CN115666010B - Rigid-flex printed circuit board and electromagnetic shielding film falling control method thereof - Google Patents
Rigid-flex printed circuit board and electromagnetic shielding film falling control method thereof Download PDFInfo
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Abstract
The invention discloses a rigid-flex printed circuit board and an electromagnetic shielding film falling control method thereof, which comprise the following steps: s1, manufacturing a hard board and a soft board; s2, manufacturing a covering film; s3, manufacturing an electromagnetic shielding film; s4, manufacturing a high-temperature-resistant PI protective film; s5, laminating the board layers; s6, product inspection; s7, tearing the high-temperature-resistant PI protective film, solving the problems that the mode of pressing the electromagnetic shielding film is expensive or the appearance is difficult to meet the quality requirement of a customer by designing a manufacturing method of a rigid-flex combined board, realizing the expansion and shrinkage controllability of the flexible board, saving the production time, saving the cost without introducing new equipment, effectively improving the falling problem of the electromagnetic shielding film, improving the appearance production yield of products and meeting the quality requirement of the customer.
Description
Technical Field
The invention belongs to the technical field of rigid-flex boards, and particularly relates to a rigid-flex board and an electromagnetic shielding film falling control method thereof.
Background
With the continuous progress of electronic information industry technology, the functional integration of products is continuously improved, which can meet the requirements of the development direction of miniaturization, densification and high multilayering, the circuit design of a circuit board is gradually complicated, the used components are also continuously increased, the noise and the external electromagnetic sound generated among the internal circuits and the components are also increasingly serious, the electromagnetic interference formed among the components seriously influences the signal transmission, and the useless electromagnetic wave can be induced with the electric signals of the components or other electronic components, so that the problem of signal distortion caused by the electromagnetic interference on the product signals in the transmission process is avoided.
The existing method for pressing the electromagnetic shielding film is a process for pressing a layer of electromagnetic shielding film on a soft board in a flexible area of the soft board after a finished product is uncovered in a post-process, but the method has the problems that after the product is uncovered, the flexible area and an outer layer form steps with different depths of the steps, special equipment needs to be purchased, a die is opened according to different sizes and thicknesses for pressing, and the cost of the special equipment and the die is increased.
The electromagnetic shielding film is pressed by adopting a processing technology of a hot press and a baking plate, but the expansion and shrinkage of the soft plate are not controlled by the method, the surface of the electromagnetic film drops after the finished product is uncovered, and the appearance of the product cannot meet the quality requirement of customers.
Disclosure of Invention
According to the rigid-flex printed circuit board and the method for controlling the falling of the electromagnetic shielding film thereof, the manufacturing method of the rigid-flex printed circuit board is designed, the problems that the mode for pressing the electromagnetic shielding film is expensive or the appearance is difficult to meet the quality requirements of customers are solved, the controllability of the expansion and shrinkage of the flexible printed circuit board is realized, the production time is saved, new equipment is not required to be introduced, the cost is saved, the falling problem of the electromagnetic shielding film is effectively improved, the appearance production yield of the product is improved, and the quality requirements of the customers are met.
The technical scheme provided by the embodiment of the application is as follows:
a method for controlling the falling of an electromagnetic shielding film of a rigid-flex printed circuit board comprises the following steps:
s1, manufacturing a hard board and a soft board: manufacturing a hard board according to a conventional circuit board process, and waiting for browning and pressing; manufacturing a flexible board according to a conventional circuit board process, and waiting for pressing a covering film;
s2, manufacturing a covering film: a, cutting a covering film and drilling a positioning hole; b, windowing the covering film with the drilled positioning hole; c, attaching the milled covering film to the flexible board; d, pressing the soft board which is attached with the covering film, thereby completing the manufacturing of the covering film;
s3, manufacturing an electromagnetic shielding film: a, cutting the electromagnetic shielding film and drilling a positioning hole; b, windowing the electromagnetic shielding film with the drilled positioning hole; c, attaching the milled electromagnetic shielding film on the covering film in an aligned manner; d, pre-pressing the attached electromagnetic shielding film by a fast press; e, tearing off the release film on the surface of the electromagnetic shielding film subjected to prepressing, thereby completing the manufacturing of the electromagnetic shielding film;
s4, manufacturing a high-temperature-resistant PI protective film: a, cutting a high-temperature-resistant PI protective film and drilling a positioning hole; b, milling the high-temperature-resistant PI protective film with the drilled positioning hole for the first time; c, attaching the high-temperature-resistant PI protective film subjected to the first milling to the electromagnetic shielding film; d, milling the attached high-temperature-resistant PI protective film for the second time; e, tearing off redundant parts after milling; f, prepressing the attached high-temperature-resistant PI protective film to complete the manufacturing of the high-temperature-resistant PI protective film; wherein first time mill and cut the realization with the second time adoption laser mode, effectively guarantee the complete smoothness nature of milling, guarantee the suitable size of high temperature resistant PI protection film 5.
