CN102625604B - Manufacturing method for high-density interconnection printed board - Google Patents
Manufacturing method for high-density interconnection printed board Download PDFInfo
- Publication number
- CN102625604B CN102625604B CN201210073637.4A CN201210073637A CN102625604B CN 102625604 B CN102625604 B CN 102625604B CN 201210073637 A CN201210073637 A CN 201210073637A CN 102625604 B CN102625604 B CN 102625604B
- Authority
- CN
- China
- Prior art keywords
- hole
- glued membrane
- copper foil
- diaphragm
- core structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a manufacturing method for a high-density interconnection printed board. The method mainly adopts the scheme that the high-density interconnection printed board comprises an external front structure, an external back structure and a core structure which are respectively manufactured, and finally, hot pressing is carried out for the external front structure, the external back structure and at least one core structure; the external front structure, the external back structure and the core structure adopt the same manufacturing method that the manufacture is based on a dual-face copper foil substrate, so that two layers of lines are synchronously manufactured, and all the external front structure, the external back structure and the core structure can be independently and synchronously manufactured, therefore, compared with the prior art, the method provided by the invention simplifies the processing procedure, and improves efficiency and yield.
Description
Technical field
The invention belongs to the manufacture field of printed circuit board (PCB), relate generally to three kinds of manufacture methods that belong to same inventive concept of high density interconnect printed board.
Background technology
Traditional multi-layer sheet is to form the substrate of circuit and bonding material layer is alternately laminated and hot pressing forms by a plurality of, and recycling boring, and metallized processing procedure in hole, reach the connection conducting function between each sandwich circuit.At electronic product, be tending towards under multi-functional complicated front topic, the contact distance of integrated circuit assembly is dwindled thereupon, the speed that signal transmits improves relatively, the thing followed is that the length locality of distribution between the raising, point of wiring quantity shortens, and these just need to be applied, and high-density line configures and micropore technology is reached target.But because the increase of line density, the packaged type of part constantly upgrades, in order to allow limited PCB area can place more more high performance parts, except line width is thinner, aperture also further dwindles.Consumption electronic products more and more tend to composite multifunction and compact in recent years, and therefore in Electric Design, must import high density interconnect can meet growth requirement.
The manufacture method of general high-density interconnected printed circuit board (HDI plate) is as follows: first make internal layer circuit, deliver to again pressing station stack heat curing-type semi-solid preparation (B Stage) film and Copper Foil and carry out pressing for the first time, make middle level and bore after buried via hole, electro-coppering in buried via hole, then with resin, stopple is got up, again by resin baking-curing, then utilize the mode of belt-sanding to grind off the resin that middle level rat comes, make again middle level circuit (circuit making for the second time), after completing, deliver to again pressing station stack heat curing-type semi-solid preparation film and Copper Foil and carry out pressing for the second time, if there is the design of the micro-guide hole in middle level, need to carry out again laser punching, and electro-coppering in hole, again make middle level circuit (circuit making for the third time), after completing, carry out again after pressing for the third time, carry out again machine drilling, laser punching, electro-coppering in hole, outer-layer circuit, welding resisting layer is made, surface coating layer is made, moulding, electrical measurement ... etc. operation.There is following defect in above-mentioned way:
One, need to, through electro-coppering repeatedly, increase dirty control cost, environmental protection not;
Two, need to, through hot pressing repeatedly, need to consume mass energy;
Three, production procedure need repeatedly circulate, and production hour increases, and causes competitiveness to decline;
Four, the above-mentioned practice also causes the problems such as efficiency and yields be not good simultaneously.
Also have the manufacture method of a kind of high-density interconnected printed circuit board (HDI plate) as follows: Chinese patent 01801603.0, on heat curing-type semi-solid preparation (B Stage) insulating barrier, hole, then in hole, fill full electroconductive paste, then on insulating barrier, stick after Copper Foil hot pressing again by interior (core) layer circuit etching, then two said structures are added to Copper Foil, be placed in respectively the superimposed heating in two sides of internal layer, after make again middle level circuit, repeat above-mentioned processing procedure and obtain outer-layer circuit, also need process cycle repeatedly, more loaded down with trivial details.
