JP2020136352A - Wiring board and manufacturing method thereof - Google Patents

Abstract

To provide a wiring board having an alignment mark in consideration of the stretchability when a stretchable electrode is manufactured using a base material that greatly expands and contracts, or when the manufactured stretchable electrode substrate is mounted on a mounted body, and a manufacturing method of the wiring board.SOLUTION: A wiring board 10 with elasticity includes: a substrate 20 including a first surface 21 and a second surface 22 located on the opposite side of the first surface, and having a first elastic coefficient; wirings 52 located on the first surface side of the base material and connected to electrodes of electronic components mounted on the wiring board; and an alignment mark member X provided on the base material and used for alignment during manufacturing of the wiring board and/or alignment during mounting of the wiring board on a mounted body. The shape and size of the alignment mark member do not change when the base material is stretched and contracted.SELECTED DRAWING: Figure 1

Description

An embodiment of the present disclosure relates to a wiring board including a base material and electronic components and wiring located on the first surface side of the base material. Moreover, the embodiment of this disclosure relates to the manufacturing method of the wiring board.

In recent years, research has been conducted on electronic devices having deformability such as elasticity. For example, Patent Document 1 discloses a wiring board having a base material and wiring provided on the base material and having elasticity. Patent Document 1 employs a manufacturing method in which a circuit is provided on a pre-stretched base material, and the base material is relaxed after the circuit is formed. Patent Document 1 intends to operate the thin film transistor on the substrate satisfactorily in both the extended state and the relaxed state of the substrate.

JP-A-2007-281406

The wiring board includes not only a part having resistance to deformation such as expansion and contraction but also a part easily damaged due to deformation. For this reason, if the circuit is provided on the base material in the stretched state in advance, problems such as damage to the wiring board are likely to occur.

On the other hand, for example, in the production of semiconductors, liquid crystals, etc., a base material that expands and contracts significantly is not used. For this reason, most of the alignment marks used for alignment at the time of bonding the base materials have a shape and size corresponding to one-to-one with the base materials to be bonded, and the corresponding marks are highly accurate. Need to be made.
In order to realize the alignment function when the telescopic electrode is manufactured using the base material which expands and contracts greatly, or when the prepared telescopic electrode base material is mounted on the object to be mounted, for example, a human body or an object. An alignment mark is required in consideration of its elasticity.

An object of the present disclosure is to provide a wiring board and a method for manufacturing a wiring board that can effectively solve such a problem.

One embodiment of the present disclosure is a stretchable wiring board comprising a first surface and a second surface located on the opposite side of the first surface and having a first elastic modulus, and the above-mentioned. A wiring that is located on the first surface side of the base material and is connected to an electrode of an electronic component mounted on the wiring board, and a wiring that is provided on the base material and is aligned at the time of manufacturing the wiring board and / or An alignment mark member used for alignment of the wiring board with respect to the mounted body at the time of mounting is provided so that the shape and size of the alignment mark member do not change when the base material is stretched and contracted. It is a wiring board.

In the wiring board according to the embodiment of the present disclosure, the wiring may have a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base material. ..

In the wiring board according to the embodiment of the present disclosure, the alignment mark member is at least partially overlapped with the region where the alignment mark member is formed when viewed along the normal direction of the first surface of the base material, and the first A marking reinforcing member having an elastic modulus larger than that of the above may be provided.

In the wiring board according to the embodiment of the present disclosure, the mark reinforcing member may be integrated with the alignment mark member.

In the wiring board according to the embodiment of the present disclosure, the portion of the wiring that does not overlap with the mark reinforcing member when viewed along the normal direction of the first surface is the first surface of the base material. It may have a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction.

In the wiring board according to the embodiment of the present disclosure, the wiring is located between the wiring and the first surface of the base material and has a third elastic modulus larger than the first elastic modulus. A support substrate for supporting may be further provided.

In the wiring board according to the embodiment of the present disclosure, when the support substrate is provided on the support substrate and the support substrate is attached to the base material, the wiring board is viewed along the normal direction of the first surface of the base material. By overlapping the alignment mark member with the alignment mark member in a predetermined positional relationship, an additional alignment mark member for aligning the base material and the support substrate at a predetermined position is further provided. May be good.

In the wiring board according to the embodiment of the present disclosure, the alignment mark member and the additional alignment mark member are combined to form one alignment mark, which is used for alignment of the wiring board with respect to the mounted body at the time of mounting. May be good.

In the wiring board according to the embodiment of the present disclosure, when the wiring board is used for alignment at the time of mounting the wiring board with respect to the mounted body, when viewed along the normal direction of the first surface of the base material. In a state where the wiring board is mounted on the mounted body so that the predetermined position of the mounted body and the position of the alignment mark member have a predetermined positional relationship, necessary information is obtained from the mounted body. The position of the alignment mark member on the wiring board may be set so that it can be detected.

In the wiring board according to the embodiment of the present disclosure, the size of the alignment mark member may be set based on the elongation rate of the base material.

In the wiring board according to the embodiment of the present disclosure, the alignment mark member may be located on the first surface of the base material.

In the wiring board according to the embodiment of the present disclosure, the alignment mark member may be located on the second surface of the base material.

In the wiring board according to the embodiment of the present disclosure, the alignment mark member may be located in the base material.

In the wiring board according to the embodiment of the present disclosure, the alignment mark member is located on the first surface side of the base material so as to be exposed on the first surface of the base material. May be good.

In the wiring board according to the embodiment of the present disclosure, the alignment mark member is located on the second surface side of the base material so as to be exposed on the second surface of the base material. May be good.

In the wiring board according to the embodiment of the present disclosure, the alignment mark member is located in the base material so as to penetrate between the first surface and the second surface of the base material. It may be.

In the wiring board according to the embodiment of the present disclosure, the thickness of the alignment mark member is the same as the thickness of the base material in the direction from the first surface to the second surface of the base material. May be good.

In the wiring board according to the embodiment of the present disclosure, the thickness of the alignment mark member is set to be smaller than the thickness of the base material in the direction from the first surface to the second surface of the base material. May be good.

In the wiring board according to the embodiment of the present disclosure, the wiring board is located on the first surface side of the base material or the second surface side of the base material, and is located along the normal direction of the first surface of the base material. When viewed, a reinforcing member for an electronic component that partially overlaps the electronic component mounted on the wiring board and has a second elastic modulus larger than the first elastic modulus may be further provided.

In the wiring board according to the embodiment of the present disclosure, the portion of the wiring that does not overlap with the reinforcing member for electronic components when viewed along the normal direction of the first surface is the first surface of the base material. It may have a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the above.

In the wiring board according to the embodiment of the present disclosure, the amplitude of the bellows-shaped portion of the wiring may be 1 μm or more.

In the wiring board according to the embodiment of the present disclosure, the additional alignment mark member may be located on the first surface of the support board.

In the wiring board according to the embodiment of the present disclosure, the additional alignment mark member may be located on the second surface of the support board.

In the wiring board according to the embodiment of the present disclosure, the additional alignment mark member may be located in the support board.

In the wiring board according to the embodiment of the present disclosure, the additional alignment mark member is located on the first surface side of the support substrate so as to be exposed on the first surface of the support substrate. You may.

In the wiring board according to the embodiment of the present disclosure, the additional alignment mark member is located on the second surface side of the support substrate so as to be exposed on the second surface of the support substrate. You may.

In the wiring board according to the embodiment of the present disclosure, the additional alignment mark member is located in the base material so as to penetrate between the first surface and the second surface of the support substrate. You may do so.

In the wiring board according to the embodiment of the present disclosure, the thickness of the additional alignment mark member is the same as the thickness of the support board in the direction from the first surface to the second surface of the support board. You may.

In the wiring board according to the embodiment of the present disclosure, the thickness of the additional alignment mark member is set to be smaller than the thickness of the support substrate in the direction from the first surface to the second surface of the support substrate. May be good.

In the wiring board according to the embodiment of the present disclosure, the base material may include silicone rubber.

In the wiring board according to the embodiment of the present disclosure, the mark reinforcing member may include a metal layer.

In the wiring board according to the embodiment of the present disclosure, the reinforcing member for electronic components may include a metal layer.

In the wiring board according to the embodiment of the present disclosure, the wiring may include a plurality of conductive particles.

The wiring board according to the embodiment of the present disclosure may further include an electronic component having an electrode located on the first surface side of the base material and electrically connected to the wiring.

In the wiring substrate according to the embodiment of the present disclosure, the resistance value of the wiring in the first state in which the tensile stress along the in-plane direction of the first surface of the base material is not applied to the base material is the first resistance value. The resistance value of the wiring in the second state in which a tensile stress is applied to the base material to extend the base material by 30% in the in-plane direction of the first surface as compared with the first state is the second resistance. When referred to as a value, the ratio of the absolute value of the difference between the first resistance value and the second resistance value to the first resistance value may be 20% or less.

In the wiring board according to the embodiment of the present disclosure, the alignment mark member may be composed of a plurality of patterns.

In the wiring board according to the embodiment of the present disclosure, the alignment mark member and the additional alignment mark member are polygonal, cross-shaped, and circular when viewed along the normal direction of the first surface of the wiring. It may have a shape, a character shape, or a number shape.

One embodiment of the present disclosure is a method for manufacturing a stretchable wiring board, which includes a first surface and a second surface located on the opposite side of the first surface, and has a first elastic modulus. In the first step of stretching the base material by applying tensile stress to the substrate, and on the first surface side of the stretched base material, wirings connected to electrodes of electronic components mounted on the wiring board are provided. The second step of providing the wiring board and the third step of removing the tensile stress from the base material are provided, and the wiring board is provided on the base material and is aligned at the time of manufacturing and / or An alignment mark member used for alignment of the wiring board with respect to the mounted body at the time of mounting is provided, and the shape and size of the alignment mark member do not change when the base material is stretched and contracted. , A method for manufacturing a wiring board.

