CN112689405A - Production process of HDI circuit board - Google Patents
Production process of HDI circuit board Download PDFInfo
- Publication number
- CN112689405A CN112689405A CN202011517434.0A CN202011517434A CN112689405A CN 112689405 A CN112689405 A CN 112689405A CN 202011517434 A CN202011517434 A CN 202011517434A CN 112689405 A CN112689405 A CN 112689405A
- Authority
- CN
- China
- Prior art keywords
- layer
- outer layer
- machine
- circuit
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention discloses a production process of an HDI circuit board, which relates to the technical field of HDI circuit boards and comprises the following steps: the method comprises the following steps: (1) cutting a board (2), making an inner layer circuit (3), automatically and optically inspecting the inner layer circuit (4), laminating the outer layer (5), mechanically drilling the outer layer (6), and plating the outer layer: (7) manufacturing (8) a secondary outer layer circuit, automatically optically inspecting (9) the secondary outer layer circuit, performing brown oxidation (10), plugging (11) the resin plug hole (11), pressing (12) the outer layer to reduce copper, performing brown oxidation (13), performing laser drilling (14), performing mechanical drilling (15) on the outer layer, performing copper deposition on the outer layer, electroplating (16), manufacturing (17) the outer layer circuit, automatically optically inspecting (18) the outer layer circuit, performing welding prevention (green oil), manufacturing (19) the chemically deposited nickel gold (20), molding (21) the chemically deposited nickel gold (22), performing appearance inspection (23), and packaging with oxidation resistance (24); the invention has the advantages of low yield, low process cost and the like.
Description
Technical Field
The invention relates to the technical field of HDI circuit boards, in particular to a production process of an HDI circuit board.
Background
HDI is an abbreviation for high density interconnect, a type of circuit board for producing printed circuit boards, a circuit board with a relatively high line distribution density using micro-blind buried via technology; HDI is a compact product designed specifically for small volume users; the modular parallel connection design is adopted, the capacity of one module is 1000VA, the module is naturally cooled and can be directly placed into a 19' rack, and 6 modules can be connected in parallel at most; the product adopts a full digital signal processing technology and a plurality of patent technologies, has full-range adaptive load capacity and strong short-time overload capacity, and can not consider load power factors and peak factors.
The HDI high-density printed circuit board has the advantages of high assembly density, small volume, light weight, convenience in installation and high reliability, is suitable for assembling small and miniaturized high-performance electronic products, but has a complex production process and low product yield, and therefore the HDI high-density printed circuit board production process is provided
Disclosure of Invention
The technical problem to be solved by the invention is to provide a production process of an HDI circuit board, which is used for solving the problem of low yield of products manufactured by the HDI circuit board production process in the prior art described in the background technology.
In order to achieve the above purpose, the present invention provides the following technical solutions: a production process of an HDI circuit board comprises the following steps:
(1) plate cutting:
selecting FR-4 grade circuit board raw materials, cutting the circuit raw materials by using an automatic cutting machine according to customer requirements to obtain a raw material plate, wherein the raw material plate consists of epoxy resin at a middle layer and copper foils positioned at an upper layer and a lower layer of the epoxy resin, and an insulating material is arranged between the copper foils and the epoxy resin to obtain the raw material plate;
(2) manufacturing an inner layer circuit:
firstly, roughening and cleaning the surface of the copper foil on the raw material plate cut in the step 1 by using an inner layer pre-browning machine;
then, an inner-layer film pressing machine is adopted to paste a layer of photosensitive material on the surface of the copper foil; the inner lamination press softens the dry film resist agent through a water film and adopts a vertical ink coating technology;
then, transferring the circuit pattern on the film to the surface of the copper foil by adopting an inner layer automatic exposure machine, and carrying out photosynthesis on a dry film at the position of the circuit pattern to form a protective layer on the circuit;
finally, an inner layer developing \ etching \ film stripping machine is adopted to protect the needed patterns, and the copper foil on the unneeded patterns is etched away to form circuits and other patterns;
(3) automatic optical inspection of inner layer circuit:
inspecting defective products in the raw material plate manufactured by the inner layer circuit in the step 2 by using an inner layer automatic optical inspection machine, and extracting the defective products; in the detection process, image capture and automatic alignment are carried out on the graph through a CCD, the obtained image is compared with the graph stored in a computer, and the difference/defect is automatically found out;
then, repairing the defective products through an inner-layer VRS machine, and putting the repaired defective products and good products together;
(4) pressing the secondary outer layer:
firstly, roughening and cleaning the surface of the secondary outer layer copper foil by using an inner layer brown oxidation machine;
