JP2011096912A - Printed circuit board, and electronic apparatus with printed circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a printed circuit board such that an inner layer shift between layers of the printed circuit board having a laminate structure can be detected with higher precision, and to provide an electronic apparatus with the printed circuit board. <P>SOLUTION: A multilayer printed circuit board 8 has a plurality of insulating layers 14 laminated, and is provided with a semicircular hole 10 and an outer-layer through hole 11. The semicircular hole 10 is provided by cutting an end of the multilayer printed circuit board 8. The outer-layer through hole 11 has a wall surface in the hole covered with a conductor. Detection coupons 9 provided between the insulating layers 14 connect with the conductor in the outer-layer through hole 11 and separate the semicircular hole 10 by a clearance 12. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a printed circuit board and an electronic apparatus including the printed circuit board.

  As the wiring pattern of a printed circuit board becomes higher in density, it is important to maintain a conductor interval (clearance) between a through hole and an adjacent pattern. In recent years, manufacturing quality has been improved by detecting an inner layer shift between layers during or after the manufacture of a high-density multilayer printed circuit board.

  The following technique is disclosed as a method for detecting an inner layer shift between layers in a high-density multilayer printed circuit board. For detecting displacement, two through holes are provided, and two check lands are provided on the upper and lower layers of each through hole. In the inner layer of the through hole, a land for conduction with the through hole is provided and connected to the ring pattern. A clearance insulation distance, which is a displacement detection distance, is provided between the ring pattern and the semicircular hole. With this pattern distance structure, the lands provided in both through holes have a pattern structure that conducts when the allowable positional deviation range is exceeded. (For example, refer to Patent Document 1).

Utility Kaihei 7-18480

  In the above-described technique, when the inner layer clearance becomes narrow, that is, when a large inner layer shift occurs in the inner layer, the through holes are electrically connected. Accordingly, the presence or absence of conduction is determined by electrical inspection, and if there is no conduction, the inner layer deviation is within an allowable range.

  However, since this electrical inspection is artificially performed using an electrical inspection probe, an erroneous inspection result may occur depending on the operation of the inspector. That is, even if the inner layer is displaced and should be conductive, if the inspector does not properly contact the electrical inspection probe with the inspection section, there will be no conduction, and as a result, the inner layer The deviation may be erroneously detected as being within an allowable range.

  The present invention has been made in view of the above-described points, and a printed circuit board capable of detecting an inner layer shift between layers in a printed circuit board having a laminated structure with higher accuracy and an electronic device including the printed circuit board The purpose is to provide equipment.

  In order to achieve the above object, a printed circuit board according to the present invention includes a laminated insulating layer, a through hole penetrating the insulating layer and covering a wall surface in the hole with a conductor, and an end of the insulating layer. And a semi-circular hole provided by cutting out and a coupon connected to the conductor covering the through-hole and spaced apart from the semi-circular hole.

  Further, an electronic device according to the present invention is an electronic device comprising a housing and a printed circuit board accommodated in the housing, wherein the printed circuit board includes a laminated insulating layer and the insulating layer. A through hole in which the wall surface in the hole is covered with a conductor, a semicircular hole provided by cutting out an end of the insulating layer, and a conductor covering the through hole, the semicircular hole And a coupon that is provided at a predetermined distance.

  ADVANTAGE OF THE INVENTION According to this invention, providing the electronic device provided with the printed circuit board and printed circuit board which can detect the inner layer shift | offset | difference between each layer in a printed circuit board which has a laminated structure with high precision is implement | achieved.

