CN101917821A - High-density circuit board registration hole and manufacturing method thereof - Google Patents
High-density circuit board registration hole and manufacturing method thereof Download PDFInfo
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- CN101917821A CN101917821A CN 201010248690 CN201010248690A CN101917821A CN 101917821 A CN101917821 A CN 101917821A CN 201010248690 CN201010248690 CN 201010248690 CN 201010248690 A CN201010248690 A CN 201010248690A CN 101917821 A CN101917821 A CN 101917821A
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- blind hole
- circuit board
- registration holes
- laser blind
- density circuit
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Abstract
The invention relates to a high-density circuit board registration hole. A plurality of groups of registration holes are arranged around a graphic region of a high-density circuit board; each group of registration holes are multi-row and multi-line laser blind hole arrays; the laser blind holes of each group of registration holes are connected in series by adopting a lead so as to ensure that each group of laser blind hole arrays form an electric conduction access. The registration hole not only can be used for accurately positioning, but also can conveniently detect the problems of the laser blind holes through detecting the electric conduction of the laser blind holes, thereby improving the quality and the efficiency of circuit board manufacture.
Description
Technical field
The present invention relates to a kind of wiring board registration holes and manufacture method, relate in particular to a kind of high-density circuit board registration holes and manufacture method.
Background technology
Along with the development of electronic industry, the wiring board industry is also more and more flourishing, the technology of laser drill progressively occurred adopting.The appearance of laser drill technology, can obtain the machining accuracy meticulousr than machine drilling processing method, the aperture is contracted to 0.05mm from original minimum 0.2mm, the wiring density of wiring board and cloth hole density increase greatly, the orifice ring size narrows down to 0.075mm--0.050mm from original 0.15mm-0.20mm, and the requirement of its manufacturing technology is also more and more higher.For high-density circuit board, high-density circuit board, its number of plies is many, need in manufacturing process accurately contraposition of each layer, and its line width and pad is all very little, and the difficulty of making is very big.The prior art situation is the contraposition effect that blind hole is judged in Aligning degree situation in the employing perusal unit or the through hole hole of adopting edges of boards, and aligning accuracy is very poor like this, produces the low and inefficiency of yield.The reliability testing of laser drill high-density circuit board also is a very stubborn problem, and existing method needs dicing method could obtain corresponding data, the cost height of wasting time and energy.
Summary of the invention
The technical problem that the present invention solves is: high-density circuit board registration holes and manufacture method are provided, overcome prior art middle-high density wiring board technique of counterpoint complexity, can not obtain the effect of accurate contraposition.
Technical scheme of the present invention is: make up a kind of high-density circuit board registration holes, many group registration holes are set around in described high-density circuit board graphics field, the laser blind hole array that described every group of registration holes is multiple lines and multiple rows adopts lead to be connected in series so that every group of laser blind hole array forms a conductive path between the laser blind hole of described every group of registration holes.
Further technical scheme of the present invention is: described many group registration holes are separately positioned on four jiaos around the described high-density circuit board graphics field.
Further technical scheme of the present invention is: described laser blind hole array pitch is 15mil-40mil, and row are apart from being 20mil-100mil.
Further technical scheme of the present invention is: around the laser blind hole of laser blind hole array welding resistance is set, described welding resistance is from laser blind hole at least 2 mils.
Further technical scheme of the present invention is: described laser blind hole array apart from the distance of circuit panel edges more than or equal to 5 millimeters.
Further technical scheme of the present invention is: the distance of described laser blind hole array and described high-density circuit board graphics field is 0.5 millimeter to 5 millimeters.