In the method for manufacturing a wiring board according to an embodiment of the present disclosure, the wiring has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base material. You may.

The method for manufacturing a wiring board according to an embodiment of the present disclosure includes a first surface and a second surface located on the opposite side of the first surface, and has a third elastic coefficient larger than the first elastic coefficient. When a support substrate preparation step of preparing a support substrate and providing the wiring on the first surface of the support substrate is further provided, the wiring board is provided on the support substrate, and the support substrate is attached to the substrate. In addition, when viewed along the normal direction of the first surface of the base material, the base material and the support substrate are overlapped with the alignment mark member in a predetermined positional relationship defined in advance. The support substrate is provided with an additional alignment mark member for aligning and with a predetermined position, and in the second step, the support substrate provided with the wiring on the first surface of the base material in an elongated state is provided. When viewed along the normal direction of the first surface of the base material, the alignment mark member and the additional alignment mark member are overlapped with each other in a predetermined positional relationship defined in advance, and the support substrate is formed. It may be joined from the second surface side of the above.

The method for manufacturing a wiring board according to an embodiment of the present disclosure further includes a base material preparation step of providing a reinforcing member for the electronic component on the second surface of the base material, and in the second step, for the electronic component. When the support substrate provided with the wiring on the first surface of the stretched base material provided with the reinforcing member is viewed along the normal direction of the first surface of the base material. In addition, the alignment mark member and the additional alignment mark member may be overlapped with each other in a predetermined positional relationship defined in advance so as to be joined from the second surface side of the support substrate.

In the method for manufacturing a wiring board according to an embodiment of the present disclosure, in the support substrate preparation step, the reinforcing member for electronic components is provided on the second surface of the support substrate, and in the second step, the elongated state is provided. When the support substrate provided with the wiring and the reinforcing member for electronic components on the first surface of the base material is viewed along the normal direction of the first surface of the base material, the said The alignment mark member and the additional alignment mark member may be overlapped with each other in a predetermined positional relationship defined in advance so as to be joined from the second surface side of the support substrate.

According to the embodiment of the present disclosure, it is possible to suppress the occurrence of a defect in the wiring board due to the expansion and contraction of the base material while realizing the highly accurate alignment function.

It is sectional drawing which shows the wiring board which concerns on one Embodiment. It is a top view which shows the wiring board which concerns on one Embodiment. It is sectional drawing which shows the case where the wiring board of FIG. 2 is cut along the line BB. It is sectional drawing which shows the other example of a wiring board. It is sectional drawing which shows the other example of a wiring board. It is sectional drawing which shows the other example of a wiring board. It is sectional drawing which shows the other example of a wiring board. It is sectional drawing which shows the other example of a wiring board. It is sectional drawing which shows the other example of a wiring board. It is sectional drawing which shows the other example of a wiring board. It is sectional drawing which shows the other example of a wiring board. It is sectional drawing which shows the other example of a wiring board. It is sectional drawing which shows the other example of a wiring board. FIG. 5 is an enlarged cross-sectional view showing an example of the wiring of the wiring board shown in FIG. 1 and its peripheral components. FIG. 5 is an enlarged cross-sectional view showing another example of the wiring of the wiring board shown in FIG. 1 and its peripheral components. FIG. 5 is an enlarged cross-sectional view showing another example of the wiring of the wiring board shown in FIG. 1 and its peripheral components. FIG. 5 is an enlarged cross-sectional view showing another example of the wiring of the wiring board shown in FIG. 1 and its peripheral components. It is a figure for demonstrating the manufacturing method of the wiring board shown in FIG. It is sectional drawing which shows the wiring board which concerns on 1st modification. FIG. 5 is an enlarged cross-sectional view showing an example of the wiring of the wiring board shown in FIG. 19 and its peripheral components. It is a figure for demonstrating the manufacturing method of the wiring board shown in FIG. It is sectional drawing which shows the wiring board which concerns on one modification. It is sectional drawing which shows the wiring board which concerns on one modification. It is a top view which shows the wiring board which concerns on 1st modification. It is sectional drawing which shows the example of the cross section of the wiring board shown in FIG. It is sectional drawing which shows the example of the cross section of the wiring board shown in FIG. It is sectional drawing which shows the example of the cross section of the wiring board shown in FIG. It is sectional drawing which shows the example of the cross section of the wiring board shown in FIG. It is sectional drawing which shows the example of the cross section of the wiring board shown in FIG. It is sectional drawing which shows the example of the cross section of the wiring board shown in FIG. It is sectional drawing which shows the wiring board which concerns on the 3rd modification. FIG. 3 is an enlarged cross-sectional view showing an example of the wiring of the wiring board shown in FIG. 31 and its peripheral components. It is a figure for demonstrating the manufacturing method of the wiring board shown in FIG. It is sectional drawing which shows the other example of the wiring board which concerns on 4th modification. It is sectional drawing which shows the other example of the wiring board which concerns on 4th modification. It is sectional drawing which shows the electronic component which concerns on 5th modification. It is a top view which shows an example of the electronic component which concerns on 5th modification. It is a top view which shows an example of the electronic component which concerns on 5th modification. It is sectional drawing which shows the wiring board which concerns on 6th modification.

Hereinafter, the configuration of the wiring board and the manufacturing method thereof according to the embodiment of the present disclosure will be described in detail with reference to the drawings. The embodiments shown below are examples of the embodiments of the present disclosure, and the present disclosure is not construed as being limited to these embodiments. Further, in the present specification, terms such as "board", "base material", "sheet" and "film" are not distinguished from each other based only on the difference in names. For example, "base material" is a concept that includes members that can be called substrates, sheets, or films. Furthermore, as used herein, terms such as "parallel" and "orthogonal" and values of length and angle that specify the shape and geometric conditions and their degrees are bound by strict meaning. Instead, the interpretation will include the range in which similar functions can be expected. Further, in the drawings referred to in the present embodiment, the same parts or parts having similar functions are designated by the same reference numerals or similar reference numerals, and the repeated description thereof may be omitted. In addition, the dimensional ratio of the drawing may differ from the actual ratio for convenience of explanation, or a part of the configuration may be omitted from the drawing.

Hereinafter, an embodiment of the present disclosure will be described with reference to FIGS. 1 to 18.

(Wiring board)
First, the wiring board 10 according to the present embodiment will be described. 1 and 2 are a cross-sectional view and a plan view showing the wiring board 10, respectively. The cross-sectional view shown in FIG. 1 is a view when the wiring board 10 of FIG. 2 is cut along the lines AA.

The wiring board 10 shown in FIG. 1 includes a base material 20, an alignment mark member X, a reinforcing member 31 for electronic components, a support substrate 40, an additional alignment mark member Y, an electronic component 51, and a wiring 52. Hereinafter, each component of the wiring board 10 will be described.

〔Base material〕
The base material 20 is a member configured to have elasticity. The base material 20 includes a first surface 21 located on the side of the electronic component 51 and the wiring 52, and a second surface 22 located on the opposite side of the first surface 21. The thickness of the base material 20 is, for example, 10 mm or less, more preferably 1 mm or less. By reducing the thickness of the base material 20, the force required for expansion and contraction of the base material 20 can be reduced. Further, by reducing the thickness of the base material 20, the thickness of the entire product using the wiring board 10 can be reduced. Thereby, for example, when the product using the wiring board 10 is a sensor attached to a part of the body such as a human arm, the wearing feeling can be reduced. The thickness of the base material 20 may be 10 μm or more.

An example of a parameter representing the elasticity of the base material 20 is the elastic modulus of the base material 20. The elastic modulus of the base material 20 is, for example, 10 MPa or less, more preferably 1 MPa or less. By using the base material 20 having such an elastic modulus, the entire wiring board 10 can be made elastic. In the following description, the elastic modulus of the base material 20 is also referred to as a first elastic modulus. The first elastic modulus of the base material 20 may be 1 kPa or more.

As a method for calculating the first elastic modulus of the base material 20, a method of carrying out a tensile test in accordance with JIS K6251 using a sample of the base material 20 can be adopted. It is also possible to adopt a method in which the elastic modulus of the sample of the base material 20 is measured by the nanoindentation method in accordance with ISO14577. A nanoindenter can be used as the measuring instrument used in the nanoindentation method. As a method of preparing a sample of the base material 20, a method of taking out a part of the base material 20 from the wiring board 10 as a sample and a method of taking out a part of the base material 20 before forming the wiring board 10 as a sample can be considered. Be done. In addition, as a method of calculating the first elastic modulus of the base material 20, the materials constituting the base material 20 are analyzed, and the first elastic modulus of the base material 20 is calculated based on the existing database of the materials. It is also possible to adopt the method. The elastic modulus in the present application is an elastic modulus in an environment of 25 ° C.

Another example of a parameter representing the elasticity of the base material 20 is the flexural rigidity of the base material 20. The flexural rigidity is the product of the moment of inertia of area of the target member and the elastic modulus of the material constituting the target member, and the unit is N · m ² or Pa · m ⁴ . The moment of inertia of area of the base material 20 is calculated based on the cross section when the portion of the base material 20 that overlaps with the wiring 52 is cut by a plane orthogonal to the expansion / contraction direction of the wiring board 10. In the following description, the flexural rigidity of the base material 20 is also referred to as the first flexural rigidity.