1 is an external perspective view of a personal computer in the present embodiment. XY top view of the multilayer printed circuit board in this Embodiment. Sectional drawing in AA 'of the multilayer printed circuit board in this Embodiment. The figure seen from the XZ plane of the multilayer printed circuit board in this Embodiment. XY top view of the inner layer of the multilayer printed circuit board in this Embodiment. The XY plan view and XZ plane of the inner layer when the inner layer shift occurs in the Y-axis direction in the multilayer printed circuit board in the present embodiment. The XY plan view of the inner layer when the inner layer shift | offset | difference arises in the X-axis direction in the multilayer printed circuit board in this Embodiment, and the figure seen from the XZ plane. The figure seen from the XZ plane at the time of the electrical test implementation of the multilayer printed circuit board in this Embodiment. Sectional drawing in BB 'at the time of the electrical inspection implementation of the multilayer printed circuit board in this Embodiment. Sectional drawing in BB 'at the time of electrical inspection implementation in case the inner layer shift | offset | difference of the multilayer printed circuit board in this Embodiment has arisen. XY top view of the multilayer printed circuit board in the modification of this Embodiment.

  Hereinafter, with reference to FIG. 1 to FIG. 11, an embodiment of the present invention will be described by taking, for example, a case where the present invention is applied to a personal computer 1 which is one of electronic devices. FIG. 1 is an external perspective view of a personal computer 1 according to the present embodiment.

  The personal computer 1 includes a computer main body 2 and a display unit 3. The computer main body 2 and the display unit 3 are rotatably connected via a hinge 4. In the display unit 3, a display device 3a is incorporated. The display device 3a is, for example, an LCD (Liquid Crystal Display).

  The computer main body 2 includes a main body housing 2a, a keyboard 5, a touch pad 6, a power switch 7, and a multilayer printed circuit board 8.

  The main body housing 2a has a thin box shape and houses various electronic components, disk drives, multilayer printed circuit boards 8, and the like. Input devices such as a keyboard 5 and a touch pad 6 are provided on the upper surface of the main body housing 2a.

  The keyboard 5 is an input device provided on the upper surface of the main body housing 2a. A signal is transmitted to each unit in accordance with the operated key of the keyboard 5.

  The touch pad 6 is a pointing device provided on the upper surface of the main body housing 2a. A signal is transmitted to each unit in accordance with the operation of the touch pad 6.

  The power switch 7 inputs a control signal for powering on / off the portable computer 1 in accordance with an operation by the user.

  The multilayer printed circuit board 8 is provided with first to eighth conductor layers 16 a to 16 h described later, and an insulating layer 14 is provided between the conductor layers 16. The multilayer printed circuit board 8 is provided with through holes penetrating all the layers, through holes partially penetrating predetermined layers, and the like. Plating 15 is applied to the wall surfaces in the holes of these through holes, and the plating 15 connects between the conductor layers 16.

  In the multilayer printed circuit board 8 according to the present embodiment, a detection coupon 9, a semicircular hole 10, and an outer layer through hole 11 are provided in order to detect an inner layer shift. In the present embodiment, as shown in FIG. 1, the XYZ axes are defined, the positive direction of the X axis is right, the negative direction of the X axis is left, the positive direction of the Y axis is back, the negative direction of the Y axis is near, The positive direction of the Z axis is referred to as “down” and the negative direction of the Z axis is referred to as “up”.

  Next, the multilayer printed circuit board 8 according to the present embodiment will be described with reference to FIG. FIG. 2 is an XY plan view of the multilayer printed circuit board in the present embodiment.

  As shown in FIG. 2, a semicircular hole 10 and an outer layer through hole 11 are provided close to the midpoint of each side forming the XY plane of the multilayer printed circuit board 8. By providing the semicircular hole 10 and the outer layer through hole 11 close to each other, it is possible to suppress a mounting area of a detection coupon 9 described later and contribute to downsizing of the multilayer printed circuit board 8.

  Next, the laminated structure of the multilayer printed circuit board 8 according to the present embodiment will be described with reference to FIG. FIG. 3 is a cross-sectional view taken along line AA ′ of the multilayer printed circuit board according to the present embodiment.