Summary of the invention
In order to overcome above-mentioned defect, the invention provides three kinds of manufacture methods of high density interconnect printed board, these three kinds of manufacture methods belong to a total inventive concept, not only processing procedure is simple, and production efficiency and yield high.
The present invention for the technical scheme that solves its technical problem and adopt is:
The manufacture method of a kind of high density interconnect printed board of the present invention, carry out in the steps below:
1., make respectively outer Facad structure, outer structure and core structure;
Wherein, the way of described core structure is as follows: the Double-sided copper clad laminate consisting of base material and Copper Foil is carried out to circuit making, make double-layered circuit board; Then on two line layer surfaces of described double-layered circuit board, all cover one deck glued membrane and layer protecting film, and described diaphragm is positioned at described glued membrane outside; Then to being coated with the described double-layered circuit board of described glued membrane and described diaphragm, hole, the hole of boring comprises some through holes and some the first blind holes that only drills through described glued membrane and described diaphragm; In the hole of then boring toward this step, filled conductive is stuck with paste; Finally described diaphragm is removed, made described core structure, described electroconductive paste protrudes from the surface of described core structure;
Wherein, the way of described outer Facad structure and described outer structure is all as follows: the Double-sided copper clad laminate consisting of base material and Copper Foil is carried out to outer copper foil is windowed and internal layer circuit is made, make and form skin window described outer Facad structure or the described outer structure of Copper Foil and internal layer circuit;
2., hot pressing: by an outer Facad structure, core structure and a described outer structure superpose successively and carry out hot pressing described at least one, after hot pressing, in described outer Facad structure, described core structure and described outer structure three, the mutual corresponding electroconductive paste in position interconnects, and described electroconductive paste connects and its line layer arriving of conducting, again and outer electroconductive paste after hot pressing, be depressed into line layer and flush, make sandwich construction;
3., outer conducting: the described outer Facad structure in the described sandwich construction that 2. step is made and described outer structure are holed, the hole of boring is to run through the window blind hole of Copper Foil and base material of described skin, electro-coppering in the blind hole of boring toward this step, make described in electro-coppering conducting skin window Copper Foil and described internal layer circuit, make described high density interconnect printed board.
Preferably, in the way of described core structure, the hole of boring also comprises that several only drill through the second blind hole of layer protecting film, one deck glued membrane, a sandwich circuit and base material.
The manufacture method of another kind of high density interconnect printed board of the present invention, carry out in the steps below:
1., make respectively outer Facad structure, outer structure and core structure;
Wherein, the way of described core structure is as follows: the Double-sided copper clad laminate consisting of base material and Copper Foil is carried out to circuit making, make double-layered circuit board; Then on two line layer surfaces of described double-layered circuit board, all cover one deck glued membrane and layer protecting film, and described diaphragm is positioned at described glued membrane outside; Then to being coated with the described double-layered circuit board of described glued membrane and described diaphragm, hole, the hole of boring comprises some through holes and some the first blind holes that only drills through described glued membrane and described diaphragm; In the hole of then boring toward this step, filled conductive is stuck with paste; Finally described diaphragm is removed, made described core structure, described electroconductive paste protrudes from the surface of described core structure;
Wherein, the way of described outer Facad structure and described outer structure is all as follows: the Double-sided copper clad laminate consisting of base material and Copper Foil is carried out to outer copper foil is windowed and internal layer circuit is made, make and form the window layer structure of Copper Foil and internal layer circuit of skin; Then on window Copper Foil and described internal layer circuit surface of described skin, all cover layer protecting film; Then to being coated with the described layer structure of described diaphragm, hole, the hole of boring comprises some through holes and some blind holes that only drills through described diaphragm; In the hole of boring toward this step, filled conductive is stuck with paste; Finally described diaphragm is removed, described electroconductive paste protrudes from the surface of described layer structure, makes described outer Facad structure or described outer structure;
2., hot pressing: by an outer Facad structure, core structure and a described outer structure superpose successively and carry out hot pressing described at least one, after hot pressing, in described outer Facad structure, described core structure and described outer structure three, the mutual corresponding electroconductive paste in position interconnects, and described electroconductive paste connects and its line layer arriving of conducting, again and outer electroconductive paste after hot pressing, be depressed into line layer and flush, make described high density interconnect printed board.
Preferably, in the way of described core structure, the hole of boring also comprises that several only drill through the second blind hole of layer protecting film, one deck glued membrane, a sandwich circuit and base material.
