JP7272074B2 - Wiring board and method for manufacturing wiring board - Google Patents

Description

An embodiment of the present disclosure relates to a wiring board including a base material and electronic components and wiring located on the first surface side of the base material. Further, embodiments of the present disclosure relate to a method for manufacturing a wiring board.

In recent years, research has been conducted on electronic devices having deformability such as stretchability. For example, Patent Literature 1 discloses a flexible wiring board that includes a base material and wiring provided on the base material. Patent Document 1 employs a manufacturing method in which a circuit is formed on a pre-stretched base material, and the base material is relaxed after the circuit is formed. Patent Document 1 intends to operate thin film transistors on a substrate well in both the stretched state and the relaxed state of the substrate.

Japanese Patent Application Laid-Open No. 2007-281406

A wiring board includes not only a portion that is resistant to deformation such as expansion and contraction, but also a portion that is easily damaged due to deformation. For this reason, if a circuit is provided on the pre-stretched base material, the wiring board is likely to be damaged.

In addition, since such a wiring board is provided with a fixing portion so as not to sink when the terminal is crimped, the portion provided with this fixing portion is hard and can be used as a living body such as a human body. When attached to a mounting body, the wiring board may not be able to sufficiently follow the deformation of the mounting body.

An object of the embodiments of the present disclosure is to provide a wiring board and a wiring board manufacturing method that can effectively solve such problems.

One embodiment of the present disclosure is a wiring board, comprising: a substrate having a first elastic modulus; a plurality of wires located on the first surface side and connected to electrodes of a plurality of electronic components mounted on a wiring substrate; and a plurality of reinforcing members provided corresponding to each of the plurality of electronic components. and at least partially overlap with each of the plurality of electronic components mounted on the wiring board when viewed along the normal direction of the first surface of the base material, and the first elastic and a plurality of reinforcing members having a second elastic modulus larger than the modulus, wherein the plurality of wirings each include a plurality of peaks and valleys aligned along the in-plane direction of the first surface of the base material. and the plurality of reinforcing members are arranged so that adjacent reinforcing members are spaced apart from each other when viewed along the normal direction of the first surface of the base material. , is a wiring substrate.

The wiring board according to an embodiment of the present disclosure may include a connecting portion that connects two adjacent reinforcing members and has a thickness smaller than that of the reinforcing member.

In the wiring board according to one embodiment of the present disclosure, the connecting portion may be made of the same material as the reinforcing member.

In the wiring board according to an embodiment of the present disclosure, the plurality of reinforcing members and the electronic component are such that when viewed along the normal direction of the first surface of the base material, the end portion of the wiring board extends. They may be arranged side by side in one or more rows along the existing direction.

In the wiring board according to an embodiment of the present disclosure, the plurality of reinforcing members and the electronic component are such that when viewed along the normal direction of the first surface of the base material, the end portion of the wiring board extends. They may be arranged in a zigzag pattern along the existing direction.

One embodiment of the present disclosure is a wiring board, comprising: a substrate having a first elastic modulus; a plurality of wires located on the first surface side and connected to electrodes of a plurality of electronic components mounted on a wiring substrate; and a plurality of reinforcing members provided corresponding to each of the plurality of electronic components. and at least partially overlap with each of the plurality of electronic components mounted on the wiring board when viewed along the normal direction of the first surface of the base material, and the first elastic and a plurality of reinforcing members having a second elastic modulus larger than the modulus, wherein the plurality of wirings each include a plurality of peaks and valleys aligned along the in-plane direction of the first surface of the base material. The wiring board has a bellows-shaped portion including a portion, and the wiring board has the first portion of the base material between two adjacent reinforcing members when viewed along the normal direction of the first surface of the base material. It is a wiring board in which a notch communicating with one surface side is formed.

In the wiring board according to one embodiment of the present disclosure, the base material has the base material between two adjacent reinforcing members when viewed along the normal direction of the first surface of the base material. A notch communicating with the first surface or the second surface may be formed.

In the wiring board according to one embodiment of the present disclosure, the plurality of reinforcing members are arranged such that adjacent reinforcing members are spaced apart from each other when viewed along the normal direction of the first surface of the base material, Or you may make it arrange|position so that it may contact.

In the wiring board according to the embodiment of the present disclosure, the cut may be formed in the wiring board in a dotted line shape when viewed along the normal direction of the first surface of the base material. good.

One embodiment of the present disclosure is a wiring board, comprising: a substrate having a first elastic modulus; a plurality of wirings located on the first surface side and connected to electrodes of a plurality of electronic components mounted on a wiring board; a common reinforcing member that at least partially overlaps with each of the plurality of electronic components mounted on the wiring board and has a second elastic modulus larger than the first elastic modulus; Each of the plurality of wirings has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base material, and the wiring substrate is provided on the surface of the reinforcing member. It is a wiring board in which a notch reaching to is formed.

In the wiring board according to an embodiment of the present disclosure, the auxiliary member may be partially formed with an auxiliary member notch that communicates with the notch.

In the wiring board according to one embodiment of the present disclosure, one end of the cut of the wiring board extends to an end of the wiring board when viewed along the normal direction of the first surface of the base material. You can make it look like

In the wiring board according to an embodiment of the present disclosure, when viewed along the normal direction of the first surface of the base material, the shape of the other end of the cut of the wiring board includes a rectangle or a circle. good too.

In the wiring board according to an embodiment of the present disclosure, when viewed along the normal direction of the first surface of the base material, the shape of both ends of the cut of the wiring board may include a rectangle or a circle. good.

In the wiring board according to one embodiment of the present disclosure, the cut of the wiring board may extend from the first surface side of the base material into the base material.

In the wiring board according to one embodiment of the present disclosure, the cut of the wiring board may extend from the second surface side of the base material into the base material.

In the wiring board according to one embodiment of the present disclosure, the cut of the wiring board extends from the first surface side of the base material to the second surface side of the base material so as to penetrate the base material. You can make it look like

In the wiring board according to one embodiment of the present disclosure, the cut of the wiring board may extend so as to penetrate between the two adjacent reinforcing members.

In the wiring board according to one embodiment of the present disclosure, the cut of the wiring board may extend from the first surface side of the base material to the inside of the reinforcing member.

In the wiring board according to one embodiment of the present disclosure, the cut of the wiring board may extend from the second surface side of the base material to the inside of the reinforcing member.

In the wiring board according to one embodiment of the present disclosure, the cut of the wiring board extends from the first surface side of the base material to the second surface side of the base material so as to penetrate the reinforcing member. You can make it look like

In the wiring board according to one embodiment of the present disclosure, the notch of the wiring board may be formed in the wiring board using a laser, die cutting, or a blade.

In the wiring board according to one embodiment of the present disclosure, the plurality of reinforcing members are portions overlapping the bellows-shaped portion of the wiring when viewed along the normal direction of the first surface of the base material, , the wiring board may be arranged in a region that is locally pushed in when the wiring board is mounted on a mounted body.

In the wiring board according to one embodiment of the present disclosure, the plurality of reinforcing members may have the same rectangular shape when viewed along the normal direction of the first surface of the base material.

In the wiring board according to one embodiment of the present disclosure, the wiring is located between the wiring and the first surface of the base material, has a third elastic modulus larger than the first elastic modulus, and You may make it further provide the support substrate which supports.

In the wiring board according to one embodiment of the present disclosure, the wiring is located between the wiring and the first surface of the base material, has a third elastic modulus larger than the first elastic modulus, and A support substrate may be further provided for supporting, and the cut of the wiring substrate may be continuously formed in the support substrate constituting the wiring substrate.

In the wiring board according to one embodiment of the present disclosure, the notch in the wiring board has a linear cross section perpendicular to the first surface of the base material when viewed from the end H side of the wiring board. may be

In the wiring board according to one embodiment of the present disclosure, the cut in the wiring board has an inverted triangular cross section perpendicular to the first surface of the base material when viewed from the end side of the wiring board. You may make it have the shape of a shape.

In the wiring board according to one embodiment of the present disclosure, the notch of the wiring board has a fan-shaped groove-like cross section perpendicular to the first surface of the base material when viewed from the end side of the wiring board. may be in the shape of

In the wiring board according to one embodiment of the present disclosure, the notch of the wiring board has a concave groove-like cross section perpendicular to the first surface of the base material when viewed from the end side of the wiring board. You may make it have a shape.

In the wiring board according to one embodiment of the present disclosure, the bellows-shaped portion is arranged on the first surface side of the base material when viewed along the normal direction of the first surface of the base material. A first bellows-shaped portion including a plurality of peaks and valleys arranged along an in-plane direction of the first surface of the base material near a boundary between an end portion of the electronic component mounted on the substrate and the wiring. may be included.

In the wiring board according to one embodiment of the present disclosure, the bellows-shaped portion is arranged on the first surface side of the base material when viewed along the normal direction of the first surface of the base material. The wiring may further include a second bellows-shaped portion of the wiring in a region farther than the vicinity of the boundary from the electronic component mounted on the substrate.

In the wiring board according to one embodiment of the present disclosure, the period of peaks and troughs of the first bellows-shaped portion of the wiring near the boundary is It may be smaller or larger than the period of peaks and valleys of .

In the wiring board according to one embodiment of the present disclosure, the amplitude of peaks and valleys of the first bellows-shaped portion of the wiring in the vicinity of the boundary is It may be larger or smaller than the amplitude.

In the wiring board according to one embodiment of the present disclosure, a portion of the wiring that does not overlap the reinforcing member when viewed along the normal direction of the first surface is in-plane of the first surface of the base material. The second bellows-shaped portion may include a plurality of ridges and troughs arranged along the direction.

In the wiring board according to an embodiment of the present disclosure, the reinforcing member is positioned on the first surface side of the base material, the second surface side of the base material, or inside the base material. may

In the wiring board according to one embodiment of the present disclosure, the amplitude of the bellows-shaped portion of the wiring may be 1 μm or more.

In the wiring board according to one embodiment of the present disclosure, the resistance value of the wiring in a first state in which a tensile stress along the in-plane direction of the first surface of the base material is not applied to the base material is referred to as a first resistance value. A second resistance is the resistance value of the wiring in a second state in which a tensile stress is applied to the base material to extend the base material by 30% in the in-plane direction of the first surface compared to the first state. When referring to a value, the ratio of the absolute value of the difference between the first resistance value and the second resistance value to the first resistance value may be 20% or less.

In the wiring board according to one embodiment of the present disclosure, the base material may contain silicone rubber.

In the wiring board according to one embodiment of the present disclosure, the reinforcing member may include a metal layer.

An embodiment of the present disclosure is a method for manufacturing a wiring board, which includes a first surface and a second surface opposite to the first surface, and applies tensile stress to a base material having a first elastic modulus. In addition, a first step of stretching the substrate, a second step of providing wiring on the first surface side of the stretched substrate, and a third step of removing the tensile stress from the substrate; wherein the wiring board includes a plurality of reinforcing members provided corresponding to each of the plurality of electronic components, the wiring board having the a plurality of reinforcing members having a second elastic modulus larger than the first elastic modulus, the reinforcing members overlapping at least partially corresponding to the plurality of electronic components mounted on the wiring board; each has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base material, and the plurality of reinforcing members are the first surface of the base material In the method for manufacturing a wiring board, adjacent reinforcing members are arranged so as to be separated from each other with a gap when viewed along the normal direction of the surface.

An embodiment of the present disclosure is a method for manufacturing a wiring board, which includes a first surface and a second surface opposite to the first surface, and applies tensile stress to a base material having a first elastic modulus. In addition, a first step of stretching the substrate, a second step of providing wiring on the first surface side of the stretched substrate, and a third step of removing the tensile stress from the substrate; wherein the wiring board includes a plurality of reinforcing members provided corresponding to each of the plurality of electronic components, the wiring board having the a plurality of reinforcing members having a second elastic modulus larger than the first elastic modulus, the reinforcing members overlapping at least partially corresponding to the plurality of electronic components mounted on the wiring board; each has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base material, and the wiring board manufacturing method includes: The wiring board manufacturing method further includes a cut forming step of forming a cut communicating between two adjacent reinforcing members when viewed along the normal direction of one surface.

An embodiment of the present disclosure is a method for manufacturing a wiring board, which includes a first surface and a second surface opposite to the first surface, and applies tensile stress to a base material having a first elastic modulus. In addition, a first step of stretching the substrate, a second step of providing wiring on the first surface side of the stretched substrate, and a third step of removing the tensile stress from the substrate; wherein the wiring board overlaps at least partially corresponding to each of the plurality of electronic components mounted on the wiring board when viewed along the normal direction of the first surface of the base material; A common reinforcing member having a second elastic modulus larger than the first elastic modulus is provided, and the plurality of wirings are arranged along the in-plane direction of the first surface of the base material. The wiring board manufacturing method further comprises a cut forming step of forming a cut in the wiring board.

