CN105101624A - Internal layer monitoring structure of multilayer printed circuit board - Google Patents
Internal layer monitoring structure of multilayer printed circuit board Download PDFInfo
- Publication number
- CN105101624A CN105101624A CN201510555665.3A CN201510555665A CN105101624A CN 105101624 A CN105101624 A CN 105101624A CN 201510555665 A CN201510555665 A CN 201510555665A CN 105101624 A CN105101624 A CN 105101624A
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- CN
- China
- Prior art keywords
- internal layer
- sheet
- circuit board
- copper ring
- printed circuit
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses an internal layer monitoring structure of a multilayer printed circuit board. The lengthways laminated structure of a working sheet of the multilayer printed circuit board comprises an external layer and multiple internal layers; the plane layout of the working sheet of the multilayer printed circuit board is that multiple circuit board single sheets are arranged; a plurality of sheet-cutting holes are formed in the edge of the working sheet; the sheet-cutting holes are through holes which run through the internal layers and the external layer; the inner surface of each sheet-cutting hole is covered with a copper sheet; the external layer of the working sheet, which is located at the periphery of the sheet-cutting holes, is provided with an external copper ring; the external copper ring is connected with the copper sheet located in each sheet-cutting hole; each internal layer of the working sheet, which is located at the periphery of the sheet-cutting holes, is provided with an internal copper ring; each internal copper ring is connected with the copper sheet in each sheet-cutting hole; the width of each internal copper ring is the maximum acceptable value of the deviation of the internal layers. When internal layer monitoring is needed, the sheet-cutting holes are taken off and cut off by using a sheet punching machine; besides the conventional internal lay data monitoring, whether the internal layers are in poor alignment can be judged through observing whether the sheet-cutting holes are located in the internal copper rings.
Description
Technical field
Character surveillance field in the plate that the invention belongs to printed circuit board (PCB), is specifically related to a kind of structure of hole of cutting into slices.
Background technology
Multilayer circuit board is all generally that connection sheet is produced, and the active gage of justifying generally comprises tens even hundreds of wiring board monolithic, and such as memory bar wiring board is generally that the active gage be made up of 108 memory bar wiring board monolithics is produced simultaneously.In order to auxiliary, character surveillance is carried out to internal layer, general meeting designs several section holes at the edges of boards of active gage, this section hole is the through hole running through active gage, the shaping situation with constructing wiring board on complete reaction active gage in this section hole, when needs carry out character surveillance to internal layer, need to be taken off from active gage in whole section hole with sheet-punching machine, the mode then by cutting section hole carries out character surveillance to internal layer.
But, though current section hole can reflect some data of internal layer, but can not alignment situation between conversion zone, what namely interlayer skew occurred badly cannot reflect at section hole place.Between current detection layers, skew adopts perspective machine mostly, carry out position scanning, thus determine side-play amount, but this detection method cost is slightly high to the anchor point on active gage.
Summary of the invention
In order to solve the problem, the invention provides a kind of multilayer printed circuit board internal layer monitoring of structures, this multilayer printed circuit board internal layer monitoring of structures not only has the function in conventional section hole, also have the function of monitoring interlayer alignment skew, and cost is low, easy to implement.
The present invention in order to the technical scheme solving its technical problem and adopt is:
A kind of multilayer printed circuit board internal layer monitoring of structures, the longitudinal direction of the active gage of multilayer printed circuit board is folded structure and is had outer and multilayer internal layer, the plane figure of the active gage of multilayer printed circuit board is for being placed with multi-disc wiring board monolithic, the edges of boards of described active gage have some section holes, described section hole is through internal layer and outer field through hole, and the inner surface in described section hole is coated with copper sheet, the skin of described active gage and be positioned at the outer of described section hole and be arranged with outer copper ring, described outer copper ring is connected with the copper sheet in section hole, the internal layer of described active gage and be positioned at section the outer of hole and be arranged with internal layer copper ring, described internal layer copper ring is connected with the copper sheet in section hole, the width of described internal layer copper ring is that internal layer offsets acceptable maximum.
The present invention in order to the further technical scheme solving its technical problem and adopt is:
Say further, the width of described internal layer copper ring is 3 ± 0.3mil.
Furthermore, the width of described internal layer copper ring is 3mil.
Say further, described wiring board monolithic is memory bar wiring board.
Furthermore, described active gage is placed with 108 memory bar wiring boards.