The manufacture method of another high density interconnect printed board of the present invention, carry out in the steps below:
1., make respectively outer Facad structure, outer structure and core structure;
Wherein, the way of described core structure is as follows: the Double-sided copper clad laminate consisting of base material and Copper Foil is carried out to circuit making, make double-layered circuit board; Then on two line layer surfaces of described double-layered circuit board, all cover one deck glued membrane and layer protecting film, and described diaphragm is positioned at described glued membrane outside; Then to being coated with the described double-layered circuit board of described glued membrane and described diaphragm, hole, the hole of boring comprises some through holes and some the first blind holes that only drills through described glued membrane and described diaphragm; In the hole of then boring toward this step, filled conductive is stuck with paste; Finally described diaphragm is removed, made described core structure, described electroconductive paste protrudes from the surface of described core structure;
Wherein, the way of described outer Facad structure and described outer structure is all as follows: the Double-sided copper clad laminate consisting of base material and Copper Foil is carried out to outer copper foil is windowed and internal layer circuit is made, make and form the window layer structure of Copper Foil and internal layer circuit of skin; Then at the described skin copper foil surface of windowing, cover layer protecting film, and be positioned at glued membrane outside at described internal layer circuit surface coverage layer protecting film and one deck glued membrane and diaphragm; Then to being coated with the described layer structure of described diaphragm and described glued membrane, hole, the hole of boring comprises some through holes and some blind holes that only drills through described diaphragm and described glued membrane; Toward this step interior filled conductive paste of holing; Finally described diaphragm is removed, make described outer Facad structure or described outer structure, electroconductive paste in described outer Facad structure protrudes from the surface of described outer Facad structure, and the electroconductive paste in described outer structure protrudes from described outer structure surface;
2., hot pressing: by an outer Facad structure, core structure and a described outer structure superpose successively and carry out hot pressing described at least one, after hot pressing, in described outer Facad structure, described core structure and described outer structure three, the mutual corresponding electroconductive paste in position interconnects, and described electroconductive paste connects and its line layer arriving of conducting, again and outer electroconductive paste after hot pressing, be depressed into line layer and flush, make described high density interconnect printed board.
Preferably, in the way of described core structure, the hole of boring also comprises that several only drill through the second blind hole of layer protecting film, one deck glued membrane, a sandwich circuit and base material.
The invention has the beneficial effects as follows: the manufacture method of high density interconnect printed board of the present invention is mainly that high density interconnect printed board is divided into outer Facad structure, outer structure and core structure are made respectively, and the most outer Facad structure, outer structure and at least one core structure carry out hot pressing, and outer Facad structure, the way of outer structure and core structure is all to carry out on the basis of Double-sided copper clad laminate, therefore be that two sandwich circuits are made simultaneously, and outer Facad structure, outer structure and core structure can be made separately simultaneously, therefore with respect to prior art, manufacture method of the present invention has been simplified processing procedure, efficiency and yield have been improved, and the mode that directly filled conductive is stuck with paste in hole is more more succinct than the mode of the heavy copper filling holes with resin after of the general employing of prior art, efficient, and yield is high, the diaphragm using is impaired and pollute for the process circuit avoiding sticking with paste at boring and filled conductive, and the thickness that can effectively control electroconductive paste protrusion is the thickness of diaphragm, tight connection and conducting when the part that electroconductive paste protrudes is conducive to subsequent thermal pressing between outer Facad structure, outer structure and core structure, avoid the empty poor flow causing that connects, and is conducive to promote yield, glued membrane is for strengthening the adhesive force between outer Facad structure, outer structure and core structure.In sum, manufacture method of the present invention not only processing procedure is simple, energy-conserving and environment-protective but also production efficiency and yield high.