S5, laminating of board layers: pressing the hard board and the soft board according to specific production pressing parameters to complete board layer pressing; the soft board and the hard board are pressed and fixed through the low-flow-glue prepreg;
s6, product inspection: performing functional and appearance inspection on the product;
s7, tearing the high-temperature-resistant PI protective film: after the hard board area corresponding to the flexible area is uncovered, the high-temperature-resistant PI protective film of the flexible area is torn off manually. The uncovering can be realized by adopting a laser or V-CUT or depth control milling mode.
According to the invention, the electromagnetic shielding film is pressed by the mode, new equipment is not required to be introduced, and the cost is effectively saved. Wherein, the electromagnetic shielding film is pressed by a rapid press instead of full pressure, so that the expansion and shrinkage of the soft board are controllable, and the production time efficiency is effectively saved. And before the lamination, a high-temperature-resistant PI protective film is attached to the electromagnetic shielding film, so that the problem of falling off of the electromagnetic shielding film can be effectively solved, the appearance production yield of the product is effectively improved, and the quality requirement of customers is met.
The method comprises the following steps of:
the invention adopts the soft board expansion and shrinkage data of the fast press plus baking plate process as follows:
the data from the two tables above yields: the smaller the above range, the smaller the expansion and contraction. The fast piezoelectric magnetic shielding film is adopted to replace full pressure, so that the expansion and shrinkage of the soft board can be effectively controlled, and the production time efficiency is saved.
Further, between S2 and S3, the surfaces of the flexible board and the cover film are subjected to plasma roughening treatment. Through the arrangement, the surface of the soft board is coarsened, and the bonding force between the soft board and the hard board is increased; meanwhile, the surface of the covering film is coarsened, the binding force between the covering film and the electromagnetic shielding film is increased, the electromagnetic shielding film is effectively prevented from falling off easily, and the binding stability is improved.
Further, in S3, the electromagnetic shielding film includes a conductive adhesive layer and a resin layer, which are sequentially connected. Through this setting, effectively shield external electromagnetic interference's effect, guarantee good shielding performance, guarantee that the circuit does not receive other signal interference's function.
Further, in the step c of S3, the alignment bonding is fixedly bonded by adopting an electric iron heating mode. Through this setting, guarantee electromagnetic shielding film laminating stability, for follow-up pre-compaction improves accurate nature, guarantee electromagnetic shielding film's pressfitting quality.
Further, the pre-pressing in the step d in the step S3 adopts the temperature of 175-185 ℃; pressure of 100-120
(ii) a The prepressing time is 10-20s. Through the setting of this pre-compaction condition, effectively guarantee to stabilize the cohesion between electromagnetic shielding film and the cover membrane, effectively prevent the obscission, guarantee the pressfitting quality.
Further, in S4, the length of the high-temperature-resistant PI protective film is smaller than that of the flexible area, and the high-temperature-resistant PI protective film is arranged in the middle of the flexible area. The distance between one end of the high-temperature-resistant PI protective film and one end of the flexible area is 0.1-0.3mm. Through this setting, at the pressfitting in-process, can prevent effectively that high temperature resistant PI protection film from stretching into the rigidity region, guarantee the later stage and tear the smooth and easy nature of high temperature resistant PI protection film, and guarantee the production quality of rigid-flex board.