In the method for manufacturing a wiring board according to an embodiment of the present disclosure, the notch of the wiring board may be formed in the wiring board using a laser, die cutting, or a blade.

According to the embodiments of the present disclosure, it is possible to suppress the occurrence of defects in the wiring board due to the expansion and contraction of the base material.

1 is a cross-sectional view showing a wiring board according to one embodiment; FIG. 1 is a plan view showing a wiring board according to one embodiment; FIG. 3 is a cross-sectional view showing a case where the wiring board in FIG. 2 is cut along line BB; FIG. FIG. 3 is a cross-sectional view showing a case where the wiring board in FIG. 2 is cut along line CC; FIG. 10 is a cross-sectional view showing another example of a wiring board; FIG. 4 is a plan view showing another example of a wiring board; FIG. 4 is a plan view showing another example of a wiring board; FIG. 2 is a cross-sectional view along line AA showing an enlarged example of the wiring of the wiring board shown in FIG. 1 and its surrounding components; 2 is an enlarged cross-sectional view showing another example of the wiring of the wiring board shown in FIG. 1 and its surrounding components; FIG. FIG. 10 is a cross-sectional view showing another example of a wiring board; 11 is a cross-sectional view along the line AA showing an enlarged example of the wiring of the wiring board shown in FIG. 10 and its surrounding components; FIG. FIG. 11 is a cross-sectional view along line AA showing another example of the wiring of the wiring board shown in FIG. 10 and its surrounding components in an enlarged manner; FIG. 10 is a cross-sectional view showing another example of a wiring board; FIG. 10 is a cross-sectional view showing another example of a wiring board; 1. It is a figure for demonstrating the manufacturing method of the wiring board shown in FIG. FIG. 10 is a cross-sectional view showing a wiring board according to a first modified example; 17A and 17B are diagrams for explaining a method of manufacturing the wiring board shown in FIG. 16; FIG. 11 is a cross-sectional view showing a wiring board according to a second modified example; 19A and 19B are diagrams for explaining a method of manufacturing the wiring board shown in FIG. 18; FIG. 11 is a cross-sectional view showing a wiring board according to a third modified example; 21 is a diagram for explaining a method of manufacturing the wiring board shown in FIG. 20; FIG. FIG. 11 is a cross-sectional view showing a wiring board according to a fourth modified example; It is a top view which shows an example of the electronic component which concerns on a 5th modification. FIG. 14 is a plan view showing another example of the electronic component according to the fifth modification; FIG. 20 is a plan view showing an example of a wiring board according to a sixth modified example; FIG. 26 is a cross-sectional view showing an example when the wiring board of FIG. 25 is cut along line CC; FIG. 26 is a cross-sectional view showing an example when the wiring board of FIG. 25 is cut along line CC; FIG. 26 is a cross-sectional view showing an example when the wiring board of FIG. 25 is cut along line CC; FIG. 26 is a cross-sectional view showing an example when the wiring board of FIG. 25 is cut along line CC; FIG. 26 is a cross-sectional view showing an example when the wiring board of FIG. 25 is cut along line CC; FIG. 26 is a cross-sectional view showing an example when the wiring board of FIG. 25 is cut along line CC; FIG. 26 is a cross-sectional view showing an example when the wiring board of FIG. 25 is cut along line CC; FIG. 20 is a plan view showing another example of the wiring board according to the sixth modified example; FIG. 20 is a plan view showing another example of the wiring board according to the sixth modified example; FIG. 11 is a plan view showing a wiring board according to a seventh modification; FIG. 20 is a plan view showing a wiring board according to an eighth modified example; FIG. 20 is a plan view showing a wiring board according to a ninth modification; FIG. 20 is a plan view showing another example of the wiring board according to the ninth modification; FIG. 20 is a plan view showing another example of the wiring board according to the ninth modification; FIG. 20 is a cross-sectional view showing a wiring board according to a tenth modification; FIG. 21 is a cross-sectional view showing another example of the wiring board according to the tenth modification; FIG. 21 is a cross-sectional view showing another example of the wiring board according to the tenth modification;

Hereinafter, a configuration of a wiring board and a method for manufacturing the same according to embodiments of the present disclosure will be described in detail with reference to the drawings. The embodiments shown below are examples of the embodiments of the present disclosure, and the present disclosure should not be construed as being limited to these embodiments. Also, in this specification, terms such as "substrate", "base material", "sheet" and "film" are not to be distinguished from each other based only on the difference in designation. For example, "base material" is a concept that includes members that can be called substrates, sheets, and films. Furthermore, terms used herein to specify shapes and geometric conditions and their degrees, such as terms such as "parallel" and "perpendicular", length and angle values, etc., are bound by strict meanings. However, it is interpreted to include the extent to which similar functions can be expected. In addition, in the drawings referred to in this embodiment, the same reference numerals or similar reference numerals may be assigned to the same portions or portions having similar functions, and repeated description thereof may be omitted. Also, the dimensional ratios in the drawings may differ from the actual ratios for convenience of explanation, and some of the configurations may be omitted from the drawings.

An embodiment of the present disclosure will be described below with reference to FIGS. 1 to 15. FIG.

(wiring board)
First, the wiring substrate 10 according to this embodiment will be described. 1 and 2 are a cross-sectional view and a plan view, respectively, showing the wiring substrate 10. FIG. The cross-sectional view shown in FIG. 1 is a view when the wiring substrate 10 in FIG. 2 is cut along the line AA.

A wiring board 10 shown in FIG. Each component of the wiring board 10 will be described below.

〔Base material〕
The base material 20 is a member configured to have elasticity. The base material 20 includes a first surface 21 located on the electronic component 51 and wiring 52 side, and a second surface 22 located on the opposite side of the first surface 21 . The thickness of the base material 20 is, for example, 10 μm or more and 10 mm or less, more preferably 20 μm or more and 3 mm or less. By setting the thickness of the base material 20 to 10 μm or more, the durability of the base material 20 can be ensured. By setting the thickness of the base material 20 to 10 mm or less, the force required for the expansion and contraction of the base material 20 can be reduced. Moreover, by reducing the thickness of the base material 20, the thickness of the entire product using the wiring board 10 can be reduced. Thereby, for example, when the product using the wiring board 10 is a sensor attached to a part of the human body such as an arm, wearing comfort can be ensured. Note that if the thickness of the base material 20 is too small, the stretchability of the base material 20 may be impaired.

An example of a parameter representing the stretchability of the base material 20 is the elastic modulus of the base material 20 . The elastic modulus of the base material 20 is, for example, 10 MPa or less, more preferably 1 MPa or less. By using the base material 20 having such an elastic modulus, the wiring board 10 as a whole can be made stretchable. In the following description, the elastic modulus of the base material 20 is also referred to as the first elastic modulus. The first elastic modulus of the base material 20 may be 1 kPa or more.

As a method of calculating the first elastic modulus of the base material 20, a method of performing a tensile test in accordance with JIS K6251 using a sample of the base material 20 can be adopted. A method of measuring the elastic modulus of a sample of the base material 20 by a nanoindentation method in compliance with ISO14577 can also be adopted. A nanoindenter can be used as a measuring instrument used in the nanoindentation method. As a method of preparing a sample of the base material 20, a method of taking out a part of the base material 20 from the wiring board 10 as a sample and a method of taking out a part of the base material 20 before forming the wiring board 10 as a sample are considered. be done. In addition, as a method of calculating the first elastic modulus of the base material 20, the material constituting the base material 20 is analyzed, and the first elastic modulus of the base material 20 is calculated based on an existing material database. method can also be adopted. In addition, the elastic modulus in this application is an elastic modulus in a 25 degreeC environment.

Another example of the parameter representing the stretchability of the base material 20 is the flexural rigidity of the base material 20 . The bending stiffness is the product of the area moment of inertia of the target member and the elastic modulus of the material constituting the target member, and the unit is N·m ² or Pa·m ⁴ . The geometrical moment of inertia of the base material 20 is calculated based on a cross section obtained by cutting a portion of the base material 20 that overlaps the wiring 52 with a plane perpendicular to the expansion/contraction direction of the wiring board 10 . In the following description, the flexural rigidity of the base material 20 is also referred to as the first flexural rigidity.

Examples of materials forming the base material 20 include thermoplastic elastomers, thermosetting elastomers, silicone rubbers, urethane gels, silicone gels, and the like. As the material of the base material 20, for example, cloth such as woven fabric, knitted fabric, and non-woven fabric can also be used. Thermoplastic elastomers include polyurethane-based elastomers, styrene-based thermoplastic elastomers, olefin-based thermoplastic elastomers, vinyl chloride-based thermoplastic elastomers, ester-based thermoplastic elastomers, amide-based thermoplastic elastomers, 1,2-BR-based thermoplastic elastomers, Fluorinated thermoplastic elastomer, silicone rubber, urethane rubber, fluororubber, polybutadiene, polyisobutylene, polystyrene butadiene, polychloroprene, and the like can be used. Considering mechanical strength and abrasion resistance, it is preferable to use a urethane-based elastomer. Furthermore, silicone rubber is excellent in heat resistance, chemical resistance, and flame resistance, and is preferable as a material for the base material 20 .

[Reinforcement member]
The reinforcing member 31 is a mechanism provided on the wiring board 10 for controlling and mitigating deformation of the base material 20 by reinforcing the base material 20 . For example, a portion of the wiring 52 located around the electronic component 51 is likely to be subjected to a large stress during expansion and contraction, and is likely to be caught under the electronic component 51, increasing the risk of breakage. Here, according to the present embodiment, by providing the reinforcing member 30 on the base material 20, it becomes possible to control, particularly reduce, the deformation of the portion of the base material 20 surrounding the electronic component 51. FIG. As a result, it is possible to suppress the occurrence of a large stress locally in the wiring 52 and the entanglement of the wiring 52 under the electronic component 51, thereby suppressing disconnection between the wiring 52 and the electronic component 51. . In the examples shown in FIGS. 1, 8 and 9, the reinforcing member 31 is located within the substrate 20. In the example shown in FIGS. For example, as shown in FIGS. 10, 11, and 12, the reinforcing member 31 may be positioned on the second surface 22 side of the base material 20, or, as shown in FIG. 31 may be positioned on the first surface 21 side of the substrate 20 .

Also, the plurality of reinforcing members 31 have the same rectangular shape when viewed along the normal line direction of the first surface 21 of the base material 20, as shown in FIG. 2, for example. In the example of FIG. 2, the plurality of reinforcing members 31 have a rectangular (quadrilateral) shape. However, if necessary, the plurality of reinforcing members 31 may have different shapes such as polygons or circles when viewed along the normal direction of the first surface 21 of the base material 20 .

This reinforcing member 31 has an elastic modulus greater than the first elastic modulus of the base material 20 . The elastic modulus of the reinforcing member 31 is, for example, 0.1 GPa or more, preferably 1 GPa or more, and more preferably 10 GPa or more. The elastic modulus of the reinforcing member 31 may be 100 times or more, or 1000 times or more, the first elastic modulus of the base material 20 . By providing such a reinforcing member 31 on the base material 20, it is possible to suppress expansion and contraction of the portion of the base material 20 that overlaps the reinforcing member 31. FIG. As a result, the base material 20 can be divided into a portion that easily expands and contracts and a portion that does not easily expand and contract. If the elastic modulus of the reinforcing member 30 is too low, it may be difficult to control expansion and contraction. Further, if the elastic modulus of the reinforcing member 30 is too high, the reinforcing member 30 may suffer structural destruction such as cracks and cracks when the base material 20 expands and contracts. In the following description, the elastic modulus of the reinforcing member 31 is also referred to as the second elastic modulus. The second elastic modulus of the reinforcing member 31 may be 500 GPa or less. The second elastic modulus of the reinforcing member 31 may be 1.1 times or more and 1000000 times or less, more preferably 100000 times or less, the first elastic modulus of the base material 20 . Note that “overlapping” means that two components overlap when viewed along the normal direction of the first surface 21 of the base material 20 .