then, a secondary outer layer pressing machine is adopted to press the non-defective raw material plate in the step 3 as a secondary outer layer inner layer plate, a secondary outer layer prepreg and a secondary outer layer copper foil to form a secondary outer layer multilayer plate, and the secondary outer layer prepreg is arranged between the secondary inner layer plate and the secondary outer layer copper foil; in the pressing process, a CCD technology is also adopted to read the graph, and the graph is automatically aligned through computer calculation, automatic compensation and a mechanical automatic device;
(5) mechanically drilling a secondary outer layer:
drilling holes on the secondary outer layer multilayer board by using a secondary outer layer numerical control drilling machine; in the process of positioning the inner layer and the outer layer of the mechanical drilling, adopting ray perspective and ray receiving CCD technology to grab alignment patterns and automatically align/position the drilling;
(6) secondary outer layer copper deposition and electroplating:
performing copper deposition and electroplating on the secondary outer layer multilayer board punched in the step 5 to plate a layer of thin copper on the hole wall of the secondary outer layer multilayer board, and then plating a layer of base copper on the surface of the secondary outer layer multilayer board;
(7) manufacturing a secondary outer layer circuit:
firstly, roughening and cleaning the surface of the plated secondary outer layer multilayer board in the step 6 by using a secondary outer layer browning machine;
then, a layer of photosensitive material is pasted on the surface of the base copper of the secondary outer layer multilayer board by using a secondary outer layer film pasting machine; the secondary outer layer film sticking machine softens the dry film resist agent through a water film and adopts a vertical ink coating technology;
then, transferring the circuit pattern on the film to the surface of the base copper by adopting a secondary outer layer automatic exposure machine, and carrying out photosynthesis on a dry film at the position of the circuit pattern to form a protective layer on the circuit;
finally, a secondary outer layer developing \ etching \ film stripping machine is adopted to protect the needed pattern, and the base copper on the pattern which is not needed is etched to form a circuit and other patterns;
(8) automatic optical inspection of the secondary outer layer circuit:
inspecting defective products in the multilayer board of the next outer layer after the inner layer circuit is manufactured in the step 7 by using an automatic optical inspection machine of the next outer layer, and extracting the defective products; in the detection process, image capture and automatic alignment are carried out on the graph through a CCD, the obtained image is compared with the graph stored in a computer, and the difference/defect is automatically found out;
then, repairing the defective products through a secondary outer layer VRS machine, and putting the repaired defective products and good products together;
(9) secondary outer brown oxidation:
roughening and cleaning the base copper surface of the good-quality secondary outer-layer multilayer board in the step 8 by using a secondary outer-layer browning machine;
(10) resin hole plugging:
filling the holes in the secondary outer layer multilayer board in the step 9 with resin by using a secondary outer layer hole filling machine;
(11) outer layer pressing:
pressing the secondary outer layer multilayer board processed in the step 10 as an outer layer inner layer board, an outer layer prepreg and an outer layer copper foil by using an outer layer pressing machine to form an outer layer multilayer board, wherein the outer layer prepreg is arranged between the inner layer board and the outer layer copper foil; in the pressing process, a CCD technology is adopted to read the pattern, and automatic alignment is carried out through computer calculation, automatic compensation and a mechanical automatic device;
(12) reduction of copper and browning
Reducing the thickness of the outer copper foil on the surface of the outer multi-layer board in the step 11 by adopting a copper reducing/brown oxidizing machine, and increasing the absorption of the surface of the outer copper foil on laser;
(13) laser drilling
Drilling the outer-layer multilayer board processed in the step 12 at the position where the blind hole needs to be drilled by using an outer-layer laser drilling machine; the outer layer laser drilling machine places a positioning pattern of a pseudo laser etching hole in the inner layer, and then the positioning pattern is grabbed by the optical CCD to be directly subjected to laser etching; wherein the outer layer laser drilling machine utilizes the instantaneous high temperature generated by the superfine columnar laser beam to strike on the board surface to ablate the thinned and brown oxidized copper layer and the dielectric layer, so that a fine cylindrical hole is formed between the two layers;
(14) mechanically drilling an outer layer:
drilling a through hole in the outer-layer multilayer board processed in the step 13 by using an outer-layer numerical control drilling machine; in the process of positioning the inner layer and the outer layer of the mechanical drilling, adopting ray perspective and ray receiving CCD technology to grab alignment patterns and automatically align/position the drilling;
(15) outer layer copper deposition and electroplating
Performing copper deposition and electroplating on the outer-layer multilayer board punched in the step 14 to plate a layer of thin copper on the hole wall of the outer-layer multilayer board, and then plating a layer of base copper on the surface of the secondary outer-layer multilayer board; the electroplating mode adopts vertical continuous electroplating, and successfully solves the problems of poor glue removal and deposition effect and uneven deposition distribution of the laser blind holes.
