CN101170897B - No empty hole installation method for installing electronic components - Google Patents
No empty hole installation method for installing electronic components Download PDFInfo
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- CN101170897B CN101170897B CN2007101707005A CN200710170700A CN101170897B CN 101170897 B CN101170897 B CN 101170897B CN 2007101707005 A CN2007101707005 A CN 2007101707005A CN 200710170700 A CN200710170700 A CN 200710170700A CN 101170897 B CN101170897 B CN 101170897B
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- building brick
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Abstract
The invention is used in none hollow space installation method of electronic component installation, and mainly facilitates insulating material exerted on the electronic component originally to be guided to a gas vent among a group of connecting points on a circuit board, until filling the hollow space between the electronic component and the connecting points at least. The invention is used in non hollow space installation method of electronic component installation. When the electronic component is assembled on a group of connecting points on a circuit board, the insulating material formed among the connecting points beforehand can fill the hollow space between the electronic component and the connecting points, under the oppression of the electronic component.
Description
Technical field
The present invention relates to a kind of electronic building brick and imbed method, particularly a kind of no empty hole installation method that is used to install electronic building brick.
Background technology
So-called " flush type passive component " (Embedded Passives), system utilizes multiple-plate inner plating processing procedure, carry out etching or mode of printing, capacitor or resistor are directly manufactured on inner plating, again after being pressed into multi-layer sheet, scattered (Discrete) passive component that is welded when assembling on the board falling face be can replace, driving component and wiring person thereof given to save the plate face.
The formula technology is gone in flush type, implanted or Tibetan, be the earliest Ohmega-ply company utilize the original Copper Foil of inner plating face hair side (Matt Side) on, handle the phosphorus nickel alloy layer of upper film in addition, as resistive composition (Resistive Element) and pressing becomes Thin core, and then utilize twice photoresistance and three etched technology, on ad-hoc location, form required film " resistor ".Owing to be to be embedded in the internal layer, merchant's name is called Buried Resistor (BR).
After this, PCB manufacturer--Zycon in the U.S. in 1992, once in the multi-layer sheet of high-order, outside original Vcc/GND internal layer, add the inner plating of the dielectric layer of (2-4mil) as thin as a wafer in addition, utilize the parallel metal copper coin face of its vast area, make the capacitor that becomes globality, this merchant's name is called BuriedCapacitor (BC).Its advantage for avoid noise under the fundamental frequency operation, energy of a charge be provided, voltage stabilizing.Zycon company had also once applied for the several pieces of patents about BC (being U.S. Patent number 5,079,069,5,161,086,5,155,655) for this reason.
When the assembling buried capacitor, if adopt distributed part assembling means, the general practice all can adopt first circuit board manufacturing, assembles afterwards again, then proceeds the making of circuit board then.Among this, can be electrically connected to electric capacity in order to make circuit board, on circuit board, can make earlier and make one group of tie point.Yet; usually have the cavity district of depression between this group tie point, when electronic building brick was installed in this group tie point, electronic building brick in fact was to be installed on the district of cavity; this causes in follow-up pressure programming, and as easy as rolling off a log because electronic building brick bottom lacks complete supportive and by compression failure.Though, in existing technology, can before carrying out pressure programming, insert insulating material at above-mentioned cavity district as far as possible, the steric hindrance that electronic building brick itself is caused makes the cavity district still be difficult to be filled up fully.
Summary of the invention
Main purpose of the present invention is, a kind of no empty hole installation method that is used to install electronic building brick is provided, and it can fill up the cavity district between electronic building brick and the one group of tie point, to avoid the supportive deficiency of electronic building brick.
Based on above-mentioned purpose, the present invention is used for installing the no empty hole installation method of electronic building brick, main make that putting on insulating material on the electronic building brick originally is led to gas port between one group of tie point on the circuit board, up to the cavity district of filling up at least between electronic building brick and the one group of tie point.The present invention is used for installing the no empty hole installation method of electronic building brick, when electronic building brick is assembled on one group of tie point on the circuit board, can make and be formed on one group of insulating material between the tie point in advance, because of being subjected to the compressing of electronic building brick, and fill up cavity district between electronic building brick and the one group of tie point.