Examples of the material constituting the base material 20 include thermoplastic elastomers, silicone rubbers, urethane gels, silicon gels, and the like. Further, as the material of the base material 20, for example, a cloth such as a woven fabric, a knitted fabric, or a non-woven fabric can be used. Examples of the thermoplastic elastomer include polyurethane-based elastomers, styrene-based thermoplastic elastomers, olefin-based thermoplastic elastomers, vinyl chloride-based thermoplastic elastomers, ester-based thermoplastic elastomers, amide-based thermoplastic elastomers, and 1,2-BR-based thermoplastic elastomers. A fluorine-based thermoplastic elastomer or the like can be used. Considering mechanical strength and abrasion resistance, it is preferable to use a urethane-based elastomer. Further, silicone rubber is excellent in heat resistance, chemical resistance, and flame retardancy, and is preferable as a material for the base material 20. When the embedded alignment mark member X needs to be visible from the outside, for example, a transparent material is selected for the base material 20.

[Reinforcing members for electronic components]
In the present embodiment, as an example, an example in which the reinforcing member 31 for electronic components is provided on the wiring board 10 in order to control the expansion and contraction of the base material 20 will be described. However, instead of the electronic component reinforcing member 31 applied in the present embodiment, another member or configuration for controlling the expansion and contraction of the base material 20 may be applied to the wiring board 10. Often, the reinforcing member for electronic components may be omitted.
As described above, the reinforcing member 31 for electronic components is a member provided on the wiring board 10 in order to control the expansion and contraction of the base material 20. In the example shown in FIG. 1, the reinforcing member 31 for electronic components is located on the second surface 22 side of the base material 20. For example, the reinforcing member 31 for electronic components is provided on the second surface 22 of the base material 20.

The reinforcing member 31 for electronic components has an elastic modulus larger than the first elastic modulus of the base material 20. The elastic modulus of the reinforcing member 31 for electronic components is, for example, 1 GPa or more, more preferably 10 GPa or more. The elastic modulus of the reinforcing member 31 for electronic components may be 100 times or more, or 1000 times or more, the first elastic modulus of the base material 20. By providing the reinforcing member 31 for electronic components on the base material 20, it is possible to prevent the portion of the base material 20 that overlaps with the reinforcing member 31 for electronic components from expanding and contracting. As a result, the base material 20 can be divided into a portion where expansion and contraction is likely to occur and a portion where expansion and contraction is unlikely to occur. In the following description, the elastic modulus of the reinforcing member 31 for electronic components is also referred to as a second elastic modulus. The second elastic modulus of the reinforcing member 31 for electronic components may be 500 GPa or less. Further, the second elastic modulus of the reinforcing member 31 for electronic parts may be 500,000 times or less the first elastic modulus of the base material 20. In addition, "overlapping" means that the two components overlap when viewed along the normal direction of the first surface 21 of the base material 20.

The method for calculating the second elastic modulus of the reinforcing member 31 for electronic components is appropriately determined according to the form of the reinforcing member 31 for electronic components. For example, the method of calculating the second elastic modulus of the reinforcing member 31 for electronic components may be the same as or different from the method of calculating the elastic modulus of the base material 20 described above. The elastic modulus of the support substrate 40 described later is also the same. For example, as a method of calculating the elastic modulus of the reinforcing member 31 for electronic components or the support substrate 40, a method of performing a tensile test in accordance with ASTM D882 using a sample of the reinforcing member 31 for electronic components or the support substrate 40. Can be adopted.

Further, the reinforcing member 31 for electronic components has a bending rigidity larger than that of the first bending rigidity of the base material 20. The flexural rigidity of the reinforcing member 31 for electronic components may be 100 times or more, or 1000 times or more, the first bending rigidity of the base material 20. In the following description, the flexural rigidity of the reinforcing member 31 for electronic components is also referred to as the second flexural rigidity.

Examples of materials constituting the reinforcing member 31 for electronic parts include a metal layer containing a metal material, a general thermoplastic elastomer, an acrylic type, a urethane type, an epoxy type, a polyester type, an epoxy type, a vinyl ether type, and a polyene. Examples thereof include thiol-based and silicone-based oligomers and polymers. Examples of metal materials include copper, aluminum, stainless steel and the like. The thickness of the reinforcing member 31 for electronic components is, for example, 10 μm or more. Among the above-mentioned materials, the metal layer is more preferable because it has a high elastic modulus and can be finely processed by etching or the like.
Further, PET film, PEN film and the like can be applied as a material example of the reinforcing member 31 for electronic parts, and for example, polyethylene naphthalate, polyimide, polycarbonate, acrylic resin, polyethylene terephthalate and the like can be used.

When an oligomer or a polymer is used as a material for forming the reinforcing member 31 for electronic parts, the reinforcing member 31 for electronic parts may have transparency. Further, the reinforcing member 31 for electronic components may have a light-shielding property, for example, a property of shielding ultraviolet rays. For example, the reinforcing member 31 for electronic components may be black. Further, the color of the reinforcing member 31 for electronic components and the color of the base material 20 may be the same.

FIG. 3 is a cross-sectional view showing a case where the wiring board 10 of FIG. 2 is cut along the line BB. Note that FIG. 2 is a plan view showing the case where the wiring board 10 is viewed from the first surface 21 side of the base material 20, so that the alignment mark member X located on the first surface 21 side of the base material 20 and the second The reinforcing member 31 for electronic components located on the surface 22 side is represented by a dotted line.

[Support board]
The support substrate 40 is a plate-shaped member configured to have lower elasticity than the substrate 20. The support substrate 40 includes a second surface 42 located on the base material 20 side and a first surface 41 located on the opposite side of the second surface 42. In the example shown in FIG. 1, the support substrate 40 supports the electronic component 51 and the wiring 52 on the first surface 41 side thereof. Further, the support substrate 40 is joined to the first surface of the base material 20 on the second surface 42 side thereof. For example, an adhesive layer 60 containing an adhesive may be provided between the base material 20 and the support substrate 40. As the material constituting the adhesive layer 60, for example, an acrylic adhesive, a silicone adhesive, or the like can be used. The thickness of the adhesive layer 60 is, for example, 5 μm or more and 200 μm or less. Further, as shown in FIG. 22, the second surface 42 of the support substrate 40 may be bonded to the first surface 21 of the base material 20 by room temperature bonding or molecular adhesion. In this case, the adhesive layer may not be provided between the base material 20 and the support substrate 40. Further, a primer layer for improving the adhesiveness of normal temperature bonding and molecular adhesion may be provided on one or both of the first surface 21 of the base material 20 and the second surface 42 of the support substrate 40. When the second surface 42 of the support substrate 40 is bonded to the first surface 21 of the base material 20 by room temperature bonding or molecular adhesion, as shown in FIG. 23, the reinforcing member 31 for electronic components is the first surface of the base material 20. It is preferably embedded in the base material 20 so as not to be exposed on the surface 21 or the second surface 22.

As will be described later, when the tensile stress is removed from the base material 20 bonded to the support substrate 40 and the base material 20 contracts, a bellows-shaped portion is formed on the support substrate 40. The characteristics and dimensions of the support substrate 40 are set so that such a bellows-shaped portion can be easily formed. For example, the support substrate 40 has an elastic modulus larger than the first elastic modulus of the substrate 20. In the following description, the elastic modulus of the support substrate 40 is also referred to as a third elastic modulus.

The third elastic modulus of the support substrate 40 is, for example, 100 MPa or more, more preferably 1 GPa or more. The third elastic modulus of the support substrate 40 may be 100 times or more, or 1000 times or more, the first elastic modulus of the base material 20. The thickness of the support substrate 40 is, for example, 10 μm or less, more preferably 5 μm or less. By increasing the elastic modulus of the support substrate 40 or reducing the thickness of the support substrate 40, a bellows-shaped portion is likely to be formed on the support substrate 40 as the base material 20 shrinks. As the material constituting the support substrate 40, for example, polyethylene naphthalate, polyimide, polycarbonate, acrylic resin, polyethylene terephthalate and the like can be used. When it is necessary for the embedded additional alignment mark member Y to be visible from the outside for the support substrate 40, for example, a transparent material is selected.

The third elastic modulus of the support substrate 40 may be 100 times or less of the first elastic modulus of the base material 20. The method of calculating the third elastic modulus of the support substrate 40 is the same as that of the base material 20. Further, the thickness of the support substrate 40 may be 500 nm or more.

[Electronic components]
In the example shown in FIG. 1, the electronic component 51 has at least an electrode connected to the wiring 52. The electronic component 51 may be an active component, a passive component, or a mechanical component.
Examples of electronic components 51 include transistors, LSI (Large-Scale Integration), MEMS (Micro Electro Mechanical Systems), relays, light emitting elements such as LEDs, OLEDs, and LCDs, sound components such as sensors and buzzers, and vibrations that generate vibrations. Examples thereof include parts, cold and heat-generating parts such as Perche elements and heating wires that control cooling heat generation, resistors, capacitors, inductors, piezoelectric elements, switches, and connectors. Of the above examples of the electronic component 51, the sensor is preferably used. Examples of sensors include temperature sensors, pressure sensors, optical sensors, photoelectric sensors, proximity sensors, shear force sensors, biosensors, laser sensors, microwave sensors, humidity sensors, strain sensors, gyro sensors, acceleration sensors, displacement sensors, etc. Examples thereof include magnetic sensors, gas sensors, GPS sensors, ultrasonic sensors, odor sensors, brain wave sensors, current sensors, vibration sensors, pulse wave sensors, electrocardiographic sensors, and photometric sensors. Of these sensors, biosensors are particularly preferred. The biosensor can measure biometric information such as heartbeat, pulse, electrocardiogram, blood pressure, body temperature, and blood oxygen concentration.