A method for calculating the second elastic modulus of the reinforcing member 31 is appropriately determined according to the form of the reinforcing member 31 . For example, the method of calculating the second elastic modulus of the reinforcing member 31 may be the same as or different from the method of calculating the elastic modulus of the substrate 20 described above. The same applies to the elastic modulus of the support substrate 40, which will be described later. For example, as a method of calculating the elastic modulus of the reinforcing member 31 or the supporting substrate 40, a method of performing a tensile test in accordance with ASTM D882 using a sample of the reinforcing member 31 or the supporting substrate 40 can be adopted. .

Further, the reinforcing member 31 has bending rigidity greater than the first bending rigidity of the base material 20 . The bending rigidity of the reinforcing member 31 may be 1.1 times or more, more preferably 2 times or more, more preferably 10 times or more the first bending rigidity of the base material 20 . In the following description, the bending rigidity of the reinforcing member 31 is also referred to as second bending rigidity.

Examples of materials constituting the reinforcing member 31 include metal layers containing metal materials, general thermoplastic elastomers, acrylic, urethane, epoxy, polyester, epoxy, vinyl ether, polyene/thiol, Oligomers such as silicones, polymers, and the like can be mentioned. Examples of metal materials include copper, aluminum, stainless steel, and solder materials. The thickness of the reinforcing member 31 is, for example, 1 μm or more and 100 μm or less, but is not particularly limited.

When an oligomer or polymer is used as the material forming the reinforcing member 31, the reinforcing member 31 may have transparency. Further, the reinforcing member 31 may have a light shielding property, for example, a property of shielding ultraviolet rays. For example, the reinforcing member 31 may be black. Moreover, the color of the reinforcing member 31 and the color of the base material 20 may be the same.

FIG. 3 is a cross-sectional view showing the wiring board 10 of FIG. 2 cut along the line BB. 4 is a cross-sectional view showing the wiring board 10 of FIG. 2 cut along the line CC. The reinforcing member 31 will be described later in detail based on the positional relationship between the electronic component 51 and the wiring 52 . Since FIG. 2 is a plan view showing the wiring board 10 viewed from the first surface 21 side of the base material 20, the reinforcing member 31 positioned inside the base material 20 is indicated by dotted lines.

[Supporting substrate]
The support substrate 40 is a plate-like member configured to have lower stretchability than the base material 20 . The support substrate 40 includes a second surface 42 located on the substrate 20 side and a first surface 41 located on the opposite side of the second surface 42 . In the example shown in FIG. 1, the support substrate 40 supports the electronic component 51 and the wiring 52 on the first surface 41 side. Also, the support substrate 40 is bonded to the first surface of the base material 20 on the second surface 42 side thereof. For example, an adhesive layer 60 containing an adhesive may be provided between the base material 20 and the support substrate 40 . As a material forming the adhesive layer 60, for example, an acrylic adhesive, a silicone adhesive, or the like can be used. The thickness of the adhesive layer 60 is, for example, 5 μm or more and 200 μm or less. Further, as shown in FIG. 14, even if the second surface 42 of the support substrate 40 is bonded to the first surface 21 of the base material 20 by room temperature bonding or by molecularly modifying the non-adhesive surface and bonding by molecular adhesion. good. In this case, an adhesive layer may not be provided between the base material 20 and the support substrate 40 . In addition, a primer layer that improves room-temperature bonding and molecular adhesion may be provided on one or both of the first surface 21 of the base material 20 and the second surface 42 of the support substrate 40 . When the second surface 42 of the support substrate 40 is bonded to the first surface 21 of the substrate 20 by room temperature bonding or molecular bonding, as shown in FIG. It is preferably embedded in the substrate 20 so as not to be exposed on the second surface 22 .

As will be described later, when the tensile stress is removed from the substrate 20 bonded to the support substrate 40 and the substrate 20 contracts, the support substrate 40 forms a bellows-shaped portion. The characteristics and dimensions of the support substrate 40 are set so as to facilitate the formation of such a bellows-shaped portion. For example, the support substrate 40 has an elastic modulus greater than the first elastic modulus of the substrate 20 . In the following description, the elastic modulus of the support substrate 40 is also referred to as the third elastic modulus.

The third elastic modulus of the support substrate 40 is, for example, 100 MPa or more, more preferably 1 GPa or more. The third elastic modulus of the support substrate 40 may be 100 times or more and 100000 times or less, or may be 1000 times or more and 50000 times or less of the first elastic modulus of the base material 20 . If the modulus of elasticity of the support substrate 40 is too low, the support substrate 40 is likely to deform during the process of forming the reinforcing member 30, and as a result, alignment of the reinforcing member 30 with respect to the electronic component 51 and the wiring 52 becomes difficult. Further, if the elastic modulus of the support substrate 40 is too high, it becomes difficult to restore the base material 20 when relaxed, and the base material 20 is likely to crack or break. As a material constituting the support substrate 40, for example, polyethylene naphthalate, polyimide, polycarbonate, acrylic resin, polyethylene terephthalate, etc. can be used. It can be preferably used.

The third modulus of elasticity of the support substrate 40 may be 100 times or less the first modulus of elasticity of the substrate 20 . The method for calculating the third elastic modulus of the support substrate 40 is the same as for the base material 20 . The thickness of the support substrate 40 is 500 nm or more and 10 μm or less, more preferably 1 μm or more and 5 μm or less. If the thickness of the support substrate 40 is too small, it becomes difficult to handle the support substrate 40 in the process of manufacturing the support substrate 40 and the process of forming members on the support substrate 40 . If the thickness of the support substrate 40 is too large, it becomes difficult to restore the base material 20 when relaxed, and the target expansion and contraction of the base material 20 cannot be obtained.

[Electronic parts]
In the example shown in FIG. 1 , electronic component 51 has at least electrodes connected to wiring 52 . The electronic component 51 may be an active component, a passive component, or a mechanical component.
Examples of the electronic components 51 include transistors, LSIs (Large-Scale Integration), MEMS (Micro Electro Mechanical Systems), relays, LEDs, OLEDs, light-emitting elements such as LCDs, sensors, sound-generating components such as buzzers, and vibrations that generate vibrations. Components, cooling/heating components such as Peltier elements and heating wires for controlling cooling heat generation, resistors, capacitors, inductors, piezoelectric elements, switches, connectors, and the like can be mentioned. Of the above examples of electronic components 51, sensors are preferably used. Examples of sensors include temperature sensors, pressure sensors, optical sensors, photoelectric sensors, proximity sensors, shear force sensors, biological sensors, laser sensors, microwave sensors, humidity sensors, strain sensors, gyro sensors, acceleration sensors, displacement sensors, A magnetic sensor, a gas sensor, a GPS sensor, an ultrasonic sensor, an odor sensor, an electroencephalogram sensor, a current sensor, a vibration sensor, a pulse wave sensor, an electrocardiogram sensor, a light intensity sensor, and the like can be mentioned. Of these sensors, biosensors are particularly preferred. A biological sensor can measure biological information such as heartbeat, pulse, electrocardiogram, blood pressure, body temperature, and blood oxygen concentration.

〔wiring〕
The wiring 52 is a conductive member connected to the electrodes of the electronic component 51 . For example, as shown in FIG. 2, one end and the other end of wiring 52 are connected to electrodes of two electronic components 51, respectively. As shown in FIG. 2, multiple wirings 52 may be provided between two electronic components 51 .

Here, in the examples shown in FIGS. 2, 6, and 7, the plurality of wirings 52 are positioned on the first surface 21 side of the base material 20, and are mounted near the end portion H of the wiring substrate 10. They are connected to the electrodes of the electronic component 51 respectively.

Note that the example of FIG. 2 shows a configuration in which three electronic components 51 are arranged in a row along the direction in which the end portion H of the wiring board 10 extends, and the examples of FIGS. , five electronic components 51 may be arranged in a plurality of rows along the direction in which the end portion H of the wiring board 10 extends.

As will be described later, when the tensile stress is removed from the base material 20 joined to the support substrate 40 and the base material 20 contracts, the wiring 52 deforms into a bellows shape. With this in mind, the wiring 52 preferably has a structure that is resistant to deformation. For example, line 52 has a base material and a plurality of conductive particles dispersed within the base material. In this case, by using a deformable material such as resin as the base material, the wiring 52 can also be deformed according to the expansion and contraction of the base material 20 . In addition, the conductivity of the wiring 52 can be maintained by setting the distribution and shape of the conductive particles so that the contact between the plurality of conductive particles is maintained even when deformation occurs. .

As a material constituting the base material of the wiring 52, for example, general thermoplastic elastomers and thermosetting elastomers can be used. Rubber, urethane rubber, fluororubber, nitrile rubber, polybutadiene, polychloroprene, and the like can be used. Among them, resins and rubbers containing urethane-based or silicone-based structures are preferably used in terms of stretchability and durability. Also, as a material forming the conductive particles of the wiring 52, particles such as silver, copper, gold, nickel, palladium, platinum, and carbon can be used. Among them, silver particles are preferably used from the viewpoint of price and conductivity.

Here, each of the plurality of wirings 52 has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface 21 of the base material 20 . What is required of this wiring 52 is to follow the expansion and contraction of the substrate 20 using the elimination and creation of accordions. Considering this point, the material of the wiring 52 is not limited to the material that itself has deformability and stretchability as described above, but also the material that itself does not have deformability and stretchability. Adoptable.
Examples of materials that can be used for the wiring 52 and that do not have elasticity per se include metals such as gold, silver, copper, aluminum, platinum, and chromium, and alloys containing these metals. A metal film can be used as the wiring 52 when the material of the wiring 52 itself does not have elasticity.

The thickness of the wiring 52 may be any thickness that can withstand expansion and contraction of the base material 20, and is appropriately selected according to the material of the wiring 52 and the like. For example, when the material of the wiring 52 does not have stretchability, the thickness of the wiring 52 can be in the range of 25 nm or more and 50 μm or less, preferably 50 nm or more and 10 μm or less, and 100 nm or more and 5 μm. It is more preferable to be within the following range.

Further, when the material of the wiring 52 has elasticity, the thickness of the wiring 52 can be in the range of 5 μm or more and 60 μm or less, preferably in the range of 10 μm or more and 50 μm or less, and 20 μm or more and 40 μm or less. It is more preferable to be within the range. The width of the wiring 52 is, for example, 50 μm or more and 10 mm or less.

In addition, an insulating film integrally covering the base material 20 or the support substrate 40 and the wiring 52 is provided on the base material 20 or on a support substrate 40 to be described later, and on the wiring 52 provided on the base material 20 or the support substrate 40 . may be provided. However, the insulating film is not provided on the connection portion of the wiring 52 with the electronic component 51 . Such an insulating film can be formed by heat-curing a thermosetting insulating resin or the like. Alternatively, the insulating film may be composed of a solvent-dried resin obtained by coating a UV-curable resin with ultraviolet light or a solution containing a resin and then volatilizing the solvent in the solution by thermal drying. The thickness of the insulating film may be, for example, 10 μm or more and 500 μm or less. Alternatively, the insulating film may be formed by screen printing or the like. Also, the connecting portion 51 a may be made of, for example, a conductive adhesive, may be made of a solder material, or may be a terminal integrated with the electronic component 51 .

A method for forming the wiring 52 is appropriately selected according to the material and the like. For example, a method of forming a metal film on the base material 20 or a support substrate 40 to be described later by a vapor deposition method, a sputtering method, a plating method, particularly a Cu plating method, or the like, and then patterning the metal film by a photolithography method can be used. Alternatively, a method may be used in which a metal foil is adhered and laminated on the base material 20 or a support substrate 40 to be described later, and then the metal film is patterned by photolithography. Further, when the material of the wiring 52 itself has stretchability, for example, the conductive composition containing the above-described conductive particles and elastomer is patterned on the base material 20 or the support substrate 40 by a general printing method. There is a method of printing. Among these methods, the printing method, which has high material efficiency and can be manufactured at low cost, can be preferably used.

[Positional relationship between reinforcing member, electronic component 51 and wiring 52]
Next, the reinforcing member 31 described above will be described based on the positional relationship between the electronic component 51 and the wiring 52 .

As shown in FIGS. 1 and 2 , the reinforcing member 31 is arranged so as to at least partially overlap the electronic component 51 when viewed along the normal direction of the first surface 21 of the base material 20 . Preferably, the reinforcing member 31 overlaps the electronic component 51 over the entire area of the electronic component 51 when viewed along the normal direction of the first surface 21 of the base material 20 . Therefore, the portion of the base material 20 that overlaps the electronic component 51 , that is, the portion that overlaps the reinforcing member 31 is less likely to deform than the portion of the base material 20 that does not overlap the reinforcing member 31 . Accordingly, when a force such as a tensile stress is applied to the base material 20 or when a force such as a tensile stress is removed from the base material 20, the portion of the base material 20 that overlaps the electronic component 51 is not deformed. can be suppressed. As a result, it is possible to suppress the application of stress to the electronic component 51 due to the deformation of the base material 20 , thereby suppressing the deformation or breakage of the electronic component 51 . Moreover, it is possible to prevent damage to the electrical joint between the electronic component 51 and the wiring 52 .