  The multilayer printed circuit board 8 in the example of FIG. 3 includes a first layer conductor layer 16a, a second layer conductor layer 16b, a third layer conductor layer 16c, a fourth layer conductor layer 16d, and a fifth layer conductor layer 16e. A sixth-layer conductor layer 16f, a seventh-layer conductor layer 16g, and an eighth-layer conductor layer 16h. An insulating layer 14 is provided between the conductor layers 16 to prevent conduction between the conductor layers 16. Each conductor layer 16 has a wiring formed of a conductor. The insulating layer 14 is provided below the first layer conductor layer 16a to the fourth layer conductor layer 16d, and the insulating layer 14 is provided above the fifth layer conductor layer 16e to the eighth layer conductor layer 16h. The multilayer printed circuit board 8 is formed by laminating and integrating the plurality of insulating layers 14 by superposing and laminating sheets for bonding the layers and performing heating and pressurization with a laminating press having a heating platen. . In the present embodiment, the detection coupon 9 is provided at the end of several layers of the first layer conductor layer 16a to the eighth layer conductor layer 16h.

  Next, a laminated structure at the end of the multilayer printed circuit board 8 according to the present embodiment will be described with reference to FIG. FIG. 4 is a view of the multilayer printed circuit board in the present embodiment as viewed from the XZ plane.

  After the multilayer printed circuit board 8 is laminated including the conductor layer 16 provided with the detection coupon 9, the semicircular hole 10 and the outer layer through hole 11 are provided by a drill machine or the like, and the inner layer 15 of the outer layer through hole 11 is plated 15 Will be completed. The plating 15 is located on the first conductor layer 16a.

  Next, the arrangement of the detection coupon 9 in the inner layer of the multilayer printed circuit board 8 will be described with reference to FIG. FIG. 5 is an XY plan view of the inner layer of the multilayer printed circuit board according to the present embodiment.

  The detection coupon 9 is provided so as to go around the outer layer through-hole 11 and be electrically connected to the plating 15. Further, the end portion of the detection coupon 9 in contact with the side of the multilayer printed circuit board 8 has a semicircular shape corresponding to the semicircular hole 10, and a certain distance (clearance 12) is provided from the semicircular hole 10. It has been.

  Next, the multilayer printed circuit board 8 when an inner layer shift occurs will be described with reference to FIGS. FIG. 6 is an XY plan view (A) and a view (B) of the inner layer when the inner layer shift occurs in the Y-axis direction in the multilayer printed circuit board according to the present embodiment, as viewed from the XZ plane. The case where the inner layer shift occurs refers to a case where the stacking position is shifted from the design value due to an overheating step and a pressing step included in the manufacturing process of the multilayer printed circuit board 8 described above.

  FIG. 6A is an XY plan view of the inner layer when the inner layer shift occurs in the Y-axis direction. For example, a description will be given of a structure in which a semicircular hole 10 is provided at a position as designed on a multilayer printed circuit board 8 in which the seventh layer conductor layer 16g is laminated while being shifted in the negative direction of the Y axis. About the 1st layer conductor layer 16a-the 6th layer conductor layer 16f laminated | stacked as a design value, the clearance 12 is maintained and the semicircle hole 10 is provided. On the other hand, since the seventh conductor layer 16g is displaced in the negative direction of the Y axis, the detection coupon 9 is located at a position where the semicircular hole 10 is provided. Therefore, when the semicircular hole 10 is provided, the detection coupon 9 is cut. That is, the seventh conductor layer 16 g has a structure in which the detection coupon 9 is exposed from the semicircular hole 10.

  As described above, when the conductor layer 16 is laminated with a gap of the clearance 12 or more, the detection coupon 9 is cut and exposed from the semicircular hole 10. That is, by providing the detection coupon 9 with the clearance 12 away from the semicircular hole 10, it can be detected that the conductor layer 16 is laminated with a clearance 12 or more.

  FIG. 6B is a view as seen from the XZ plane when an inner layer shift occurs as shown in FIG. For example, when the inner layer shift occurs in the seventh conductor layer 16g, the detection coupon 9 is exposed at the center of the semicircular hole 10.