Accompanying drawing explanation
Fig. 1 is the way schematic flow sheet of outer Facad structure described in the embodiment of the present invention 1;
Fig. 2 is the way schematic flow sheet of outer structure described in the embodiment of the present invention 1;
Fig. 3 is the way schematic flow sheet of core structure described in the embodiment of the present invention 1;
Fig. 4 is hot pressing schematic flow sheet described in the embodiment of the present invention 1;
Fig. 5 is outer conducting schematic flow sheet described in the embodiment of the present invention 1;
Fig. 6 is the way schematic flow sheet of outer Facad structure described in the embodiment of the present invention 2;
Fig. 7 is the way schematic flow sheet of outer structure described in the embodiment of the present invention 2;
Fig. 8 is the way schematic flow sheet of core structure described in the embodiment of the present invention 2;
Fig. 9 is hot pressing schematic flow sheet described in the embodiment of the present invention 2;
Figure 10 is the way schematic flow sheet of outer Facad structure described in the embodiment of the present invention 3;
Figure 11 is the way schematic flow sheet of outer structure described in the embodiment of the present invention 3;
Figure 12 is the way schematic flow sheet of core structure described in the embodiment of the present invention 3;
Figure 13 is hot pressing schematic flow sheet described in the embodiment of the present invention 3.
Embodiment
Embodiment 1: a kind of manufacture method of high density interconnect printed board, carry out in the steps below:
1., make respectively outer Facad structure Z1, outer structure Y1 and core structure X1;
Wherein, the way of described core structure X1 is as follows: the Double-sided copper clad laminate consisting of base material 11 and Copper Foil 12 is carried out to circuit making, make double-layered circuit board; Then on two line layer surfaces of described double-layered circuit board, all cover one deck glued membrane 13 and layer protecting film 14, and described diaphragm is positioned at described glued membrane outside; Then to being coated with the described double-layered circuit board of described glued membrane and described diaphragm, hole, the hole of boring comprises some through holes 15, some the first blind hole 16 and several the second blind holes 17 that only drills through layer protecting film, one deck glued membrane, a sandwich circuit and base material that only drills through described glued membrane and described diaphragm; In the hole of then boring toward this step, filled conductive sticks with paste 18; Finally described diaphragm is removed, made described core structure X1, described electroconductive paste protrudes from the surface of described core structure;
Wherein, the way of described outer Facad structure Z1 and described outer structure Y1 is all as follows: the Double-sided copper clad laminate consisting of base material 11 and Copper Foil 12 is carried out to outer copper foil is windowed and internal layer circuit is made, make and form skin window described outer Facad structure Z1 or the described outer structure Y1 of Copper Foil and internal layer circuit;
2., hot pressing: by an outer Facad structure Z1, core structure X1 and a described outer structure Y1 superpose successively and carry out hot pressing described at least one, after hot pressing, in described outer Facad structure, described core structure and described outer structure three, the mutual corresponding electroconductive paste in position interconnects, and described electroconductive paste connects and its line layer arriving of conducting, again and outer electroconductive paste after hot pressing, be depressed into line layer and flush, make sandwich construction;
3., outer conducting: the described outer Facad structure in the described sandwich construction that 2. step is made and described outer structure are holed, the hole of boring is to run through the window blind hole 19 of Copper Foil and base material of described skin, electro-coppering in the blind hole of boring toward this step, make described in electro-coppering 10 conductings skin window Copper Foil and described internal layer circuit, make described high density interconnect printed board.
Embodiment 2: a kind of manufacture method of high density interconnect printed board, carry out in the steps below:
1., make respectively outer Facad structure Z2, outer structure Y2 and core structure X2;
Wherein, the way of described core structure X2 is as follows: the Double-sided copper clad laminate consisting of base material 21 and Copper Foil 22 is carried out to circuit making, make double-layered circuit board; Then on two line layer surfaces of described double-layered circuit board, all cover one deck glued membrane 23 and layer protecting film 24, and described diaphragm is positioned at described glued membrane outside; Then to being coated with the described double-layered circuit board of described glued membrane and described diaphragm, hole, the hole of boring comprises some through holes 25, some the first blind hole 26 and several the second blind holes 27 that only drills through layer protecting film, one deck glued membrane, a sandwich circuit and base material that only drills through described glued membrane and described diaphragm; In the hole of then boring toward this step, filled conductive sticks with paste 28; Finally described diaphragm is removed, made described core structure X2, described electroconductive paste protrudes from the surface of described core structure;
Wherein, the way of described outer Facad structure Z2 and described outer structure Y2 is all as follows: the Double-sided copper clad laminate consisting of base material 21 and Copper Foil 22 is carried out to outer copper foil is windowed and internal layer circuit is made, make and form the window layer structure of Copper Foil and internal layer circuit of skin; Then on window Copper Foil and described internal layer circuit surface of described skin, all cover layer protecting film 24; Then to being coated with the described layer structure of described diaphragm, hole, the hole of boring comprises some through holes 29 and some blind holes 20 that only drills through described diaphragm; In the hole of boring toward this step, filled conductive sticks with paste 28; Finally described diaphragm is removed, described electroconductive paste protrudes from the surface of described layer structure, makes described outer Facad structure Z2 or described outer structure Y2;
2., hot pressing: by an outer Facad structure Z2, core structure X2 and a described outer structure Y2 superpose successively and carry out hot pressing described at least one, after hot pressing, in described outer Facad structure, described core structure and described outer structure three, the mutual corresponding electroconductive paste in position interconnects, and described electroconductive paste connects and its line layer arriving of conducting, again and outer electroconductive paste after hot pressing, be depressed into line layer and flush, make described high density interconnect printed board.