(16) Outer layer circuit fabrication
Firstly, roughening and cleaning the surface of the outer-layer multilayer board electroplated in the step 15 by using an outer-layer browning machine;
then, an outer layer film sticking machine is adopted to stick a layer of photosensitive material on the surface of the base copper of the outer layer multi-layer board; the outer-layer film sticking machine softens the dry film resist agent through a water film and adopts a vertical ink coating technology;
then, transferring the circuit pattern on the film to the surface of the base copper by adopting an outer layer automatic exposure machine, and carrying out photosynthesis on a dry film at the position of the circuit pattern to form a protective layer on the circuit;
finally, an outer layer developing \ etching \ film stripping machine is adopted to protect the needed pattern, and the base copper on the pattern which is not needed is etched to form a circuit and other patterns;
(17) automatic optical inspection of outer layer circuit:
inspecting defective products in the outer-layer multilayer board manufactured by the outer-layer circuit in the step 16 by using an outer-layer automatic optical inspection machine, and extracting the defective products; in the detection process, image capture and automatic alignment are carried out on the graph through a CCD, the obtained image is compared with the graph stored in a computer, and the difference/defect is automatically found out;
repairing the defective products through an outer-layer VRS machine, and putting the repaired defective products and good products together to obtain a PCB;
(18) solder mask (green oil) preparation:
firstly, the foreign matters on the surface of the PCB are removed through a green oil pretreatment line,
developing the printing ink on the PCB without the screen printing solder mask by using a green oil automatic exposure machine to expose the copper sheet; the technology adsorbs atomized ink fog beads to the surface of a production plate through high-voltage static electricity to form a uniform coating;
printing characters on the solder mask surface of the PCB by a screen printing machine;
(19) chemical immersion nickel gold
Performing gold immersion manufacturing on the PCB processed in the step 18 through a gold immersion production line, and then coating metal or organic solderability preservative on element pads of the PCB by using an antioxidant production line;
(20) molding:
processing the PCB processed in the step 19 by using a forming machine to form mechanical characteristics;
(21) electrical testing:
carrying out open-short circuit test on the molded PCB by adopting a general test machine, and removing defective products to obtain good products;
(22) and (3) appearance inspection:
comprehensively checking the appearance of the good PCB in the step 21, and removing defective products to obtain good products;
(23) antioxidation:
coating an organic solder mask on the element bonding pads on the good PCB in the step 22 by using an anti-oxidation machine;
(24) packaging:
and (4) packaging the PCB processed in the step (23) by using a vacuum packaging machine.
Preferably: and 7, manufacturing the secondary outer layer alignment target by adopting an equal division target shooting mode and a laser ablation technology.
Preferably: and 10, filling holes in the resin by adopting a nano silver powder and composite material preparation technology.
Preferably: the laser drilling machine in the step 13 uses the superfine columnar laser beam to hit the instantaneous high temperature generated on the board surface to ablate the thinned and brown oxidized copper layer and the dielectric layer.
Preferably: the electroplating mode adopted in the step 15 is a vertical continuous electroplating mode.
The beneficial effect of adopting above technical scheme is:
the adhesion between the prepreg and the copper foil can be increased through the arranged browning machine; the secondary outer layer alignment target is manufactured by adopting an equal target practice mode and a laser ablation technology, and the interlayer alignment degree can be reduced to be within 25 um; by utilizing a vertical continuous electroplating mode and applying a twice electroplating technology, the technical problem of simultaneous electroplating of a high-aspect-ratio conducting hole and a laser blind hole is effectively solved, so that the thermal shock resistance of electroplating of the conducting hole and the blind hole is ensured; the preparation technology of the nano silver powder and the composite material applied to the PCB micropore filling improves the hole filling capacity of the buried hole resin; advanced optical technologies such as laser, CCD and the like are successfully applied to key processes and equipment such as processing, positioning/contraposition and detection of the plate, so that the productivity and the product quality of the device are effectively improved;
the fine line process, the drilling process, the hole metallization electroplating process and the like determine the performance of the product, are difficult points for manufacturing the HDI high-density printed circuit board, and are key technologies for industrialization of the HDI high-density printed circuit board.
Detailed Description
Preferred embodiments of the present invention are described in detail below.