  FIG. 7 is an XY plan view (A) and a diagram (B) viewed from the XZ plane of the inner layer when the inner layer shift occurs in the X-axis direction in the multilayer printed circuit board 8 in the present embodiment.

  FIG. 7A is an XY plan view of the inner layer when the inner layer shift occurs in the X-axis direction. For example, a description will be given of a structure in which a semicircular hole 10 is provided at a position as designed on a multilayer printed circuit board 8 in which a seventh layer conductor layer 16g is laminated with being shifted in the positive direction of the X axis. About the 1st layer conductor layer 16a-the 6th layer conductor layer 16f laminated | stacked as a design value, the clearance 12 is maintained and the semicircle hole 10 is provided. On the other hand, since the seventh conductor layer 16g is displaced in the positive direction of the X axis, the detection coupon 9 is located at a position where the semicircular hole 10 is provided. Therefore, when the semicircular hole 10 is provided, the detection coupon 9 is cut. That is, the seventh conductor layer 16 g has a structure in which the detection coupon 9 is exposed from the semicircular hole 10.

  FIG. 7B is a view as seen from the XZ plane when an inner layer shift occurs as shown in FIG. For example, when the inner layer shift occurs in the seventh conductor layer 16g, the detection coupon 9 is exposed at the left end of the semicircular hole 10.

  As described above, the end of the detection coupon 9 has a shape corresponding to the semicircular hole 10 and is provided at a fixed distance (clearance 12), so that the same inspection accuracy can be obtained regardless of which direction the inner layer is displaced. Inspection is possible.

  Next, with reference to FIG. 8 to FIG. 10, an electrical inspection in the inner layer displacement of the multilayer printed circuit board 8 will be described. FIG. 8 is a view as seen from the XZ plane when an electrical inspection is performed on the multilayer printed circuit board according to the present embodiment. In the electrical inspection of the multilayer printed circuit board 8, an electrical inspection probe 13 is inserted into the semicircular hole 10 and the outer layer through hole 11 to inspect whether there is conduction.

  FIG. 9 is a cross-sectional view taken along the line BB ′ when an electrical inspection is performed on the multilayer printed circuit board according to the present embodiment. If the clearance 12 is secured in each insulating layer 14, the electrical inspection probe 13 and the detection coupon 9 do not contact with each other through the semicircular hole 10. That is, there is no conduction between the semicircular hole 10 and the outer layer through hole 11.

  Next, with reference to FIG. 10, an electrical inspection in the case where the inner layer shift occurs in the Y-axis direction in the seventh conductor layer 16g will be described. FIG. 10 is a cross-sectional view taken along the line BB ′ when the electrical inspection is performed when the inner layer shift of the multilayer printed circuit board 8 in the present embodiment occurs.

  As shown in FIG. 6, when the detection coupon 9 is exposed in the cross section of the semicircular hole 10 due to the inner layer shift in the Y-axis direction in the seventh conductor layer 16g, the semicircular hole 10 is used for electrical inspection. The probe 13 and the detection coupon 9 are in contact. That is, conduction is made between the semicircular hole 10 and the outer layer through hole 11.

  In the present embodiment, the shift in the Y-axis direction shown in FIG. 6 has been described as an example, but the same applies to the inner layer shift in the X-axis direction. In other words, if the inner layer shift occurs and the detection coupon 9 is exposed in the semicircular hole 10, electrical conduction is established between the semicircular hole 10 and the outer layer through hole 11 as in the example shown in FIG. 10.

  Next, a modification of the present embodiment will be described with reference to FIG. FIG. 11 is an XY plan view of the multilayer printed circuit board 8 in a modification of the present embodiment.

  In the modification of the present embodiment, not only the midpoint of each side forming the XY plane of the multilayer printed circuit board 8, but also semicircular holes 10 and outer layer through holes 11 are formed at the four corners of the multilayer printed circuit board 8. Has been given. Furthermore, by applying to the four corners of the multilayer printed circuit board 8, it is possible to detect the inner layer shift in the oblique direction of the XY plane more accurately.