Description of drawings
Can be further understood by the detailed description of following accompanying drawing and inventive embodiments about the advantages and spirit of the present invention.
Figure 1A～Fig. 1 E be used to install for the present invention electronic building brick no empty hole installation method first implement schematic diagram;
Fig. 2 be used to install for the present invention electronic building brick no empty hole installation method second implement schematic diagram;
Fig. 3 A～Fig. 3 C be used to install for the present invention electronic building brick no empty hole installation method the 3rd implement schematic diagram.
The reference numeral explanation
10 substrates, 11 line layers
13,14 1 groups of tie points of 12 power/ground
20 gas ports, 30 electric conducting materials
31 electronic building bricks, 40 cavity district
50 dielectric layers, 51 fibrages
52,53 resin beds, 60,70 copper foil layers
100 insulating material
Embodiment
See also Figure 1A～Fig. 1 E, Figure 1A～Fig. 1 E be used to install for the present invention electronic building brick no empty hole installation method first implement schematic diagram.Shown in Figure 1A, can be electrically connected to electronic building brick 31 (for example passive component, electric capacity, resistance or diode) in order to make circuit board (including substrate 10, line layer 11, power/ground 12), on circuit board, can make one group of tie point earlier.This group tie point can be 13,14 compositions of two tie points.
In simple terms, shown in Fig. 1 D, in order to provide complete supportive, utilize pull of vacuum that insulating material 100 is fed to gas port 20 below it through electronic building bricks 31 earlier, and fill up at the cavity district 40 between electronic building brick 31, the one group of tie point 13,14 to electronic building brick 31.What need pay special attention to is that above-mentioned attraction step can be carried out before carrying out pressure programming.
Specifically, shown in Figure 1B, utilize machine drilling or laser pore-forming, between this group tie point 13,14, run through circuit board, and form gas port 20.Then, just make electronic building brick 31 utilize electric conducting material 30 to be assembled on this group tie point 13,14 on the circuit board, shown in Fig. 1 C.Then, shown in Fig. 1 D, utilize methods such as printing coating, some glue or ink-jet, apply insulating material 100 facing to electronic building brick 31.At last, utilize pull of vacuum, make insulating material 100 electronic building brick 31 of flowing through, and be led to the gas port 20 between this group tie point 13,14, up to the cavity district of filling up at least between electronic building brick 31 and this group tie point 13,14 20, shown in Fig. 1 E.
But under all multifactor impacts, insulating material 100 may fill up gas port 20 fully, and then causes being formed with the gas port 20 in cavity.For this reason, can cooperate pressure programming, gas port 20 is filled up.
See also Fig. 2, Fig. 2 be used to install for the present invention electronic building brick no empty hole installation method second implement schematic diagram.As shown in Figure 2, along with utilizing dielectric layer 50 (forming) when another circuit board being pressure bonded on the circuit board that electronic building brick 31 is installed by fibrage 51,52,53 of resin beds, make insulating material 100 circuit unit 31 of flowing through, and be led to gas port 20 between this group tie point 13,14, up to the cavity district of filling up at least between electronic building brick 31 and this group tie point 13,14 40.What need pay special attention to is, in above-mentioned pressure programming, among the insulating material of the dielectric layer below the gas port 20 50 will be depressed into gas port 20, and then strengthens the purpose of filling up gas port 20.
See also Fig. 3 A～Fig. 3 C, Fig. 3 A～Fig. 3 C be used to install for the present invention electronic building brick no empty hole installation method the 3rd implement schematic diagram.As shown in Figure 3A, in order to make circuit board (including substrate 10, line layer 11, power/ground 12) can be electrically connected to electronic building brick 31, on circuit board, can make earlier and make one group of tie point 13,14, and between one group of tie point 13,14, have cavity district 40.
Shown in Fig. 3 B, between group tie point 13,14, apply insulating material 100 earlier, when making electronic building brick 31 be assembled on this group tie point 13,14 on the circuit board then, can make insulating material 100 fill up the cavity district 40 between electronic building brick 31 and this group tie point 13,14.