2, 6, and 7, the plurality of reinforcing members 31 are provided corresponding to each of the plurality of electronic components 51 (one-to-one correspondence in the illustrated example). ing.
In particular, the plurality of reinforcing members 31 are mounted on the wiring substrate 10 when viewed along the normal direction of the first surface 21 of the base material 20, as shown in FIGS. 2, 6, and 7, for example. The plurality of electronic components 51 are at least partially overlapped corresponding to each other.

2, 6, and 7, for example, when viewed along the normal direction of the first surface 21 of the base material 20, the adjacent reinforcing members 31 are They are arranged so as to be spaced apart with a gap R therebetween. As a result, the periphery of the reinforcing member 31 provided for controlling and mitigating the deformation of the base material 20 can follow the deformation of the base material 20 .

For example, as shown in FIG. 5, the wiring board 10 is provided with a connection portion 31d that connects two adjacent reinforcing members 31 and has a thickness smaller than that of the reinforcing member 31. good too. The connecting portion 31d is made of, for example, the same material as the reinforcing member 31, but may be made of a different material if necessary. Since the film thickness of the connecting portion 31 d is thin, the mechanism for controlling and mitigating the deformation of the base material 20 at the connecting portion is weakened compared to the reinforcing member, so that the periphery of the reinforcing member 31 can follow the deformation of the base material 20 . become.

In addition, for example, as shown in FIG. 2, the plurality of reinforcing members 31 and the electronic components 51 are positioned such that the end portion H of the wiring board 10 is positioned when viewed along the normal direction of the first surface 21 of the base material 20. They are arranged in a row along the extending direction.

However, when viewed along the normal direction of the first surface 21 of the base material 20, the plurality of reinforcing members 31 and the electronic components 51 are arranged in multiple rows along the direction in which the end portion H of the wiring board 10 extends. may be arranged side by side.

Further, the plurality of reinforcing members 31 and the electronic components 51, for example, as shown in FIG. They may be arranged in a zigzag pattern along the extending direction. The positions of the plurality of reinforcing members 31 and the electronic components 51 are not limited to this and are arbitrary.

As described above, FIGS. 1, 4, and 5 show an example in which the reinforcing member 31 is positioned within the base material 20, but the position of the reinforcing member 31 is arbitrary. That is, as described above, the reinforcing member 31 may be positioned on the first surface 21 side of the substrate 20 , on the second surface 22 side of the substrate 20 , or within the substrate 20 .

[Wiring structure]
Next, the cross-sectional structure of the wiring 52 will be described in detail with reference to FIG. FIG. 8 is an enlarged cross-sectional view showing an example of the wiring 52 of the wiring board 10 shown in FIG. 1 and its surrounding components.

As shown in FIGS. 1 to 3 , most of the wiring 52 is arranged so as not to overlap the reinforcing member 31 . Therefore, when deformation such as shrinkage occurs in the base material 20 , the wiring 52 is likely to be deformed along with the deformation of the base material 20 . For example, if the wiring 52 is provided on the stretched base material 20 and then the base material 20 is relaxed, a bellows-shaped portion is produced as shown in FIG. Of these bellows-shaped portions, the first bellows-shaped portion 571 is located between the end portion of the electronic component 51 mounted on the wiring board 10 and the wiring 52 when viewed along the normal line direction of the first surface 21 of the base material 20 . is generated near the boundary Z with . On the other hand, the second bellows-shaped portion 572 has a regular shape that occurs in a portion of the wiring 52 that does not overlap with the reinforcing member 31 in a region away from the electronic component 51 by the vicinity Z of the boundary.

As described above, the wiring 52 has, for example, first and second bellows shapes including a plurality of peaks and valleys arranged along the in-plane direction of the first surface 21 of the base material 20, as shown in FIG. It has parts 571 and 572 . For example, as shown in FIG. 8, the bellows-shaped portion of the wiring 52 is not provided between the electronic component 51 and the base material 20 when viewed along the normal direction of the first surface 21. .

Also, the first and second bellows-shaped portions 571 and 572 include peak portions 531 and 532 and valley portions 551 and 552 in the normal direction of the first surface 21 of the base material 20 .

In FIG. 8 , reference numerals 531 and 532 represent peaks appearing on the surface of the wiring 52 , and reference numerals 541 and 542 represent peaks appearing on the back surface of the wiring 52 . Reference numerals 551 and 552 denote valleys appearing on the surface of the wiring 52, and reference numerals 561 and 562 denote valleys appearing on the back surface of the wiring 52. FIG. The front surface is the surface of the wiring 52 that is farther from the substrate 20 , and the back surface is the surface of the wiring 52 that is closer to the substrate 20 .

8, reference numerals 261, 262 and 271, 272 represent peaks and valleys appearing on the first surface 21 of the base material 20. As shown in FIG. By deforming the base material 20 so that the peaks 261 and 262 and the valleys 271 and 272 appear on the first surface 21, the wiring 52 is deformed into a bellows shape and has a bellows-shaped portion. The ridges 261 and 262 of the first surface 21 of the substrate 20 correspond to the ridges 531 , 532 , 541 and 542 of the first and second accordion-shaped portions 571 and 572 of the wiring 52 , and the first The troughs 271 and 272 of the surface 21 correspond to the troughs 551 , 552 , 561 and 562 of the first and second bellows-shaped portions 571 and 572 of the wiring 52 .

The peaks 532 , 542 and valleys 552 , 562 of the second bellows-shaped portion 572 appear repeatedly along the in-plane direction of the first surface 21 of the base material 20 . The period at which the peaks 532, 542 and the valleys 552, 562 appear repeatedly is, for example, 10 μm or more and 100 mm or less. Note that FIG. 8 shows an example in which the plurality of peaks and valleys of the second accordion-shaped portion 572 are arranged at a constant cycle, but the plurality of peaks and valleys of the second accordion-shaped portion 572 are They may be arranged irregularly along the in-plane direction of the first surface 21 .

In FIG. 8, symbol S1 represents the amplitude of the second bellows-shaped portion 572 on the surface of the wiring 52 .
The amplitude S1 is, for example, 1 μm or more, more preferably 10 μm or more. By setting the amplitude S1 to 10 μm or more, the wiring 52 is easily deformed following the extension of the base material 20 . Also, the amplitude S1 may be, for example, 500 μm or less.

The amplitude S1 is, for example, the distance in the normal direction of the first surface 21 between the adjacent peaks 532 and valleys 552 of the second bellows-shaped portion 572 over a certain range in the length direction of the wiring 52. It is calculated by taking measurements and averaging them. As a measuring device for measuring the distance between adjacent peaks 532 and valleys 552, a non-contact measuring device using a laser microscope or the like may be used, or a contact measuring device may be used. . Alternatively, the distance between adjacent peaks 532 and valleys 552 may be measured based on an image such as a cross-sectional photograph.
The method of calculating the amplitude of the first bellows-shaped portion 571 on the surface of the wiring 52 is also the same. Further, the calculation method of amplitudes S2, S3, and S4, which will be described later, is the same.

In FIG. 8, symbol S2 represents the amplitude of the second bellows-shaped portion 572 on the back surface of the wiring 52 . Similar to the amplitude S1, the amplitude S2 is, for example, 1 μm or more, more preferably 10 μm or more. Also, the amplitude S2 may be, for example, 500 μm or less.

As shown in FIG. 8 , the support substrate 40 , the adhesive layer 60 and the first surface 21 of the base material 20 may also have a bellows-shaped portion similar to the wiring 52 . In FIG. 8 , symbol S3 represents the amplitude of the second bellows-shaped portion 572 on the first surface 21 of the base material 20 . The second bellows-shaped portion 572 on the first surface 21 includes a plurality of peaks 262 and valleys 272 . The amplitude S3 is, for example, 1 μm or more, more preferably 10 μm or more. Also, the amplitude S3 may be, for example, 500 μm or less.

Note that, for example, the period of the peaks 531 and the valleys 551 of the first bellows-shaped portion 571 of the wiring 52 in the vicinity of the boundary Z is the electronic component mounted on the wiring board 10 among the bellows-shaped portions 571 and 572 of the wiring 52 . It is smaller or larger than the period of the peaks 532 and the valleys 552 of the second bellows-shaped portion 572 of the wiring 52 in the region away from the border vicinity Z from the wiring 51 . In the example of FIG. 8, as an example, the period of the first bellows-shaped portion 571 of the wiring 52 in the vicinity Z of the boundary is the same as that of the wiring 52 in the area away from the electronic component 51 mounted on the wiring board 10 from the vicinity Z of the boundary. , the period of the first bellows-shaped portion 571 of the wiring 52 in the vicinity of the boundary Z is smaller than the period of the peaks 532 and the valleys 552 of the second bellows-shaped portion 572. may be mixed and irregular.

Further, for example, the amplitude of the peaks 531 and the valleys 551 of the first bellows-shaped portion 571 of the wiring 52 near the boundary Z is larger than the amplitude of the peaks 532 and the valleys 552 of the second bellows-shaped portion 572 of the wiring 52. , becoming smaller or larger. In the example of FIG. 8, as an example, the amplitude of the first bellows-shaped portion 571 of the wiring 52 in the vicinity Z of the boundary is the same as that of the wiring 52 in a region farther from the electronic component 51 mounted on the wiring board 10 than the vicinity Z of the boundary. shows a case where the amplitude of the peaks 532 and the valleys 552 of the second bellows-shaped portion 572 is larger than the amplitude of the first bellows-shaped portion 571 of the wiring 52 near the boundary Z may be mixed and irregular.

Since the first bellows-shaped portion 571 has a more irregular shape than the second bellows-shaped portion 572, there is a possibility that the wiring 52 of the first bellows-shaped portion 571 is disconnected when it is stretched.

FIG. 9 is an enlarged cross-sectional view showing another example of the wiring 52 of the wiring board 10 shown in FIG. 1 and its surrounding components. As shown in FIG. 9, the first surface 21 of the base material 20 may not have the bellows-shaped portion.

Next, the advantage of forming the second bellows-shaped portion 572 of the bellows-shaped portion shown in FIGS. 8 and 9 on the wiring 52 will be described. As described above, the base material 20 has an elastic modulus of 10 MPa or less. Therefore, when a tensile stress is applied to the wiring board 10, the base material 20 can be elongated by elastic deformation. Here, if the wiring 52 is similarly stretched by elastic deformation, the total length of the wiring 52 increases and the cross-sectional area of the wiring 52 decreases, so that the resistance value of the wiring 52 increases. Moreover, it is conceivable that damage such as cracks may occur in the wiring 52 due to elastic deformation of the wiring 52 .

On the other hand, in the present embodiment, the wiring 52 has the second bellows-shaped portion 572 of the bellows-shaped portion. Therefore, when the base material 20 is stretched, the wiring 52 follows the expansion of the base material 20 by deforming to reduce the undulation of the second accordion-shaped portion 572, that is, by eliminating the accordion shape. be able to. Therefore, it is possible to suppress an increase in the total length of the wiring 52 and a decrease in the cross-sectional area of the wiring 52 due to the extension of the base material 20 . As a result, it is possible to suppress an increase in the resistance value of the wiring 52 due to the extension of the wiring board 10 . In addition, it is possible to suppress the occurrence of damage such as cracks in the wiring 52 .

In addition, in the above-described embodiment, an example in which the electronic component 51 and the wiring 52 are positioned on the first surface 41 of the support substrate 40 is shown. However, the present invention is not limited to this, and the electronic component 51 and the wiring 52 may be located on the second surface 42 of the support substrate 40 . In this case, the reinforcing member 31 may be located on the second surface 22 of the substrate 20, may be located on the first surface 21 of the substrate 20, or may be located on the first surface 41 of the support substrate. may be located.

Moreover, in the above embodiment, the reinforcing member 31 is embedded in the base material 20 so as not to be exposed on the first surface 21 or the second surface 22 of the base material 20 . However, it is not limited to this, and for example, the reinforcing member 31 may be embedded in the base material 20 so as to be exposed on the first surface 21 of the base material 20 . Moreover, the reinforcing member 31 may be embedded in the base material 20 so as to be exposed on the second surface 22 of the base material 20 . Also, the reinforcing member 31 may be embedded in the adhesive layer 60 .