Technical scheme of the present invention is: a kind of high-density circuit board registration holes manufacture method is provided, many group registration holes are set on every side in described high-density circuit board graphics field, manufacture method comprises the steps:
Determine that registration holes is provided with the position: determine around in the high-density circuit board graphics field that registration holes is provided with the position;
The laser blind hole array is set: registration holes is set in definite position, described registration holes is many groups, the laser blind hole array that described every group of registration holes is multiple lines and multiple rows adopts lead to be connected in series so that every group of laser blind hole array forms a conductive path between the laser blind hole of described every group of registration holes;
The processing of laser blind hole array during plating: comprise the film that carries out graphics process on high-density circuit board, the laser blind hole in the high-density circuit board graphics field does not need to electroplate when filling and leading up, and described registration holes adopts dry film to cover on the described film; Need electroplate when filling and leading up at the laser blind hole of high-density circuit board graphics field, the part laser blind hole in the close circuit board pattern zone of laser blind hole array adopts dry film to cover on the described film in the described registration holes.
Further technical scheme of the present invention is: described many group registration holes are separately positioned on four jiaos around the described high-density circuit board graphics field.
Further technical scheme of the present invention is: described laser blind hole array pitch is 15mil-40mil, and row are apart from being 20mil-100mil.
Further technical scheme of the present invention is: the distance of described laser blind hole array and described high-density circuit board graphics field is 0.5 millimeter to 5 millimeters.
Technique effect of the present invention is: around in described high-density circuit board graphics field many group registration holes are set, the laser blind hole array that described every group of registration holes is multiple lines and multiple rows adopts lead to be connected in series so that every group of laser blind hole array forms a conductive path between the laser blind hole of described every group of registration holes.Registration holes of the present invention can be finished accurate contraposition, is convenient to the problem by the conductivity detection laser blind hole of detection laser blind hole again, thereby has improved quality and efficient that wiring board is made.
Description of drawings
Fig. 1 is a structural representation of the present invention.
Fig. 2 is a laser blind hole array schematic diagram of the present invention.
Fig. 3 is a laser blind hole lead connection diagram of the present invention.
Fig. 4 is a welding resistance schematic diagram of the present invention.
Fig. 5 is a flow chart of the present invention.
Embodiment
Below in conjunction with specific embodiment, technical solution of the present invention is further specified.
As shown in Figure 1, the present invention makes up a kind of high-density circuit board registration holes 3,12 is provided with many group registration holes 3 on every side in described high-density circuit board graphics field, described every group of registration holes 3 is the laser blind hole array of multiple lines and multiple rows, adopts lead 33 to be connected in series between the laser blind hole of described every group of registration holes 3 so that every group of laser blind hole array forms a conductive path.In the preferred implementation of the present invention, described many group registration holes are separately positioned on four jiaos around the described high-density circuit board graphics field.
Specific implementation process of the present invention is as follows: 2 positions of determining to be provided with registration holes 3 around 1 in described high-density circuit board graphics field, to organize registration holes 3 then is separately positioned on the relevant position more, described every group of registration holes 3 is the laser blind hole array of multiple lines and multiple rows, each laser blind hole 35 usefulness leads 33 in every group of laser blind hole array is connected in series so that every group of laser blind hole array forms a conductive path.
As shown in Figure 2, preferred implementation of the present invention is: described laser blind hole array pitch is 15mil-40mil, described laser blind hole array pitch optimum value is 20mil, and described laser blind hole array row are apart from being 20mil-100mil, and it is 40mil that described laser blind hole array is listed as apart from optimum value.The laser blind hole array is 10 row, 10 row in the specific embodiment of the invention.
As shown in Figure 3, when laser blind hole arrays of conductive path was set, described top layer laser blind hole array adopted lead 33 dislocation series connection repeatedly not to be connected the laser blind hole of described every group of registration holes so that every group of laser blind hole array forms a conductive path with innermost layer laser blind hole array.
As shown in Figure 4, preferred implementation of the present invention is: around the laser blind hole 35 of laser blind hole array welding resistance is set, described welding resistance is from laser blind hole at least 2 mils.Among the present invention, the laser blind hole 35 that laser blind hole array place has does not all cover welding resistance, and welding resistance is at least 2mil (0.05mm) from the distance of laser blind hole 35, does not go up blind hole Xi Quan with welding resistance during contraposition.