Embodiment 3: a kind of manufacture method of high density interconnect printed board, carry out in the steps below:
1., make respectively outer Facad structure Z3, outer structure Y3 and core structure X3;
Wherein, the way of described core structure X3 is as follows: the Double-sided copper clad laminate consisting of base material 31 and Copper Foil 32 is carried out to circuit making, make double-layered circuit board; Then on two line layer surfaces of described double-layered circuit board, all cover one deck glued membrane 33 and layer protecting film 34, and described diaphragm is positioned at described glued membrane outside; Then to being coated with the described double-layered circuit board of described glued membrane and described diaphragm, hole, the hole of boring comprises some through holes 35, some the first blind hole 36 and several the second blind holes 37 that only drills through layer protecting film, one deck glued membrane, a sandwich circuit and base material that only drills through described glued membrane and described diaphragm; In the hole of then boring toward this step, filled conductive sticks with paste 38; Finally described diaphragm is removed, made described core structure X3, described electroconductive paste protrudes from the surface of described core structure;
Wherein, the way of described outer Facad structure Z3 and described outer structure Y3 is all as follows: the Double-sided copper clad laminate consisting of base material 31 and Copper Foil 32 is carried out to outer copper foil is windowed and internal layer circuit is made, make and form the window layer structure of Copper Foil and internal layer circuit of skin; Then at the described skin copper foil surface of windowing, cover layer protecting film 34, and be positioned at glued membrane outside at described internal layer circuit surface coverage layer protecting film 34 and one deck glued membrane 33 and diaphragm; Then to being coated with the described layer structure of described diaphragm and described glued membrane, hole, the hole of boring comprises some through holes 39 and some blind holes 30 that only drills through described diaphragm and described glued membrane; Toward this step interior filled conductive paste 38 of holing; Finally described diaphragm is removed, make described outer Facad structure Z3 or described outer structure Y3, electroconductive paste in described outer Facad structure protrudes from the surface of described outer Facad structure, and the electroconductive paste in described outer structure protrudes from the surface of described outer structure;
2., hot pressing: by an outer Facad structure Z3, core structure X3 and a described outer structure Y3 superpose successively and carry out hot pressing described at least one, after hot pressing, in described outer Facad structure, described core structure and described outer structure three, the mutual corresponding electroconductive paste in position interconnects, and described electroconductive paste connects and its line layer arriving of conducting, again and outer electroconductive paste after hot pressing, be depressed into line layer and flush, make described high density interconnect printed board.