Further, the plurality of reinforcing members 31 are portions overlapping with the bellows-shaped portions of the wirings 52 when viewed along the normal direction of the first surface 21 of the base material 20, and the wiring substrate 10 is a mounted body (not shown). It may be located in an area that would be locally squeezed if it were mounted on the .

As a result, when the wiring board 10 is mounted on a mounting target (not shown) and is locally pushed by contacting or colliding with something, a part of the bellows-shaped portion of the wiring 52 is broken in the region where the wiring board 10 is pushed. The wiring board 10 can follow the deformation of the mounted body even when it is mounted. It should be noted that although the above-described mounted object is, for example, a living body such as a human body or an animal, an object other than a living body such as a human body or an animal, such as a robot, a device, a machine, cloth, clothes, diapers, belts, collars, etc. It may be a bag, a sponge, or the like.

In particular, when using a soft object such as a human body, clothes, diapers, sponges, etc., as compared to a hard object such as a robot, when the entire wiring is pushed in, a hard object such as an electronic component may However, the wiring board 10 is made to follow the deformation of the mounted body in the region where the electronic component is pushed in, so that the wiring board 10 exhibits a predetermined function. be able to.

(Method for manufacturing wiring board)
A method for manufacturing the wiring board 10 will be described below with reference to FIGS.

First, a substrate preparation step for preparing the substrate 20 is performed. In this embodiment, in the base material preparation step, as shown in FIG. 15A, the base material 20 having the reinforcing member 31 embedded therein is prepared.

In addition, as described above, the plurality of reinforcing members 31 are provided corresponding to each of the plurality of electronic components 51 . The plurality of reinforcing members 31 at least partially overlap the plurality of electronic components 51 mounted on the wiring board 10 when viewed along the normal direction of the first surface 21 of the base material 20 . , having a second modulus of elasticity greater than the first modulus of elasticity.

In addition, as described above, the plurality of reinforcing members 31 are arranged such that adjacent reinforcing members 31 are separated from each other with the gap R when viewed along the normal line direction of the first surface 21 of the base material 20 . is located in

In addition, as shown in FIGS. 10 to 12, the reinforcing member 31 may be provided on the second surface 22 of the base material 20 . In this case, for example, first, a metal layer is formed over the entire second surface 22 of the base material 20, and then the metal layer is partially removed by etching or the like. Thereby, a reinforcing member 31 including a metal layer can be formed.

Also, a support substrate preparation step for preparing the support substrate 40 is performed. In the present embodiment, in the support substrate preparation step, electronic components 51 and wiring 52 are provided on the first surface 41 of the support substrate 40 as shown in FIG. 15(b). As a method of providing the wiring 52, for example, a method of printing a conductive paste containing a base material and conductive particles on the first surface 41 of the support substrate 40 can be adopted.

Subsequently, a first step of applying a tensile stress T to the base material 20 to elongate the base material 20 is performed. The elongation rate of the base material 20 is, for example, 10% or more and 200% or less. The first step may be performed while the substrate 20 is heated, or may be performed at room temperature. When heating the substrate 20, the temperature of the substrate 20 is, for example, 50°C or higher and 100°C or lower.

Subsequently, the second step of providing the electronic component 51 and the wiring 52 on the first surface 21 side of the base material 20 in a state of being stretched by the tensile stress T is performed. In the second step of the present embodiment, as shown in FIG. Join from the second surface 42 side. At this time, an adhesive layer 60 may be provided between the base material 20 and the support substrate 40 .

After that, the third step of removing the tensile stress T from the base material 20 is performed. 15(d), the base material 20 shrinks, and the support substrate 40 and the wiring 52 bonded to the base material 20 are also deformed. The third elastic modulus of support substrate 40 is greater than the first elastic modulus of base material 20 . Therefore, the deformation of the support substrate 40 and the wiring 52 can be generated as the generation of the bellows-shaped portion.

Here, as described above, the plurality of reinforcing members 31 are arranged so that the adjacent reinforcing members 31 are separated from each other with the gap R when viewed along the normal direction of the first surface 21 of the base material 20 . , the region of the wiring board 10 where the plurality of reinforcing members 31 are arranged can be flexibly deformed. Therefore, when the wiring board 10 is attached to the mounted body, the shape of the wiring board 10 can follow the deformation of the mounted body.

Further, in the present embodiment, reinforcing member 31 is arranged on base material 20 so as to overlap electronic component 51 . Therefore, it is possible to suppress expansion of the portion of the base material 20 that overlaps the electronic component 51 in the first step. Therefore, it is possible to suppress the shrinkage of the portion of the base material 20 that overlaps the electronic component 51 in the third step. As a result, it is possible to suppress the application of stress to the electronic component 51 caused by the deformation of the base material 20 , thereby suppressing the deformation or breakage of the electronic component 51 . Moreover, it is possible to prevent damage to the electrical joint between the electronic component 51 and the wiring 52 . As described above, according to the present embodiment, by controlling the deformation occurring in the base material 20 depending on the position, it is possible to improve the ease of mounting the electronic component 51 and the reliability of the electronic component 51 and the wiring 52. can.

In addition, when the base material 20 is stretched, there is a possibility that the reinforcing member 31 is warped or deformed. Even if the reinforcing member 31 is deformed, the amount of deformation of the reinforcing member 31 is smaller than the amount of deformation occurring in a portion of the base material 20 that does not overlap with the reinforcing member 31 . Therefore, it is possible to prevent the electronic component 51 from being deformed or damaged. Moreover, it is possible to prevent damage to the electrical joint between the electronic component 51 and the wiring 52 .

An example of the effect on the resistance value of the wiring 52 obtained by the bellows-shaped portion of the wiring 52 will be described. Here, the resistance value of the wiring 52 in the first state in which the tensile stress along the in-plane direction of the first surface 21 of the base material 20 is not applied to the base material 20 is referred to as the first resistance value. Further, the resistance value of the wiring 52 in the second state in which the base member 20 is stretched by 30% in the in-plane direction of the first surface 21 by applying a tensile stress to the base member 20 as compared with the first state is defined as the second resistance value. called. According to the present embodiment, by forming the bellows-shaped portion in the wiring 52, the ratio of the absolute value of the difference between the first resistance value and the second resistance value to the first resistance value is set to 20% or less. more preferably 10% or less, more preferably 5% or less.

Applications of the wiring board 10 include the healthcare field, the medical field, the nursing care field, the electronics field, the sports/fitness field, the beauty field, the mobility field, the livestock/pet field, the amusement field, the fashion/apparel field, the security field, and the military field. , distribution, education, building materials/furniture/decoration, environmental energy, agriculture, forestry and fisheries, and robots. For example, a product to be attached to a part of the human body such as an arm is constructed using the wiring board 10 according to the present embodiment. Since the wiring board 10 can be stretched, for example, by attaching the wiring board 10 to the body in a stretched state, the wiring board 10 can be brought into closer contact with a part of the body. Therefore, it is possible to realize a good wearing feeling. Moreover, since it is possible to suppress a decrease in the resistance value of the wiring 52 when the wiring board 10 is stretched, good electrical characteristics of the wiring board 10 can be realized. In addition, since the wiring board 10 can be stretched, it can be installed or incorporated along a curved surface or a three-dimensional shape, not limited to a living body such as a human being. Examples of such products include vital sensors, masks, hearing aids, toothbrushes, plasters, poultices, contact lenses, artificial hands, artificial legs, artificial eyes, catheters, gauze, drug packs, bandages, disposable bioelectrodes, diapers, rehabilitation equipment, and home appliances. Products, displays, signage, personal computers, mobile phones, mice, speakers, sportswear, wristbands, headbands, gloves, swimwear, supporters, balls, gloves, rackets, clubs, bats, fishing rods, relay batons and gymnastics equipment, In addition, grips, equipment for physical training, floats, tents, swimwear, bibs, goal nets, goal tapes, chemical penetration beauty masks, electrical stimulation diet products, pocket warmers, false nails, tattoos, automobiles, airplanes, trains, ships, bicycles , strollers, drones, wheelchairs, etc., seats, instrument panels, tires, interiors, exteriors, saddles, handles, roads, rails, bridges, tunnels, gas and water pipes, electric wires, tetrapods, ropes, collars, leads, Harnesses, animal tags, bracelets, belts, game consoles, haptic devices such as controllers, luncheon mats, tickets, dolls, stuffed animals, support goods, hats, clothes, glasses, shoes, insoles, socks, stockings, slippers, etc. Innerwear, mufflers, earmuffs, bags, accessories, rings, watches, ties, personal ID recognition devices, helmets, packages, IC tags, plastic bottles, stationery, books, pens, carpets, sofas, bedding, lighting, doorknobs, handrails , vases, beds, mattresses, cushions, curtains, doors, windows, ceilings, walls, floors, wireless power supply antennas, batteries, vinyl houses, nets, robot hands, and robot exteriors.

Various modifications can be made to the above-described embodiment. Modifications will be described below with reference to the drawings as necessary. In the following description and the drawings used in the following description, the same reference numerals as those used for the corresponding portions in the above-described embodiment are used for the portions that can be configured in the same manner as in the above-described embodiment, Duplicate explanations are omitted. Further, when it is clear that the effects obtained in the above-described embodiment can also be obtained in the modified example, the explanation thereof may be omitted.

(First modification)
In the above-described embodiment, an example in which the reinforcing member 31 is positioned inside the base material 20 is shown, but the present invention is not limited to this, and the reinforcing member 31 is provided on the first surface 21 side of the base material 20. may be For example, as shown in FIG. 16, the reinforcing member 31 may be positioned between the first surface 21 of the base material 20 and the electronic component 51 . In the example shown in FIG. 16 , the reinforcing member 31 is positioned on the second surface 42 of the support substrate 40 .

Also in this modification, a bellows-shaped portion is formed in a portion of the wiring 52 that does not overlap with the reinforcing member 30, as in the case of the above-described embodiment. Therefore, it is possible to suppress an increase in the total length of the wiring 52 and a decrease in the cross-sectional area of the wiring 52 due to the deformation of the base material 20 .

17A to 17D are diagrams for explaining a method of manufacturing the wiring substrate 10 shown in FIG. 16. FIG.

First, as shown in FIG. 17(a), a base material preparation step for preparing the base material 20 is performed.

Subsequently, as shown in FIG. 17B, a support substrate preparation step for preparing the support substrate 40 is performed. In this modification, in the support substrate preparation step, electronic components 51 and wiring 52 are provided on the first surface 41 of the support substrate 40 as shown in FIG. A reinforcing member 31 is provided on the second surface 42 of the support substrate 40 . The order in which the reinforcing member 31, the electronic component 51, and the wiring 52 are provided on the support substrate 40 is arbitrary.

Subsequently, a first step of applying a tensile stress T to the base material 20 to elongate the base material 20 is performed. Subsequently, the second step of providing the electronic component 51 and the wiring 52 on the first surface 21 side of the base material 20 in a state of being stretched by the tensile stress T is performed. In this modified example, in the second step, as shown in FIG. Bonding is performed from the second surface 42 side of the support substrate 40 .

After that, the third step of removing the tensile stress T from the base material 20 is performed. 17(d), the base material 20 shrinks, and the support substrate 40 and the wiring 52 bonded to the base material 20 also deform. The third elastic modulus of support substrate 40 is greater than the first elastic modulus of base material 20 . Therefore, the deformation of the support substrate 40 and the wiring 52 can be generated as the generation of the bellows-shaped portion.

Here, also in this modified example, the plurality of reinforcing members 31 are arranged so that the adjacent reinforcing members 31 are separated from each other with the gap R when viewed along the normal line direction of the first surface 21 of the base material 20 . , the region of the wiring board 10 where the plurality of reinforcing members 31 are arranged can be flexibly deformed. can follow the deformation of the mounted body.

Further, in this modified example, a reinforcing member 31 is arranged on the second surface 42 of the support substrate 40 so as to overlap with the electronic component 51 . Therefore, it is possible to suppress the electronic component 51 from being affected by the contraction of the base material 20 in the third step. This can prevent the electronic component 51 from being deformed or damaged.

(Second modification)
Although the reinforcing member 31 is positioned on either the base material 20 or the support substrate 40 in the above embodiment and the first modification, the present invention is not limited to this. As shown in FIG. 18 , the reinforcing member 31 may be positioned either within the substrate 20 or between the first surface 21 of the substrate 20 and the electronic component 51 . In the example shown in FIG. 18 , the wiring board 10 includes reinforcing members 31 positioned inside the base material 20 and reinforcing members 31 positioned on the second surface 42 of the support substrate 40 .