In the preferred implementation of the present invention, more than or equal to 5 millimeters, the distance of described laser blind hole array and described high-density circuit board graphics field is 0.5 millimeter to 5 millimeters to described laser blind hole array apart from the distance of circuit panel edges.
The present invention is by 2 being provided with many group registration holes 3 in described high-density circuit board graphics field around 1, described every group of registration holes 3 is the laser blind hole array of multiple lines and multiple rows, adopts lead 33 to be connected in series between the laser blind hole of described every group of registration holes 3 so that every group of laser blind hole array forms a conductive path.Registration holes of the present invention can be finished accurate contraposition, is convenient to the problem by the conductivity detection laser blind hole of detection laser blind hole 35 again, thereby has improved quality and efficient that wiring board is made.
As shown in Figure 5, technical scheme of the present invention is: a kind of high-density circuit board registration holes manufacture method is provided, many group registration holes are set on every side in described high-density circuit board graphics field, manufacture method comprises the steps:
Step 100: determine that registration holes is provided with the position, that is, determine on every side that in the high-density circuit board graphics field registration holes is provided with the position.The present invention is when determining that registration holes is provided with the position on every side in the high-density circuit board graphics field, more than or equal to 5 millimeters, the distance of described laser blind hole array and described high-density circuit board graphics field is 0.5 millimeter to 5 millimeters to described laser blind hole array apart from the distance of circuit panel edges.Determine the position of laser blind hole array in such zone, both can prevent too closely,, can prevent that again the laser blind hole array is too far away from the wiring board graphics field, influence the effect of contraposition to influence the effect of circuit board pattern from the wiring board graphics field.
Step 200: the laser blind hole array is set, promptly, in definite position registration holes is set, described registration holes is many groups, the laser blind hole array that described every group of registration holes is multiple lines and multiple rows adopts lead to be connected in series so that every group of laser blind hole array forms a conductive path between the laser blind hole of described every group of registration holes.When laser blind hole arrays of conductive path is set, described top layer laser blind hole array and innermost layer laser blind hole array adopt lead dislocation series connection repeatedly not to be connected the laser blind hole of described every group of registration holes so that every group of laser blind hole array forms a conductive path, and wherein lead connects not exist and repeats to connect.
Step 300: the processing of laser blind hole array during plating, promptly, comprise the film that carries out graphics process on high-density circuit board, the laser blind hole in the high-density circuit board graphics field does not need to electroplate when filling and leading up, and described registration holes adopts dry film to cover on the described film; Need electroplate when filling and leading up at the laser blind hole of high-density circuit board graphics field, the part laser blind hole in the close circuit board pattern zone of laser blind hole array adopts dry film to cover on the described film in the described registration holes.
Preferred implementation of the present invention is: described many group registration holes are separately positioned on four jiaos around the described high-density circuit board graphics field.Described laser blind hole array pitch is 15mil-40mil, and row are apart from being 20mil-100mil.The distance of described laser blind hole array and described high-density circuit board graphics field is 0.5 millimeter to 5 millimeters.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (10)
1. high-density circuit board registration holes, it is characterized in that, many group registration holes are set around in described high-density circuit board graphics field, the laser blind hole array that described every group of registration holes is multiple lines and multiple rows adopts lead to be connected in series so that every group of laser blind hole array forms a conductive path between the laser blind hole of described every group of registration holes.
2. high-density circuit board registration holes according to claim 1 is characterized in that, described many group registration holes are separately positioned on four jiaos around the described high-density circuit board graphics field.
3. high-density circuit board registration holes according to claim 1 is characterized in that, described laser blind hole array pitch is 15mil-40mil, and row are apart from being 20mil-100mil.
4. high-density circuit board registration holes according to claim 1 is characterized in that, around the laser blind hole of laser blind hole array welding resistance is set, and described welding resistance is from laser blind hole at least 2 mils.
5. high-density circuit board registration holes according to claim 1 is characterized in that, described laser blind hole array apart from the distance of circuit panel edges more than or equal to 5 millimeters.