In this embodiment, a production process of an HDI circuit board includes the following steps:
(1) plate cutting:
selecting FR-4 grade circuit board raw materials, cutting the circuit raw materials by using an automatic cutting machine according to customer requirements to obtain a raw material plate, wherein the raw material plate consists of epoxy resin at a middle layer and copper foils positioned at an upper layer and a lower layer of the epoxy resin, and an insulating material is arranged between the copper foils and the epoxy resin to obtain the raw material plate;
(2) manufacturing an inner layer circuit:
firstly, roughening and cleaning the surface of the copper foil on the raw material plate cut in the step 1 by using an inner layer pre-browning machine;
then, an inner-layer film pressing machine is adopted to paste a layer of photosensitive material on the surface of the copper foil; the inner lamination machine softens the dry film resist agent through the water film to reduce the viscosity of the dry film and enhance the fluidity of the dry film, so that the dry film can be more fully filled into the pit of the plate surface, the adhesion force of the dry film and the plate surface is greatly improved, and the yield of products is improved;
then, transferring the circuit pattern on the film to the surface of the copper foil by adopting an inner layer automatic exposure machine, and carrying out photosynthesis on a dry film at the position of the circuit pattern to form a protective layer on the circuit;
finally, an inner layer developing \ etching \ film stripping machine is adopted to protect the needed patterns, the copper foil on the unneeded patterns is etched to form circuits and other patterns, and an equal division targeting mode and a laser ablation technology are adopted to manufacture a secondary outer layer alignment target;
(3) automatic optical inspection of inner layer circuit:
inspecting defective products in the raw material plate manufactured by the inner layer circuit in the step 2 by using an inner layer automatic optical inspection machine, and extracting the defective products; in the detection process, image capture and automatic alignment are carried out on the graph through a CCD, the obtained image is compared with the graph stored in a computer, and the difference/defect is automatically found out;
then, repairing the defective products through an inner-layer VRS machine, and putting the repaired defective products and good products together;
(4) pressing the secondary outer layer:
firstly, roughening and cleaning the surface of the secondary outer layer copper foil by using an inner layer brown oxidation machine;
then, a secondary outer layer pressing machine is adopted to press the non-defective raw material plate in the step 3 as a secondary outer layer inner layer plate, a secondary outer layer prepreg and a secondary outer layer copper foil to form a secondary outer layer multilayer plate, and the secondary outer layer prepreg is arranged between the secondary inner layer plate and the secondary outer layer copper foil; in the pressing process, a CCD technology is also adopted to read the graph, and the graph is automatically aligned through computer calculation, automatic compensation and a mechanical automatic device;
(5) mechanically drilling a secondary outer layer:
drilling holes on the secondary outer layer multilayer board by using a secondary outer layer numerical control drilling machine; in the process of positioning the inner layer and the outer layer of the mechanical drilling, adopting ray perspective and ray receiving CCD technology to grab alignment patterns and automatically align/position the drilling;
(6) secondary outer layer copper deposition and electroplating:
performing copper deposition and electroplating on the secondary outer layer multilayer board punched in the step 5 to plate a layer of thin copper on the hole wall of the secondary outer layer multilayer board, and then plating a layer of base copper on the surface of the secondary outer layer multilayer board;
(7) manufacturing a secondary outer layer circuit:
firstly, roughening and cleaning the surface of the plated secondary outer layer multilayer board in the step 6 by using a secondary outer layer browning machine;
then, a layer of photosensitive material is pasted on the surface of the base copper of the secondary outer layer multilayer board by using a secondary outer layer film pasting machine; the secondary outer layer film sticking machine softens the dry film resist through a water film so as to reduce the viscosity of the dry film and enhance the fluidity of the dry film, so that the dry film can be more fully filled into the pit of the plate surface, the adhesion force between the dry film and the plate surface is greatly improved, and the yield of products is improved;
then, transferring the circuit pattern on the film to the surface of the base copper by adopting a secondary outer layer automatic exposure machine, and carrying out photosynthesis on a dry film at the position of the circuit pattern to form a protective layer on the circuit;
finally, a secondary outer layer developing \ etching \ film stripping machine is adopted to protect the needed pattern, and the base copper on the pattern which is not needed is etched to form a circuit and other patterns; manufacturing a secondary outer layer alignment target by adopting an equal target practice mode and a laser ablation technology;
(8) automatic optical inspection of the secondary outer layer circuit:
inspecting defective products in the multilayer board of the next outer layer after the inner layer circuit is manufactured in the step 7 by using an automatic optical inspection machine of the next outer layer, and extracting the defective products; in the detection process, image capture and automatic alignment are carried out on the graph through a CCD, the obtained image is compared with the graph stored in a computer, and the difference/defect is automatically found out;
then, repairing the defective products through a secondary outer layer VRS machine, and putting the repaired defective products and good products together;
(9) secondary outer brown oxidation:
roughening and cleaning the base copper surface of the good-quality secondary outer-layer multilayer board in the step 8 by using a secondary outer-layer browning machine;
(10) resin hole plugging:
filling the holes in the secondary outer layer multilayer board in the step 9 with resin by using a secondary outer layer hole filling machine; the resin hole plugging mode adopts the preparation technology of nano silver powder and composite materials to plug the holes with the resin, so that the hole plugging capability of the buried hole resin is improved;