Also in this modification, a bellows-shaped portion is formed in a portion of the wiring 52 that does not overlap with the reinforcing member 30, as in the case of the above-described embodiment. Therefore, it is possible to suppress an increase in the total length of the wiring 52 and a decrease in the cross-sectional area of the wiring 52 due to the deformation of the base material 20 .

19A to 19D are diagrams for explaining a method of manufacturing the wiring substrate 10 shown in FIG. 18. FIG.

First, as shown in FIG. 19(a), a base material preparation step for preparing the base material 20 is performed. In this modification, in the base material preparation step, as shown in FIG. 19A, a reinforcing member 31 is provided in the base material 20 . Subsequently, as shown in FIG. 19B, a support substrate preparation step for preparing the support substrate 40 is performed. In this modification, in the support substrate preparation step, electronic components 51 and wiring 52 are provided on the first surface 41 of the support substrate 40 as shown in FIG. 19B. A reinforcing member 31 is provided on the second surface 42 of the support substrate 40 . The order in which the reinforcing member 31, the electronic component 51, and the wiring 52 are provided on the support substrate 40 is arbitrary.

Subsequently, a first step of applying a tensile stress T to the base material 20 to elongate the base material 20 is performed. Subsequently, the second step of providing the electronic component 51 and the wiring 52 on the first surface 21 side of the base material 20 in a state of being stretched by the tensile stress T is performed. In the second step of this modified example, as shown in FIG. The supporting substrate 40 is joined from the second surface 42 side of the supporting substrate 40 .

Here, also in this modified example, the plurality of reinforcing members 31 are arranged so that the adjacent reinforcing members 31 are separated from each other with the gap R when viewed along the normal line direction of the first surface 21 of the base material 20 . , the region of the wiring board 10 where the plurality of reinforcing members 31 are arranged can be flexibly deformed. Therefore, when the wiring board 10 is attached to the mounted body, the shape of the wiring board 10 can follow the deformation of the mounted body.

Further, in this modified example, reinforcing members 31 are arranged on both the second surface 22 of the base material 20 and the second surface 42 of the support substrate 40 so as to overlap the electronic components 51 . Therefore, it is possible to further suppress expansion of the portion of the base material 20 that overlaps the electronic component 51 in the first step. Therefore, it is possible to suppress the shrinkage of the portion of the base material 20 that overlaps the electronic component 51 in the third step. As a result, it is possible to suppress the application of stress to the electronic component 51 caused by the deformation of the base material 20 , thereby suppressing the deformation or breakage of the electronic component 51 . Moreover, it is possible to prevent damage to the electrical joint between the electronic component 51 and the wiring 52 .

(Third modification)
In the above-described embodiment and each modified example, the electronic component 51 and the wiring 52 are supported by the support substrate 40 having the third elastic modulus higher than the first elastic modulus of the base material 20. However, it is not limited to this. As shown in FIG. 20 , the electronic component 51 and the wiring 52 may be provided on the first surface 21 of the base material 20 . In this case, the reinforcing member 31 is located inside the base material 20 .

Also in this modification, a bellows-shaped portion is formed in a portion of the wiring 52 that does not overlap with the reinforcing member 31, as in the case of the above-described embodiment. Therefore, it is possible to suppress an increase in the total length of the wiring 52 and a decrease in the cross-sectional area of the wiring 52 due to the deformation of the base material 20 .

21A to 21D are diagrams for explaining a method of manufacturing the wiring board 10 shown in FIG.

First, as shown in FIG. 21( a ), a substrate preparation step for preparing the substrate 20 is performed. In this modification, a reinforcing member 31 is provided in the base material 20 in the base material preparation step, as shown in FIG.

Subsequently, as shown in FIG. 21(b), a first step of applying a tensile stress T to the base material 20 to elongate the base material 20 is performed. Subsequently, as shown in FIG. 21C, the second step of providing the electronic component 51 and the wiring 52 on the first surface 21 of the base material 20 stretched by the tensile stress T is performed.

After that, the third step of removing the tensile stress T from the base material 20 is performed. As a result, the base material 20 shrinks and the wiring 52 provided on the base material 20 is also deformed, as indicated by arrow C in FIG. 21(d). The reinforcing member 31 is arranged so as not to overlap the entire wiring 52 or most of the wiring 52 . Therefore, the deformation of the wiring 52 occurs as a bellows-shaped portion is generated.

Here, also in this modified example, the plurality of reinforcing members 31 are arranged so that the adjacent reinforcing members 31 are separated from each other with the gap R when viewed along the normal line direction of the first surface 21 of the base material 20 . , the region of the wiring board 10 where the plurality of reinforcing members 31 are arranged can be flexibly deformed. Therefore, when the wiring board 10 is attached to the mounted body, the shape of the wiring board 10 can follow the deformation of the mounted body.

Further, in this modified example, a reinforcing member 31 is arranged in the base material 20 . Therefore, it is possible to suppress the expansion of the portion of the base material 20 that is to overlap with the electronic component 51 in the first step. Therefore, it is possible to suppress the shrinkage of the portion of the base material 20 that overlaps the electronic component 51 in the third step. As a result, it is possible to suppress the application of stress to the electronic component 51 caused by the deformation of the base material 20 , thereby suppressing the deformation or breakage of the electronic component 51 .

(Fourth modification)
In the above-described embodiment and each modified example, an example in which the electronic component 51 is prepackaged before being mounted on the wiring board 10 is shown. However, the present invention is not limited to this, and the electronic component 51 is configured by sealing some of the constituent elements after mounting some of the constituent elements of the electronic component 51 on the wiring board 10 . There may be. For example, as shown in FIG. 22 , the electronic component 51 may have a chip 513 , wires 514 connecting the chip 513 and the wiring 52 , and resin 515 covering the chip 513 and the wires 514 . A wire 514 functions as an electrode connected to the wiring 52 . In the step of providing such an electronic component 51, first, the chip 513 is placed on the wiring substrate 10, for example, the support substrate 40. As shown in FIG. At this time, the chip 513 may be fixed to the wiring substrate 10 using an adhesive or the like. Then, wire 514 is connected to chip 513 and wiring 52 . Wires 514 include gold, aluminum, copper, or the like. Subsequently, a liquid resin is dropped onto the chip 513 and the wire 514 to form a resin 515 covering the chip 513 and the wire 514 . This process is also called potting. Urethane resin, epoxy resin, or the like can be used as the resin 515 . When electronic component 51 contains resin 515 as shown in FIG.

A portion of the base material 20 that overlaps the resin 515 is less likely to deform than a portion of the base material 20 that does not overlap the resin 515 . In this case, when base material 20 expands and contracts, stress concentrates on the boundary between a portion of wiring substrate 10 overlapping resin 515 and a portion of wiring substrate 10 not overlapping resin 515 . Considering this point, as shown in FIG. 22 , the reinforcing member 31 is provided so as to extend beyond the outer edge 512 of the electronic component 51 . As a result, it is possible to suppress the application of stress to the electronic component 51 caused by the deformation of the base material 20 , thereby suppressing the deformation or breakage of the electronic component 51 . Moreover, it is possible to prevent damage to the electrical joint between the electronic component 51 and the wiring 52 .

Although FIG. 22 shows an example in which the potting resin 515 covers the entire chip 513, the present invention is not limited to this. A potting resin 50 may be provided to reinforce the packaged electronic component 51 . In this case, the resin 50 may cover the entire electronic component 51 . Alternatively, the resin 50 does not have to cover the entire electronic component 51 . For example, the resin 50 may be positioned between the end of the reinforcing member 31 and the end of the electronic component 51 around the electronic component 51 so as to reinforce the periphery of the electronic component 51 .

(Fifth Modification)
In the above-described embodiment and modifications, the electronic component 51 is a component that is different from the constituent elements of the wiring board 10 . In the modification below, an example in which electronic component 51 includes a member integral with at least one component among the plurality of components of wiring board 10 will be described.

For example, the electronic component 51 may include a conductive layer integral with the conductive layer forming the wiring 52 of the wiring board 10 .

For example, FIG. 23 is a plan view showing an example of the electronic component 51. As shown in FIG. In the example shown in FIG. 23 , the conductive layer forming the electronic component 51 has a wider width than the conductive layer forming the wiring 52 . The portion where the width of the conductive layer changes is the outer edge 512 of the electronic component 51 . The electronic component 51 shown in FIG. 23 can function, for example, as a pad. A probe for testing, a terminal for rewriting software, and the like are connected to the pad.

24 is a plan view showing another example of the electronic component 51. FIG. In the example shown in FIG. 24, the conductive layer forming electronic component 51 has a spiral shape. The portion where the conductive layer begins to extend spirally is the outer edge 512 of the electronic component 51 . An electronic component 51 including a conductive layer having a predetermined pattern as shown in FIG. 24 can function as an antenna or a pressure sensor.

(Sixth modification)
In the above-described embodiment, the plurality of reinforcing members 31 are arranged so that the adjacent reinforcing members 31 are separated from each other with the gap R when viewed along the normal direction of the first surface 21 of the base material 20. 2, an example in which the reinforcing members 31 are arranged has been described, but there are cases where the region of the wiring board 10 where the plurality of reinforcing members 31 are arranged can be flexibly deformed.
Therefore, in the sixth modification, as a configuration in which the region of the wiring substrate where the plurality of reinforcing members are arranged can be flexibly deformed, two adjacent reinforcing members are communicated from the first surface side of the base material. An example of a configuration in which cuts (cuts) are formed for each will be described.

Here, FIG. 25 is a plan view showing an example of a wiring board according to the sixth modification. Also, FIG. 26 is a cross-sectional view showing an example when the wiring board of FIG. 25 is cut along the line CC. 27 to 32 are cross-sectional views showing other examples when the wiring board in FIG. 25 is cut along the line CC.

For example, as shown in FIG. 25, a plurality of reinforcing members 31 are provided corresponding to each of a plurality of electronic components 51, as in the above-described embodiments. The plurality of reinforcing members 31 at least partially correspond to the plurality of electronic components 51 mounted on the wiring board 10 when viewed along the normal direction of the first surface 21 of the base material 20. are overlapping.

For example, as shown in FIGS. 25 and 26 , the wiring board 10 is positioned between two adjacent reinforcing members 31 when viewed along the normal direction of the first surface 21 of the base material 20 . A notch (cut) U communicating from the first surface 21 side of the material 20 is formed.

When the plurality of reinforcing members 31 are viewed along the normal direction of the first surface 21 of the base material 20, the adjacent reinforcing members 31 are separated from each other by a gap R including the cut U or the cut U. are arranged so that they come into contact with each other through the

Here, when viewed along the normal direction of the first surface 21 of the base material 20, for example, as shown in FIG. extended. When viewed along the normal direction of the first surface 21 of the base material 20, for example, as shown in FIG. extends to the area.

26, 27, and 29, for example, when the base material 20 is viewed along the normal direction of the first surface 21 of the base material 20, the two adjacent reinforcing members 31 A notch (cut) U communicating from the first surface 21 or the second surface 22 of the base material 20 is formed between them.

Further, for example, as shown in FIG. 26, in the present embodiment, the notch U of the wiring substrate 10 is also continuously formed in the supporting substrate 40 that constitutes the wiring substrate 10 .

In addition, as shown in FIG. 26, for example, the cut U of the wiring board 10 extends from the first surface 21 side of the base material 20 to the second surface 22 side of the base material 20 and extends between two adjacent reinforcing members 31. It extends through.

In particular, the cut U of the wiring substrate 10 extends so as to penetrate the base material 20 from the first surface 21 side of the base material 20 to the second surface 22 side of the base material 20, for example, as shown in FIG. You can make it look like

For example, as shown in FIG. 26, the cut U of the wiring board 10 has a linear cross section perpendicular to the first surface 21 of the base material 20 when viewed from the end H side of the wiring board 10. .

The cut U of the wiring board 10 may be formed in the wiring board 10 by any method as long as it has a desired cut, for example, using a laser, die cutting, or a blade.

In this manner, the plurality of reinforcing members 31 are arranged such that adjacent reinforcing members 31 are separated from each other by the gap R when viewed along the normal direction of the first surface 21 of the base material 20. there is
As a result, since the region of the wiring board 10 where the plurality of reinforcing members 31 are arranged can be flexibly deformed, when the wiring board 10 is attached to the mounting body, the shape of the wiring board 10 can be changed to the mounting body. It is designed to be able to follow the deformation of

That is, according to this modification, when the wiring board 10 is attached to the mounted body, the shape of the wiring board 10 is made to follow the deformation of the mounted body, so that the wiring board exhibits a predetermined function. be able to.