〔wiring〕
The wiring 52 is a conductive member connected to the electrodes of the electronic component 51. For example, as shown in FIG. 2, one end and the other end of the wiring 52 are connected to the electrodes of the two electronic components 51, respectively. As shown in FIG. 2, a plurality of wirings 52 may be provided between the two electronic components 51.

As will be described later, when the tensile stress is removed from the base material 20 bonded to the support substrate 40 and the base material 20 contracts, the wiring 52 is deformed in a bellows shape. In consideration of this point, preferably, the wiring 52 has a structure having resistance to deformation. For example, the wiring 52 has a base material and a plurality of conductive particles dispersed in the base material. In this case, by using a deformable material such as resin as the base material, the wiring 52 can also be deformed according to the expansion and contraction of the base material 20. Further, the conductivity of the wiring 52 can be maintained by setting the distribution and shape of the conductive particles so that the contact between the plurality of conductive particles is maintained even when the deformation occurs. ..

As a material constituting the base material of the wiring 52, for example, a general thermoplastic elastomer and a thermosetting elastomer can be used, and for example, a styrene elastomer, an acrylic elastomer, an olefin elastomer, a urethane elastomer, and a silicone. Rubber, urethane rubber, fluororubber, nitrile rubber, polybutadiene, polychloroprene and the like can be used. Among them, resins and rubbers containing urethane-based and silicone-based structures are preferably used in terms of their elasticity and durability. Further, as a material constituting the conductive particles of the wiring 52, for example, particles such as silver, copper, gold, nickel, palladium, platinum, and carbon can be used. Among them, silver particles are preferably used from the viewpoint of price and conductivity.

What is required of the wiring 52 is to follow the expansion and contraction of the base material 20 by utilizing the elimination and formation of the bellows-shaped portion 57. Considering this point, as the material of the wiring 52, not only the material itself having deformability and elasticity as described above, but also the material itself having no deformability and elasticity. It can be adopted.
Examples of the material that can be used for the wiring 52 and does not have elasticity by itself include metals such as gold, silver, copper, aluminum, platinum, and chromium, and alloys containing these metals. When the material of the wiring 52 itself does not have elasticity, a metal film can be used as the wiring 52.

The thickness of the wiring 52 is smaller than the thickness of the electronic component 51, for example, 50 μm or less. The width of the wiring 52 is, for example, 50 μm or more and 10 mm or less.

[Positional relationship of reinforcing members for electronic components]
Next, the reinforcing member 31 for electronic components will be described based on the positional relationship between the electronic components 51 and the wiring 52.

As shown in FIGS. 1 and 2, the reinforcing member 31 for electronic components is arranged so as to at least partially overlap the electronic component 51 when viewed along the normal direction of the first surface 21 of the base material 20. ing. Preferably, the reinforcing member 31 for an electronic component overlaps the electronic component 51 over the entire area of the electronic component 51 when viewed along the normal direction of the first surface 21 of the base material 20. Therefore, the portion of the base material 20 that overlaps with the electronic component 51, that is, the portion that overlaps with the electronic component reinforcing member 31, is less likely to be deformed than the portion of the base material 20 that does not overlap with the electronic component reinforcing member 31. As a result, when a force such as tensile stress is applied to the base material 20, or when a force such as tensile stress is removed from the base material 20, the portion of the base material 20 that overlaps with the electronic component 51 is deformed. Can be suppressed. As a result, it is possible to suppress the stress caused by the deformation of the base material 20 from being applied to the electronic component 51, and it is possible to prevent the electronic component 51 from being deformed or damaged. Further, it is possible to prevent the electrical joint between the electronic component 51 and the wiring 52 from being damaged.

Although FIG. 1 shows an example in which the reinforcing member 31 for electronic components is located on the second surface 22 of the base material 20, the position of the reinforcing member 31 for electronic components is arbitrary. For example, the reinforcing member 31 for electronic components may be located on the first surface 21 of the base material 20.

[Alignment mark member and additional alignment mark member]
The alignment mark member X is provided on the base material 20 as shown in FIGS. 1 and 2, for example. In the example of FIG. 1, the alignment mark member X is located in the base material 20. In particular, in the example of FIG. 1, the alignment mark member X is located on the first surface 21 side of the base material 20 so as to be exposed on the first surface 21 of the base material 20.

The alignment mark member X is used for alignment at the time of manufacturing the wiring board 10 and / or at the time of mounting the wiring board 10 with respect to an object to be mounted (not shown). The mounted body is, for example, a living body such as a human body, but may be an object other than a living body such as a human body.

The shape and size of the alignment mark member X do not change when the base material 20 is stretched and contracted. The size of the alignment mark member X is set based on, for example, the elongation rate of the base material 20.

When viewed along the normal direction of the first surface 21 of the base material 20, it at least partially overlaps the region where the alignment mark member X is formed, and has an elastic modulus larger than the first elastic modulus. A marking reinforcing member may be provided. Further, the marking reinforcing member may include, for example, a metal layer. In the examples of FIGS. 1 and 2, the mark reinforcing member is integrated with the alignment mark member X.

Then, for example, when viewed along the normal direction of the first surface 21 of the base material 20 of the wiring 52, the mark reinforcing member, that is, the portion that does not overlap with the alignment mark member X is the base material 20. It has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface 21.

Further, the additional alignment mark member Y is provided on the support substrate 40 as shown in FIGS. 1 and 2. In the example of FIG. 1, the additional alignment mark member Y is located in the support substrate 40. In particular, in the example of FIG. 1, the additional alignment mark member Y is located on the first surface 41 side of the support substrate 40 so as to be exposed on the first surface 41 of the support substrate 40.

When the support substrate 40 is attached to the base material 20, the additional alignment mark member Y is predetermined as a predetermined alignment mark member when viewed along the normal direction of the first surface 21 of the base material 20. It is a member for aligning the base material 20 and the support substrate 40 at a predetermined position by overlapping them in the positional relationship of.

For example, the alignment mark member X and the additional alignment mark member Y are combined to form one alignment mark, which is used for alignment of the wiring board 10 with respect to the mounted body at the time of mounting.

Further, when the wiring board 10 is used for positioning with respect to the mounted body at the time of mounting, when viewed along the normal direction of the first surface 21 of the base material 20, the mounted body, for example, the human body is defined in advance. With the wiring board 10 mounted on the mounted body so that the position, for example, the position of the blood vessel and the position of the alignment mark member X have a predetermined positional relationship, necessary information such as blood pressure is mounted. The position of the alignment mark member X on the wiring board 10 is set so that it can be detected from the body.

Here, the arrangement of the alignment mark member X and the additional alignment mark member Y on the wiring board is not limited to the configuration shown in FIG. 4 to 13 are cross-sectional views showing another example of arrangement of the alignment mark member X and the additional alignment mark member Y of the wiring board.

For example, as shown in FIG. 4, the alignment mark member X may be located on the second surface 22 side of the base material 20 so as to be exposed on the second surface 22 of the base material 20. ..

Further, as shown in FIG. 5, the alignment mark member X is located in the base material 20, and the thickness of the alignment mark member X is increased in the direction from the first surface 21 to the second surface 22 of the base material 20. , It may be made smaller than the thickness of the base material 20.

Further, as shown in FIG. 6, the alignment mark member X is positioned in the base material 20 so as to penetrate between the first surface 21 and the second surface 22 of the base material 20. May be good. In particular, in this case, as shown in FIG. 6, the thickness of the alignment mark member X is the same as the thickness of the base material 20 in the direction from the first surface 21 to the second surface 22 of the base material 20. You may.

Further, as shown in FIG. 7, the alignment mark member X may be located on the first surface 21 of the base material 20.

Further, as shown in FIG. 8, the alignment mark member X may be located on the second surface 22 of the base material 20.

On the other hand, for example, as shown in FIG. 4, the additional alignment mark member Y is located on the first surface 41 side of the support substrate 40 so as to be exposed on the first surface 41 of the support substrate 40. You may.

Further, as shown in FIG. 9, the additional alignment mark member Y may be located on the second surface 42 side of the support substrate 40 so as to be exposed on the second surface 42 of the support substrate 40. Good.

Further, as shown in FIG. 10, the additional alignment mark member Y is located in the support substrate 40, and the thickness of the additional alignment mark member Y in the direction from the first surface 41 to the second surface 42 of the support substrate 40. The thickness may be smaller than the thickness of the support substrate 40.

Further, as shown in FIG. 11, the additional alignment mark member Y is located in the support substrate 40 so as to penetrate between the first surface 41 and the second surface 42 of the support substrate 40. You may. In particular, in this case, as shown in FIG. 11, the thickness of the additional alignment mark member Y in the direction from the first surface 41 to the second surface 42 of the support substrate 40 seems to be the same as the thickness of the support substrate 40. It may be.

Further, as shown in FIG. 12, the additional alignment mark member Y may be located on the first surface 41 of the support substrate 40.

Further, as shown in FIG. 13, the additional alignment mark member Y may be located on the second surface 42 of the support substrate 40.

In the example of each figure, one alignment mark member X is composed of one pattern, but the present invention is not limited to this, and the alignment mark member X is configured to be composed of a plurality of patterns. May be good.

In the example of FIG. 2, the shapes of the alignment mark member X and the additional alignment mark member Y are square when viewed along the normal direction of the first surface 21 of the base material 20 of the wiring 52. However, when viewed along the normal direction of the first surface 21 of the base material 20 of the wiring 52, the alignment mark member X and the additional alignment mark member Y are, for example, polygonal, cross-shaped, or circular. May have. Further, if the alignment mark member X has a readable shape, it may have numbers, letters, or the like.

[Wiring structure]
Subsequently, the cross-sectional structure of the wiring 52 will be described in detail with reference to FIG. FIG. 14 is an enlarged cross-sectional view showing an example of the wiring 52 of the wiring board 1010 shown in FIG. 1 and its peripheral components.