(11) outer layer pressing:
pressing the secondary outer layer multilayer board processed in the step 10 as an outer layer inner layer board, an outer layer prepreg and an outer layer copper foil by using an outer layer pressing machine to form an outer layer multilayer board, wherein the outer layer prepreg is arranged between the inner layer board and the outer layer copper foil; in the pressing process, a CCD technology is adopted to read the pattern, and automatic alignment is carried out through computer calculation, automatic compensation and a mechanical automatic device;
(12) reduction of copper and browning
Reducing the thickness of the outer copper foil on the surface of the outer multi-layer board in the step 11 by adopting a copper reducing/brown oxidizing machine, and increasing the absorption of the surface of the outer copper foil on laser;
(13) laser drilling
Drilling the outer-layer multilayer board processed in the step 12 at the position where the blind hole needs to be drilled by using an outer-layer laser drilling machine; the outer layer laser drilling machine places a positioning pattern of a pseudo laser etching hole in the inner layer, and then the positioning pattern is grabbed by the optical CCD to be directly subjected to laser etching; wherein the outer layer laser drilling machine utilizes the instant high temperature generated by the superfine columnar laser beam to strike on the board surface to ablate the thinned brown oxidized copper layer and the dielectric layer, so that a fine cylindrical hole is formed between the two layers, and the hole drilling aperture and precision are from the traditional 6mil (150 mu m) and 1mil (25.4 mu m) to 4mil (100 mu m) and 0.6mil (15 mu m);
(14) mechanically drilling an outer layer:
drilling a through hole in the outer-layer multilayer board processed in the step 13 by using an outer-layer numerical control drilling machine; in the process of positioning the inner layer and the outer layer of the mechanical drilling, adopting ray perspective and ray receiving CCD technology to grab alignment patterns and automatically align/position the drilling;
(15) outer layer copper deposition and electroplating
Performing copper deposition and electroplating on the outer-layer multilayer board punched in the step 14 to plate a layer of thin copper on the hole wall of the outer-layer multilayer board, and then plating a layer of base copper on the surface of the secondary outer-layer multilayer board; the electroplating mode adopts a vertical continuous electroplating process, successfully solves the problems of poor glue removal and deposition effects and uneven deposition distribution of laser blind holes, greatly reduces the production cost and improves the reliability of products;
(16) outer layer circuit fabrication
Firstly, roughening and cleaning the surface of the outer-layer multilayer board electroplated in the step 15 by using an outer-layer browning machine;
then, an outer layer film sticking machine is adopted to stick a layer of photosensitive material on the surface of the base copper of the outer layer multi-layer board; the outer-layer film sticking machine softens the dry film resist through a water film so as to reduce the viscosity of the dry film and enhance the fluidity of the dry film, so that the dry film can be more fully filled into the pit of the plate surface, the adhesion force between the dry film and the plate surface is greatly improved, and the yield of products is improved;
then, transferring the circuit pattern on the film to the surface of the base copper by adopting an outer layer automatic exposure machine, and carrying out photosynthesis on a dry film at the position of the circuit pattern to form a protective layer on the circuit;
finally, an outer layer developing \ etching \ film stripping machine is adopted to protect the needed pattern, and the base copper on the pattern which is not needed is etched to form a circuit and other patterns;
(17) automatic optical inspection of outer layer circuit:
inspecting defective products in the outer-layer multilayer board manufactured by the outer-layer circuit in the step 16 by using an outer-layer automatic optical inspection machine, and extracting the defective products; in the detection process, image capture and automatic alignment are carried out on the graph through a CCD, the obtained image is compared with the graph stored in a computer, and the difference/defect is automatically found out;
repairing the defective products through an outer-layer VRS machine, and putting the repaired defective products and good products together to obtain a PCB;
(18) solder mask (green oil) preparation:
firstly, the foreign matters on the surface of the PCB are removed through a green oil pretreatment line,
developing the printing ink on the PCB without the screen printing solder mask by using a green oil automatic exposure machine to expose the copper sheet; the technology adsorbs atomized ink fog beads to the surface of a production plate through high-voltage static electricity to form a uniform coating; manual operation can be effectively reduced, and the automation level and the production efficiency of production are improved;
printing characters on the solder mask surface of the PCB by a screen printing machine;
(19) chemical immersion nickel gold
Performing gold immersion manufacturing on the PCB processed in the step 18 through a gold immersion production line, and then coating metal or organic solderability preservative on element pads of the PCB by using an antioxidant production line;
(20) molding:
processing the PCB processed in the step 19 by using a forming machine to form mechanical characteristics;
(21) electrical testing:
carrying out open-short circuit test on the molded PCB by adopting a general test machine, and removing defective products to obtain good products;
(22) and (3) appearance inspection:
comprehensively checking the appearance of the good PCB in the step 21, and removing defective products to obtain good products;
(23) antioxidation:
coating an organic solder mask on the element bonding pads on the good PCB in the step 22 by using an anti-oxidation machine;
(24) packaging:
and (4) packaging the PCB processed in the step (23) by using a vacuum packaging machine.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various changes and modifications can be made without departing from the inventive concept of the present invention, and these changes and modifications are all within the scope of the present invention.