Say further, described copper sheet is chemical copper.
Say further, described outer copper ring is the copper ring etched by outer copper foil.
Say further, described internal layer copper ring is the copper ring etched by internal layer Copper Foil.
The invention has the beneficial effects as follows: the present invention is mainly on the basis in routine section hole, at the internal layer of active gage, the internal layer copper ring corresponding with section hole is set, and the width of internal layer copper ring is arranged to the acceptable maximum of internal layer side-play amount, internal layer copper ring can react the alignment situation of internal layer with the alignment situation in section hole, when needs carry out internal layer monitoring, with sheet-punching machine section hole taken off and cut, except can carrying out conventional internal layer data monitoring, internal layer copper ring whether can also be positioned at by observing section hole, whether contraposition is bad to judge internal layer, when hole of cutting into slices is positioned at internal layer copper ring center, show that position alignment of inner layer plates is accurate, when the eccentric contraposition of cut into slices hole and internal layer copper ring but cut into slices Kong Shang in internal layer copper ring time, show that internal layer offsets still in tolerance interval, when section hole has deviated from the outer bowlder of internal layer copper ring, show that position alignment of inner layer plates is bad.And outer copper ring can fix the adhesive force of section hole and sheet material.
Accompanying drawing explanation
Fig. 1 is one of principle of the invention schematic diagram (position alignment of inner layer plates is accurate);
Fig. 2 is principle of the invention schematic diagram two (internal layer skew can accept);
Fig. 3 is principle of the invention schematic diagram three (position alignment of inner layer plates is bad).
Embodiment
Below by way of specific instantiation, the specific embodiment of the present invention is described, those skilled in the art can understand advantage of the present invention and effect easily by content disclosed in the present specification.The present invention also can be implemented in further, different ways, that is, not departing under disclosed category, can give different modifications and change.
Embodiment: a kind of multilayer printed circuit board internal layer monitoring of structures, the longitudinal direction of the active gage of multilayer printed circuit board is folded structure and is had outer 1 and multilayer internal layer 2, the plane figure of the active gage of multilayer printed circuit board is for being placed with multi-disc wiring board monolithic, the edges of boards of described active gage have some section holes 3, described section hole is through internal layer and outer field through hole, and the inner surface in described section hole is coated with copper sheet 4, the skin of described active gage and be positioned at the outer of described section hole and be arranged with outer copper ring 5, described outer copper ring is connected with the copper sheet in section hole, the internal layer of described active gage and be positioned at section the outer of hole and be arranged with internal layer copper ring 6, described internal layer copper ring is connected with the copper sheet in section hole.The width of described internal layer copper ring is that internal layer offsets acceptable maximum, is specially 3mil.
Described wiring board monolithic is memory bar wiring board.Described active gage is placed with 108 memory bar wiring boards.
Described copper sheet is chemical copper.
Described outer copper ring is the copper ring etched by outer copper foil.
Described internal layer copper ring is the copper ring etched by internal layer Copper Foil.
Outer copper ring can fix the adhesive force of section hole and sheet material.
Operation principle of the present invention is as follows: when needs carry out internal layer monitoring, with sheet-punching machine section hole taken off and cut, except can carrying out conventional internal layer data monitoring, internal layer copper ring whether can also be positioned at by observing section hole, whether contraposition is bad to judge internal layer, when hole of cutting into slices is positioned at internal layer copper ring center, show that position alignment of inner layer plates is accurate; When the eccentric contraposition of cut into slices hole and internal layer copper ring but cut into slices Kong Shang in internal layer copper ring time, show that internal layer offsets still in tolerance interval; When section hole has deviated from the outer bowlder of internal layer copper ring, show that position alignment of inner layer plates is bad.
Claims (8)
1. a multilayer printed circuit board internal layer monitoring of structures, it is characterized in that: the longitudinal direction of the active gage of multilayer printed circuit board is folded structure and had skin (1) and multilayer internal layer (2), the plane figure of the active gage of multilayer printed circuit board is for being placed with multi-disc wiring board monolithic, the edges of boards of described active gage have some section holes (3), described section hole is through internal layer and outer field through hole, and the inner surface in described section hole is coated with copper sheet (4), the skin of described active gage and be positioned at the outer of described section hole and be arranged with outer copper ring (5), described outer copper ring is connected with the copper sheet in section hole, the internal layer of described active gage and be positioned at section the outer of hole and be arranged with internal layer copper ring (6), described internal layer copper ring is connected with the copper sheet in section hole, the width of described internal layer copper ring is that internal layer offsets acceptable maximum.