As shown in FIGS. 1 to 3, the entire wiring 52 or most of the wiring 52 is arranged so as not to overlap with the reinforcing member 31 for electronic components. Therefore, when the base material 20 is deformed such as shrinkage, the wiring 52 is easily deformed with the deformation of the base material 20. For example, when the wiring 52 is provided on the stretched base material 20 and then the base material 20 is relaxed, as shown in FIG. 14, a portion of the wiring 52 that does not overlap with the reinforcing member 31 for electronic components is formed. A bellows-shaped portion 57 is formed.

The bellows-shaped portion 57 includes peaks and valleys in the normal direction of the first surface 21 of the base material 20. In FIG. 14, reference numeral 53 represents a mountain portion appearing on the front surface of the wiring 52, and reference numeral 54 represents a mountain portion appearing on the back surface of the wiring 52. Further, reference numeral 55 represents a valley portion appearing on the front surface of the wiring 52, and reference numeral 56 represents a valley portion appearing on the back surface of the wiring 52. The front surface is a surface of the wiring 52 located on the side farther from the base material 20, and the back surface is a surface of the wiring 52 located on the side closer to the base material 20. Further, in FIG. 14, reference numerals 26 and 27 represent peaks and valleys appearing on the first surface 21 of the base material 20. When the base material 20 is deformed so that the mountain portion 26 and the valley portion 27 appear on the first surface 21, the wiring 52 is deformed in a bellows shape to have the bellows-shaped portion 57. The peak 26 of the first surface 21 of the base material 20 corresponds to the peaks 53 and 54 of the bellows shape portion 57 of the wiring 52, and the valley portion 27 of the first surface 21 of the base material 20 corresponds to the bellows shape of the wiring 52. It corresponds to the valley portions 55 and 56 of the portion 57.

The peaks 53 and 54 and the valleys 55 and 56 repeatedly appear along the in-plane direction of the first surface 21 of the base material 20. The period F in which the peaks 53 and 54 and the valleys 55 and 56 appear repeatedly is, for example, 10 μm or more and 100 mm or less. Note that FIG. 14 shows an example in which a plurality of peaks and valleys of the bellows-shaped portion 57 are arranged at regular intervals, but the present invention is not limited to this. Although not shown, the plurality of peaks and valleys of the bellows-shaped portion 57 may be arranged irregularly along the in-plane direction of the first surface 21. For example, the distance between two adjacent peaks in the in-plane direction of the first surface 21 may not be constant.

In FIG. 14, reference numeral S1 represents the amplitude of the bellows-shaped portion 57 on the surface of the wiring 52. The amplitude S1 is, for example, 1 μm or more, more preferably 10 μm or more. By setting the amplitude S1 to 10 μm or more, the wiring 52 is easily deformed following the elongation of the base material 20. Further, the amplitude S1 may be, for example, 500 μm or less.

The amplitude S1 measures, for example, the distance in the normal direction of the first surface 21 between the adjacent peaks 53 and the valleys 55 over a certain range in the length direction of the wiring 52, and averages them. It is calculated by finding it. The "constant range in the length direction of the wiring 52" is, for example, 10 mm. As the measuring instrument for measuring the distance between the adjacent peaks 53 and the valleys 55, a non-contact measuring instrument using a laser microscope or the like may be used, or a contact measuring instrument may be used. .. Further, the distance between the adjacent mountain portion 53 and the valley portion 55 may be measured based on an image such as a cross-sectional photograph. The calculation method of the amplitudes S2, S3, and S4 described later is also the same.

In FIG. 14, reference numeral S2 represents the amplitude of the bellows-shaped portion 57 on the back surface of the wiring 52. The amplitude S2 is, for example, 1 μm or more, more preferably 10 μm or more, like the amplitude S1. Further, the amplitude S2 may be, for example, 500 μm or less.

As shown in FIG. 14, a bellows-shaped portion similar to the wiring 52 may be formed on the support substrate 40, the adhesive layer 60, and the first surface 21 of the base material 20. In FIG. 14, reference numeral S3 represents the amplitude of the bellows-shaped portion on the first surface 21 of the base material 20. The bellows-shaped portion on the first surface 21 includes a plurality of peaks 26 and valleys 27. The amplitude S3 is, for example, 1 μm or more, more preferably 10 μm or more. Further, the amplitude S3 may be, for example, 500 μm or less.

FIG. 15 is an enlarged cross-sectional view showing another example of the wiring 52 of the wiring board 10 shown in FIG. 1 and its peripheral components. As shown in FIG. 15, the bellows-shaped portion may not be formed on the first surface 21 of the base material 20.

FIG. 16 is an enlarged cross-sectional view showing another example of the wiring 52 of the wiring board 10 shown in FIG. 1 and its peripheral components. As shown in FIG. 16, a bellows-shaped portion may be formed not only on the first surface 21 of the base material 20 but also on the second surface 22. The bellows-shaped portion on the second surface 22 includes a plurality of peaks 28 and valleys 29. In the example shown in FIG. 16, the mountain portion 28 of the second surface 22 appears at a position overlapping the valley portion 27 of the first surface 21, and the valley portion 29 of the second surface 22 is formed on the mountain portion 26 of the first surface 21. Appears in overlapping positions. Although not shown, the positions of the peaks 28 and the valleys 29 of the second surface 22 of the base material 20 do not have to overlap the valleys 27 and 26 of the first surface 21. Further, the number or period of the peaks 28 and 29 of the second surface 22 of the base material 20 may be the same as or different from the number or period of the peaks 26 and 27 of the first surface 21. You may. For example, the period of the peak 28 and the valley 29 of the second surface 22 of the base material 20 may be larger than the period of the peak 26 and the valley 27 of the first surface 21. In this case, the period of the peaks 28 and the valleys 29 of the second surface 22 of the base material 20 may be 1.1 times or more the period of the peaks 26 and the valleys 27 of the first surface 21. . It may be 2 times or more, 1.5 times or more, or 2.0 times or more. It should be noted that "the period of the peaks 28 and the valleys 29 of the second surface 22 of the base material 20 is larger than the period of the peaks 26 and the valleys 27 of the first surface 21" is the second of the base material 20. This is a concept including the case where the peaks and valleys do not appear on the surface 22.

In FIG. 16, reference numeral S4 represents the amplitude of the peak 28 and the valley 29 appearing on the second surface 22 of the base material 20. The amplitude S4 of the second surface 22 may be the same as or different from the amplitude S3 of the first surface 21. For example, the amplitude S4 of the second surface 22 may be smaller than the amplitude S3 of the first surface 21. For example, the amplitude S4 of the second surface 22 may be 0.9 times or less, 0.8 times or less, or 0.6 times or less the amplitude S3 of the first surface 21. Good. Further, the amplitude S4 of the second surface 22 may be 0.1 times or more, or 0.2 times or more, the amplitude S3 of the first surface 21. When the thickness of the base material 20 is small, the ratio of the amplitude S4 of the second surface 22 to the amplitude S3 of the first surface 21 tends to be large. It should be noted that "the amplitude of the peaks 28 and the valleys 29 of the second surface 22 of the base material 20 is smaller than the amplitudes of the peaks 26 and the valleys 27 of the first surface 21" is the second of the base material 20. This is a concept including the case where the peaks and valleys do not appear on the surface 22.

Further, in FIG. 16, an example is shown in which the positions of the peaks 28 and 29 of the second surface 22 coincide with the positions of the valleys 27 and 26 of the first surface 21, but this is limited to this. There is no such thing. As shown in FIG. 17, the positions of the peaks 28 and 29 of the second surface 22 may be deviated by J from the positions of the valleys 27 and 26 of the first surface 21. The deviation amount J is, for example, 0.1 × F or more, and may be 0.2 × F or more.

The advantage that the bellows-shaped portion 57 shown in FIGS. 14 and 15, 16 and 17 is formed in the wiring 52 will be described. As described above, the base material 20 has an elastic modulus of 10 MPa or less. Therefore, when tensile stress is applied to the wiring board 10, the base material 20 can be stretched by elastic deformation. Here, if the wiring 52 is similarly stretched by elastic deformation, the total length of the wiring 52 increases and the cross-sectional area of the wiring 52 decreases, so that the resistance value of the wiring 52 increases. Further, it is also conceivable that the wiring 52 may be damaged such as cracks due to the elastic deformation of the wiring 52.

On the other hand, in the present embodiment, the wiring 52 has a bellows-shaped portion 57. Therefore, when the base material 20 is stretched, the wiring 52 can follow the stretch of the base material 20 by deforming the bellows-shaped portion 57 so as to reduce the undulations, that is, by eliminating the bellows shape. it can. Therefore, it is possible to prevent the total length of the wiring 52 from increasing and the cross-sectional area of the wiring 52 from decreasing as the base material 20 stretches. As a result, it is possible to suppress an increase in the resistance value of the wiring 52 due to the extension of the wiring board 10. Further, it is possible to prevent the wiring 52 from being damaged such as a crack.

(Manufacturing method of wiring board)
Hereinafter, a method for manufacturing the elastic wiring board 10 will be described with reference to FIGS. 18A to 18D.

First, a base material preparation step for preparing the base material 20 is carried out. In the present embodiment, as shown in FIG. 18A, in the base material preparation step, the reinforcing member 31 for electronic components is provided on the second surface 22 of the base material 20 provided with the alignment mark member X. For example, first, a metal layer is formed over the entire second surface 22 of the base material 20, and then the metal layer is partially removed by etching or the like. As a result, the reinforcing member 31 for electronic components including the metal layer can be formed. As described above, the shape and size of the alignment mark member X do not change when the base material 20 is stretched and contracted.

