CN116456632B - Pressing manufacturing method of high-rise PCB - Google Patents
Pressing manufacturing method of high-rise PCB Download PDFInfo
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- CN116456632B CN116456632B CN202310706619.3A CN202310706619A CN116456632B CN 116456632 B CN116456632 B CN 116456632B CN 202310706619 A CN202310706619 A CN 202310706619A CN 116456632 B CN116456632 B CN 116456632B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 52
- 238000003825 pressing Methods 0.000 title claims description 49
- 238000003475 lamination Methods 0.000 claims abstract description 66
- 239000010410 layer Substances 0.000 claims description 141
- 238000001816 cooling Methods 0.000 claims description 75
- 238000000034 method Methods 0.000 claims description 62
- 230000008569 process Effects 0.000 claims description 46
- 239000003292 glue Substances 0.000 claims description 43
- 239000002184 metal Substances 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 238000010438 heat treatment Methods 0.000 claims description 17
- 239000000853 adhesive Substances 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 13
- 239000012790 adhesive layer Substances 0.000 claims description 13
- 238000010030 laminating Methods 0.000 claims description 9
- 238000001465 metallisation Methods 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 230000008602 contraction Effects 0.000 abstract description 5
- 239000011347 resin Substances 0.000 description 13
- 229920005989 resin Polymers 0.000 description 13
- 230000001965 increasing effect Effects 0.000 description 12
- 230000009471 action Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 230000002035 prolonged effect Effects 0.000 description 4
- 230000000630 rising effect Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005429 filling process Methods 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
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- 238000012536 packaging technology Methods 0.000 description 1
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- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
Abstract
The invention provides a press-fit manufacturing method of a high-rise PCB, which is characterized in that a plurality of blind holes are arranged on the surface of the high-rise PCB and used as device holes, BGA sites are provided for electronic devices mounted on the surface of the high-rise PCB, and the device holes with good shape and better reliability are manufactured on the high-rise PCB by improving the press-fit manufacturing mode of the high-rise PCB; the device holes are manufactured through superposition, the first buried holes in the second sub-board are formed through the first through holes in the first sub-board through repeated lamination, and finally the device holes on the surface of the high-rise PCB are formed by corresponding to the first buried hole blind holes after total lamination, so that the quality of the finally manufactured device holes is improved, and the stability and reliability of the device holes are improved. Meanwhile, the invention also improves the expansion and contraction difference between layers during the lamination of the high-rise PCB by changing the lamination manufacturing program of the high-rise PCB, and prepares the high-rise PCB with smoother and higher reliability.
Description
Technical Field
The invention relates to the field of PCB manufacturing, in particular to a press-fit manufacturing method of a high-rise PCB.
Background
PCB (Printed Circuit Board), also called a printed circuit board, is an important electronic component, is a carrier for supporting electronic components and realizing electrical interconnection, and along with rapid development and wide application of integrated circuits, requirements on functions and precision of the PCB are also increasingly high, and the number of devices connected on the PCB, routing density and the like are also continuously improved. In accordance with the development trend of miniaturization and light weight of intelligent electronic products, higher requirements are also put on the surface mounting technology SMT (Surface Mount Technology) of electronic devices on PCBs, wherein BGA (Ball Grid Array package) is a high-density packaging technology which has entered a practical stage.
In order to increase the speed and capacity of the integrated circuit as much as possible, increase the number of devices connected on the PCB and the routing density, reduce the power consumption, reduce the size of BGA devices on the PCB board, increase the number of pins and the pitch, generally, in order to realize signal connection between the devices and the PCB, the devices Kong Changshe on the PCB are placed as vias, and the number of vias arranged on the PCB is increased, which results in a decrease in the routing space on the circuit layer of the PCB and an increase in crosstalk between signals. Particularly in a high-level PCB, the larger the thickness of the PCB, the larger the aperture of the arranged via hole is, otherwise, the aspect ratio of the via hole on the high-level PCB is increased, and the reliability and the signal transmission quality of the PCB are affected. Therefore, in the existing high-speed and high-level PCB, the blind/buried holes are usually adopted as BGA bit holes to increase the wiring space of the inner-layer circuit of the PCB and improve the quality of signal transmission, and during installation, the BGA device welded on the surface of the PCB can realize signal connection with the corresponding circuit layer on the PCB by inserting pins into the metallized BGA bit holes, so that the connection quality between the BGA bit holes on the PCB and the BGA device is the key for influencing the signal connection between the BGA device and the PCB, and the manufacturing quality of the BGA bit holes on the PCB is the key for influencing the reliability of the high-speed and high-level PCB.
Disclosure of Invention
The invention aims to overcome at least one defect of the prior art, and provides a pressing manufacturing method of a high-layer PCB, which is suitable for BGA device installation, and has good reliability and good practicability.
The technical scheme provides a laminating manufacturing method of a high-rise PCB, wherein a plurality of device holes are formed in the surface of the high-rise PCB, and the method comprises the following procedures:
s1, pressing for one time to finish pressing manufacture of a first sub-board;
s2, hole manufacturing and hole metallization, wherein a metallized first via hole is manufactured on the first sub-board;
s3, performing secondary lamination, namely sequentially covering a first bonding layer and a cover plate on the upper side and the lower side of the first sub-board, laminating to form a second sub-board, forming a metalized first buried hole in the second sub-board by the first via hole, filling glue on one side in the first buried hole, controlling the glue filling depth of the first buried hole, and sealing the hole on the non-filled side by a metal layer;
s4, total lamination, wherein before lamination, the second sub-board is arranged on the surface and keeps one side of the first buried hole, which is not filled with glue, outwards, and the second sub-board is laminated with other boards to form the high-rise PCB;
s5, manufacturing a device hole, wherein a first blind hole is formed in the surface of the high-rise PCB at a position corresponding to the first buried hole, and the first blind hole is communicated with the first buried hole to form the device hole.
In the technical scheme, a plurality of device holes are arranged on the surface of the high-rise PCB to provide BGA sites for the electronic devices mounted on the surface of the PCB, so that stable and reliable mounting connection between the BGA devices and the high-rise PCB is realized; meanwhile, in order to prepare a device hole with good shape and better reliability on the high-layer PCB, the pressing manufacturing mode of the high-layer PCB is improved. Firstly, because the drilling depth is not required to be controlled in the process of manufacturing the via hole compared with the process of manufacturing the blind hole, layers with more uniform thickness, through which the metal plating layer is connected with the via hole, can be manufactured in the process of hole electroplating, a more stable and uniform hole wall state is constructed, and the quality of connecting the hole wall of the device with each circuit layer is improved, so that a core board, an adhesive layer, a thickness filling layer, a metal layer and the like with the required number of layers are laminated and arranged according to the designed sequence, a first sub board containing all inner circuit layers to be connected with BGA position holes is synthesized in a pressing mode, and then, a first via hole is manufactured on the first sub board at a position corresponding to the designed BGA position hole, and the first via hole is metallized in a plating mode and the like; preferably, the first via hole of the first sub-board is used as a BGA bit hole for depositing gold. Because the matching mode of the BGA device and the device hole is a unidirectional plug-in, in order to facilitate subsequent plug-in and welding with the BGA device, the device hole finally presents a blind hole shape on the surface of the high-layer PCB, and the blind hole does not allow residual resin or sundries and the like to influence the plug-in, so that the influence of the subsequent pressing process on the filler in the device hole is required to be controlled. When in secondary lamination, the upper side and the lower side of the first sub-board are sequentially covered with the adhesive layer and the cover plate to form a second sub-board, and meanwhile, the first via hole manufactured by primary lamination is formed into a first buried hole in the second sub-board; in the second sub-board, an outer layer circuit layer is formed on one outward side, so that one side, which is not filled with glue, of a first buried hole is sealed by a metal layer, an outer layer circuit layer is further formed in a subsequent process, a thickness filling layer is formed on the other side, single-side glue filling in the first buried hole and glue filling depth in the first buried hole are enabled to be in a set value range by controlling secondary pressing process parameters, the thickness of glue filling at the bottom of the first buried hole is ensured to be proper, no glue residue exists in the buried hole, and the second sub-board is suitable for a subsequent plug-in unit; further, in order to enable the high-rise PCB to achieve a set plate thickness, the second sub-board and other boards are pressed together to form the high-rise PCB, in the total pressing process, the second sub-board is kept to be placed on the surface of the high-rise PCB, an outer layer circuit layer in the second sub-board faces outwards, namely, one side of the first buried hole, which is not filled with glue, is kept outwards, the final device hole can be manufactured based on the first buried hole in the next process, after the total pressing, a corresponding hole manufacturing process is carried out on the finally obtained high-rise PCB, a first blind hole is formed at a position corresponding to the first buried hole on the surface of the high-rise PCB, the manufactured first blind hole is communicated with the first buried hole to form a device hole finally used for the plug-in, the device hole is manufactured in a mode of being communicated with the blind hole, the high-rise PCB after the total pressing is still in a mode of the first buried hole, the quality of the first buried hole can be protected from being disturbed by the outside in the process of stacked plate storage and transportation, and the like, and therefore the stability and reliability of the device hole are improved.
Further, in the step S3, the first adhesive layer includes a first adhesive sheet that is perforated at a position corresponding to the first via hole and a second adhesive sheet that is not perforated;
the diameter of the opening hole on the first bonding sheet is larger than that of the first through hole, and the opening hole and the first through hole are concentrically arranged;
before pressing, when arranging the plates, one side of the first via hole is sequentially covered with a first bonding sheet, a metal layer and a cover plate from inside to outside, and the other side is sequentially covered with a second bonding sheet and a cover plate from inside to outside;
the cover plate is one or a combination of more than one of a metal layer, a thickness filling layer, a circuit layer core plate or a second bonding layer.
In the technical scheme, in order to realize that the hole filling depth of a single side in a first buried hole in a second sub-board is stable and controllable, during a secondary lamination process, two sides of the first via hole are respectively covered with a first bonding sheet which is correspondingly provided with a hole at the position of the first via hole and a second bonding sheet which is not provided with a hole, then the two sides of the board are sequentially covered with plates which are required by the outside, and the lamination program of the board is adjusted during lamination. Specifically, the two sides of the first via hole are covered with a metal layer or a cover plate except the first bonding layer, the introduction of the cover plate is convenient for the alignment between the plates and provides a flat pressing surface for the manufacture of the first buried hole, the manufacture quality of the first buried hole is ensured, the composition of the cover plate is designed according to the function of the cover plate during the subsequent total pressing, the first bonding sheet with the opening is in fusion bonding with the first sub-plate and the metal layer during the pressing, the fluid glue does not contact the first via hole during the pressing, therefore, the first sub-plate is tightly bonded with the metal layer, the first via hole is sealed by the metal layer, the cover plate is additionally covered on the metal layer because the metal layer is thinner, the cover plate is not bonded with the metal layer, the rough surface of the metal layer faces the first bonding sheet, the smooth surface faces the cover plate, the alignment pressing is realized through the matching of the positioning hole, the Pin needle, the auxiliary positioning nail and the like, and the flatness of the bonding of the metal layer is ensured through the introduction of the cover plate; the second bonding sheet without holes is used for fusion bonding of the first sub-board and the cover board, part of the adhesive is filled into one side of the first through hole, single-side adhesive filling in the first buried hole is realized, the adhesive of the first bonding sheet does not flow into the first through hole by controlling the pressing process of the adhesive, the depth of the second bonding sheet filled into the first buried hole is in a certain range, and preferably, the second bonding sheet is at least covered with a thickness filling layer for supporting the pressing of the second sub-board and realizing adhesive filling in the first buried hole.
Further, the step S3 includes the following lamination stages:
s31, vacuum stage: vacuum preheating the plates after the plates are arranged;
s32, heating: vacuum heating to enable the bonding material between the plates to flow and gap;
s33, curing: the plates are tightly adhered by high-temperature solidification;
s34, a cooling stage: releasing the internal stress of the plate;
in the step S32, the first buried hole is filled with glue;
and controlling the filling depth of the first buried hole by adjusting the pressurizing program in the S32 stage, wherein the filling depth of the first buried hole is not more than 10-20mil after pressing.
In the technical scheme, the single-side glue filling of the first buried hole is realized by controlling a pressurizing program in the secondary lamination process, the glue filling depth in the first buried hole is controlled to be not more than 10-20mil, specifically, before secondary lamination, a first bonding layer and a cover plate are sequentially covered on the upper side and the lower side of a first sub-plate after primary lamination to carry out plate arrangement, and after plate arrangement, the plate arrangement enters a lamination process: firstly, preheating plates after plate arrangement at constant temperature at an initial temperature of a heating stage in a vacuum environment without pressurization, uniformly heating all the plates to be pressed, enhancing the stability of all the plates in the pressing process, and simultaneously enabling the resin in the bonding sheets of the bonding layer to start to be heated and melted, in particular to enable the first bonding sheet and the second bonding sheet in the first bonding layer to start to be heated and flow; preferably, the first adhesive layer contacting the two ends of the first via hole and the second adhesive layer arranged in the cover plate adopt different adhesive sheets, and the glass transition temperature (Dk value) of the adhesive sheet in the first adhesive layer is smaller than that of the second adhesive layer. In the heating stage, the laminating temperature is continuously increased, and pressure is applied to perform lamination, at the moment, the molten resin in the bonding sheets in the first bonding layer flows more severely, the first bonding sheets flow between layers without contacting the first buried holes under the control of a pressurizing program, and the second bonding sheets flow to fill the first buried holes and flow into the depth of not more than 10-20mil; further, before the temperature rising stage is finished, ensuring that the resin which flows in a melting way in the bonding sheet of the first bonding layer is completely solidified at high temperature, and filling the solidified resin with the depth of not more than 10-20mil from one side into the first buried hole; meanwhile, the temperature continues to rise, so that the second bonding layer reaches the glass transition temperature, the resin of the second bonding layer is melted and flows to connect all layers in the cover plate, and then bonding sheets in the second bonding layer are completely solidified in the solidification stage, so that stable and smooth bonding of the cover plate is realized; and then, the internal stress generated by hot pressing in the pressed second sub-board is completely released through the high-temperature curing and cooling stages in the curing stage, so that the pressed second sub-board is uniform and flat, the good and deformation-free form of the first buried hole is ensured, and the reliability of the manufactured device hole is improved.
Further, the step S32 further includes the following steps of different pressure states:
s321, a first stage: constant pressure state, the pressure value is 50-100PSI;
s322, a second stage: the dynamic pressure state, the pressure value is circularly lifted between the upper pressure value and the lower pressure value, and the lifting time of the pressure value between the upper pressure value and the lower pressure value is equal and is 1-3min;
s323, third stage: constant pressure state, the pressure value is 300-400PSI;
in the S322 stage, the lower pressure value is 120-180PSI, the upper pressure value is 220-280PSI, and the upper pressure value is adopted first when the dynamic pressure state starts.
Further, in the step S3, the first adhesive layer is a low-flow prepreg; the radius of the opening is 10-20 mils larger than the radius of the first via.
In the technical scheme, in order to realize the control of the pressurizing program in the temperature rising stage and further control of the depth of single-side glue filling in the first buried hole in the second sub-plate laminating process, the temperature rising stage is specifically divided into three stages with different pressure states, in the first stage, the constant pressure with the pressure value of 50-100PSI is applied to the plates to be laminated in the initial laminating stage, the temperature uniformity of each layer of plates is improved, the expansion and contraction difference of the plates is reduced, and the warping and the hole deformation of the plates are reduced; meanwhile, under the condition of smaller pressure value, the heated and melted bonding sheets, particularly the bonding sheets of the first bonding layer uniformly and slowly flow among the plates and are filled in gaps among the plates in the lamination process, so that the glue filling thickness among the plates and the thickness of the whole second sub-plate are uniform; and in the second stage, dynamic pressure is applied to the plate in pressing, and the melted gummosis in the first bonding sheet is enabled to uniformly fill the adjacent two layers in bonding by controlling the pressure state to circularly rise and fall in the medium pressure range, so that the gummosis does not go deep into the first buried holes, and meanwhile, the melted gummosis of the second bonding sheet can be stably and uniformly pressed into the first buried holes. In the medium pressure state, the fluidity of the melted resin is moderate, and the resin is suitable for controlling the flowing state of the gumming through the pressure state, preferably, the lower pressure value is 120-180PSI, and the upper pressure value is 220-280PSI. In the dynamic pressure state, the flowing glue formed by the second bonding sheet is pressed into the first buried hole under the action of gradually increasing pressure in the pressure increasing process, and the pressure is gradually reduced in the pressure decreasing process, so that the flowing glue can retract in the hole to a certain extent under the action of the surface tension of the flowing glue; therefore, when the dynamic pressure stage starts, the gummosis is pressed into the first buried hole by a certain pressure by adopting an upper pressure value with a larger pressure value, and then the process of depressurization, pressurization and depressurization is repeated, so that the depth of the gummosis filled into the first buried hole can be controlled, the depth of the gummosis is not too deep to influence the subsequent plug-in units, and the depth of the gummosis is not too shallow, so that the device holes are protected from swelling when the subsequent plug-in units are not carried out, and the stability and the reliability of the device holes are ensured; meanwhile, because the depth of the filling glue to be controlled in the first buried hole is relatively smaller, the speed of boosting and reducing in the dynamic pressure state is consistent and maintained at a faster level, and preferably, the time for the pressure value to rise and fall between the upper pressure value and the lower pressure value is equal and is 1-3min. Furthermore, the uniformity of the first bonding layer for filling the gaps of the plates and the uniformity of filling the first buried holes can be improved by circularly lifting the pressure program to control the glue filling depth, so that the uniformity of the glue filling thickness among the plates is improved, interlayer cavities and glue shortage are avoided, the glue filling quality in the first buried holes is ensured, and the overall reliability of the second sub-plates is improved. Preferably, the first adhesive layer is a low-flow prepreg, and the radius of the opening on the first adhesive sheet is 10-20mil larger than the radius of the first via hole, and the low-flow prepreg has low resin content for flow glue, so that the resin has low fluidity during hot pressing, and the flowing distance of the resin between layers and in the hole can be controlled more easily through the pressing state. Further, since the cover plate further comprises a second bonding layer for stably bonding each layer in the cover plate, after the first bonding layer completes the gumming hole filling process and begins to be stably solidified, the pressure is continuously increased in the continuous heating process, so that the bonding sheets in the second bonding layer are promoted to uniformly melt and flow between each layer of the cover plate, and each layer is stably bonded. Through the design, the first buried holes with good single-side glue filling and good shape and stable property are constructed in the pressing process of the second sub-board, and meanwhile, the thickness of the pressed second sub-board is uniform, so that the uniformity and reliability of the subsequent device hole manufacturing are ensured.
Further, the step S4 includes the following lamination stages: s41, a vacuum stage; s42, heating; s43, a curing stage; s44, a cooling stage;
in the S44 stage, a vacuum state and a constant pressure state are adopted, the pressure value is 50-100PSI, and the high-rise PCB pressed for many times is slowly and uniformly cooled by adopting a stepped cooling process.
In the technical scheme, at least one single-sided BGA pasting piece is arranged in the designed high-rise PCB, the corresponding BGA position holes are blind holes, the conductive circuit is unbalanced or the circuits on the two sides of the PCB are obviously asymmetric, especially, under the condition that one end in the circuit board structure is provided with the blind holes and the other end is not provided with the blind holes, the situation of stress concentration is extremely easy to form, the problem of warping of the high-rise PCB is caused, the positioning of the pasted components is inaccurate, pins are irregular, and the assembly work is influenced. In the cooling stage, the vacuum state is maintained, the temperature uniformity of each layer of the high-level PCB is ensured by removing air heat conduction, meanwhile, the constant pressure state of the pressure value in the range of 50-100PSI is maintained, the high-level PCB is prevented from being bent due to uneven sudden pressure loss temperature change by providing certain pressure for the high-level PCB in cooling, further, the temperature change rate is reduced by the step cooling process, the cooling time is prolonged, the stress in the high-level PCB is completely released, the temperature uniformity and the flatness of each layer of the high-level PCB are ensured, the regular and stable shape of the device holes in the high-level PCB is ensured, the high-level PCB is suitable for subsequent plug-in units, and the uniform, flat and reliable high-level PCB with stable and reliable device holes is finally constructed.
Further, the step S44 includes a plurality of continuous step cooling stages with equal time, the step cooling stages include a cooling stage and a constant temperature stage, and in the same step cooling stage, the cooling stage is performed before the constant temperature stage; preferably, the total duration of the step cooling stage is 12-25min, the cooling rate of the cooling stage is 5-8 ℃/min, and the duration of the constant temperature stage is not less than 60% of the total duration of the step cooling stage.
In this technical scheme, among the cooling stage that high-rise PCB total pressfitting was crossed, cascaded cooling process includes the equal cascaded cooling stage of a plurality of time in succession, and every cascaded cooling stage contains cooling section and constant temperature section, has prolonged the cooling time of single cascaded cooling stage, has reduced high-rise PCB's cooling rate, has increased the constant temperature section simultaneously, makes high-rise PCB stabilize for a period of time at the end constant temperature of single cascaded cooling stage, has guaranteed the temperature homogeneity of each layer of high-rise PCB, has reduced the difference of swelling and shrinking between the high-rise PCB board, has guaranteed the level and even of pressfitting high-rise PCB. Preferably, the total duration of the stepped cooling stages is 12-25min, the cooling rate of the cooling stage is 5-8 ℃/min, and the duration of the constant temperature stage is not less than 60% of the total duration of the single stepped cooling stage.
In one embodiment of the present disclosure, a high-layer PCB is further provided, where the high-layer PCB is manufactured by using the pressing method of the high-layer PCB in the present disclosure, and the high-layer PCB is formed by pressing two identical second sub-boards and other boards together, and before pressing, the two second sub-boards are respectively placed on the upper and lower surfaces when the boards are arranged, so that the upper and lower surfaces of the high-layer PCB are provided with a plurality of device holes, and the device holes can be used for mounting and attaching BGA devices; in the high-rise PCB, the circuit layers are provided by the second sub-board, and other boards are thickness filling layers or bonding layers. The design designs the circuit layer which is vertically symmetrical in the high-level PCB, and through mirror image stacking or complete symmetrical high-level PCB design, the distortion, bending or warping of the high-level PCB caused by asymmetric lamination is avoided, and the reliability of the high-level PCB is improved. Preferably, the thickness of the high-layer PCB is not less than 2mm. Because the thickness of the PCB is larger when the high-frequency and high-speed PCB is designed, especially when the length of a via hole designed on the PCB is larger than 2.0mm, the signal distortion is easily caused due to lower impedance continuity, the impedance continuity is usually improved by increasing the aperture of the via hole, the device can be mounted on the double sides of the high-layer PCB, and the via hole is replaced by a blind hole arranged on the bidirectional surface of the high-layer PCB as a device hole, so that the aperture is reduced, the interlayer wiring space is saved, the better signal transmission function of a circuit layer is realized, and the functionality and the reliability of the high-layer PCB are improved.
Compared with the prior art, the invention has the beneficial effects that:
1. the method comprises the steps that a plurality of blind holes are formed in the surface of a high-rise PCB and serve as device holes to provide BGA sites for electronic devices mounted on the surface of the PCB, the device holes with good shape and better reliability are prepared on the high-rise PCB by improving the lamination manufacturing mode of the high-rise PCB, the device holes are manufactured through superposition, the first buried holes in the second sub-board are formed by the first through holes in the first sub-board through repeated lamination, finally, the device holes on the surface of the high-rise PCB are formed by opening the blind holes corresponding to the first buried holes after total lamination, in the lamination manufacturing process, the characteristics that the through holes do not need to be manufactured in a depth control mode and are more uniform in metallization electroplating are utilized, a more stable and uniform hole wall state is constructed, and the reliability of connecting the device holes with each circuit layer is improved; secondly, the device holes are in the form of first buried holes in the secondary lamination and total lamination processes, the quality of the first buried holes is protected from external interference in the processes of lamination, storage and transportation, and the like, the quality of the finally manufactured device holes is improved, and the stability and reliability of the device holes are improved.
2. Specifically, when the first buried hole is manufactured by secondary lamination, in order to match the manufacture of the subsequent device hole, the single-side glue filling in the first buried hole is realized by controlling the process parameters of the secondary lamination, the glue filling depth in the first buried hole is controlled, the proper glue filling thickness at the bottom of the first buried hole is ensured, and no residual glue or sundries exist in the buried hole, so that the method is suitable for the manufacture of the subsequent device hole and the plug-in unit; further, during total lamination, one side of the first buried hole, which is not filled with glue, is kept outwards, after total lamination, a first blind hole is formed in the position, corresponding to the first buried hole, of the surface of the high-rise PCB, and the first blind holes are communicated together to form a device hole, so that more stable and reliable device holes are prepared, and the quality of the finally manufactured device hole is ensured.
3. The step-type cooling process is adopted in the total lamination manufacturing process of the high-rise PCB, and the high-rise PCB subjected to multiple lamination is slowly and uniformly cooled in a vacuum and constant-pressure state, so that the expansion and contraction difference among the high-rise PCBs is reduced, and the laminated high-rise PCB is ensured to be flat and uniform.
The temperature change rate is also reduced through the step-type cooling process, the cooling time is prolonged, so that the stress in the high-rise PCB is completely released, the temperature uniformity and flatness of each layer of the high-rise PCB are ensured, the regular and stable shape of the device holes in the high-rise PCB is further ensured, the device holes are suitable for subsequent plug-ins, and the uniform, flat and reliable high-rise PCB with stable and reliable device holes is finally constructed.
Drawings
Fig. 1 is a process flow chart of a press-fit manufacturing method of a high-level PCB according to the present invention.
Fig. 2 is a flowchart of a secondary lamination process in a lamination manufacturing method of a high-level PCB according to the present invention.
Fig. 3 is a schematic structural diagram of a high-level PCB according to the present invention.
Fig. 4 is a schematic diagram of a secondary lamination board of a high-level PCB according to the present invention.
Fig. 5 is a graph showing a process of secondary lamination of a high-level PCB according to the present invention.
Fig. 6 is a schematic diagram of a board arrangement of a total lamination of a high-level PCB according to the present invention.
Fig. 7 is a graph showing the total lamination process of a high-level PCB according to the present invention.
Detailed Description
The drawings are for illustrative purposes only and are not to be construed as limiting the invention. For better illustration of the following embodiments, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the actual product dimensions; it will be appreciated by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.
Example 1
As shown in fig. 1-2, the embodiment provides a pressing manufacturing method of a high-rise PCB with a plurality of device holes on the surface, wherein the high-rise PCB is manufactured by pressing for a plurality of times by adopting a vacuum oil press, and the method specifically comprises the following steps:
s1, laminating for one time: before lamination, firstly cutting materials, completing the manufacture of each inner layer circuit layer which is required to be communicated with the device hole through inner layer etching, arranging the inner layer circuit layers, the bonding layer, the thickness filling layer and the like according to the designed sequence, completing lamination manufacture, and forming a first sub-board.
S2, hole manufacturing and hole metallization: after one press fit, drilling, plate surface metallization, outer layer circuit pattern manufacture and other procedures are carried out on the pressed first sub-plate according to the manufacture data, wherein a plurality of first through holes are manufactured on the first sub-plate according to the corresponding design sites of the device holes, and then the needed metallized first through holes are manufactured through electroplating, chemical deposition and other methods.
S3, secondary lamination: when the plate is arranged, the upper side and the lower side of the first sub-plate which completes hole manufacturing and hole metallization are sequentially covered with a first bonding layer, a metal layer and a cover plate, the first bonding layer comprises a first bonding sheet which is provided with holes at the corresponding positions of the first through holes and a second bonding sheet which is not provided with holes, the holes on the first bonding sheet are concentric with the first through holes, the diameter of the holes is larger than that of the first through holes, and the cover plate is one or a combination of a plurality of metal layers, thickness filling layers, circuit layer core plates or second bonding layers. Specifically, one side of the first via hole sequentially covers the first bonding sheet, the metal layer and the cover plate from inside to outside, and the other side sequentially covers the second bonding sheet and the cover plate from inside to outside, and a second sub-board is formed through secondary lamination; preferably, the first adhesive layer is a low-flow prepreg, and the radius of the opening on the first adhesive layer is 10-20mil larger than the radius of the first via hole.
When in secondary lamination, the original first via hole is a metallized first buried hole in the second sub-board, glue is filled in the side hole only at one side of the contact of the first buried hole and the second bonding sheet by controlling the lamination program of secondary lamination, the glue filling depth is controlled to be not more than 10-20mil, and the side hole of the contact of the first buried hole and the first bonding sheet is not filled with glue and sealed by a metal layer.
Specifically, the secondary lamination process comprises the following lamination stages:
s31, vacuum stage: overlapping the cover plate, the metal layer, the first bonding layer, the first sub-plate and the like after plate arrangement, aligning and fixing, and preheating in a vacuum, constant temperature and zero pressure state.
S32, heating: the pressurizing program at the stage is controlled to enable the single side in the first buried hole to be filled with glue and the glue filling depth to be not more than 10-20mil, and simultaneously enable the second bonding layer in the cover plate to be fully melted and flowed to bond the adjacent plates, preferably, the first bonding layer contacted with the two ends of the first via hole and the second bonding layer arranged in the cover plate adopt different bonding sheets, and the glass transition temperature (Dk value) of the bonding sheet in the first bonding layer is smaller than that of the second bonding layer; specifically, the temperature rising stage may be divided into the following lamination stages with different pressure states:
s321, a first stage: and in a constant pressure state, the pressure value is 50-100PSI, so that the second sub-board in pressing is better preheated, the temperature uniformity of each layer is improved, and the board warping and hole deformation caused by the expansion and contraction difference between the layers are reduced.
S322, a second stage: the dynamic pressure state is that firstly, the pressure state is controlled to circularly rise and fall in a medium pressure range, in the pressure increasing process, the gummosis formed by the second bonding sheet is pressed into the first buried hole under the action of gradually increased pressure, in the pressure decreasing process, the pressure is gradually reduced, so that the gummosis can generate certain retraction in the hole under the action of the tension of the gummosis surface; preferably, the magnitude of the lower pressure value is 120-180PSI, the magnitude of the upper pressure value is 220-280PSI, and at the beginning of a dynamic pressure stage, the upper pressure value with a larger pressure value is adopted, so that the gummosis is pressed into the first buried hole with a certain pressure, and then the process of depressurization, pressurization and depressurization is repeated, so that the depth control of single-side gum filling and gummosis filling into the first buried hole is realized, meanwhile, the gum filling depth to be controlled in the first buried hole is relatively smaller and is not more than 10-20mil, so that the rate of pressurization and depressurization under the dynamic pressure state is consistent and maintained at a faster level, preferably, the time for lifting the pressure value between the upper pressure value and the lower pressure value is equal and is 1-3min, and the stability and reliability of the device hole are ensured.
S323, third stage: constant pressure state, and the pressure value is 300-400PSI; in the second stage, the first bonding layer completes the gumming hole filling process and begins to solidify steadily, the pressure is continuously increased in the continuous heating process in the third stage, the bonding sheets in the second bonding layer are promoted to flow evenly and melt between layers of the cover plate, the layers are stably bonded, meanwhile, the other layers of the second sub-board are solidified under high pressure, the thickness uniformity and reliability of the whole second sub-board are improved, and the stability and reliability of the first buried holes are also ensured.
S33, curing: in a state of constant higher temperature, the resin of the second bonding layer is solidified at high temperature, so that the second sub-board is tightly bonded, and meanwhile, the stress in the second sub-board is reduced; further, the pressing pressure on the whole second sub-board is reduced, and preparation is made for releasing the vacuum state and cooling and releasing the stress of the second sub-board.
S34, a cooling stage: and the internal stress of the plate is released under a constant pressure state with a lower pressure value, so that the second sub-plate after pressing is uniform and smooth, the shape of the first buried hole in the second sub-plate is ensured to be good and free from deformation, and the reliability of the manufactured device hole is improved.
After the second lamination, the second sub-board after lamination is also required to be drilled, the board surface is metallized, the outer layer circuit pattern is manufactured and the like according to the manufacturing data.
S4, total lamination: and overlapping the second sub-board with other required boards according to a design structure, arranging the second sub-board on the surface during board arrangement, keeping the first buried holes in the second sub-board not filled with glue and outwards sealing one side of the metal layer by hole sealing, and forming the required high-rise PCB through pressing.
The total lamination process comprises the following lamination stages: s41, a vacuum stage; s42, heating; s43, a curing stage; s44, a cooling stage; wherein, for the vacuum state and the constant pressure state adopted in the S44 stage, the pressure value is 50-100PSI, and the high-rise PCB after multiple pressing is slowly and uniformly cooled by adopting the step cooling process, so that the flatness of the whole high-rise PCB is ensured.
Specifically, the S44 cooling stage includes a plurality of continuous step cooling stages with equal time, each step cooling stage includes a cooling section and a constant temperature section, and in the same step cooling stage, the cooling section is performed before the constant temperature section; each stepped cooling stage comprises a cooling stage and a constant temperature stage, the cooling time of a single stepped cooling stage is prolonged, the cooling rate of a high-rise PCB is reduced, meanwhile, the constant temperature stage is added, the high-rise PCB is stabilized for a period of time at the tail of the single stepped cooling stage at constant temperature, the temperature uniformity of each layer of the high-rise PCB is ensured, the expansion and contraction difference among the high-rise PCBs is reduced, preferably, the total duration of the single stepped cooling stage is 12-25min, the cooling rate of the cooling stage is 5-8 ℃/min, and the duration of the constant temperature stage is not less than 60% of the total duration of the single stepped cooling stage. Further, in the cooling stage, the temperature uniformity of each layer of the high-rise PCB is ensured by maintaining the vacuum state and removing air heat conduction, and meanwhile, the constant pressure state of the pressure value at 50-100PSI is maintained, and the high-rise PCB in cooling is also prevented from being bent due to uneven sudden pressure loss temperature change by providing certain pressure for the high-rise PCB, so that uniform, flat and reliable high-rise PCB is provided for device holes with stable and reliable structure.
S5, manufacturing a device hole: and a first blind hole is formed in the surface of the high-rise PCB at a position corresponding to the first buried hole, so that the first blind hole is communicated with the first buried hole to form the device hole, and the manufacturing of the high-rise PCB with the device hole is completed.
Example 2
The embodiment provides a high-rise PCB, the circuit layer of high-rise PCB is whole to be mirror symmetry structure, and its upper and lower surface all is provided with a plurality of the device hole, all can be used to the installation of BGA device, on embodiment 1's basis, this high-rise PCB is by two same second daughter boards and other panel total pressfitting, and before the pressfitting, when arranging the board, the upper and lower surface of high-rise PCB is regarded as respectively to the second daughter board, in this high-rise PCB, the circuit layer is provided by the second daughter board, other panel is thickness filling layer or adhesive linkage, and preferably, the thickness of high-rise PCB is not less than 2mm.
Specifically, as shown in fig. 3, the circuit layer of the high-level PCB is in mirror symmetry, wherein the 46 layers are the number of copper foils in the high-level PCB, i.e. the number of circuit layers is replaced by L1 to L46, and the method for manufacturing the high-level PCB and BGA device holes thereon by lamination is as follows:
s1, laminating for one time: arranging boards according to design data, and respectively pressing L2-L23 and L24-L45 into a first sub-board;
s2, hole manufacturing and hole metallization: respectively manufacturing a plurality of first through holes on the first sub-boards of L2-L23 and L24-L45 according to the corresponding design sites of the device holes, and then manufacturing a first through hole for depositing gold through the procedures of copper deposition, electroplating, gold deposition and the like;
s3, secondary lamination: when the plate arrangement is performed, on a first sub-plate of L2-L23 and L24-L45, sequentially covering a first bonding sheet, a copper foil and other cover plates containing a second bonding layer from inside to outside on the outer sides of L2 and L45, and sequentially covering a second bonding sheet and a thickness filling plate from inside to outside on the outer sides of L23 and L24 to form a second sub-plate of L1-L23 and L24-L46, sealing a first via hole to form a first buried hole, and leveling and uniformly filling glue on one side in the first buried hole by controlling the pressurizing state in the pressing process; the first bonding sheet and the second bonding sheet adopt 1080 low-flow glue prepregs with 65% of resin content, the second bonding layer in the cover plate adopts a conventional 370HR prepreg, and the radius of an opening on the first bonding sheet is 15mil larger than that of the first through hole.
Specifically, as shown in fig. 4 to 5, the secondary bonding process of the second sub-boards of L1 to L23 and L24 to L46 is:
s31, vacuum stage: preheating at 140 deg.c for 5min in vacuum state and zero pressure state;
s32, heating: vacuum state, heating to 248 deg.C from 140 deg.C, and pressing for 23min; when the pressing stages are distinguished according to the pressure state, the following steps are obtained:
s321, a first stage: constant pressure state, pressure value is 75PSI, constant temperature state, temperature is 140 ℃, and the second sub-board in pressing is preheated;
s322, a second stage: the dynamic pressure state, the pressure value is circularly lifted four times between 150PSI and 250PSI, and 250PSI is adopted at the beginning of the dynamic pressure stage; the time for the pressure value to rise and fall between the upper pressure value and the lower pressure value is equal and is 1.5min; the temperature is gradually increased from 140 ℃ to 160 ℃; completing the flowing glue filling and curing process of the first bonding layer;
s323, third stage: constant pressure state, the pressure value is 350PSI; raising the temperature from 160 ℃ to 248 ℃, pressing for 15min, uniformly melting and flowing the bonding sheets in the second bonding layer between layers of the cover plate, and stably bonding the layers;
s33, curing: the method comprises the steps of (1) in a constant temperature state, setting the temperature at 188 ℃, curing at a high temperature for 55min under the condition that the pressure is 350PSI in a vacuum state, then releasing the vacuum state, and curing at a high temperature for 10min under the condition that the pressure is 75 PSI;
s34, a cooling stage: constant pressure, 75PSI, and reducing the temperature from 188 ℃ to 50 ℃ in 40 min.
And after the secondary lamination, drilling holes, plate surface metallization, outer layer circuit pattern manufacturing and the like are carried out on the second sub-plates of the laminated L1-L23 and L24-L46 according to manufacturing data.
S4, total lamination: overlapping the second sub-boards of L1-L23 and L24-L46 with other thickness filling layers and bonding layers, keeping the L1 and L46 positioned at the outer side, and forming a required high-level PCB through lamination;
specifically, as shown in fig. 6-7, the total lamination process includes the following lamination stages:
s41, vacuum stage: preheating at 140 deg.c for 5min in vacuum state and zero pressure state;
s42, heating: pressing at constant temperature of 75PSI and 140 ℃ for 15min under vacuum state, pressing at constant pressure of 450PSI for 16min, and heating from 140 ℃ to 220min during the process;
s43, curing: vacuum state, constant temperature state, and temperature value 188 ℃, high temperature curing for 45min under the condition that pressure value is 450PSI, then continuing high temperature curing for 45min under the condition that pressure value is 75 PSI;
s44, cooling stage: the vacuum state, the constant pressure state and the pressure value of 75PSI are adopted, and the high-rise PCB after being pressed for many times is slowly cooled from 188 ℃ to 50 ℃ by adopting a step cooling process, so that the flatness of the whole high-rise PCB is ensured; the step cooling process comprises a step cooling stage, the cooling amplitude of a single step cooling stage is at least 20 ℃, the duration is at least 15min, and the duration of the constant temperature stage is not less than 70% of the total duration of the single step cooling stage.
S5, manufacturing a device hole: and a first blind hole is formed in the upper surface and the lower surface of the high-rise PCB at a position corresponding to the first buried hole, so that the first blind hole is communicated with the first buried hole to form a device hole.
It should be understood that the foregoing examples of the present invention are merely illustrative of the present invention and are not intended to limit the present invention to the specific embodiments thereof. Any modification, equivalent replacement, improvement, etc. that comes within the spirit and principle of the claims of the present invention should be included in the protection scope of the claims of the present invention.
Claims (9)
1. The laminating manufacturing method of the high-rise PCB is characterized by comprising the following steps of:
s1, pressing for one time to finish pressing manufacture of a first sub-board;
s2, hole manufacturing and hole metallization, wherein a metallized first via hole is manufactured on the first sub-board;
s3, performing secondary lamination, namely sequentially covering a first bonding layer and a cover plate on the upper side and the lower side of the first sub-board, laminating to form a second sub-board, forming a metalized first buried hole in the second sub-board by the first via hole, filling glue on one side in the first buried hole, controlling the glue filling depth of the first buried hole, and sealing the hole on the non-filled side by a metal layer;
s4, total lamination, wherein before lamination, the second sub-board is arranged on the surface and keeps one side of the first buried hole, which is not filled with glue, outwards, and the second sub-board is laminated with other boards to form the high-rise PCB;
s5, manufacturing a device hole, namely forming a first blind hole on the surface of the high-rise PCB at a position corresponding to the first buried hole, wherein the first blind hole is communicated with the first buried hole to form the device hole;
in the step S3, the first adhesive layer includes a first adhesive sheet that is perforated at a position corresponding to the first via hole and a second adhesive sheet that is not perforated;
the diameter of the opening hole on the first bonding sheet is larger than that of the first through hole, and the opening hole and the first through hole are concentrically arranged;
before pressing, when arranging the plates, one side of the first via hole is sequentially covered with a first bonding sheet, a metal layer and a cover plate from inside to outside, and the other side is sequentially covered with a second bonding sheet and a cover plate from inside to outside;
the cover plate is one or a combination of more than one of a metal layer, a thickness filling layer, a circuit layer core plate or a second bonding layer.
2. The method for manufacturing a high-rise PCB according to claim 1, wherein the step S3 includes the following steps:
s31, vacuum stage: vacuum preheating the plates after the plates are arranged;
s32, heating: vacuum heating to enable the bonding material between the plates to flow and gap;
s33, curing: the plates are tightly adhered by high-temperature solidification;
s34, a cooling stage: releasing the internal stress of the plate;
in the step S32, the first buried hole is filled with glue;
and controlling the filling depth of the first buried hole by adjusting the pressurizing program in the S32 stage, wherein the filling depth of the first buried hole is not more than 10-20mil after pressing.
3. The lamination method of claim 2, wherein the step S32 further comprises the following steps of:
s321, a first stage: constant pressure state, the pressure value is 50-100PSI;
s322, a second stage: the dynamic pressure state, the pressure value is circularly lifted between the upper pressure value and the lower pressure value, and the lifting time of the pressure value between the upper pressure value and the lower pressure value is equal and is 1-3min;
s323, third stage: constant pressure state, the pressure value is 300-400PSI;
in the S322 stage, the lower pressure value is 120-180PSI, the upper pressure value is 220-280PSI, and the upper pressure value is adopted first when the dynamic pressure state starts.
4. The method for manufacturing a high-rise PCB according to claim 3, wherein in the step S3, the first adhesive layer is a low-flow prepreg; the radius of the opening is 10-20 mils larger than the radius of the first via.
5. The method for manufacturing a high-rise PCB according to any one of claims 1 to 4, wherein,
the step S4 comprises the following lamination stages: s41, a vacuum stage; s42, heating; s43, a curing stage; s44, a cooling stage;
in the S44 stage, a vacuum state and a constant pressure state are adopted, the pressure value is 50-100PSI, and the high-rise PCB pressed for many times is slowly and uniformly cooled by adopting a stepped cooling process.
6. The method according to claim 5, wherein the step S44 includes a plurality of continuous stepped cooling stages with equal time, the stepped cooling stages include a cooling stage and a constant temperature stage, and the cooling stage is performed before the constant temperature stage in the same stepped cooling stage.
7. The method for manufacturing the high-rise PCB in a pressing manner according to claim 6, wherein the total time length of the step cooling stage is 12-25min, the cooling rate of the cooling stage is 5-8 ℃/min, and the time length of the constant temperature stage is not less than 60% of the total time length of the step cooling stage.
8. A high-rise PCB, characterized in that it is manufactured by the press-fit manufacturing method of the high-rise PCB according to any one of claims 1 to 7;
the high-rise PCB is formed by total lamination of two identical second sub-boards and other boards;
before pressing, when arranging the boards, the second sub-boards are respectively stacked on the upper surface and the lower surface, so that the upper surface and the lower surface of the high-rise PCB are provided with a plurality of device holes;
in the high-rise PCB, the circuit layers are all provided by the second sub-board, and the other boards are thickness filling layers or bonding layers.
9. The high-rise PCB of claim 8, wherein the high-rise PCB has a thickness of not less than 2mm.
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| CN101697661A (en) * | 2009-11-11 | 2010-04-21 | 深南电路有限公司 | Methods for plugging hole of PCB and manufacturing double-sided PCB |
| WO2013186966A1 (en) * | 2012-06-14 | 2013-12-19 | パナソニック株式会社 | Composite multilayer wiring board and method for manufacturing same |
| CN217241040U (en) * | 2022-03-18 | 2022-08-19 | 深圳市牧泰莱电路技术有限公司 | Thick copper PCB with step metallization device hole |
| CN115988779A (en) * | 2022-12-02 | 2023-04-18 | 广州添利电子科技有限公司 | Process method for improving bending of mixed material PCB |
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| US6753483B2 (en) * | 2000-06-14 | 2004-06-22 | Matsushita Electric Industrial Co., Ltd. | Printed circuit board and method of manufacturing the same |
| JP2002232135A (en) * | 2001-01-30 | 2002-08-16 | Matsushita Electric Ind Co Ltd | Double-sided circuit board for lamination and its manufacturing method, and multilayer printed circuit board using the same |
| TW200505304A (en) * | 2003-05-20 | 2005-02-01 | Matsushita Electric Ind Co Ltd | Multilayer circuit board and method for manufacturing the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101697661A (en) * | 2009-11-11 | 2010-04-21 | 深南电路有限公司 | Methods for plugging hole of PCB and manufacturing double-sided PCB |
| WO2013186966A1 (en) * | 2012-06-14 | 2013-12-19 | パナソニック株式会社 | Composite multilayer wiring board and method for manufacturing same |
| CN217241040U (en) * | 2022-03-18 | 2022-08-19 | 深圳市牧泰莱电路技术有限公司 | Thick copper PCB with step metallization device hole |
| CN115988779A (en) * | 2022-12-02 | 2023-04-18 | 广州添利电子科技有限公司 | Process method for improving bending of mixed material PCB |
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