Claims (6)
1. a manufacture method for high density interconnect printed board, is characterized in that: carry out in the steps below:
1., make respectively outer Facad structure, outer structure and core structure;
Wherein, the way of described core structure is as follows: the Double-sided copper clad laminate consisting of base material and Copper Foil is carried out to circuit making, make double-layered circuit board; Then on two line layer surfaces of described double-layered circuit board, all cover one deck glued membrane and layer protecting film, and described diaphragm is positioned at described glued membrane outside; Then to being coated with the described double-layered circuit board of described glued membrane and described diaphragm, hole, the hole of boring comprises some through holes and some the first blind holes that only drills through described glued membrane and described diaphragm; In the hole of then boring toward this step, filled conductive is stuck with paste; Finally described diaphragm is removed, made described core structure, described electroconductive paste protrudes from the surface of described core structure;
Wherein, the way of described outer Facad structure and described outer structure is all as follows: the Double-sided copper clad laminate consisting of base material and Copper Foil is carried out to outer copper foil is windowed and internal layer circuit is made, make and form skin window described outer Facad structure or the described outer structure of Copper Foil and internal layer circuit;
2., hot pressing: by an outer Facad structure, core structure and a described outer structure superpose successively and carry out hot pressing described at least one, after hot pressing, in described outer Facad structure, described core structure and described outer structure three, the mutual corresponding electroconductive paste in position interconnects, and described electroconductive paste connects and its line layer arriving of conducting, again and outer electroconductive paste after hot pressing, be depressed into line layer and flush, make sandwich construction;
3., outer conducting: the described outer Facad structure in the described sandwich construction that 2. step is made and described outer structure are holed, the hole of boring is to run through the window blind hole of Copper Foil and base material of described skin, electro-coppering in the blind hole of boring toward this step, make described in electro-coppering conducting skin window Copper Foil and described internal layer circuit, make described high density interconnect printed board.
2. the manufacture method of high density interconnect printed board as claimed in claim 1, is characterized in that: in the way of described core structure, the hole of boring also comprises that several only drill through the second blind hole of layer protecting film, one deck glued membrane, a sandwich circuit and base material.
3. a manufacture method for high density interconnect printed board, is characterized in that: carry out in the steps below:
1., make respectively outer Facad structure, outer structure and core structure;
Wherein, the way of described core structure is as follows: the Double-sided copper clad laminate consisting of base material and Copper Foil is carried out to circuit making, make double-layered circuit board; Then on two line layer surfaces of described double-layered circuit board, all cover one deck glued membrane and layer protecting film, and described diaphragm is positioned at described glued membrane outside; Then to being coated with the described double-layered circuit board of described glued membrane and described diaphragm, hole, the hole of boring comprises some through holes and some the first blind holes that only drills through described glued membrane and described diaphragm; In the hole of then boring toward this step, filled conductive is stuck with paste; Finally described diaphragm is removed, made described core structure, described electroconductive paste protrudes from the surface of described core structure;
Wherein, the way of described outer Facad structure and described outer structure is all as follows: the Double-sided copper clad laminate consisting of base material and Copper Foil is carried out to outer copper foil is windowed and internal layer circuit is made, make and form the window layer structure of Copper Foil and internal layer circuit of skin; Then on window Copper Foil and described internal layer circuit surface of described skin, all cover layer protecting film; Then to being coated with the described layer structure of described diaphragm, hole, the hole of boring comprises some through holes and some blind holes that only drills through described diaphragm; In the hole of boring toward this step, filled conductive is stuck with paste; Finally described diaphragm is removed, described electroconductive paste protrudes from the surface of described layer structure, makes described outer Facad structure or described outer structure;
2., hot pressing: by an outer Facad structure, core structure and a described outer structure superpose successively and carry out hot pressing described at least one, after hot pressing, in described outer Facad structure, described core structure and described outer structure three, the mutual corresponding electroconductive paste in position interconnects, and described electroconductive paste connects and its line layer arriving of conducting, again and outer electroconductive paste after hot pressing, be depressed into line layer and flush, make described high density interconnect printed board.
4. the manufacture method of high density interconnect printed board as claimed in claim 3, is characterized in that: in the way of described core structure, the hole of boring also comprises that several only drill through the second blind hole of layer protecting film, one deck glued membrane, a sandwich circuit and base material.