28 and 30, the auxiliary member 31 may be partially formed with an auxiliary member notch (cut) communicating with the notch U, for example.

That is, the cut U of the wiring board 10 may extend from the first surface 21 side of the base material 20 to the inside of the reinforcing member 31 as shown in FIG. 28, for example. Alternatively, the cutout U of the wiring board 10 may extend from the second surface 22 side of the base material 20 to the inside of the reinforcing member 31 as shown in FIG. 30, for example.

In this way, the reinforcing member 31 may not be completely divided into a plurality of pieces by the notch U of the wiring board 10 .

Further, for example, as shown in FIG. 31 , the wiring board 10 includes one common reinforcing member 31 for the plurality of electronic components 51 , and the cut U of the wiring board 10 is provided on the first surface 21 of the base material 20 . The reinforcing member 31 may extend from the side to the inside of the base material 20 (the reinforcing member 31 is not divided).

Further, for example, as shown in FIG. 32 , the wiring board 10 includes one common reinforcing member 31 for the plurality of electronic components 51 , and the cut U of the wiring board 10 is located on the second surface 22 of the base material 20 . The reinforcing member 31 may extend from the side to the inside of the base material 20 (the reinforcing member 31 is not divided).

In this way, one common reinforcing member 31 is at least partially attached to each of the plurality of electronic components 51 mounted on the wiring board 10 when viewed along the normal direction of the first surface 21 of the base material 20 . You may make it overlap corresponding to . In this case, the wiring board 10 is formed with a notch (cut) U reaching the surface of the reinforcing member 31, as shown in FIGS. 31 and 32, for example.

Here, FIG. 33 is a plan view showing another example of the wiring board according to the sixth modification. Also, FIG. 34 is a plan view showing another example of the wiring board according to the sixth modification.

For example, as shown in FIG. 33, when viewed along the normal direction of the first surface 21 of the base material 20, the shape of the other end of the notch U of the wiring board 10 may include a circle Ua. Further, for example, as shown in FIG. 34, when viewed along the normal direction of the first surface 21 of the base material 20, the shape of the other end of the cut U of the wiring substrate 10 is rectangular (for example, square). Ub may be included. By adopting this shape, it is possible to suppress the cut portion from extending during mounting. As long as it is possible to suppress the extension of the cut portion, the shape of the end portion may be any shape such as a polygon other than a circle or a rectangle.

Note that the method for manufacturing the wiring board 10 according to this modification differs from the above-described embodiment in that it includes a cut forming step for forming cuts (cuts) U.
In particular, in the present modification, the method of manufacturing the wiring board 10 includes a notch ( A notch forming step for forming a cut (cut) U is provided.

According to the method for manufacturing the wiring board 10, the wiring board 10 includes the plurality of reinforcing members 31 provided corresponding to the plurality of electronic components, respectively, as described above. When viewed along the normal direction of the wiring board 10, it overlaps at least partially corresponding to each of the plurality of electronic components 51 mounted on the wiring board 10, and has a second elastic modulus larger than the first elastic modulus A plurality of reinforcing members 31 are provided.
Each of the plurality of wirings 52 has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface 21 of the base material 20 .

The notch U of the wiring board 10 is formed in the wiring board 10 using, for example, a laser, die cutting, or a blade, as described above.

The incision forming step may be performed, for example, before the support substrate 40 and the substrate 10 are bonded together, or may be performed after the support substrate 40 and the substrate 10 are bonded together.

In the method for manufacturing the wiring board 10 according to this modified example, the other steps of the method for manufacturing the wiring board 10 are the same as those in the above-described embodiment.

Further, instead of the cut forming step, the method of manufacturing the wiring board 10 may further include another cut forming step of forming a cut (cut) U reaching the surface of one common reinforcing member 31. good.

According to this method of manufacturing the wiring board 10, the wiring board 10 is at least partially attached to the plurality of electronic components mounted on the wiring board 10 when viewed along the normal line direction of the first surface 21 of the base material 20. and have a common reinforcing member 31 having a second modulus of elasticity greater than the first modulus of elasticity.

Each of the plurality of wirings 52 has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface 21 of the base material 20 .

(Seventh Modification)
In the above-described embodiment, the plurality of reinforcing members 31 are arranged so that the adjacent reinforcing members 31 are separated from each other with the gap R when viewed along the normal direction of the first surface 21 of the base material 20. Although an example in which the reinforcing members 31 are arranged has been described, there are cases where the region of the wiring board 10 where the plurality of reinforcing members 31 are arranged can be flexibly deformed.

Therefore, in the seventh modification, as a configuration in which the region of the wiring substrate where the plurality of reinforcing members are arranged can be flexibly deformed, when viewed along the normal direction of the first surface of the base material, An example of a configuration in which cuts are formed in a dotted line (discontinuously) in the wiring board 10 will be described.

Here, FIG. 35 is a plan view showing a wiring board according to the seventh modification.

For example, as shown in FIG. 35, the cut U is formed in a dotted line (discontinuously) in the wiring substrate 10 when viewed along the normal direction of the first surface 21 of the base material 20. You may do so. In this case, the notch U of the wiring board 10 may extend, for example, from the first surface 21 side of the base material 20 to the second surface 22 side of the base material 20 so as to penetrate the reinforcing member 31. good.

As a result, the wiring board 10 can be easily deformed starting from the notch U of the wiring board 10, and the region of the wiring board 10 where the plurality of reinforcing members 31 are arranged can be flexibly deformed. Therefore, when the wiring board 10 is attached to the mounted body, the shape of the wiring board 10 can follow the deformation of the mounted body.

(Eighth modification)
In the eighth modified example, another example of a configuration in which the region of the wiring substrate where the plurality of reinforcing members are arranged can be flexibly deformed will be described.

Here, FIG. 36 is a plan view showing a wiring board according to the eighth modification.

For example, as shown in FIG. 36, when viewed along the normal direction of the first surface 21 of the base material 20, one end of the cut U of the wiring board 10 overlaps the reinforcing member 31, and the other end of the cut U may extend to the edge H of the wiring board 10 .

(Ninth modification)
In the ninth modified example, another example of a configuration in which the region of the wiring board where the plurality of reinforcing members are arranged can be flexibly deformed will be described.

Here, FIG. 37 is a plan view showing a wiring board according to the ninth modification. Also, FIG. 38 is a plan view showing another example of the wiring board according to the ninth modification. Also, FIG. 39 is a plan view showing another example of the wiring board according to the ninth modification.

For example, as shown in FIG. 37, when viewed along the normal direction of the first surface 21 of the base material 20, both ends of the notch U of the wiring board 10 may overlap both ends of the reinforcing member 31. good.

In particular, when viewed along the normal direction of the first surface 21 of the base material 20, for example, as shown in FIG. .

Further, when viewed along the normal direction of the first surface 21 of the base material 20, for example, as shown in FIG. may be included. The shape of both ends is not limited to this, and may be different shapes at both ends, for example, one end may be circular Ua and one end may be rectangular Ub. Moreover, the shape of the said both ends may be a polygon.

(Tenth Modification)
In the above-described embodiment, an example is described in which the notch U of the wiring board 10 has a linear cross section perpendicular to the first surface 21 of the base material 20 when viewed from the end H side of the wiring board 10. However, it is not limited to this. Therefore, in the tenth modification, an example of another shape of the cross section perpendicular to the first surface 21 of the base material 20 will be described.

Here, FIG. 40 is a cross-sectional view showing a wiring substrate according to a tenth modification. Also, FIG. 41 is a cross-sectional view showing another example of the wiring board according to the tenth modification. Also, FIG. 42 is a cross-sectional view showing another example of the wiring board according to the tenth modification.

For example, as shown in FIG. 40 , the cut U of the wiring board 10 has an inverted triangular groove-like cross section perpendicular to the first surface 21 of the base material 20 when viewed from the end H side of the wiring board 10 . You may make it have a shape. In addition, in FIG. 40, the inverted triangular groove shape is formed only by the support substrate 40 , but it may be formed with a depth up to the base material 20 .

In addition, as shown in FIG. 41, for example, the cut U of the wiring board 10 has a concave groove-like cross section perpendicular to the first surface 21 of the base material 20 when viewed from the end H side of the wiring board 10. You may make it have a shape. In addition, in FIG. 40 , the concave groove-like shape is formed only by the support substrate 40 , but it may be formed with a depth up to the base material 20 .

Moreover, as shown in FIG. 42, for example, the notch U of the wiring board 10 has a fan-shaped groove-like cross section perpendicular to the first surface 21 of the base material 20 when viewed from the end H side of the wiring board 10 . may be in the shape of In addition, in FIG. 40 , the fan-shaped groove shape is formed only by the support substrate 40 , but it may be formed with a depth up to the base material 20 .

40, 41, and 42 show an example in which the cutout U of the wiring board 10 is formed in the support substrate 40 of the wiring board 10, but the cutout U is formed in the base material 20 or the reinforcing member. 31 may also be formed.

(Modified example of wiring board)
In the above-described embodiment and each modified example, an example in which the wiring board 10 includes the electronic component 51 mounted on the first surface 21 side of the base material 20 is shown. However, the present invention is not limited to this, and the wiring board 10 does not have to include the electronic component 51 . For example, the base material 20 without the electronic component 51 mounted thereon may have a bellows-shaped portion. Alternatively, the support substrate 40 without the electronic component 51 mounted thereon may be attached to the base material 20 . Moreover, the wiring board 10 may be shipped without the electronic component 51 mounted thereon.

Although several modifications of the above-described embodiment have been described, it is of course possible to apply a plurality of modifications in appropriate combination.

EXAMPLES Next, the present invention will be described in more detail with reference to Examples, but the present invention is not limited to the description of the Examples below as long as it does not exceed the gist thereof.
<Example 1>
In Example 1, as the wiring board 10, a board in which adjacent reinforcing members are arranged with a gap therebetween as shown in FIGS. 1 and 2 was manufactured.

(Wiring preparation process)
First, a PEN (polyethylene naphthalate) film having a thickness of 1 μm was prepared as the support substrate 40 for the wiring 52 to be installed on the first surface 21 side of the base material 20 . Subsequently, a copper layer having a thickness of 1 μm was formed on the support substrate 40 by vapor deposition. Subsequently, the copper layer was patterned using photolithography and etching to form wiring 52 . The wiring 52 was patterned to have a line width of 200 μm, and was further patterned so that a part of the wiring 52 became an electrode pair with an interval of 500 μm. Also, the elastic modulus of the support substrate 40 was measured by a tensile test conforming to ASTM D882. As a result, the elastic modulus of the support substrate 40 was 2.2 Gpa. Then, an LED chip of 1.0×0.5 mm size was mounted on the electrode pair using a conductive adhesive.

(Preparation step of substrate 20)
An adhesive sheet 8146-2 (manufactured by 3M) was prepared as an adhesive layer between the support substrate 40 and the base material 20 . Next, a two-liquid addition condensation polydimethylsiloxane (hereinafter referred to as PDMS) was applied to the adhesive sheet to a thickness of about 250 μm and cured.
Next, a polyimide film (UPILEX, thickness 125 μm, manufactured by Ukosan Co., Ltd.) was placed as a reinforcing member 31 on the PDMS coated and cured as described above. The shape of the reinforcing member 31 installed at this time was cut by a cutting plotter so as to be 5 mm square. The five LED chips and the corresponding five reinforcing members were arranged so as to be spaced apart from each other. In addition, five reinforcing members corresponding to the FPC to be crimped later were also arranged so as to be spaced apart from each other. Here, the elastic modulus of the polyimide film was measured by a tensile test based on ASTM D882. As a result, the elastic modulus was 7 Gpa.

Next, PDMS was further applied to a thickness of about 250 μm so as to cover the reinforcing member 30 installed above, and cured.