In addition, a support substrate preparation step for preparing the support substrate 40 is carried out. In the present embodiment, in the support substrate preparation step, as shown in FIG. 18B, the electronic component 51 and the wiring 52 are provided on the first surface 41 of the support substrate 40 provided with the additional alignment mark member Y. As a method of providing the wiring 52, for example, a method of printing a conductive paste containing a base material and conductive particles on the first surface 41 of the support substrate 40 can be adopted.
As described above, when the support substrate 40 is attached to the base material 20, the support substrate 40 is aligned with the alignment mark member X when viewed along the normal direction of the first surface 21 of the base material 20. An additional alignment mark member Y for aligning the base material 20 and the support substrate 40 at a predetermined position is provided by overlapping the base material 20 and the support substrate 40 in a predetermined positional relationship.

Subsequently, the first step of applying tensile stress T to the base material 20 to extend the base material 20 is carried out. The elongation rate of the base material 20 is, for example, 10% or more and 200% or less. The first step may be carried out in a state where the base material 20 is heated, or may be carried out at room temperature. When the base material 20 is heated, the temperature of the base material 20 is, for example, 50 ° C. or higher and 100 ° C. or lower.

Subsequently, a second step of providing the electronic component 51 and the wiring 52 on the first surface 21 side of the base material 20 stretched by the tensile stress T is carried out. In the second step of the present embodiment, as shown in FIG. 18C, the alignment mark member X and the reinforcing member 31 for electronic parts are added to the first surface 21 of the base material 20 in an extended state. When the support substrate 40 provided with the alignment mark member Y and the wiring 52 is viewed along the normal direction of the first surface 21 of the base material 20, the alignment mark member X and the additional alignment mark member Y are defined in advance. The support substrates 40 are joined from the second surface 42 side so as to overlap each other in a predetermined positional relationship. At this time, the adhesive layer 60 may be provided between the base material 20 and the support substrate 40.

Here, as described above, the shape and size of the alignment mark member X do not change when the base material 20 is stretched and contracted. As a result, in this second step, even if the base material 20 is stretched, the shape and size of the alignment mark member X do not change, so that the alignment mark member X and the additional alignment mark member Y are predetermined. It is possible to improve the alignment accuracy by overlapping them in a positional relationship so that they can be accurately joined from the second surface 42 side of the support substrate 40.

Then, a third step of removing the tensile stress T from the base material 20 is carried out. As a result, as shown by the arrow C in FIG. 18D, the base material 20 contracts, and the support substrate 40 and the wiring 52 joined to the base material 20 are also deformed. The third elastic modulus of the support substrate 40 is larger than the first elastic modulus of the base material 20. Therefore, the support substrate 40 and the wiring 52 can be deformed as the bellows-shaped portion is generated.

Further, in the present embodiment, the reinforcing member 31 for electronic components is arranged on the first surface 21 of the base material 20 so as to overlap with the electronic components 51. Therefore, it is possible to prevent the portion of the base material 20 that overlaps with the electronic component 51 from stretching in the first step. Therefore, it is possible to prevent the portion of the base material 20 that overlaps with the electronic component 51 from shrinking in the third step. As a result, it is possible to suppress the stress caused by the deformation of the base material 20 from being applied to the electronic component 51, and it is possible to prevent the electronic component 51 from being deformed or damaged. Further, it is possible to prevent the electrical joint between the electronic component 51 and the wiring 52 from being damaged. As described above, according to the present embodiment, by controlling the deformation of the base material 20 according to the position, it is possible to improve the ease of mounting the electronic component 51 and the reliability of the electronic component 51 and the wiring 52. it can.

When the base material 20 is stretched, the reinforcing member 31 for electronic components may be deformed such as warped. Even if the reinforcing member 31 for electronic components is deformed, the amount of deformation of the reinforcing member 31 for electronic components is smaller than the amount of deformation that occurs in the portion of the base material 20 that does not overlap with the reinforcing member 31 for electronic components. Therefore, it is possible to prevent the electronic component 51 from being deformed or damaged. Further, it is possible to prevent the electrical joint between the electronic component 51 and the wiring 52 from being damaged.

An example of the effect on the resistance value of the wiring 52 obtained by the bellows-shaped portion 57 of the wiring 52 will be described. Here, the resistance value of the wiring 52 in the first state in which the tensile stress along the in-plane direction of the first surface 21 of the base material 20 is not applied to the base material 20 is referred to as a first resistance value. Further, the resistance value of the wiring 52 in the second state in which tensile stress is applied to the base material 20 to extend the base material 20 by 30% in the in-plane direction of the first surface 21 as compared with the first state is set to the second resistance value. It is called. According to the present embodiment, by forming the bellows-shaped portion 57 on the wiring 52, the ratio of the absolute value of the difference between the first resistance value and the second resistance value to the first resistance value is set to 20% or less. It can be more preferably 10% or less, and even more preferably 5% or less.

Applications of the wiring board 10 include healthcare field, medical field, nursing care field, electronics field, sports / fitness field, beauty field, mobility field, livestock / pet field, amusement field, fashion / apparel field, security field, and military field. , Distribution field, education field, building materials / furniture / decoration field, environmental energy field, agriculture, forestry and fisheries field, robot field, etc. For example, a product to be attached to a part of the body such as a human arm is configured by using the wiring board 10 according to the present embodiment. Since the wiring board 10 can be stretched, for example, by attaching the wiring board 10 to the body in an stretched state, the wiring board 10 can be brought into close contact with a part of the body. Therefore, a good wearing feeling can be realized. Further, since it is possible to suppress a decrease in the resistance value of the wiring 52 when the wiring board 10 is stretched, it is possible to realize good electrical characteristics of the wiring board 10. In addition, since the wiring board 10 can be extended, it can be installed or incorporated along a curved surface or a three-dimensional shape, not limited to a living body such as a human being. Examples of these products include vital sensors, masks, hearing aids, toothbrushes, adhesive plasters, wetclothes, contact lenses, artificial hands, artificial legs, artificial eyes, catheters, gauze, chemical packs, bandages, disposable bioelectrodes, diapers, home appliances, sportswear. , Wristbands, earmuffs, gloves, swimwear, supporters, balls, rackets, chemical penetration beauty masks, electrical stimulation diet supplies, pocket furnaces, automobile interiors, seats, instrument panels, strollers, drones, wheelchairs, tires, collars, leads, haptics devices , Luncheon mats, hats, clothes, glasses, shoes, insoles, socks, stockings, innerwear, mufflers, earmuffs, bags, accessories, rings, claws, watches, personal ID recognition devices, helmets, packages, IC tags, pets Examples include bottles, stationery, books, carpets, sofas, bedding, lighting, doorknobs, vases, beds, mattresses, cushions, wireless power antennas, batteries, vinyl houses, robot hands, and robot exteriors.

It is possible to make various changes to the above-described embodiment. Hereinafter, a modified example will be described with reference to the drawings as necessary. In the following description and the drawings used in the following description, the same reference numerals as those used for the corresponding portions in the above-described embodiment will be used for the portions that can be configured in the same manner as in the above-described embodiment. Duplicate description is omitted. Further, when it is clear that the action and effect obtained in the above-described embodiment can be obtained in the modified example, the description thereof may be omitted.

(First modification)
In the above-described embodiment, an example is shown in which the reinforcing member 31 for electronic components is located on the second surface 22 side of the base material 20, but the present invention is not limited to this, and the reinforcing member 31 for electronic components is the base material. It may be provided on the first surface 21 side of 20. For example, as shown in FIG. 19, the reinforcing member 31 for electronic components may be located between the first surface 21 of the base material 20 and the electronic component 51. In the example shown in FIG. 19, the reinforcing member 31 for electronic components is located on the second surface 42 of the support substrate 40.

FIG. 20 is an enlarged cross-sectional view showing an example of the wiring 52 of the wiring board 10 shown in FIG. 19 and its peripheral components. Also in this modified example, the bellows-shaped portion 57 is formed in the portion of the wiring 52 that does not overlap with the reinforcing member 31 for electronic components, as in the case of the above-described embodiment. Therefore, it is possible to prevent the total length of the wiring 52 from increasing and the cross-sectional area of the wiring 52 from decreasing due to the deformation of the base material 20.

21 (a) to 21 (d) are diagrams for explaining a method of manufacturing the elastic wiring board 10 shown in FIG.

First, as shown in FIG. 21A, a base material preparation step for preparing the base material 20 provided with the alignment mark member X is carried out. Subsequently, as shown in FIG. 21B, a support substrate preparation step for preparing the support substrate 40 provided with the additional alignment mark member Y is performed. In this modification, as shown in FIG. 21B, in the support substrate preparation step, the electronic component 51 and the wiring 52 are provided on the first surface 41 of the support substrate 40 provided with the additional alignment mark member Y. Further, a reinforcing member 31 for electronic components is provided on the second surface 42 of the support substrate 40. The order in which the reinforcing member 31 for electronic components, the electronic components 51, and the wiring 52 are provided on the support substrate 40 is arbitrary.

Subsequently, the first step of applying tensile stress T to the base material 20 to extend the base material 20 is carried out. Subsequently, a second step of providing the electronic component 51 and the wiring 52 on the first surface 21 side of the base material 20 stretched by the tensile stress T is carried out. In this modification, in the second step, as shown in FIG. 21C, the first surface 21 of the stretched base material 20 has a reinforcing member 31 for electronic components, an electronic component 51, wiring 52, and electrons. When the support substrate 40 provided with the component reinforcing member 31 is viewed along the normal direction of the first surface 21 of the base material 20, the alignment mark member X and the additional alignment mark member Y are defined in advance. The support substrates 40 are joined from the second surface 42 side so as to overlap in a predetermined positional relationship.