5. a manufacture method for high density interconnect printed board, is characterized in that: carry out in the steps below:
1., make respectively outer Facad structure, outer structure and core structure;
Wherein, the way of described core structure is as follows: the Double-sided copper clad laminate consisting of base material and Copper Foil is carried out to circuit making, make double-layered circuit board; Then on two line layer surfaces of described double-layered circuit board, all cover one deck glued membrane and layer protecting film, and described diaphragm is positioned at described glued membrane outside; Then to being coated with the described double-layered circuit board of described glued membrane and described diaphragm, hole, the hole of boring comprises some through holes and some the first blind holes that only drills through described glued membrane and described diaphragm; In the hole of then boring toward this step, filled conductive is stuck with paste; Finally described diaphragm is removed, made described core structure, described electroconductive paste protrudes from the surface of described core structure;
Wherein, the way of described outer Facad structure and described outer structure is all as follows: the Double-sided copper clad laminate consisting of base material and Copper Foil is carried out to outer copper foil is windowed and internal layer circuit is made, make and form the window layer structure of Copper Foil and internal layer circuit of skin; Then at the described skin copper foil surface of windowing, cover layer protecting film, and be positioned at glued membrane outside at described internal layer circuit surface coverage layer protecting film and one deck glued membrane and diaphragm; Then to being coated with the described layer structure of described diaphragm and described glued membrane, hole, the hole of boring comprises some through holes and some blind holes that only drills through described diaphragm and described glued membrane; Toward this step interior filled conductive paste of holing; Finally described diaphragm is removed, make described outer Facad structure or described outer structure, electroconductive paste in described outer Facad structure protrudes from the surface of described outer Facad structure, and the electroconductive paste in described outer structure protrudes from the surface of described outer structure;
2., hot pressing: by an outer Facad structure, core structure and a described outer structure superpose successively and carry out hot pressing described at least one, after hot pressing, in described outer Facad structure, described core structure and described outer structure three, the mutual corresponding electroconductive paste in position interconnects, and described electroconductive paste connects and its line layer arriving of conducting, again and outer electroconductive paste after hot pressing, be depressed into line layer and flush, make described high density interconnect printed board.
6. the manufacture method of high density interconnect printed board as claimed in claim 5, is characterized in that: in the way of described core structure, the hole of boring also comprises that several only drill through the second blind hole of layer protecting film, one deck glued membrane, a sandwich circuit and base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210073637.4A CN102625604B (en) | 2012-03-20 | 2012-03-20 | Manufacturing method for high-density interconnection printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210073637.4A CN102625604B (en) | 2012-03-20 | 2012-03-20 | Manufacturing method for high-density interconnection printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102625604A CN102625604A (en) | 2012-08-01 |
| CN102625604B true CN102625604B (en) | 2014-10-01 |
Family
ID=46565214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210073637.4A Active CN102625604B (en) | 2012-03-20 | 2012-03-20 | Manufacturing method for high-density interconnection printed board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102625604B (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103052267B (en) * | 2012-12-31 | 2015-07-29 | 广州杰赛科技股份有限公司 | The processing method of blind buried via hole wiring board |
| US10757819B2 (en) | 2013-06-21 | 2020-08-25 | Sanmina Corporation | Method of forming a laminate structure having a plated through-hole using a removable cover layer |
| CN103369821B (en) * | 2013-07-25 | 2016-04-20 | 东莞生益电子有限公司 | Possesses pcb board of high density interconnect designs and radiator structure and preparation method thereof |
| CN103402332B (en) * | 2013-07-25 | 2016-04-20 | 东莞生益电子有限公司 | Possesses pcb board of high density interconnect designs and radiator structure and preparation method thereof |
| CN103458630B (en) * | 2013-08-09 | 2016-12-28 | 高德（无锡）电子有限公司 | A kind of method overcoming printed circuit board (PCB) copper-clad base plate thin plate operation to limit |
| CN104684276A (en) * | 2013-11-28 | 2015-06-03 | 深圳崇达多层线路板有限公司 | Printed wiring board and processing method thereof |
