CN111683463B

CN111683463B - Processing method of thick copper circuit board containing anti-bonding pad

Info

Publication number: CN111683463B
Application number: CN202010649997.9A
Authority: CN
Inventors: 琼迪克森
Original assignee: Wus Printed Circuit Co Ltd
Current assignee: Wus Printed Circuit Co Ltd
Priority date: 2020-07-08
Filing date: 2020-07-08
Publication date: 2022-10-14
Anticipated expiration: 2040-07-08
Also published as: CN111683463A

Abstract

The invention discloses a processing method of a thick copper circuit board containing an anti-bonding pad, which comprises the following steps: the inner core board is divided into a first inner core board containing an anti-bonding pad and a second inner core board without the anti-bonding pad; manufacturing and punching a positioning hole target on the copper-clad plate of the first inner core plate; carrying out positioning hole target manufacturing and punching and inner layer graph manufacturing on the second inner layer core plate; drilling a hole in the position of an anti-bonding pad of the first inner-layer core plate to form a through hole; filling resin into the drilled through hole, and putting the through hole into an oven to be baked until the resin is cured; manufacturing an inner layer pattern of the cured first inner layer core plate according to the target positioning; and performing brown oxidation treatment on the first inner core board and the second inner core board, then sequentially overlapping the first inner core board and the second inner core board, placing the first inner core board and the second inner core board for pressing, covering copper foil on the outermost layer to form a semi-finished product of the thick copper circuit board, and then performing subsequent conventional PCB processing flow to prepare the high-quality thick copper circuit board containing the anti-bonding pad.

Description

Processing method of thick copper circuit board containing anti-bonding pad

Technical Field

The invention relates to a processing method of a thick copper circuit board containing an anti-bonding pad, belonging to the technical field of circuit board processing.

Background

In order to meet the welding requirement of an ultra-high power component, the thickness of a copper-clad layer of a core board needs to be increased, the existing method for manufacturing the circuit board is difficult to meet the quality requirement of the thick copper circuit board, the problem of insufficient glue filling and gap generation during pressing, the thickness of a medium layer is uneven, the problem of cracks or explosion and the like during later packaging occurs, and the quality of the circuit board is seriously affected.

Disclosure of Invention

The purpose is as follows: in order to overcome the defects in the prior art, the invention provides a method for processing a thick copper circuit board containing an anti-bonding pad.

The technical scheme is as follows: in order to solve the technical problems, the technical scheme adopted by the invention is as follows:

a method for processing a thick copper circuit board with an anti-bonding pad comprises the following processes,

(1) The inner core plates are divided into two types, namely a first inner core plate and a second inner core plate, wherein the first inner core plate contains anti-bonding pads, and the second inner core plate does not contain anti-bonding pads;

manufacturing a positioning hole target on the copper-clad plate of the first inner core plate; manufacturing a positioning hole target and an inner layer pattern on the second inner layer core plate;

the first inner core plate and the second inner core plate are punched according to the positioning hole targets;

(2) The inner layer copper clad of the first inner layer core board is provided with an anti-bonding pad pattern, and the anti-bonding pad position of the first inner layer core board is drilled to be hollow to form a through hole;

(3) Filling resin into the through hole drilled in the step (2), and placing the first inner-layer core plate into an oven to be baked until the resin is cured;

(4) Positioning the first inner-layer core plate cured in the step (3) to manufacture an inner-layer graph according to a target;

(5) Carrying out brown oxidation treatment on the first inner core board treated in the step (4) and the second inner core board treated in the step (1), then stacking and pressing the first inner core board, the second inner core board and the prepreg in sequence, and covering copper foil on the outermost layer to form a semi-finished product of the thick copper circuit board;

(6) And carrying out subsequent processing flow on the semi-finished product of the thick copper circuit board according to the traditional processing method of the circuit board, and preparing the thick copper circuit board containing the anti-bonding pad.

Further, the thickness of the copper-clad plate of the first inner core plate is larger than 2oz.

Further, in the step (2), the position of the anti-welding disc of the first inner core plate is drilled out in a laser or mechanical drilling mode.

Further, the resin filling in the step (3) is realized by adopting a mode of coating resin on the surface or soaking liquid resin.

Further, in the step (3), after the resin is cured, the surface of the first inner core plate is polished to remove the redundant resin on the surface, so that the whole thickness of the first inner core plate is uniform.

Further, in the step (1), after the second inner core board finishes the pattern making, AOI pattern detection is carried out, and the next operation procedure is entered after the second inner core board is confirmed to be error-free.