Then, a third step of removing the tensile stress T from the base material 20 is carried out. As a result, as shown by the arrow C in FIG. 21D, the base material 20 contracts, and the support substrate 40 and the wiring 52 joined to the base material 20 are also deformed. The third elastic modulus of the support substrate 40 is larger than the first elastic modulus of the base material 20. Therefore, the support substrate 40 and the wiring 52 can be deformed as the bellows-shaped portion is generated.

Further, in this modification, the reinforcing member 31 for electronic components is arranged on the second surface 42 of the support substrate 40 so as to overlap with the electronic components 51. Therefore, it is possible to prevent the electronic component 51 from being affected by the shrinkage of the base material 20 in the third step. As a result, it is possible to prevent the electronic component 51 from being deformed or damaged.

(Second modification)
In the above-described embodiment and modification, an example in which the additional alignment mark member Y is provided on the support substrate 40 of the wiring board is shown, but the present invention is not limited to this.
Here, FIG. 24 is a plan view showing a wiring board according to the first modification. 25 to 30 are cross-sectional views showing an example of a cross section of the wiring board shown in FIG. 24. As shown in FIGS. 24 to 30, the additional alignment mark member Y may not be provided on the support substrate 40 of the wiring board. In this case, the alignment mark member X is used, for example, for aligning the wiring board 10 with respect to a mounted body (not shown) at the time of mounting. Further, the alignment mark member X may be used, for example, for alignment at the time of manufacturing the wiring board 10 such as forming electrodes and wiring on the base material 20 and mounting electronic components.

For example, as shown in FIG. 25, while omitting the additional alignment mark member Y, the alignment mark member X is exposed on the second surface 22 of the base material 20 so as to be exposed on the second surface 22 side of the base material 20. It may be located in.

Further, as shown in FIG. 26, the alignment mark member X may be located in the base material 20 while omitting the additional alignment mark member Y.

Further, as shown in FIG. 27, while omitting the additional alignment mark member Y, the alignment mark member X penetrates between the first surface 21 and the second surface 22 of the base material 20 so as to penetrate the base material 20. It may be located inside. In particular, in this case, as shown in FIG. 27, the thickness of the alignment mark member X is the same as the thickness of the base material 20 in the direction from the first surface 21 to the second surface 22 of the base material 20. You may.

Further, as shown in FIG. 28, the alignment mark member X may be located on the first surface 21 of the base material 20 while omitting the additional alignment mark member Y.

Further, as shown in FIG. 29, the alignment mark member X may be located on the second surface 22 of the base material 20 while omitting the additional alignment mark member Y.

Further, as shown in FIG. 30, while omitting the additional alignment mark member Y, the alignment mark member X is exposed on the first surface 21 of the base material 20 on the second surface 22 side in the base material 20. It may be located in.

(Third variant)
In the above-described embodiment and modification 1, the electronic component 51 and the wiring 52 are supported by a support substrate 40 having a third elastic modulus higher than the first elastic modulus of the base material 20. However, it is not limited to this. As shown in FIG. 31, the electronic component 51 and the wiring 52 may be provided on the first surface 21 of the base material 20. In this case, at least the alignment mark member X is provided on the base material 20, and the reinforcing member 31 for electronic components is located on the second surface 22 side of the base material 20. In the example of FIG. 31, since the support substrate is omitted, the additional alignment mark member Y is also omitted. In this case, the alignment mark member X is used, for example, for aligning the wiring board 10 with respect to a mounted body (not shown) at the time of mounting. Further, the alignment mark member X may be used, for example, for alignment at the time of manufacturing the wiring board 10 such as forming electrodes and wiring on the base material 20 and mounting electronic components.

FIG. 32 is an enlarged cross-sectional view showing an example of the wiring 52 of the wiring board 10 shown in FIG. 31 and its peripheral components. Also in this modified example, the bellows-shaped portion 57 is formed in the portion of the wiring 52 that does not overlap with the reinforcing member 31 for electronic components, as in the case of the above-described embodiment. Therefore, it is possible to prevent the total length of the wiring 52 from increasing and the cross-sectional area of the wiring 52 from decreasing due to the deformation of the base material 20.

33 (a) to 33 (d) are diagrams for explaining a method of manufacturing the elastic wiring board 10 shown in FIG. 31.

First, as shown in FIG. 33A, a base material preparation step for preparing the base material 20 is carried out. In this modification, as shown in FIG. 33A, in the base material preparation step, the reinforcing member 31 for electronic components is provided on the second surface 22 of the base material 20 provided with the alignment mark member X.

Subsequently, as shown in FIG. 33B, the first step of applying a tensile stress T to the base material 20 provided with the alignment mark member X to extend the base material 20 is carried out. Subsequently, as shown in FIG. 33 (c), a second step of providing the electronic component 51 and the wiring 52 on the first surface 21 of the base material 20 stretched by the tensile stress T is carried out.

Then, a third step of removing the tensile stress T from the base material 20 is carried out. As a result, as shown by the arrow C in FIG. 33 (d), the base material 20 contracts, and the wiring 52 provided on the base material 20 is also deformed. The reinforcing member 31 for electronic components is arranged so as not to overlap the entire wiring 52 or most of the wiring 52. Therefore, the deformation of the wiring 52 occurs as the formation of the bellows-shaped portion.

Further, in this modification, the reinforcing member 31 for electronic components is arranged on the second surface 22 of the base material 20. Therefore, it is possible to prevent the portion of the base material 20 that is to overlap with the electronic component 51 from stretching in the first step. Therefore, it is possible to prevent the portion of the base material 20 that overlaps with the electronic component 51 from shrinking in the third step. As a result, it is possible to suppress the stress caused by the deformation of the base material 20 from being applied to the electronic component 51, and it is possible to prevent the electronic component 51 from being deformed or damaged.

(Fourth modification)
In the above-described embodiment and each modification, an example is shown in which the electronic component 51 is pre-packaged before being mounted on the wiring board 10. However, the present invention is not limited to this, and the electronic component 51 is configured by sealing some of the components after mounting some of the components of the electronic component 51 on the wiring board 10. There may be.
As shown in FIGS. 34 and 35, a potting resin 50 may be provided to reinforce the packaged electronic component 51. In this case, as shown in FIG. 34, the resin 50 may cover the entire electronic component 51. Alternatively, as shown in FIG. 35, the resin 50 does not have to cover the entire electronic component 51. For example, the resin 50 may be located around the electronic component 51 between the end of the reinforcing member 31 for the electronic component and the end of the electronic component 51 so as to reinforce the periphery of the electronic component 51. In any of the examples of FIGS. 34 and 35, the resin 50 is preferably located inside (on the electronic component 51 side) of the end of the electronic component reinforcing member 31.

(Fifth variant)
In the above-described embodiment and each modification, an example is shown in which the electronic component 51 is a component made of a member different from each component of the wiring board 10. In the following modification, an example will be described in which the electronic component 51 includes a member integrated with at least one component of the plurality of components of the wiring board 10.

FIG. 36 is an enlarged cross-sectional view showing the wiring board 10 according to the modified example. As shown in FIG. 36, the electronic component 51 includes a conductive layer integrated with the conductive layer constituting the wiring 52 of the wiring board 10. In the example shown in FIG. 36, both the conductive layer forming the wiring 52 and the conductive layer forming the electronic component 51 are located on the first surface 41 of the support substrate 40. A bellows-shaped portion 57 appears on the conductive layer constituting the wiring 52. On the other hand, the reinforcing member 31 for electronic components is superposed on the conductive layer constituting the electronic component 51, and therefore, the bellows-shaped portion does not appear in the conductive layer constituting the electronic component 51.

FIG. 37 is a plan view showing an example of the electronic component 51 shown in FIG. 36. In the example shown in FIG. 37, the conductive layer constituting the electronic component 51 has a wider width than the conductive layer constituting the wiring 52. The portion where the width of the conductive layer changes is the outer edge 512 of the electronic component 51. The electronic component 51 shown in FIG. 37 can function as, for example, a pad. A probe for inspection, a terminal for rewriting software, etc. are connected to the pad.

FIG. 38 is a plan view showing another example of the electronic component 51 shown in FIG. 36. In the example shown in FIG. 38, the conductive layer constituting the electronic component 51 has a shape extending in a spiral shape. The portion where the conductive layer begins to extend spirally is the outer edge 512 of the electronic component 51. As shown in FIG. 38, the electronic component 51 including the conductive layer having a predetermined pattern can function as an antenna or a pressure sensor.

(Sixth variant)
FIG. 39 is a plan view showing a modified example of the wiring board 10. In addition to the wiring 52, the wiring board 10 is further provided with cross wiring 59 laminated on the wiring 52 via the insulating layer 45. In this modification, the cross wiring 59 constitutes the electronic component 51. The cross wiring 59 extends so as to intersect the wiring 52 in a plan view. By providing the insulating layer 45 between the wiring 52 and the cross wiring 59, it is possible to prevent the cross wiring 59 from being short-circuited with the wiring 52. As the material constituting the insulating layer 45, an organic resin such as polyimide, acrylic, urethane or epoxy, or an inorganic material such as SiO ₂ or alumina can be used.

As shown in FIG. 39, the reinforcing member 31 for electronic components is provided so as to straddle the conductive layer constituting the wiring 52 and the conductive layer of the cross wiring 59 constituting the electronic component 51. As a result, when stress such as elongation or bending is applied to the wiring board 10, the insulating layer 45 is cracked or the insulating performance is deteriorated, resulting in a short circuit between the wiring 52 and the intersecting wiring 59. Can be prevented.