Claims (5)
1. A production process of an HDI circuit board is characterized by comprising the following steps: the method comprises the following steps:
(1) plate cutting:
selecting FR-4 grade circuit board raw materials, cutting the circuit raw materials by using an automatic cutting machine according to customer requirements to obtain a raw material plate, wherein the raw material plate consists of epoxy resin at a middle layer and copper foils positioned at an upper layer and a lower layer of the epoxy resin, and an insulating material is arranged between the copper foils and the epoxy resin to obtain the raw material plate;
(2) manufacturing an inner layer circuit:
firstly, roughening and cleaning the surface of the copper foil on the raw material plate cut in the step 1 by using an inner layer pre-browning machine;
then, an inner-layer film pressing machine is adopted to paste a layer of photosensitive material on the surface of the copper foil; the inner lamination press softens the dry film resist agent through a water film and adopts a vertical ink coating technology;
then, transferring the circuit pattern on the film to the surface of the copper foil by adopting an inner layer automatic exposure machine, and carrying out photosynthesis on a dry film at the position of the circuit pattern to form a protective layer on the circuit;
finally, an inner layer developing \ etching \ film stripping machine is adopted to protect the needed patterns, and the copper foil on the unneeded patterns is etched away to form circuits and other patterns;
(3) automatic optical inspection of inner layer circuit:
inspecting defective products in the raw material plate manufactured by the inner layer circuit in the step 2 by using an inner layer automatic optical inspection machine, and extracting the defective products; in the detection process, image capture and automatic alignment are carried out on the graph through a CCD, the obtained image is compared with the graph stored in a computer, and the difference/defect is automatically found out;
then, repairing the defective products through an inner-layer VRS machine, and putting the repaired defective products and good products together;
(4) pressing the secondary outer layer:
firstly, roughening and cleaning the surface of the secondary outer layer copper foil by using an inner layer brown oxidation machine;
then, a secondary outer layer pressing machine is adopted to press the non-defective raw material plate in the step 3 as a secondary outer layer inner layer plate, a secondary outer layer prepreg and a secondary outer layer copper foil to form a secondary outer layer multilayer plate, and the secondary outer layer prepreg is arranged between the secondary inner layer plate and the secondary outer layer copper foil; in the pressing process, a CCD technology is also adopted to read the graph, and the graph is automatically aligned through computer calculation, automatic compensation and a mechanical automatic device;
(5) mechanically drilling a secondary outer layer:
drilling holes on the secondary outer layer multilayer board by using a secondary outer layer numerical control drilling machine; in the process of positioning the inner layer and the outer layer of the mechanical drilling, adopting ray perspective and ray receiving CCD technology to grab alignment patterns and automatically align/position the drilling;
(6) secondary outer layer copper deposition and electroplating:
performing copper deposition and electroplating on the secondary outer layer multilayer board punched in the step 5 to plate a layer of thin copper on the hole wall of the secondary outer layer multilayer board, and then plating a layer of base copper on the surface of the secondary outer layer multilayer board;
(7) manufacturing a secondary outer layer circuit:
firstly, roughening and cleaning the surface of the plated secondary outer layer multilayer board in the step 6 by using a secondary outer layer browning machine;
then, a layer of photosensitive material is pasted on the surface of the base copper of the secondary outer layer multilayer board by using a secondary outer layer film pasting machine; the secondary outer layer film sticking machine softens the dry film resist agent through a water film and adopts a vertical ink coating technology;
then, transferring the circuit pattern on the film to the surface of the base copper by adopting a secondary outer layer automatic exposure machine, and carrying out photosynthesis on a dry film at the position of the circuit pattern to form a protective layer on the circuit;
finally, a secondary outer layer developing \ etching \ film stripping machine is adopted to protect the needed pattern, and the base copper on the pattern which is not needed is etched to form a circuit and other patterns;
(8) automatic optical inspection of the secondary outer layer circuit:
inspecting defective products in the multilayer board of the next outer layer after the inner layer circuit is manufactured in the step 7 by using an automatic optical inspection machine of the next outer layer, and extracting the defective products; in the detection process, image capture and automatic alignment are carried out on the graph through a CCD, the obtained image is compared with the graph stored in a computer, and the difference/defect is automatically found out;
then, repairing the defective products through a secondary outer layer VRS machine, and putting the repaired defective products and good products together;
(9) secondary outer brown oxidation:
roughening and cleaning the base copper surface of the good-quality secondary outer-layer multilayer board in the step 8 by using a secondary outer-layer browning machine;
(10) resin hole plugging:
filling the holes in the secondary outer layer multilayer board in the step 9 with resin by using a secondary outer layer hole filling machine;
(11) outer layer pressing:
pressing the secondary outer layer multilayer board processed in the step 10 as an outer layer inner layer board, an outer layer prepreg and an outer layer copper foil by using an outer layer pressing machine to form an outer layer multilayer board, wherein the outer layer prepreg is arranged between the inner layer board and the outer layer copper foil; in the pressing process, a CCD technology is adopted to read the pattern, and automatic alignment is carried out through computer calculation, automatic compensation and a mechanical automatic device;
(12) reduction of copper and browning
Reducing the thickness of the outer copper foil on the surface of the outer multi-layer board in the step 11 by adopting a copper reducing/brown oxidizing machine, and increasing the absorption of the surface of the outer copper foil on laser;
(13) laser drilling
Drilling the outer-layer multilayer board processed in the step 12 at the position where the blind hole needs to be drilled by using an outer-layer laser drilling machine; the outer layer laser drilling machine places a positioning pattern of a pseudo laser etching hole in the inner layer, and then the positioning pattern is grabbed by the optical CCD to be directly subjected to laser etching; wherein the outer layer laser drilling machine utilizes the instantaneous high temperature generated by the superfine columnar laser beam to strike on the board surface to ablate the thinned and brown oxidized copper layer and the dielectric layer, so that a fine cylindrical hole is formed between the two layers;
(14) mechanically drilling an outer layer:
drilling a through hole in the outer-layer multilayer board processed in the step 13 by using an outer-layer numerical control drilling machine; in the process of positioning the inner layer and the outer layer of the mechanical drilling, adopting ray perspective and ray receiving CCD technology to grab alignment patterns and automatically align/position the drilling;
(15) outer layer copper deposition and electroplating
Performing copper deposition and electroplating on the outer-layer multilayer board punched in the step 14 to plate a layer of thin copper on the hole wall of the outer-layer multilayer board, and then plating a layer of base copper on the surface of the secondary outer-layer multilayer board; the electroplating mode adopts vertical continuous electroplating, and successfully solves the problems of poor glue removal and deposition effect and uneven deposition distribution of the laser blind holes.
(16) Outer layer circuit fabrication
Firstly, roughening and cleaning the surface of the outer-layer multilayer board electroplated in the step 15 by using an outer-layer browning machine;
then, an outer layer film sticking machine is adopted to stick a layer of photosensitive material on the surface of the base copper of the outer layer multi-layer board; the outer-layer film sticking machine softens the dry film resist agent through a water film and adopts a vertical ink coating technology;
then, transferring the circuit pattern on the film to the surface of the base copper by adopting an outer layer automatic exposure machine, and carrying out photosynthesis on a dry film at the position of the circuit pattern to form a protective layer on the circuit;
finally, an outer layer developing \ etching \ film stripping machine is adopted to protect the needed pattern, and the base copper on the pattern which is not needed is etched to form a circuit and other patterns;
(17) automatic optical inspection of outer layer circuit:
inspecting defective products in the outer-layer multilayer board manufactured by the outer-layer circuit in the step 16 by using an outer-layer automatic optical inspection machine, and extracting the defective products; in the detection process, image capture and automatic alignment are carried out on the graph through a CCD, the obtained image is compared with the graph stored in a computer, and the difference/defect is automatically found out;
repairing the defective products through an outer-layer VRS machine, and putting the repaired defective products and good products together to obtain a PCB;
(18) solder mask (green oil) preparation:
firstly, the foreign matters on the surface of the PCB are removed through a green oil pretreatment line,
developing the printing ink on the PCB without the screen printing solder mask by using a green oil automatic exposure machine to expose the copper sheet; the technology adsorbs atomized ink fog beads to the surface of a production plate through high-voltage static electricity to form a uniform coating;
printing characters on the solder mask surface of the PCB by a screen printing machine;
(19) chemical immersion nickel gold
Performing gold immersion manufacturing on the PCB processed in the step 18 through a gold immersion production line, and then coating metal or organic solderability preservative on element pads of the PCB by using an antioxidant production line;
(20) molding:
processing the PCB processed in the step 19 by using a forming machine to form mechanical characteristics;
(21) electrical testing:
carrying out open-short circuit test on the molded PCB by adopting a general test machine, and removing defective products to obtain good products;
(22) and (3) appearance inspection:
comprehensively checking the appearance of the good PCB in the step 21, and removing defective products to obtain good products;
(23) antioxidation:
coating an organic solder mask on the element bonding pads on the good PCB in the step 22 by using an anti-oxidation machine;
(24) packaging:
and (4) packaging the PCB processed in the step (23) by using a vacuum packaging machine.
2. The HDI circuit board production process according to claim 1, wherein in the step 7, a uniform target shooting mode and a laser ablation technology are adopted to manufacture the secondary outer layer alignment target.
3. The HDI circuit board production process according to claim 1, wherein the step 10 is carried out by resin hole plugging by using a nano silver powder and composite material preparation technology.
4. The HDI circuit board production process according to claim 1, wherein the laser drilling machine in step 13 ablates the thinned and brown oxidized copper layer and the dielectric layer by using the instantaneous high temperature generated by the very fine columnar laser beam.
