CN204906847U - Multilayer printed circuit board inlayer monitoring structure - Google Patents
Multilayer printed circuit board inlayer monitoring structure Download PDFInfo
- Publication number
- CN204906847U CN204906847U CN201520678308.1U CN201520678308U CN204906847U CN 204906847 U CN204906847 U CN 204906847U CN 201520678308 U CN201520678308 U CN 201520678308U CN 204906847 U CN204906847 U CN 204906847U
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- CN
- China
- Prior art keywords
- internal layer
- copper ring
- circuit board
- inlayer
- printed circuit
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model discloses a multilayer printed circuit board inlayer monitoring structure, vertical structure of folding of multilayer printed circuit board's work piece has outerly and the multilayer inlayer, the plane figure of multilayer printed circuit board's work piece is the multi -disc circuit board monolithic of having arranged, the flange of work piece has a plurality of section holes, inlayer and outer through -hole are link up to the section hole, and covering, the internal surface in section hole has the copper sheet, the outer periphery that just is located the section hole of work piece is equipped with outer copper ring, outer copper ring is connected with the downthehole copper sheet of section, the inlayer of work piece is equipped with the inlayer copper ring and be located the periphery in section hole, the inlayer copper ring is connected with the downthehole copper sheet of section, the width of inlayer copper ring is inlayer skew acceptable maximum value. Carry out inlayer prison time measuring when needs, will cut into slices the hole with the sheet -punching machine and take off and open, except can carrying out conventional inlayer data monitoring, can also whether be located the inlayer copper ring through observing the section hole, determine the inlayer and whether counterpoint harmfully.
Description
Technical field
Character surveillance field in the plate that the utility model belongs to printed circuit board (PCB), is specifically related to a kind of structure of hole of cutting into slices.
Background technology
Multilayer circuit board is all generally that connection sheet is produced, and the active gage of justifying generally comprises tens even hundreds of wiring board monolithic, and such as memory bar wiring board is generally that the active gage be made up of 108 memory bar wiring board monolithics is produced simultaneously.In order to auxiliary, character surveillance is carried out to internal layer, general meeting designs several section holes at the edges of boards of active gage, this section hole is the through hole running through active gage, the shaping situation with constructing wiring board on complete reaction active gage in this section hole, when needs carry out character surveillance to internal layer, need to be taken off from active gage in whole section hole with sheet-punching machine, the mode then by cutting section hole carries out character surveillance to internal layer.
But, though current section hole can reflect some data of internal layer, but can not alignment situation between conversion zone, what namely interlayer skew occurred badly cannot reflect at section hole place.Between current detection layers, skew adopts perspective machine mostly, carry out position scanning, thus determine side-play amount, but this detection method cost is slightly high to the anchor point on active gage.
Utility model content
In order to solve the problem, the utility model provides a kind of multilayer printed circuit board internal layer monitoring of structures, this multilayer printed circuit board internal layer monitoring of structures not only has the function in conventional section hole, also have the function of monitoring interlayer alignment skew, and cost is low, easy to implement.
The utility model in order to the technical scheme solving its technical problem and adopt is:
A kind of multilayer printed circuit board internal layer monitoring of structures, the longitudinal direction of the active gage of multilayer printed circuit board is folded structure and is had outer and multilayer internal layer, the plane figure of the active gage of multilayer printed circuit board is for being placed with multi-disc wiring board monolithic, the edges of boards of described active gage have some section holes, described section hole is through internal layer and outer field through hole, and the inner surface in described section hole is coated with copper sheet, the skin of described active gage and be positioned at the outer of described section hole and be arranged with outer copper ring, described outer copper ring is connected with the copper sheet in section hole, the internal layer of described active gage and be positioned at section the outer of hole and be arranged with internal layer copper ring, described internal layer copper ring is connected with the copper sheet in section hole, the width of described internal layer copper ring is that internal layer offsets acceptable maximum.
The utility model in order to the further technical scheme solving its technical problem and adopt is:
Say further, the width of described internal layer copper ring is 3 ± 0.3mil.
Furthermore, the width of described internal layer copper ring is 3mil.
Say further, described wiring board monolithic is memory bar wiring board.
Furthermore, described active gage is placed with 108 memory bar wiring boards.
Say further, described copper sheet is chemical copper.
Say further, described outer copper ring is the copper ring etched by outer copper foil.
Say further, described internal layer copper ring is the copper ring etched by internal layer Copper Foil.
The beneficial effects of the utility model are: the utility model is mainly on the basis in routine section hole, at the internal layer of active gage, the internal layer copper ring corresponding with section hole is set, and the width of internal layer copper ring is arranged to the acceptable maximum of internal layer side-play amount, internal layer copper ring can react the alignment situation of internal layer with the alignment situation in section hole, when needs carry out internal layer monitoring, with sheet-punching machine section hole taken off and cut, except can carrying out conventional internal layer data monitoring, internal layer copper ring whether can also be positioned at by observing section hole, whether contraposition is bad to judge internal layer, when hole of cutting into slices is positioned at internal layer copper ring center, show that position alignment of inner layer plates is accurate, when the eccentric contraposition of cut into slices hole and internal layer copper ring but cut into slices Kong Shang in internal layer copper ring time, show that internal layer offsets still in tolerance interval, when section hole has deviated from the outer bowlder of internal layer copper ring, show that position alignment of inner layer plates is bad.And outer copper ring can fix the adhesive force of section hole and sheet material.