(Modification example of wiring board)
In the above-described embodiment and each modification, an example is shown in which the wiring board 10 includes an electronic component 51 mounted on the first surface 21 side of the base material 20. However, the present invention is not limited to this, and the wiring board 10 may not include the electronic component 51. For example, the bellows-shaped portion 57 may be formed on the base material 20 in which the electronic component 51 is not mounted. Further, the support substrate 40 in which the electronic component 51 is not mounted may be bonded to the base material 20. Further, the wiring board 10 may be shipped in a state where the electronic component 51 is not mounted.

Although some modifications to the above-described embodiments have been described, it is naturally possible to apply a plurality of modifications in combination as appropriate.

10 Wiring board 20 Base material 21 First surface 22 Second surface 31 Reinforcing member for electronic components 40 Support substrate 41 First surface 42 Second surface 51 Electronic components 52 Wiring 53, 54 Mountains 55, 56 Valley 57 Bellows 60 Adhesive layer X Alignment mark member Y Additional alignment mark member

Claims (42)

A wiring board with elasticity
A base material containing a first surface and a second surface located on the opposite side of the first surface and having a first elastic modulus, and
Wiring that is located on the first surface side of the base material and is connected to the electrodes of electronic components mounted on the wiring board.
It is provided on the base material and includes an alignment mark member used for alignment at the time of manufacturing the wiring board and / or at the time of mounting the wiring board with respect to the mounted body.
A wiring board in which the shape and size of the alignment mark member do not change when the base material is stretched and contracted. The wiring board according to claim 1, wherein the wiring has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base material. A mark having an elastic modulus larger than that of the first elastic modulus, which overlaps at least partially with the region where the alignment mark member is formed when viewed along the normal direction of the first surface of the base material. The wiring board according to claim 1 or 2, further comprising a reinforcing member for use. The wiring board according to claim 3, wherein the mark reinforcing member is integrated with the alignment mark member. The portion of the wiring that does not overlap with the mark reinforcing member when viewed along the normal direction of the first surface is a plurality of mountain portions arranged along the in-plane direction of the first surface of the base material. The wiring board according to claim 3, further comprising a bellows-shaped portion including a valley portion. 1. A support substrate which is located between the wiring and the first surface of the base material, has a third elastic modulus larger than the first elastic modulus, and supports the wiring is further provided. The wiring board according to any one of 5 to 5. When the support substrate is attached to the support substrate and is provided on the support substrate, when viewed along the normal direction of the first surface of the base material, a predetermined alignment mark member and a predetermined shape are defined in advance. The wiring board according to claim 6, further comprising an additional alignment mark member for aligning the base material and the support board at a predetermined position by overlapping them in the positional relationship of the above. The wiring board according to claim 7, wherein the alignment mark member and the additional alignment mark member are combined to form one alignment mark, which is used for alignment of the wiring board with respect to a mounted body at the time of mounting. When used for alignment of the wiring board with respect to the mounted body at the time of mounting, when viewed along the normal direction of the first surface of the base material, the position is defined as a predetermined position of the mounted body. The alignment on the wiring board so that necessary information can be detected from the mounted body in a state where the wiring board is mounted on the mounted body so that the positions of the alignment mark members have a predetermined positional relationship. The wiring board according to any one of claims 1 to 8, wherein the position of the mark member is set. The wiring board according to claim 1, wherein the size of the alignment mark member is set based on the elongation rate of the base material. The wiring board according to claim 1, wherein the alignment mark member is located on the first surface of the base material. The wiring board according to claim 1, wherein the alignment mark member is located on the second surface of the base material. The wiring board according to claim 1, wherein the alignment mark member is located in the base material. The wiring board according to claim 13, wherein the alignment mark member is located on the first surface side of the base material so as to be exposed on the first surface of the base material. The wiring board according to claim 13, wherein the alignment mark member is located on the second surface side of the base material so as to be exposed on the second surface of the base material. The wiring board according to claim 13, wherein the alignment mark member is located in the base material so as to penetrate between the first surface and the second surface of the base material. The wiring board according to claim 16, wherein the thickness of the alignment mark member is the same as the thickness of the base material in the direction from the first surface to the second surface of the base material. The wiring board according to claim 13, wherein the thickness of the alignment mark member is smaller than the thickness of the base material in the direction from the first surface to the second surface of the base material. It is located on the first surface side of the base material or on the second surface side of the base material, and is mounted on the wiring board when viewed along the normal direction of the first surface of the base material. The wiring board according to claim 2, further comprising a reinforcing member for an electronic component that overlaps the electronic component at least partially and has a second elastic modulus larger than the first elastic modulus. The portion of the wiring that does not overlap with the reinforcing member for electronic components when viewed along the normal direction of the first surface is a plurality of piles arranged along the in-plane direction of the first surface of the base material. The wiring board according to claim 19, which has a bellows-shaped portion including a portion and a valley portion. The wiring board according to any one of claims 2, 19 or 20, wherein the amplitude of the bellows-shaped portion of the wiring is 1 μm or more. The wiring board according to claim 7, wherein the additional alignment mark member is located on the first surface of the support board. The wiring board according to claim 7, wherein the additional alignment mark member is located on the second surface of the support board. The wiring board according to claim 7, wherein the additional alignment mark member is located in the support board. The wiring board according to claim 24, wherein the additional alignment mark member is located on the first surface side of the support substrate so as to be exposed on the first surface of the support substrate. The wiring board according to claim 24, wherein the additional alignment mark member is located on the second surface side of the support substrate so as to be exposed on the second surface of the support substrate. The wiring board according to claim 24, wherein the additional alignment mark member is located in the base material so as to penetrate between the first surface and the second surface of the support substrate. The wiring board according to claim 27, wherein the thickness of the additional alignment mark member is the same as the thickness of the support board in the direction from the first surface to the second surface of the support board. The wiring board according to claim 26, wherein the thickness of the additional alignment mark member is smaller than the thickness of the support board in the direction from the first surface to the second surface of the support board. The wiring board according to any one of claims 1 to 29, wherein the base material contains silicone rubber. The wiring board according to claim 1, wherein the marking reinforcing member includes a metal layer. The wiring board according to claim 19, wherein the reinforcing member for electronic components includes a metal layer. The wiring board according to any one of claims 1 to 32, wherein the wiring includes a plurality of conductive particles. The wiring board according to any one of claims 1 to 33, further comprising an electronic component having an electrode electrically connected to the wiring, which is located on the first surface side of the base material. The resistance value of the wiring in the first state in which the tensile stress along the in-plane direction of the first surface of the base material is not applied to the base material is referred to as the first resistance value, and the tensile stress is applied to the base material. When the resistance value of the wiring in the second state in which the base material is extended by 30% in the in-plane direction of the first surface as compared with the first state is referred to as the second resistance value, the resistance value is relative to the first resistance value. The wiring substrate according to any one of claims 1 to 34, wherein the ratio of the absolute value of the difference between the first resistance value and the second resistance value is 20% or less. The wiring board according to any one of claims 1 to 35, wherein the alignment mark member is composed of a plurality of patterns. When viewed along the normal direction of the first surface of the wiring, the alignment mark member and the additional alignment mark member have a polygonal shape, a cross shape, a circular shape, a character shape, or a numerical shape. , The wiring board according to claim 7. A method for manufacturing a wiring board with elasticity.
A first step of extending a base material by applying tensile stress to a base material having a first surface and a second surface located on the opposite side of the first surface and having a first elastic modulus.
A second step of providing wiring connected to an electrode of an electronic component mounted on the wiring board on the first surface side of the stretched base material.
A third step of removing the tensile stress from the substrate is provided.
The wiring board
An alignment mark member provided on the base material and used for alignment at the time of manufacturing the wiring board and / or at the time of mounting the wiring board with respect to the mounted body is provided.
A method for manufacturing a wiring board, wherein the shape and size of the alignment mark member do not change when the base material is stretched and contracted. The method for manufacturing a wiring board according to claim 38, wherein the wiring has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base material. A support substrate including a first surface and a second surface located on the opposite side of the first surface and having a third elastic modulus larger than the first elastic modulus is prepared, and the first surface of the support substrate is prepared. Further provided with a support board preparation step for providing the wiring in the
The wiring board
When the support substrate is attached to the support substrate and is provided on the support substrate, when viewed along the normal direction of the first surface of the base material, a predetermined alignment mark member and a predetermined shape are defined in advance. An additional alignment mark member for aligning the base material and the support substrate at a predetermined position is provided so as to overlap with each other in the positional relationship of.
In the second step, when the support substrate provided with the wiring on the first surface of the stretched base material is viewed along the normal direction of the first surface of the base material. 39. The wiring board according to claim 39, wherein the alignment mark member and the additional alignment mark member are joined from the second surface side of the support substrate so as to overlap each other in a predetermined positional relationship defined in advance. Manufacturing method. A base material preparation step of providing the reinforcing member for the electronic component on the second surface of the base material is further provided.
In the second step, the support substrate provided with the wiring on the first surface of the stretched base material provided with the reinforcing member for electronic components is attached to the first surface of the base material. When viewed along the normal direction of the surface, the alignment mark member and the additional alignment mark member are overlapped with each other in a predetermined positional relationship defined in advance from the second surface side of the support substrate. The method for manufacturing a wiring board according to claim 40, which is to be joined. In the support substrate preparation step, the reinforcing member for electronic components is provided on the second surface of the support substrate.
In the second step, the support substrate provided with the wiring and the reinforcing member for electronic components is provided on the first surface of the stretched base material, and the normal of the first surface of the base material. A claim that the alignment mark member and the additional alignment mark member are joined from the second surface side of the support substrate so as to overlap each other in a predetermined positional relationship when viewed along a direction. Item 40. The method for manufacturing a wiring board according to item 40.