number of described silk-screen pilot hole is 5;
Whether the surrounding covering copper point described in C judges has uniform shadow, if having, then described boring is qualified; Otherwise described boring is defective.
2. method of testing according to claim 1, is characterized in that, after described C, also comprises: measure described deflection of borehole amount.
3. method of testing according to claim 1, is characterized in that, after described C, also comprises: checking boring drilling coordinate data, if described boring is qualified, holes according to described test data; If described boring is defective, then need adjustment ectonexine shift ratio.
4. method of testing according to claim 1, is characterized in that, the diameter of described silk-screen pilot hole is 3.175mm.
5. method of testing according to claim 1, is characterized in that, the diameter that described circle covers copper point is 3.375mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210370819.8A CN102865838B (en) | 2012-09-28 | 2012-09-28 | Printed circuit board (PCB) borehole test method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210370819.8A CN102865838B (en) | 2012-09-28 | 2012-09-28 | Printed circuit board (PCB) borehole test method |
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| Publication Number | Publication Date |
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| CN102865838A CN102865838A (en) | 2013-01-09 |
| CN102865838B true CN102865838B (en) | 2015-07-01 |
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| CN201210370819.8A Active CN102865838B (en) | 2012-09-28 | 2012-09-28 | Printed circuit board (PCB) borehole test method |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103442530A (en) * | 2013-09-18 | 2013-12-11 | 胜华电子（惠阳）有限公司 | Manufacturing method for PCB unilateral annular ring |
| CN103533761B (en) * | 2013-10-23 | 2016-05-04 | 广东依顿电子科技股份有限公司 | A kind of preparation method that promotes pcb board back of the body borehole accuracy |
| CN104582284B (en) * | 2014-12-31 | 2017-11-10 | 广州兴森快捷电路科技有限公司 | The preparation method of package substrate |
| CN110430679A (en) * | 2019-07-26 | 2019-11-08 | 重庆伟鼎电子科技有限公司 | A kind of method that PCB circuit board internal layer plate angle increases PAD test coupon module |
| CN118654609A (en) * | 2024-08-19 | 2024-09-17 | 广州广合科技股份有限公司 | PCB offset hole detection method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102072716A (en) * | 2010-12-21 | 2011-05-25 | 胜宏科技（惠州）有限公司 | Method for detecting interlayer offset and drilling offset of multi-layer circuit board |
| CN202284948U (en) * | 2011-10-31 | 2012-06-27 | 深圳市深联电路有限公司 | Simple measurement device for printed circuit board (PCB) film expansion and contraction value |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6097687A (en) * | 1983-10-31 | 1985-05-31 | 株式会社島津製作所 | Method of inspecting printed board through hole |
| JP2985045B2 (en) * | 1994-11-30 | 1999-11-29 | セイコープレシジョン株式会社 | Drilling method and X-ray drilling device using X-ray |
| JP2003008238A (en) * | 2001-06-21 | 2003-01-10 | Toppan Printing Co Ltd | Drilling machine for multilayer printed wiring board, and manufacturing method using the same |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102072716A (en) * | 2010-12-21 | 2011-05-25 | 胜宏科技（惠州）有限公司 | Method for detecting interlayer offset and drilling offset of multi-layer circuit board |
| CN202284948U (en) * | 2011-10-31 | 2012-06-27 | 深圳市深联电路有限公司 | Simple measurement device for printed circuit board (PCB) film expansion and contraction value |
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| CN102865838A (en) | 2013-01-09 |
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