2. multilayer printed circuit board internal layer monitoring of structures as claimed in claim 1, is characterized in that: the width of described internal layer copper ring is 3 ± 0.3mil.
3. multilayer printed circuit board internal layer monitoring of structures as claimed in claim 2, is characterized in that: the width of described internal layer copper ring is 3mil.
4. multilayer printed circuit board internal layer monitoring of structures as claimed in claim 1, is characterized in that: described wiring board monolithic is memory bar wiring board.
5. multilayer printed circuit board internal layer monitoring of structures as claimed in claim 4, is characterized in that: described active gage is placed with 108 memory bar wiring boards.
6. multilayer printed circuit board internal layer monitoring of structures as claimed in claim 1, is characterized in that: described copper sheet is chemical copper.
7. multilayer printed circuit board internal layer monitoring of structures as claimed in claim 1, is characterized in that: described outer copper ring is the copper ring etched by outer copper foil.
8. multilayer printed circuit board internal layer monitoring of structures as claimed in claim 1, is characterized in that: described internal layer copper ring is the copper ring etched by internal layer Copper Foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510555665.3A CN105101624B (en) | 2015-09-02 | 2015-09-02 | Multilayer printed circuit board internal layer monitoring of structures |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510555665.3A CN105101624B (en) | 2015-09-02 | 2015-09-02 | Multilayer printed circuit board internal layer monitoring of structures |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105101624A true CN105101624A (en) | 2015-11-25 |
| CN105101624B CN105101624B (en) | 2018-07-06 |
Family
ID=54580832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510555665.3A Active CN105101624B (en) | 2015-09-02 | 2015-09-02 | Multilayer printed circuit board internal layer monitoring of structures |
Country Status (1)
| Country | Link |
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| CN (1) | CN105101624B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06338670A (en) * | 1993-05-31 | 1994-12-06 | Matsushita Electric Works Ltd | Printed wiring board |
| JPH0750464A (en) * | 1993-08-06 | 1995-02-21 | Mitsubishi Electric Corp | Cut throughhole substrate and its manufacture |
| US20080217051A1 (en) * | 2007-03-07 | 2008-09-11 | Fujitsu Limited | Wiring board and method of manufacturing wiring board |
| CN101697001A (en) * | 2009-01-22 | 2010-04-21 | 依利安达(广州)电子有限公司 | Method for detecting positional deviation among layers of multilayer printed circuit board |
| CN104159394A (en) * | 2014-07-24 | 2014-11-19 | 深圳崇达多层线路板有限公司 | PCB slice and preparation method thereof |
| CN104470227A (en) * | 2014-12-05 | 2015-03-25 | 深圳崇达多层线路板有限公司 | Method for improving high multilayer circuit board slice position and BGA position plated-through hole copper thickness unevenness |
| CN204906847U (en) * | 2015-09-02 | 2015-12-23 | 竞陆电子(昆山)有限公司 | Multilayer printed circuit board inlayer monitoring structure |
-
2015
- 2015-09-02 CN CN201510555665.3A patent/CN105101624B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06338670A (en) * | 1993-05-31 | 1994-12-06 | Matsushita Electric Works Ltd | Printed wiring board |
| JPH0750464A (en) * | 1993-08-06 | 1995-02-21 | Mitsubishi Electric Corp | Cut throughhole substrate and its manufacture |
| US20080217051A1 (en) * | 2007-03-07 | 2008-09-11 | Fujitsu Limited | Wiring board and method of manufacturing wiring board |
| CN101697001A (en) * | 2009-01-22 | 2010-04-21 | 依利安达(广州)电子有限公司 | Method for detecting positional deviation among layers of multilayer printed circuit board |
| CN104159394A (en) * | 2014-07-24 | 2014-11-19 | 深圳崇达多层线路板有限公司 | PCB slice and preparation method thereof |
| CN104470227A (en) * | 2014-12-05 | 2015-03-25 | 深圳崇达多层线路板有限公司 | Method for improving high multilayer circuit board slice position and BGA position plated-through hole copper thickness unevenness |
| CN204906847U (en) * | 2015-09-02 | 2015-12-23 | 竞陆电子(昆山)有限公司 | Multilayer printed circuit board inlayer monitoring structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105101624B (en) | 2018-07-06 |
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