  Further, in the present embodiment and the modification, it has been described that the outer layer through-holes 11 are provided at the end portions such as the midpoint and the four corners of each side of the multilayer printed circuit board 8, but the present invention is not limited to this position. No. That is, the outer layer through-hole 11 may be provided at a portion other than the end of the multilayer printed circuit board 8. In the manufacturing process of the multilayer printed circuit board 8, the semicircular hole 10 and the outer layer through hole 11 are provided to detect the inner layer shift, and then the end is cut in accordance with the arrangement of the devices in the housing 2 to be accommodated. Therefore, in the present embodiment and the modification, when the multilayer printed circuit board 8 accommodated in the housing 2 does not have the semicircular hole 10 and the outer layer through-hole 11 and is provided at a portion other than the end portion. The outer layer through hole 11 remains.

  As described above, according to the present embodiment, the inner layer displacement can be detected with higher accuracy by performing not only an electrical inspection but also a visual inspection as a method of inspecting the inner layer displacement of the multilayer printed circuit board 8. That is, the continuity between the semicircular hole 10 and the outer layer through hole 11 is inspected by providing the semicircular hole 10 and the outer layer through hole 11 at the position where the detection coupon 9 for detecting the inner layer deviation is arranged. Thus, it can be determined whether or not the detection coupon 9 secures the clearance 12 in the semicircular hole 10. Further, by providing the semicircular hole 10 at the end of the multilayer printed circuit board 8, the detection coupon 9 is exposed to the outside when an inner layer shift of the clearance 12 or more occurs, and visual inspection can be performed. .

  Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. In addition, various inventions can be formed by appropriately combining a plurality of components disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, constituent elements over different embodiments may be appropriately combined.

  DESCRIPTION OF SYMBOLS 1 ... Personal computer, 2 ... Computer main body, 2a ... Main body housing, 3 ... Display unit, 3a ... Display apparatus, 4 ... Hinge, 5 ... Keyboard, 6 ... Touch pad, 7 ... Power switch, 8 ... Multilayer printed circuit board DESCRIPTION OF SYMBOLS 9 ... Detection coupon, 10 ... Semicircular hole, 11 ... Outer layer through-hole, 12 ... Clearance, 13 ... Probe for electrical inspection, 14 ... Insulating layer, 15 ... Plating, 16a-h ... Conductor layer.

Claims (8)

Laminated insulating layers;
A through hole penetrating the insulating layer and covering a wall surface in the hole with a conductor; and
A semicircular hole provided by cutting out an end of the insulating layer;
Connected to a conductor covering the through hole, a coupon provided at a certain distance from the semicircular hole,
A printed circuit board comprising:   The portion of the coupon adjacent to the semicircular hole has a shape corresponding to the semicircular hole, and is provided at a certain distance from the semicircular hole. The printed circuit board as described. The semicircular holes are provided by cutting out four sides forming the printed circuit board,
The printed circuit board according to claim 2, wherein a plurality of the through holes are provided in proximity to the plurality of semicircular holes.   The printed circuit board according to claim 3, wherein the through hole and the semicircular hole are further provided at four corners of the printed circuit board. A housing,
An electronic device comprising a printed circuit board housed in the housing,
The printed circuit board is:
Laminated insulating layers;
A through hole penetrating the insulating layer and covering a wall surface in the hole with a conductor; and
A semicircular hole provided by cutting out an end of the insulating layer;
Connected to a conductor covering the through hole, a coupon provided at a predetermined distance from the semicircular hole,
An electronic device comprising:   The portion of the coupon adjacent to the semicircular hole has a shape corresponding to the semicircular hole, and is provided at a certain distance from the semicircular hole. The electronic device described. The semicircular holes are provided by cutting out four sides forming the printed circuit board,
The electronic device according to claim 6, wherein a plurality of the through holes are provided in proximity to the plurality of semicircular holes.   The electronic device according to claim 6, wherein the through hole and the semicircular hole are further provided at four corners of the printed circuit board.

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