| CN106961808B (en) * | 2017-02-20 | 2019-09-10 | 宁波华远电子科技有限公司 | The production method of sunk type high density interconnecting board |
| CN109429420B (en) * | 2017-08-22 | 2021-11-16 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board with electromagnetic shielding function and manufacturing method thereof |
| CN110798972B (en) * | 2018-08-01 | 2020-11-24 | 庆鼎精密电子（淮安）有限公司 | Soft and hard combined circuit board with offset structure and manufacturing method thereof |
| CN111683463B (en) * | 2020-07-08 | 2022-10-14 | 沪士电子股份有限公司 | Processing method of thick copper circuit board containing anti-bonding pad |
| CN112291951A (en) * | 2020-11-10 | 2021-01-29 | 深圳市昶东鑫线路板有限公司 | Blind buried hole circuit board processing technology |
| CN112601377B (en) * | 2020-11-30 | 2022-05-03 | 景旺电子科技(珠海)有限公司 | Manufacturing method of copper paste hole plugging printed board and manufacturing method of FPC board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020023343A1 (en) * | 2000-07-07 | 2002-02-28 | Seiji Oka | Method of manufacturing multi-layer printed wiring board |
| CN1377217A (en) * | 2001-03-23 | 2002-10-30 | 株式会社藤仓 | Multi-layer circuit board assembly, unit thereof and manufacture thereof |
| CN1578589A (en) * | 2003-07-25 | 2005-02-09 | 松下电器产业株式会社 | Wiring substrate for intermediate connection and multi-layered wiring board and their production |
| CN1319157C (en) * | 1999-11-26 | 2007-05-30 | 揖斐电株式会社 | Multilayer circuit board and semiconductor device |
| CN101142863A (en) * | 2005-03-17 | 2008-03-12 | 松下电器产业株式会社 | Method for manufacturing circuit forming board |
-
2012
- 2012-03-20 CN CN201210073637.4A patent/CN102625604B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1319157C (en) * | 1999-11-26 | 2007-05-30 | 揖斐电株式会社 | Multilayer circuit board and semiconductor device |
| US20020023343A1 (en) * | 2000-07-07 | 2002-02-28 | Seiji Oka | Method of manufacturing multi-layer printed wiring board |
| CN1377217A (en) * | 2001-03-23 | 2002-10-30 | 株式会社藤仓 | Multi-layer circuit board assembly, unit thereof and manufacture thereof |
| CN1578589A (en) * | 2003-07-25 | 2005-02-09 | 松下电器产业株式会社 | Wiring substrate for intermediate connection and multi-layered wiring board and their production |
| CN101142863A (en) * | 2005-03-17 | 2008-03-12 | 松下电器产业株式会社 | Method for manufacturing circuit forming board |
Non-Patent Citations (2)
| Title |
|---|
| 一次压合积层法印制板制造技术;龚永林;《印制信息》;20030430(第4期);全文 * |
| 龚永林.一次压合积层法印制板制造技术.《印制信息》.2003,(第4期),第3页，图1和图5. |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102625604A (en) | 2012-08-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102625604B (en) | Manufacturing method for high-density interconnection printed board | |
| CN102595799B (en) | Manufacturing method of high-density interconnected printed circuit board | |
| CN102595809A (en) | Method for manufacturing high-density interconnection printed circuit board | |
| CN102946687B (en) | Local-fitting hole-avoiding flex-rigid combined board and manufacturing method thereof | |
| CN103025051B (en) | HDI plate of a kind of mechanical back drill pore structure and preparation method thereof | |
| CN103906371B (en) | Circuit board with embedded element and preparation method thereof | |
| CN103906372B (en) | There is circuit board of embedded element and preparation method thereof | |
| CN103052264B (en) | Pressing method for sandwich aluminum-base printed circuit board | |
| TW200704307A (en) | Circuit board with a through hole wire, and forming method thereof | |
| CN104168711B (en) | The compression method of cavity circuit plate and its preparation method of pressing structure | |
| CN103298274B (en) | A kind of bury hold printed circuit board manufacture method and bury appearance printed circuit board | |
| CN109714901B (en) | Method for processing outer-layer flexible rigid-flex board by wet film pasting and rigid-flex board | |
| CN103687342B (en) | A kind of printed circuit board with disconnected hole and preparation method thereof | |
| CN103906344A (en) | Heat-conductive two-side circuit board | |
| CN202406390U (en) | Structure of high-density interconnection printed circuit board | |
| CN110167289A (en) | A kind of production method of multilayer circuit board | |
| CN102869208A (en) | Method for controlling depth of two-sided inserting blind hole of printed circuit board | |
| CN104159397B (en) | The pressing structure of cavity PCB plate and the compression method of cavity PCB plate | |
| CN202998663U (en) | Printed circuit board with two blind holes | |
| CN204090296U (en) | Blind buried via hole printed circuit board (PCB) | |
| CN101170897B (en) | No empty hole installation method for installing electronic components | |
| CN202998662U (en) | Printed circuit board with blind holes and buried hole | |
| CN204131835U (en) | Soft and hard combined printing circuit board | |
| CN202998643U (en) | Printed circuit board with a plurality of blind holes and two buried holes | |
| CN206100611U (en) | Printed circuit board of two blind holes in area |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |