CN116489878A - Circuit board structure capable of adding layers and embedding built-in elements and manufacturing method thereof - Google Patents
Circuit board structure capable of adding layers and embedding built-in elements and manufacturing method thereof Download PDFInfo
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- CN116489878A CN116489878A CN202310276881.9A CN202310276881A CN116489878A CN 116489878 A CN116489878 A CN 116489878A CN 202310276881 A CN202310276881 A CN 202310276881A CN 116489878 A CN116489878 A CN 116489878A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 239000003292 glue Substances 0.000 claims abstract description 18
- 239000010410 layer Substances 0.000 claims description 97
- 239000000047 product Substances 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 238000005553 drilling Methods 0.000 claims description 14
- 239000011889 copper foil Substances 0.000 claims description 12
- 238000012546 transfer Methods 0.000 claims description 11
- 238000009713 electroplating Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 238000011161 development Methods 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 6
- 238000003475 lamination Methods 0.000 claims description 5
- 239000011265 semifinished product Substances 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000012792 core layer Substances 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- 238000003801 milling Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 230000001939 inductive effect Effects 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000013461 design Methods 0.000 abstract description 8
- 230000002093 peripheral effect Effects 0.000 abstract description 5
- 238000010030 laminating Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention provides a circuit board structure capable of adding layers to embed built-in elements, which comprises a core board layer and a plurality of layer adding structures, wherein network conduction connection is realized between the adjacent layer adding structures; the layer-adding structure comprises: the thickness deviation of each component is smaller than 25 mu m, the through holes are formed in the build-up core plate corresponding to each component, and the thickness of the build-up core plate is matched with the thickness of each component. The invention also provides a manufacturing method for manufacturing the circuit board structure, and by the arrangement, all components can be connected with a PCB network through blind holes on two sides and fan out signals, so that the complex wiring and network design of the product can be utilized; meanwhile, the thickness difference of the components buried in the same build-up layer is smaller than 25um, so that the glue filling difference required by the cavities where different components are located is not large, and the risks of cavity generation due to insufficient glue filling above the components and insufficient thickness of the dielectric layer in the peripheral area of the components are eliminated.
Description
Technical Field
The invention belongs to the technical field of circuit board structures and manufacturing methods, and particularly relates to a circuit board structure capable of adding layers and embedding built-in elements and a manufacturing method thereof.
Background
The type of embedded components of the PCB board at present comprises active components such as a memory chip, a power chip and a logic chip, and also comprises passive components such as a surface mount type capacitor, a resistor, an inductor and the like. The thicknesses of embedded components with different properties are often inconsistent, and even components with the same properties can also cause inconsistent thicknesses due to the difference of component models. This results in the inner core layer still having a thickness 15-20um greater than the maximum element thickness after pattern transfer is completed, thus also creating the following disadvantages:
1. most of the circuit boards have only the thickest embedded components, can be connected with a circuit board network through blind holes on both sides and fan out signals, and the rest can only be conducted and fan out on one side, so that the whole wiring and network design of the product is extremely wasted;
2. because the thickness of the core plate is far greater than that of the thinner element, when in lamination, a huge cavity above the thinner element needs to be filled with the gumming, if the cavity is not filled with the gumming sufficiently, the risk of lamination cavity is easy to generate, and meanwhile, because too much gumming is used for filling the cavity, the thickness of the dielectric layer close to the cavity is easy to be severely thinned, so that the requirement of customers cannot be met.
Disclosure of Invention
The invention aims to at least solve one of the technical problems in the prior art, and provides a circuit board structure which can solve the problems that only one side of the circuit board structure of the existing build-up embedded built-in element can be conducted and fanned, so that the waste of product production design is caused, meanwhile, a huge cavity above a thin element needs to be filled with fluid glue, the risk of laminating cavities is easy to occur, the production requirements of customers cannot be met, and the like.
The invention aims to solve at least the second technical problem in the prior art, and provides a manufacturing method of the circuit board structure of the built-in component embedded in the increased layer, which can solve the problems that only one side of the circuit board structure of the built-in component embedded in the increased layer can be conducted and fanned, so that the waste of product production design is caused, meanwhile, a huge cavity above a thin component needs to be filled with fluid glue, so that the risk of laminating cavities is easy to occur, the production requirements of customers cannot be met, and the like.
One of the purposes of the invention is realized by adopting the following technical scheme:
a circuit board structure with build-in components embedded therein, comprising: the sandwich panel comprises a sandwich panel layer and a plurality of sandwich structures respectively stacked on the upper surface and the lower surface of the sandwich panel layer, wherein network conduction connection is formed between adjacent sandwich structures;
the build-up structure comprises:
the components are adhered and fixed on the surface of the core plate layer through conductive adhesive respectively and are connected with a network on the core plate layer in a conducting manner, and the thickness deviation of each component is smaller than 25um;
the build-up core plate is arranged on the surface of the core plate layer, through holes are formed in the build-up core plate corresponding to the components, and the thickness of the build-up core plate is matched with the thickness of the components;
copper foil is stacked on the build-up core plate;
and the filling layer is filled between the core plate layer and the build-up core plate and between the build-up core plate and the copper foil.
Further, the build-up structures are symmetrically arranged on the upper surface and the lower surface of the core plate layer, and thickness deviation of the components at the same distance from the core plate layer is smaller than 25um.
Further, the component types are different at different distances from the core layer.
Further, the conductive adhesive is conductive silver paste or solder paste.
Further, the components include chip, chip-type capacitive, resistive and inductive elements.
The second purpose of the invention is realized by adopting the following technical scheme:
a method of manufacturing a circuit board structure for manufacturing an additively embedded built-in component according to any one of claims 1-5, comprising the steps of: comprising the steps of (a) a step of,
s1, preparing a core plate layer, sequentially performing processes of drilling through holes, electroplating and filling up the through holes, film pasting, exposure, development, etching, film stripping and the like on the core plate layer, and completing pattern transfer of the core plate layer;
s2, selecting a plurality of components with the thickness smaller than 25um, attaching the components to the upper surface and the lower surface of the core plate layer, and connecting the components and the core plate layer through conductive adhesive to conduct a network between the components and the core plate layer;
s3, opening the filling layer and the build-up core board for corresponding components, respectively stacking the filling layer, the build-up core board, the filling layer and the copper foil in sequence along the direction away from the upper surface and the lower surface of the core board layer, and performing high-temperature lamination, thereby forming build-up structures on the upper surface and the lower surface of the core board layer;
s4, sequentially performing blind hole drilling, blind hole filling by electroplating, film pasting, exposure, development, etching, film stripping and the like on the pressed semi-finished product, and completing pattern transfer of the structure.
Further, S5: on the product with the step S4 completed, the steps S2-S4 can be repeatedly executed, and a plurality of build-up structures are respectively stacked on the upper surface and the lower surface of the core plate layer.
Further, S6: and (3) drilling a penetrating buried hole of the product subjected to S5, plating copper on the wall of the buried hole, and finally completing the hole plugging of the buried hole according to the sequence of the vacuum resin hole plugging, the ceramic grinding plate and the electroplating.
Further, S7: and (3) performing resistance welding and surface treatment on the product subjected to the step S6, and finally performing milling forming to finish the product manufacturing.
Compared with the prior art, the invention has the beneficial effects that:
when the circuit board structure with the built-in components embedded in the build-up layers is used, the core board layer can be subjected to pattern transfer treatment firstly, then a plurality of components with thickness deviation smaller than 25um are adhered and fixed on the upper surface and the lower surface of the core board layer, then the components are stacked and pressed and fixed in sequence through the glue filling layer, the build-up layer core board and the copper foil, and finally the pattern transfer treatment is carried out again. Through the arrangement, all components can be connected with the PCB network through the blind holes in double sides and fan out signals, so that complex wiring and network design of the product can be utilized; meanwhile, the thickness difference of the components embedded in the same build-up layer is smaller than 25um, so that the glue filling difference required by cavities where different components are located is not large, the risks of cavity generation due to insufficient glue filling above the components and insufficient thickness of dielectric layers in peripheral areas of the components are eliminated, the quality of the circuit board structure is improved, and the production cost loss is reduced. The invention also provides a manufacturing method for manufacturing the circuit board structure, by the arrangement, the complex wiring and network design of the product can be utilized, meanwhile, the risks of cavity generation due to insufficient glue filling above the components and insufficient thickness of the dielectric layer in the peripheral area of the components are eliminated, the quality of the circuit board structure is improved, and the production cost loss is reduced.