(Lamination process)
The base material 20 in which the reinforcing member 31 was embedded and prepared in the base material 20 preparation process was stretched 1.5 times in one axial direction. Next, on the first surface 21 side of the substrate 20, the support substrate 40 with the chip component (LED chip) obtained in the wiring preparation step and the wiring 52 was attached. Specifically, the surface of the support substrate 40 on which no component was mounted and the first surface 21 of the base material 20 were bonded together via an adhesive surface. After that, the elongation of the substrate 20 was released. The wiring 52 thus formed has a bellows-shaped portion on the surface of the wiring 52 outside the area surrounded by the reinforcing member 31, and the amplitude inside the area surrounded by the reinforcing member 31 is larger than that outside the area. A small bellows-shaped portion of Here, the LED chips were arranged so as to overlap five reinforcing members 31 corresponding to the LED chips. Also, the electrodes for crimping the FPC were arranged so as to overlap the five reinforcing members 31 corresponding to the FPC.

(FPC crimping process)
The FPC was crimped using this crimping device CBM-13 (manufactured by Ohashi Seisakusho). The indentation pressure is 250 kPa.

(Confirm lighting)
After crimping the FPC, the LED lighting was confirmed, and the LED was lit, and electrical connection was confirmed without disconnection or the like.

<Comparative example>
Except for using the area of five reinforcing members of the example as the reinforcing member corresponding to the LED chip, and using the area of the five reinforcing members of the example as the reinforcing member corresponding to the FPC. A wiring board was formed by the same method. Here, the area of five reinforcing members in the embodiment means 5 mm×25 mm square. In the LED lighting check immediately after formation, the LED was lit, and electrical connection was confirmed without disconnection or the like.

<Results>
The FPC crimped electrode part was stretched by 150% in parallel with the direction in which the FPC electrodes are arranged (←Please correct if there is an appropriate expression), and LED lighting was confirmed. As a result, it was confirmed that the LED was lit in the example, but the LED was not lit in the comparative example. As a result, it was confirmed that the embodiment followed the shape without disconnection or the like when elongated in the direction in which the electrodes were arranged.

<Example 2>
In the present Example 2, the reinforcing member of 5 mm×25 mm square is the same as in Example 1 up to the step of bonding.

(Incision process)
After bonding, in order to divide the reinforcing member corresponding to the LED chip and the reinforcing member corresponding to the FPC into five parts when viewed from above, cuts were made by a laser so as to penetrate the upper and lower sides of the substrate. As a result, the reinforcing member was divided into five 5 mm squares. When viewed in the normal direction, each reinforcing member is fully notched.

(FPC crimping process)
The FPC was crimped using this crimping device CBM-13 (manufactured by Ohashi Seisakusho). The indentation pressure is 250 kPa.

(Confirm lighting)
After crimping the FPC, the LED lighting was confirmed, and the LED was lit, and electrical connection was confirmed without disconnection or the like.

<Comparative Example 2>
A wiring board was formed in the same manner as in Example 2, except that no cut was made. In the LED lighting check immediately after formation, the LED was lit, and electrical connection was confirmed without disconnection or the like.

<Results>
The FPC crimped electrode portion was stretched by 150% in parallel with the direction in which the FPC electrodes are arranged, and LED lighting was confirmed. As a result, it was confirmed that the LED was lit in the example, but the LED was not lit in the comparative example. As a result, it was confirmed that the embodiment followed the shape without disconnection or the like when elongated in the direction in which the electrodes were arranged.

10 Wiring board 20 Base material 21 First surface 22 Second surface 31 Reinforcing member 40 Support substrate 41 First surface 42 Second surface 51 Electronic component 52 Wiring 60 Adhesive layer U Notch Z Boundary vicinity

Claims (38)

a substrate comprising a first surface and a second surface opposite the first surface and having a first modulus of elasticity;
a plurality of wires positioned on the first surface side of the base material and connected to electrodes of a plurality of electronic components mounted on a wiring substrate;
a plurality of reinforcing members provided corresponding to each of the plurality of electronic components, the plurality of reinforcing members being mounted on the wiring board when viewed along the normal direction of the first surface of the base material; and a plurality of reinforcing members having a second elastic modulus greater than the first elastic modulus and correspondingly at least partially overlapping the electronic components of the
each of the plurality of wirings has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base material;
When the wiring board is viewed along the normal direction of the first surface of the base material, a notch is formed between two adjacent reinforcing members so as to communicate from the first surface side of the base material. wiring board. The base material communicates between two adjacent reinforcing members from the first surface or the second surface of the base material when viewed along the normal direction of the first surface of the base material. 2. The wiring board according to claim 1 , wherein a notch is formed. The plurality of reinforcing members are arranged such that adjacent reinforcing members are separated from each other with a gap or are in contact with each other when viewed along the normal direction of the first surface of the base material, The wiring board according to claim 2 . The wiring board according to any one of claims 1 to 3 , wherein the notch is formed in the wiring board in a dotted line shape when viewed along the normal direction of the first surface of the base material. . a substrate comprising a first surface and a second surface opposite the first surface and having a first modulus of elasticity;
a plurality of wires positioned on the first surface side of the base material and connected to electrodes of a plurality of electronic components mounted on a wiring substrate;
When viewed along the normal direction of the first surface of the base material, the plurality of electronic components mounted on the wiring board are at least partially overlapped with each other, and the elastic modulus is greater than the first elastic modulus. a common reinforcing member having a second modulus of elasticity greater than
each of the plurality of wirings has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base material;
The wiring board is formed with a cut reaching the surface of the reinforcing member. 6. The wiring board according to claim 5 , wherein said auxiliary member is partially formed with an auxiliary member notch communicating with said notch. 7. The wiring board according to any one of claims 1 to 6 , wherein one end of the cut of the wiring board extends to an end of the wiring board when viewed along the normal direction of the first surface of the base material. The wiring board according to item 1. 8. The wiring board according to claim 7 , wherein the shape of the other end of said cut of said wiring board includes a rectangle or a circle when viewed along the normal direction of said first surface of said base material. 7. The configuration according to any one of claims 1 to 6 , wherein the shape of both ends of the cut of the wiring board includes a rectangle or a circle when viewed along the normal direction of the first surface of the base material. wiring board. 10. The wiring board according to claim 1 , wherein said cut of said wiring board extends from said first surface side of said base material into said base material. 10. The wiring board according to claim 1 , wherein said cut of said wiring board extends from said second surface side of said base material into said base material. 10. The cut of the wiring board according to any one of claims 1 to 9 , wherein the cut extends from the first surface side of the base material to the second surface side of the base material so as to penetrate the base material. The wiring board according to item 1. 5. The wiring board according to claim 1 , wherein said cut of said wiring board extends so as to penetrate between said two adjacent reinforcing members. 10. The wiring board according to claim 1 , wherein said cut of said wiring board extends from said first surface side of said base material to inside said reinforcing member. 10. The wiring board according to claim 1 , wherein said notch of said wiring board extends from said second surface side of said base material into said reinforcing member. 10. The notch of the wiring board according to any one of claims 1 to 9 , wherein the notch extends from the first surface side of the base material to the second surface side of the base material so as to penetrate the reinforcing member. The wiring board according to item 1. 17. The wiring board according to any one of claims 1 to 16 , wherein said notches of said wiring board are formed in said wiring board using a laser, die cutting, or a blade. The plurality of reinforcing members are portions that overlap the bellows-shaped portion of the wiring when viewed along the normal direction of the first surface of the base material, and the wiring board is mounted on a mounted body. 18. The wiring board according to any one of claims 1 to 17 , arranged in a region that is locally pushed in when the wiring board is pressed. The wiring board according to any one of claims 1 to 4 , wherein the plurality of reinforcing members have the same rectangular shape when viewed along the normal direction of the first surface of the base material. 2. A supporting substrate positioned between said wiring and said first surface of said base material, having a third elastic modulus larger than said first elastic modulus, and supporting said wiring, further comprising a support substrate according to claim 1. 20. The wiring board according to any one of items 19 to 19 . a support substrate positioned between the wiring and the first surface of the base material, having a third elastic modulus larger than the first elastic modulus, and supporting the wiring;
The wiring board according to any one of claims 1 to 17 , wherein the notch of the wiring board is also continuously formed in the supporting substrate constituting the wiring board. 18. The cut in the wiring board according to any one of claims 1 to 17, wherein a cross section of the cut in the wiring board perpendicular to the first surface of the base material seen from the end H side of the wiring board has a linear shape. The wiring board according to the item. 18. The cut of the wiring board, wherein a cross section of the cut of the wiring board perpendicular to the first surface of the base material viewed from the end of the wiring board has an inverted triangular groove shape. The wiring board according to any one of the items. 18. The cut in the wiring board according to any one of claims 1 to 17, wherein a cross section perpendicular to the first surface of the base material viewed from the end of the wiring board has a fan-shaped groove shape. 1. The wiring board according to claim 1. 18. The cut in the wiring board according to any one of claims 1 to 17, wherein a cross section perpendicular to the first surface of the base material viewed from the end of the wiring board has a concave groove shape. The wiring board according to item 1. The accordion-shaped portion is an end portion of the electronic component mounted on the wiring board when viewed along the normal direction of the first surface of the base material on the first surface side of the base material. 26. The first bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the substrate in the vicinity of the boundary between the substrate and the wiring. The wiring board according to item 1. The accordion-shaped portion extends from the electronic component mounted on the wiring board to the boundary when viewed along the normal direction of the first surface of the base material on the first surface side of the base material. 27. The wiring board according to claim 26 , further comprising a second bellows portion of said wiring in a region farther than near. The period of peaks and troughs of the first bellows-shaped portion of the wiring in the vicinity of the boundary is greater than the cycle of peaks and troughs of the second bellows-shaped portion of the wiring. 28. The wiring board of claim 27 , which is smaller or larger. The amplitude of peaks and valleys of the first accordion-shaped portion of the wiring near the boundary is larger or smaller than the amplitude of peaks and valleys of the second accordion-shaped portion of the wiring, The wiring board according to claim 28 . A portion of the wiring that does not overlap the reinforcing member when viewed along the normal direction of the first surface has a plurality of peaks and valleys aligned along the in-plane direction of the first surface of the base material. 28. The wiring board according to claim 27 , wherein said second accordion-shaped portion includes a portion. 31. The reinforcing member of any one of claims 1-30 , wherein the reinforcing member is located on the first side of the substrate, on the second side of the substrate, or within the substrate. wiring board. 32. The wiring board according to claim 1, wherein the amplitude of said accordion-shaped portion of said wiring is 1 [mu]m or more. A resistance value of the wiring in a first state in which a tensile stress along the in-plane direction of the first surface of the base material is not applied to the base material is referred to as a first resistance value, and a tensile stress is applied to the base material. When the resistance value of the wiring in the second state in which the base material is stretched by 30% compared to the first state in the in-plane direction of the first surface is referred to as the second resistance value, 33. The wiring board according to claim 1, wherein the ratio of the absolute values of the difference between said first resistance value and said second resistance value is 20% or less. 34. The wiring board according to any one of claims 1 to 33 , wherein the base material contains silicone rubber. 35. The wiring board according to any one of claims 1 to 34 , wherein said reinforcing member comprises a metal layer. A method for manufacturing a wiring board,
a first step of applying a tensile stress to a substrate comprising a first surface and a second surface opposite the first surface and having a first modulus of elasticity to elongate the substrate;
a second step of providing wiring on the first surface side of the base material in an extended state;
a third step of removing the tensile stress from the substrate;
The wiring board includes a plurality of reinforcing members provided corresponding to each of the plurality of electronic components, and the wiring board has a plurality of reinforcing members when viewed along the normal direction of the first surface of the base material. a plurality of reinforcing members at least partially corresponding to the plurality of electronic components to be mounted and having a second elastic modulus larger than the first elastic modulus;
each of the plurality of wirings has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base material;
The wiring board manufacturing method further includes a cut forming step of forming a cut communicating between two adjacent reinforcing members when viewed along the normal direction of the first surface of the base material. , a method for manufacturing a wiring board. A method for manufacturing a wiring board,
a first step of applying a tensile stress to a substrate comprising a first surface and a second surface opposite the first surface and having a first modulus of elasticity to elongate the substrate;
a second step of providing wiring on the first surface side of the base material in an extended state;
a third step of removing the tensile stress from the substrate;
The wiring board overlaps at least partially corresponding to each of the plurality of electronic components mounted on the wiring board when viewed along the normal direction of the first surface of the base material, a common reinforcing member having a second modulus of elasticity greater than the modulus of elasticity of
each of the plurality of wirings has a bellows-shaped portion including a plurality of peaks and valleys arranged along the in-plane direction of the first surface of the base material;
A method for manufacturing a wiring board, further comprising a cut forming step of forming a cut in the wiring board. 38. The method of manufacturing a wiring board according to claim 36, wherein said notch of said wiring board is formed in said wiring board using a laser, die cutting, or a blade.

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