5. A HDI circuit board manufacturing process according to claim 1, wherein said electroplating manner adopted in step 15 is a vertical continuous electroplating manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011517434.0A CN112689405A (en) | 2020-12-21 | 2020-12-21 | Production process of HDI circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011517434.0A CN112689405A (en) | 2020-12-21 | 2020-12-21 | Production process of HDI circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112689405A true CN112689405A (en) | 2021-04-20 |
Family
ID=75449775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011517434.0A Pending CN112689405A (en) | 2020-12-21 | 2020-12-21 | Production process of HDI circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112689405A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114364157A (en) * | 2021-12-23 | 2022-04-15 | 广东德赛矽镨技术有限公司 | Paster of PCB with double-side welding pad and packaging method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102281726A (en) * | 2011-07-16 | 2011-12-14 | 中山市达进电子有限公司 | Multilayer circuit board method with high density interconnection and high reliability combination |
| CN102869206A (en) * | 2012-09-27 | 2013-01-09 | 电子科技大学 | Method for co-plating metallization of blind holes and through hole of printed circuit board |
| CN105263274A (en) * | 2015-10-28 | 2016-01-20 | 深圳崇达多层线路板有限公司 | Manufacture method of high density interconnection board |
| CN105430939A (en) * | 2015-10-30 | 2016-03-23 | 江苏博敏电子有限公司 | Printed circuit board buried hole resin plugging method |
| CN108040428A (en) * | 2017-12-12 | 2018-05-15 | 惠州市金百泽电路科技有限公司 | The production method that a kind of high-order HDI folds the rigid-flexible combined circuit plate in hole |
-
2020
- 2020-12-21 CN CN202011517434.0A patent/CN112689405A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102281726A (en) * | 2011-07-16 | 2011-12-14 | 中山市达进电子有限公司 | Multilayer circuit board method with high density interconnection and high reliability combination |
| CN102869206A (en) * | 2012-09-27 | 2013-01-09 | 电子科技大学 | Method for co-plating metallization of blind holes and through hole of printed circuit board |
| CN105263274A (en) * | 2015-10-28 | 2016-01-20 | 深圳崇达多层线路板有限公司 | Manufacture method of high density interconnection board |
| CN105430939A (en) * | 2015-10-30 | 2016-03-23 | 江苏博敏电子有限公司 | Printed circuit board buried hole resin plugging method |
| CN108040428A (en) * | 2017-12-12 | 2018-05-15 | 惠州市金百泽电路科技有限公司 | The production method that a kind of high-order HDI folds the rigid-flexible combined circuit plate in hole |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114364157A (en) * | 2021-12-23 | 2022-04-15 | 广东德赛矽镨技术有限公司 | Paster of PCB with double-side welding pad and packaging method |
| CN114364157B (en) * | 2021-12-23 | 2023-11-10 | 广东德赛矽镨技术有限公司 | Patch with double-sided welding pad for PCB and packaging method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100508692C (en) | Method of fabricating printed circuit board having thin core layer | |
| US6586686B1 (en) | Multilayer printed wiring board and method for manufacturing the same | |
| US20100096171A1 (en) | Printed circuit board having round solder bump and method of manufacturing the same | |
| KR100632560B1 (en) | Parallel printed circuit board manufacturing method | |
| US20160135295A1 (en) | Multi-layer circuit board | |
| KR100857165B1 (en) | Method for manufacturing circuit board | |
| CN112689405A (en) | Production process of HDI circuit board | |
| US20080030965A1 (en) | Circuit board structure with capacitors embedded therein and method for fabricating the same | |
| CN112739022A (en) | Process for applying printed circuit board by HDI technology | |
| KR100752017B1 (en) | Manufacturing Method of Printed Circuit Board | |
| CN111432577A (en) | Photosensitive polyimide addition and subtraction circuit process of ultrathin rigid-flex board | |
| KR20170138220A (en) | High-current transfer methods utilizing the printed circuit board | |
| CN103582321A (en) | Multilayer circuit board and manufacturing method thereof | |
| JP2013122962A (en) | Wiring board | |
| KR100674320B1 (en) | PCB with circuit pattern formed by injection nozzle | |
| KR100734244B1 (en) | Multilayer printed circuit board and fabricating method thereof | |
| CN114206001A (en) | High-voltage-resistance MEMS packaging carrier plate and manufacturing process thereof | |
| KR100651422B1 (en) | Method for fabricating the multi layer using Layup Process | |
| CN111405768A (en) | Method for manufacturing multilayer printed circuit board | |
| KR100754071B1 (en) | Method of manufacturing printed circuit board for using all layer interstitial via hole | |
| KR100601473B1 (en) | Method for fabricating printed circuit board using hybrid build-up process | |
| JP7430494B2 (en) | Connection hole forming method for multilayer wiring board and method for manufacturing multilayer wiring board using the same | |
| KR20120031775A (en) | Method of manufacturing coreless substrate | |
| KR20110030160A (en) | Fabricating method of printed circuit board | |
| CN117711953A (en) | Coreless substrate structure and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210420 |