Accompanying drawing explanation
Fig. 1 is one of the utility model principle schematic (position alignment of inner layer plates is accurate);
Fig. 2 is the utility model principle schematic two (internal layer skew can accept);
Fig. 3 is the utility model principle schematic three (position alignment of inner layer plates is bad).
Embodiment
Below by way of specific instantiation, embodiment of the present utility model is described, those skilled in the art can understand advantage of the present utility model and effect easily by content disclosed in the present specification.The utility model also can be implemented in further, different ways, that is, under the category do not disclosed departing from the utility model, can give different modifications and change.
Embodiment: a kind of multilayer printed circuit board internal layer monitoring of structures, the longitudinal direction of the active gage of multilayer printed circuit board is folded structure and is had outer 1 and multilayer internal layer 2, the plane figure of the active gage of multilayer printed circuit board is for being placed with multi-disc wiring board monolithic, the edges of boards of described active gage have some section holes 3, described section hole is through internal layer and outer field through hole, and the inner surface in described section hole is coated with copper sheet 4, the skin of described active gage and be positioned at the outer of described section hole and be arranged with outer copper ring 5, described outer copper ring is connected with the copper sheet in section hole, the internal layer of described active gage and be positioned at section the outer of hole and be arranged with internal layer copper ring 6, described internal layer copper ring is connected with the copper sheet in section hole.The width of described internal layer copper ring is that internal layer offsets acceptable maximum, is specially 3mil.
Described wiring board monolithic is memory bar wiring board.Described active gage is placed with 108 memory bar wiring boards.
Described copper sheet is chemical copper.
Described outer copper ring is the copper ring etched by outer copper foil.
Described internal layer copper ring is the copper ring etched by internal layer Copper Foil.
Outer copper ring can fix the adhesive force of section hole and sheet material.
Operation principle of the present utility model is as follows: when needs carry out internal layer monitoring, with sheet-punching machine section hole taken off and cut, except can carrying out conventional internal layer data monitoring, internal layer copper ring whether can also be positioned at by observing section hole, whether contraposition is bad to judge internal layer, when hole of cutting into slices is positioned at internal layer copper ring center, show that position alignment of inner layer plates is accurate; When the eccentric contraposition of cut into slices hole and internal layer copper ring but cut into slices Kong Shang in internal layer copper ring time, show that internal layer offsets still in tolerance interval; When section hole has deviated from the outer bowlder of internal layer copper ring, show that position alignment of inner layer plates is bad.
Claims (8)
1. a multilayer printed circuit board internal layer monitoring of structures, it is characterized in that: the longitudinal direction of the active gage of multilayer printed circuit board is folded structure and had skin (1) and multilayer internal layer (2), the plane figure of the active gage of multilayer printed circuit board is for being placed with multi-disc wiring board monolithic, the edges of boards of described active gage have some section holes (3), described section hole is through internal layer and outer field through hole, and the inner surface in described section hole is coated with copper sheet (4), the skin of described active gage and be positioned at the outer of described section hole and be arranged with outer copper ring (5), described outer copper ring is connected with the copper sheet in section hole, the internal layer of described active gage and be positioned at section the outer of hole and be arranged with internal layer copper ring (6), described internal layer copper ring is connected with the copper sheet in section hole, the width of described internal layer copper ring is that internal layer offsets acceptable maximum.
2. multilayer printed circuit board internal layer monitoring of structures as claimed in claim 1, is characterized in that: the width of described internal layer copper ring is 3 ± 0.3mil.
3. multilayer printed circuit board internal layer monitoring of structures as claimed in claim 2, is characterized in that: the width of described internal layer copper ring is 3mil.
4. multilayer printed circuit board internal layer monitoring of structures as claimed in claim 1, is characterized in that: described wiring board monolithic is memory bar wiring board.
5. multilayer printed circuit board internal layer monitoring of structures as claimed in claim 4, is characterized in that: described active gage is placed with 108 memory bar wiring boards.
6. multilayer printed circuit board internal layer monitoring of structures as claimed in claim 1, is characterized in that: described copper sheet is chemical copper.
7. multilayer printed circuit board internal layer monitoring of structures as claimed in claim 1, is characterized in that: described outer copper ring is the copper ring etched by outer copper foil.
8. multilayer printed circuit board internal layer monitoring of structures as claimed in claim 1, is characterized in that: described internal layer copper ring is the copper ring etched by internal layer Copper Foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520678308.1U CN204906847U (en) | 2015-09-02 | 2015-09-02 | Multilayer printed circuit board inlayer monitoring structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520678308.1U CN204906847U (en) | 2015-09-02 | 2015-09-02 | Multilayer printed circuit board inlayer monitoring structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204906847U true CN204906847U (en) | 2015-12-23 |
Family
ID=54928983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520678308.1U Withdrawn - After Issue CN204906847U (en) | 2015-09-02 | 2015-09-02 | Multilayer printed circuit board inlayer monitoring structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204906847U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105101624A (en) * | 2015-09-02 | 2015-11-25 | 竞陆电子(昆山)有限公司 | Internal layer monitoring structure of multilayer printed circuit board |
-
2015
- 2015-09-02 CN CN201520678308.1U patent/CN204906847U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105101624A (en) * | 2015-09-02 | 2015-11-25 | 竞陆电子(昆山)有限公司 | Internal layer monitoring structure of multilayer printed circuit board |
| CN105101624B (en) * | 2015-09-02 | 2018-07-06 | 竞陆电子(昆山)有限公司 | Multilayer printed circuit board internal layer monitoring of structures |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20151223 Effective date of abandoning: 20180706 |