6. high-density circuit board registration holes according to claim 1 is characterized in that, the distance of described laser blind hole array and described high-density circuit board graphics field is 0.5 millimeter to 5 millimeters.
7. a high-density circuit board registration holes manufacture method is characterized in that, many group registration holes are set on every side in described high-density circuit board graphics field, and manufacture method comprises the steps:
Determine that registration holes is provided with the position: determine around in the high-density circuit board graphics field that registration holes is provided with the position;
The laser blind hole array is set: registration holes is set in definite position, described registration holes is many groups, the laser blind hole array that described every group of registration holes is multiple lines and multiple rows adopts lead to be connected in series so that every group of laser blind hole array forms a conductive path between the laser blind hole of described every group of registration holes;
The processing of laser blind hole array during plating: comprise the film that carries out graphics process on high-density circuit board, the laser blind hole in the high-density circuit board graphics field does not need to electroplate when filling and leading up, and described registration holes adopts dry film to cover on the described film; Need electroplate when filling and leading up at the laser blind hole of high-density circuit board graphics field, the part laser blind hole in the close circuit board pattern zone of laser blind hole array adopts dry film to cover on the described film in the described registration holes.
8. high-density circuit board registration holes manufacture method according to claim 7 is characterized in that, described many group registration holes are separately positioned on four jiaos around the described high-density circuit board graphics field.
9. high-density circuit board registration holes manufacture method according to claim 7 is characterized in that described laser blind hole array pitch is 15mil-40mil, and row are apart from being 20mil-100mil.
10. high-density circuit board registration holes manufacture method according to claim 7 is characterized in that, the distance of described laser blind hole array and described high-density circuit board graphics field is 0.5 millimeter to 5 millimeters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102486904A CN101917821B (en) | 2010-08-06 | 2010-08-06 | High-density circuit board registration hole and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102486904A CN101917821B (en) | 2010-08-06 | 2010-08-06 | High-density circuit board registration hole and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101917821A true CN101917821A (en) | 2010-12-15 |
| CN101917821B CN101917821B (en) | 2012-08-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010102486904A Expired - Fee Related CN101917821B (en) | 2010-08-06 | 2010-08-06 | High-density circuit board registration hole and manufacturing method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102072716A (en) * | 2010-12-21 | 2011-05-25 | 胜宏科技（惠州）有限公司 | Method for detecting interlayer offset and drilling offset of multi-layer circuit board |
| CN106604577A (en) * | 2017-01-03 | 2017-04-26 | 江苏博敏电子有限公司 | HDI circuit board manufacturing process capable of realizing accurate alignment |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040066642A1 (en) * | 2002-06-05 | 2004-04-08 | Swetland Paul A. | Apparatus, method and system for interfacing electronic circuits |
| CN101494954A (en) * | 2009-02-27 | 2009-07-29 | 深圳市五株电路板有限公司 | Control method for laser drilling contraposition accuracy of high-density lamination circuit board |
-
2010
- 2010-08-06 CN CN2010102486904A patent/CN101917821B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040066642A1 (en) * | 2002-06-05 | 2004-04-08 | Swetland Paul A. | Apparatus, method and system for interfacing electronic circuits |
| CN101494954A (en) * | 2009-02-27 | 2009-07-29 | 深圳市五株电路板有限公司 | Control method for laser drilling contraposition accuracy of high-density lamination circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102072716A (en) * | 2010-12-21 | 2011-05-25 | 胜宏科技（惠州）有限公司 | Method for detecting interlayer offset and drilling offset of multi-layer circuit board |
| CN102072716B (en) * | 2010-12-21 | 2012-05-23 | 胜宏科技（惠州）有限公司 | Method for detecting interlayer offset and drilling offset of multi-layer circuit board |
| CN106604577A (en) * | 2017-01-03 | 2017-04-26 | 江苏博敏电子有限公司 | HDI circuit board manufacturing process capable of realizing accurate alignment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101917821B (en) | 2012-08-22 |
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