Drawings
Fig. 1 is a schematic structural view of a preferred embodiment of a circuit board structure with build-up components embedded therein.
Wherein, each reference sign in the figure:
10. a core plate layer; 20. a component; 30. laminating a core plate; 40. a glue filling layer; 50. copper foil; 60. conducting resin; 70. and (5) burying holes.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and detailed description, wherein it is to be understood that, on the premise of no conflict, the following embodiments or technical features may be arbitrarily combined to form new embodiments.
The invention is shown with reference to fig. 1, which comprises a core plate layer 10 and a plurality of layered structures respectively stacked on the upper surface and the lower surface of the core plate layer 10, wherein the adjacent layered structures are connected in a network conduction manner; the build-up structure comprises: the device comprises a plurality of components 20, a build-up core plate 30, copper foils 50, a filling layer 40 and a filling layer 40, wherein the components 20 are respectively adhered and fixed on the surface of the core plate layer 10 through conductive adhesive 60 and are respectively connected with a network on the core plate layer 10, the build-up core plate 30 is arranged on the surface of the core plate layer 10, the copper foils 50 are stacked on the build-up core plate 30, the filling layer 40 is filled between the core plate layer 10 and the build-up core plate 30 and between the build-up core plate 30 and the copper foils 50, the thickness deviation of each component 20 is smaller than 25um, the build-up core plate 30 is provided with through holes corresponding to each component 20, and the thickness of the build-up core plate 30 is matched with the thickness of each component 20. When the scheme is used, the pattern transfer treatment can be firstly carried out on the core plate layer 10, then a plurality of components 20 with the thickness deviation smaller than 25um are adhered and fixed on the upper surface and the lower surface of the core plate layer 10, then the components are sequentially stacked, pressed and fixed through the glue filling layer 40, the build-up core plate 30 and the copper foil 50, and finally the pattern transfer treatment is carried out again. Through the arrangement, all the components 20 can be connected with the PCB network through the blind holes in double faces and fan out signals, so that complex wiring and network design of the product can be utilized; meanwhile, the thickness difference of the components 20 buried in the same build-up layer is smaller than 25um, so that the glue filling difference required by the cavities where different components 20 are positioned is not large, the risks of cavity generation due to insufficient glue filling above the components 20 and insufficient thickness of the dielectric layer in the peripheral area of the components 20 are eliminated, the quality of the circuit board structure is improved, and the production cost loss is reduced. Specifically, the value smaller than 25um is selected for calculation consideration of adapting to laser drilling blind holes and mechanical drilling through holes.
As a preferred embodiment of the invention, it may also have the following additional technical features:
in this embodiment, referring to fig. 1, a plurality of build-up structures are symmetrically disposed on the upper and lower surfaces of the core board layer 10, and the thickness deviation of the component 20 at the same distance from the core board layer 10 is less than 25um. The components 20 on the build-up structure, which are specifically spaced from the upper and lower surfaces of the core plate layer 10 by the same distance, are all of the same type, thereby ensuring that the thickness deviation is within 25um. Through the arrangement, the circuit board structure after molding can be ensured to be basically symmetrical up and down, and the risk that the element is bent or even cracked due to the influence of stress generated by the asymmetry of the structure is avoided. The stability and the service life of the circuit board structure are improved.
In this embodiment, referring to fig. 1, the types of the components 20 are different at different distances from the core plate layer 10. Through the arrangement, the circuit board structure after the forming is basically symmetrical up and down, the structure is stable, meanwhile, different types of components 20 can be embedded in different build-up structures of the core board layer 10, the types and the number of the embedded components 20 are increased, and the circuit board structure after the forming is also enabled to have more complex electronic circuit performance and more various functions.
In this embodiment, referring to fig. 1, the conductive paste 60 is conductive silver paste or solder paste. Through the arrangement, the two materials can be used for bonding and fixing the component 20 on the core board layer 10, and meanwhile, the two materials also have the electric conduction capability, so that the component 20 bonded and fixed by the two materials can be conducted with a circuit on the core board layer 10, and a fan-out signal of the Bottom surface of the component is realized. It should be noted that, in the curing process of the conductive paste 60, different curing modes are adopted, if the conductive paste 60 is conductive silver paste, the conductive paste is baked and cured by a programmable oven, and if the glue is solder paste, the conductive paste is cured by lead-free reflow soldering.
In this embodiment, the component 20 includes a chip, a chip-type capacitor, a resistor, and an inductor. Through the above arrangement, the above components 20 can be mounted in the core board layer 10 and the build-up structure, so that the formed circuit board structure has more complex electronic circuit performance and more various functions.
The invention also provides a method for manufacturing the circuit board structure with the built-in component embedded in the layer, which comprises the following steps: comprising the steps of (a) a step of,
s1, preparing a core plate layer 10, punching an X-shaped laser drilling through hole on the core plate layer 10, then electroplating and filling the X-shaped laser drilling through hole, and finally sequentially performing processes of film pasting, exposure, development, etching, film stripping and the like on the core plate layer 10 to complete pattern transfer of the core plate layer 10;
s2, selecting a plurality of components 20 with the thickness smaller than 25um, attaching the components 20 to the upper surface and the lower surface of the core plate layer 10, and connecting the components 20 and a network between the core plate layer 10 through connection of conductive adhesive 60;
s3, opening the glue filling layer 40 and the build-up core board 30 to the corresponding components 20, arranging the boards from bottom to top in sequence along the direction away from the upper surface and the lower surface of the core board layer 10 respectively towards the direction away from the upper surface and the lower surface of the core board layer 10, and pressing the boards at high temperature by a press to form a build-up structure on the upper surface and the lower surface of the core board layer 10; the glue filling layer 40 is usually a prepreg, which melts and fills the cavity between the different components 20 and the build-up core board 30 during the high-temperature lamination process;
s4, performing laser drilling pretreatment on the semi-finished product, processing laser drilling blind holes, processing a first mechanical drilling buried hole 70, then electroplating, filling the laser drilling blind holes, plating copper on the wall of the buried hole 70, and connecting and conducting circuits and electric signals in the build-up core board 30, the components 20 and the core board layer 10 in each build-up structure in the mode;
s5, plugging the semi-finished product subjected to the step S4 with the buried holes 70 according to the flow sequence of vacuum resin plugging, ceramic grinding and electroplating;
and S6, sequentially performing processes of film pasting, exposure, development, etching, film stripping and the like on the semi-finished product after the completion of the step S5, and completing pattern transfer of the layered structure.
S7, the staff can repeatedly execute the steps of S2-S6 on the finished product in S6 according to the requirements of the user, and a plurality of layering structures are stacked on the upper surface and the lower surface of the product;
and S8, performing resistance welding and surface treatment on the product subjected to the steps, and finally milling and forming to finish the product manufacturing.
Through the arrangement, compared with the traditional product structure and processing method, the novel product structure and processing method have the following advantages:
1. all components 20 can be connected to the PCB network through blind vias on both sides and fan out signals, enabling complex wiring and network designs of the product to be utilized.
2. The thickness difference of the components 20 embedded in the same build-up structure is only 25um, so that the difference of the glue filling amounts required by the cavities where different components 20 are positioned is not large, and the risk of insufficient glue filling above the components 20, cavity generation or insufficient thickness of the dielectric layer in the peripheral area of the components 20 is eliminated.
3. The thickness dimension and the upper and lower layout of the whole mechanism and each component 20 of the circuit board structure formed by the method are basically symmetrical, the influence of stress generated by the asymmetry of the structure on the components is avoided, and the risk of bending and even cracking of the circuit board structure is eliminated.
4. The components 20 can be embedded in any layer, and the number of the components 20 which can be embedded is doubled, so that the circuit board structure has more complex electronic circuit performance.
5. The stacked package (Package on Package) of the chip in the PCB is realized, the packaging density is high, and the transmission path is short.
The above additional technical features can be freely combined and superimposed by a person skilled in the art without conflict.
The above embodiments are only preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, but any insubstantial changes and substitutions made by those skilled in the art on the basis of the present invention are intended to be within the scope of the present invention as claimed.
Claims (9)
1. The circuit board structure capable of adding layers and embedding built-in elements is characterized by comprising: a core plate layer (10) and a plurality of layer-adding structures respectively stacked on the upper surface and the lower surface of the core plate layer (10), wherein the adjacent layer-adding structures are connected in a network conduction way;
the build-up structure comprises:
the components (20) are respectively adhered and fixed on the surface of the core plate layer (10) through conductive adhesive (60) and are connected with a network on the core plate layer (10) in a conducting manner, and the thickness deviation of each component (20) is smaller than 25 mu m;
the build-up core board (30) is arranged on the surface of the core board layer (10), through holes are formed in the build-up core board (30) corresponding to the components (20), and the thickness of the build-up core board (30) is matched with the thickness of the components (20);
copper foil (50) stacked on the build-up core board (30);
and the filling layer (40) is filled between the core plate layer (10) and the build-up core plate (30) and between the build-up core plate (30) and the copper foil (50).
2. Circuit board structure with built-in components embedded in layers according to claim 1, characterized in that a plurality of said build-up structures are symmetrically arranged on the upper and lower surfaces of said core board layer (10), the thickness deviation of said components (20) at the same distance from said core board layer (10) is less than 25um.
3. Circuit-board structure of an additively embedded built-in component according to claim 1, characterized in that the types of components (20) at different distances from the core layer (10) are different.
4. Circuit board structure with built-in components embedded in layers according to claim 1, characterized in that the conductive glue (60) is conductive silver paste or solder paste.
5. Circuit board structure with built-in components embedded in layers according to claim 1, characterized in that the components (20) comprise chip, chip-mounted capacitive, resistive and inductive components.
6. A method of manufacturing a circuit board structure for manufacturing an additively embedded built-in component according to any one of claims 1-5, comprising the steps of: comprising the steps of (a) a step of,
s1, preparing a core plate layer (10), and sequentially performing the processes of drilling through holes, electroplating and filling up the through holes, film pasting, exposure, development, etching, film stripping and the like on the core plate layer (10) to finish pattern transfer of the core plate layer (10);
s2, selecting a plurality of components (20) with the thickness smaller than 25um, attaching the components (20) to the upper surface and the lower surface of the core plate layer (10), and connecting the components (20) and a network between the core plate layer (10) through connection of conductive adhesive (60);
s3, opening the filling layer (40) and the build-up core board (30) for corresponding components (20), respectively stacking the filling layer (40), the build-up core board (30), the filling layer (40) and the copper foil (50) in sequence along the direction away from the upper surface and the lower surface of the core board layer (10), and performing high-temperature lamination, thereby forming a build-up structure on the upper surface and the lower surface of the core board layer (10);
s4, sequentially performing blind hole drilling, blind hole filling by electroplating, film pasting, exposure, development, etching, film stripping and the like on the pressed semi-finished product, and completing pattern transfer of the structure.
7. The method of manufacturing of claim 6, further comprising S5: and (3) repeatedly executing the steps S2-S4 on the product with the step S4, and stacking a plurality of build-up structures on the upper surface and the lower surface of the core plate layer (10) respectively.
8. The method of manufacturing of claim 7, further comprising S6: and (3) drilling a penetrating buried hole (70) on the product subjected to the step S5, plating copper on the wall of the buried hole (70), and finally completing the plugging of the buried hole (70) according to the sequence of the vacuum resin plugging, the ceramic grinding and the electroplating.
9. The method of manufacturing of claim 8, further comprising S7: and (3) performing resistance welding and surface treatment on the product subjected to the step S6, and finally performing milling forming to finish the product manufacturing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310276881.9A CN116489878A (en) | 2023-03-20 | 2023-03-20 | Circuit board structure capable of adding layers and embedding built-in elements and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310276881.9A CN116489878A (en) | 2023-03-20 | 2023-03-20 | Circuit board structure capable of adding layers and embedding built-in elements and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116489878A true CN116489878A (en) | 2023-07-25 |
Family
ID=87214618
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310276881.9A Pending CN116489878A (en) | 2023-03-20 | 2023-03-20 | Circuit board structure capable of adding layers and embedding built-in elements and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116489878A (en) |
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2023
- 2023-03-20 CN CN202310276881.9A patent/CN116489878A/en active Pending
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