By the above detailed description of preferred embodiments, be that hope can be known description feature of the present invention and spirit more, and be not to come category of the present invention is limited with above-mentioned disclosed preferred embodiment.On the contrary, its objective is that hope can contain in the category of claim of being arranged in of various changes and tool equality institute of the present invention desire application.
Claims (9)
1. no empty hole installation method that is used to install electronic building brick comprises:
Circuit board with one group of tie point is provided;
Between this group tie point, run through this circuit board, and form a gas port;
One electronic building brick is assembled on this group tie point on this circuit board;
Apply an insulating material facing to this electronic building brick; And
Make this insulating material this electronic building brick of flowing through, and be led to this gas port between this group tie point, up to filling up the cavity of one between this electronic building brick and this group tie point district at least.
2. the no empty hole installation method that is used to install electronic building brick as claimed in claim 1 is characterized in that, this electronic building brick is electric capacity, resistance, diode.
3. the no empty hole installation method that is used to install electronic building brick as claimed in claim 1 is characterized in that, this gas port is to be utilized machine drilling or the laser pore-forming forms.
4. the no empty hole installation method that is used to install electronic building brick as claimed in claim 1 is characterized in that, utilizes printing coating, some glue or ink-jet to apply this insulating material.
5. the no empty hole installation method that is used to install electronic building brick as claimed in claim 1 is characterized in that, utilizes pull of vacuum, makes this insulating material be led to this gas port.
6. the no empty hole installation method that is used to install electronic building brick as claimed in claim 1 is characterized in that, further comprises:
When utilizing a dielectric layer one circuit board to be pressure bonded on this circuit board that this electronic building brick is installed, make this insulating material this circuit unit of flowing through, and be led to this gas port between this group tie point, up to this cavity district of filling up at least between this electronic building brick and this group tie point.
7. no empty hole installation method that is used to install electronic building brick comprises:
Circuit board with one group of tie point is provided;
Between this group tie point, apply an insulating material; And
One electronic building brick is assembled on this group tie point on this circuit board, and makes this insulating material fill up the cavity of one between this electronic building brick and this group tie point district.
8. the no empty hole installation method that is used to install electronic building brick as claimed in claim 7 is characterized in that, this electronic building brick is electric capacity, resistance, diode.
9. the no empty hole installation method that is used to install electronic building brick as claimed in claim 7 is characterized in that, utilizes printing coating, some glue or ink-jet to apply this insulating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101707005A CN101170897B (en) | 2007-11-21 | 2007-11-21 | No empty hole installation method for installing electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007101707005A CN101170897B (en) | 2007-11-21 | 2007-11-21 | No empty hole installation method for installing electronic components |
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| Publication Number | Publication Date |
|---|---|
| CN101170897A CN101170897A (en) | 2008-04-30 |
| CN101170897B true CN101170897B (en) | 2010-06-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101707005A Active CN101170897B (en) | 2007-11-21 | 2007-11-21 | No empty hole installation method for installing electronic components |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103596369B (en) * | 2013-11-14 | 2016-10-26 | 广州杰赛科技股份有限公司 | The rigid-flex combined board manufacture method of tool blind slot |
| CN204408283U (en) | 2015-02-15 | 2015-06-17 | 华为技术有限公司 | A kind of power tube syndeton of power amplifier and power amplifier |
| CN113556884B (en) * | 2020-04-24 | 2022-11-15 | 鹏鼎控股(深圳)股份有限公司 | Embedded circuit board and manufacturing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1391431A (en) * | 2001-06-07 | 2003-01-15 | Lg电子株式会社 | Printing circuit board pore filling methods and apparatus |
| CN1434674A (en) * | 2001-12-28 | 2003-08-06 | 全懋精密科技股份有限公司 | Method for making multilayer circuit board using preimmersion base material as adhesive layer |
-
2007
- 2007-11-21 CN CN2007101707005A patent/CN101170897B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1391431A (en) * | 2001-06-07 | 2003-01-15 | Lg电子株式会社 | Printing circuit board pore filling methods and apparatus |
| CN1434674A (en) * | 2001-12-28 | 2003-08-06 | 全懋精密科技股份有限公司 | Method for making multilayer circuit board using preimmersion base material as adhesive layer |
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|---|---|
| CN101170897A (en) | 2008-04-30 |
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