Has the advantages that: according to the processing method of the thick copper circuit board containing the anti-bonding pad, holes are drilled at the position of the anti-bonding pad containing the core board of the anti-bonding pad and are filled with resin in advance, then the anti-bonding pad is superposed and pressed with other core boards of inner layers, and the prepreg does not need to fill the area of the anti-bonding pad during pressing, so that the uniform pressing thickness of the prepreg can be ensured, the bonding force between the prepreg and the thick copper surface is increased, cracks or explosion during later packaging is avoided, and the quality of the thick copper circuit board is improved.

Drawings

FIG. 1 is a schematic structural view of a second inner core board after pattern fabrication;

FIG. 2-1 is a schematic top view of the first inner core panel after drilling;

FIG. 2-2 is a schematic side view of the first inner core panel after drilling;

FIG. 3 is a schematic structural diagram of a first inner core board obtained after drilling holes at the positions of the reverse welding discs and filling resin;

FIG. 4 is a schematic structural view of the cured first inner core board after patterning;

fig. 5 is a schematic structural diagram of a semi-finished thick copper circuit board after a multilayer core board and a prepreg are laminated.

Detailed Description

The present invention will be further described with reference to the accompanying drawings.

A processing method of a thick copper circuit board containing an anti-bonding pad comprises the following steps:

(1) The inner core boards are divided into two types, namely a first inner core board 1 and a second inner core board 2, wherein the first inner core board 1 contains anti-bonding pads, the thickness of the copper-clad plate of the first inner core board 1 is larger than 2oz, and the second inner core board 2 does not contain anti-bonding pads;

manufacturing a positioning hole target on the copper-clad plate of the first inner core plate 1; manufacturing a positioning hole target and an inner layer pattern on the second inner layer core plate 2, wherein the second inner layer core plate structure after the pattern manufacturing is completed is shown in figure 1; the second inner core board 2 performs AOI graph detection after graph manufacturing is completed, and can enter the next operation procedure after no error is confirmed;

the first inner core plate 1 and the second inner core plate 2 are punched according to the positioning hole targets, and as shown in fig. 2-1, four positioning holes 11 are formed around the first inner core plate 1.

(2) The inner copper clad of the first inner core board is provided with an anti-bonding pad pattern, and the anti-bonding pad position of the first inner core board is drilled to be hollow in a laser or mechanical drilling mode to form a through hole 12, as shown in fig. 2-2.

(3) Filling the resin 13 in the through hole drilled in the step (2) by adopting a mode of coating the resin on the surface or soaking the resin in liquid, putting the first inner-layer core plate into an oven, and gradually heating and baking from low temperature to high temperature until the resin is cured;

after the resin is cured, the surface of the first inner core plate is polished to remove excess resin on the surface, so that the whole thickness of the first inner core plate is uniform, as shown in fig. 3.

(4) And (4) positioning the first inner-layer core plate cured in the step (3) according to a target to manufacture an inner-layer graph, as shown in fig. 4.

(5) And (3) performing brown oxidation treatment on the first inner core board 1 treated in the step (4) and the second inner core board 2 treated in the step (1), then sequentially stacking and laminating the first inner core board 1, the second inner core board 2 and the prepreg 3, and covering copper foil 4 on the outermost layer to form a semi-finished product of the thick copper circuit board, as shown in fig. 5.

(6) And carrying out subsequent processing flow on the semi-finished product of the thick copper circuit board according to the processing method of the traditional circuit board, and preparing the thick copper circuit board containing the anti-bonding pad.

The above description is only of the preferred embodiments of the present invention, and it should be noted that: it will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the principles of the invention and these are intended to be within the scope of the invention.

Claims

1. A processing method of a thick copper circuit board containing an anti-bonding pad is characterized in that: comprises the following steps of,

(3) Filling resin into the through hole drilled in the step (2), and placing the first inner-layer core plate into an oven to bake until the resin is cured;

2. The method of manufacturing a thick copper wiring board having an anti-pad according to claim 1, wherein: the thickness of the copper-clad plate of the first inner core plate is more than 2oz.

3. The method of manufacturing a thick copper wiring board having an anti-pad according to claim 1, wherein: and (3) drilling the position of the reverse welding disk of the first inner-layer core plate in a laser or mechanical drilling mode.

4. The method of claim 1, wherein the method comprises the steps of: and (4) the resin filling in the step (3) is realized by adopting a mode of coating resin on the surface or infiltrating liquid resin.

5. The method of manufacturing a thick copper wiring board having an anti-pad according to claim 1, wherein: in the step (3), after the resin is cured, the surface of the first inner core plate is polished to remove the redundant resin on the surface, so that the whole thickness of the first inner core plate is uniform.

6. The method of manufacturing a thick copper wiring board having an anti-pad according to claim 1, wherein: and (2) performing AOI (automated optical inspection) graphic detection after the second inner core board finishes graphic manufacturing in the step (1), and entering the next operation procedure after no error is confirmed.