Further, in step S4, the first milling and the second milling in steps b and d are performed in a laser mode. Through this setting, effectively guarantee the complete smoothness nature of milling, guarantee the suitable size of high temperature resistant PI protection film.
Further, in the step C in S4, an electric soldering iron fixing mode is adopted for attaching. Through this setting, effectively with high temperature resistant PI protection film stable laminating on electromagnetic shield membrane, guarantee the accurate cutting of milling the second time, guarantee the suitable milling size of high temperature resistant PI protection film.
Further, the prepressing in the step f in the step S4 is realized by a quick press; the temperature is 175-185 ℃; pressure of 100-120
(ii) a The prepressing time is 400-600s. Through the setting of this pre-compaction condition, effectively guarantee to stabilize cohesion between electromagnetic shielding film and the high temperature resistant PI protection film, effectively prevent the obscission, guarantee the pressfitting quality, high temperature resistant PI protection film is at the effective protective electromagnetic shielding film of later stage soft board and hard board pressfitting in-process.
A rigid-flex printed circuit board is manufactured according to the electromagnetic shielding film falling control method.
The invention has the beneficial effects that:
by designing the manufacturing method of the rigid-flex printed circuit board, the problems that the mode of pressing the electromagnetic shielding film is expensive or the appearance is difficult to meet the quality requirements of customers are solved, the controllability of expansion and shrinkage of the flexible printed circuit board is realized, the production timeliness is saved, new equipment does not need to be introduced, the cost is saved, the falling problem of the electromagnetic shielding film is effectively improved, the appearance production yield of products is improved, and the quality requirements of customers are met.
Drawings
FIG. 1 is a flowchart illustrating a method for controlling the falling-off of the electromagnetic shielding film according to the present invention;
FIG. 2 is a schematic structural view of a rigid-flex printed circuit board according to a first embodiment of the present invention;
FIG. 3 is a schematic diagram of the high temperature resistant PI protective film milling operation in the present invention;
FIG. 4 is a diagram illustrating a state of a rigid-flex board with an electromagnetic shielding film falling off in the prior art;
fig. 5 is a schematic view of a rigid-flex board in which the electromagnetic shielding film does not fall off in the present invention.
The labels in the figure are: a hard board 1; a flexible board 2; a cover film 3; an electromagnetic shielding film 4; a high-temperature resistant PI protective film 5; low flow prepreg 6.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
To facilitate an understanding of the present invention for those skilled in the art, the present invention will be described in further detail below with reference to specific embodiments and accompanying drawings.
As shown in fig. 1 to 5, an embodiment of the present invention provides a method for controlling falling of an electromagnetic shielding film of a 4-layer rigid-flex printed circuit board, including the following steps:
s1, manufacturing a hard board 1 and a soft board 2: manufacturing a hard board 1 according to a conventional circuit board process, and waiting for browning and pressing; manufacturing a flexible board 2 according to a conventional circuit board process, and waiting for pressing a covering film 3;
s2, manufacturing of a covering film 3: a, cutting a covering film 3 and drilling a positioning hole; b, windowing the covering film 3 with the drilled positioning hole; c, attaching the milled covering film 3 to the soft board 2; d, pressing the flexible board 2 which is attached with the covering film 3, thereby completing the manufacturing of the covering film 3;
s3, manufacturing the electromagnetic shielding film 4: a, cutting the electromagnetic shielding film 4 and drilling a positioning hole; b, windowing the electromagnetic shielding film 4 with the drilled positioning hole; c, attaching the milled electromagnetic shielding film 4 to the covering film 3 in an aligned manner; d, pre-pressing the electromagnetic shielding film 4 which is completely attached through a quick press; e, tearing off the release film on the surface of the electromagnetic shielding film 4 after the pre-pressing, thereby completing the manufacturing of the electromagnetic shielding film 4;
s4, manufacturing a high-temperature-resistant PI protective film 5: a, cutting a high-temperature-resistant PI protective film 5 and drilling a positioning hole; b, milling the high-temperature-resistant PI protective film 5 with the drilled positioning hole for the first time; c, attaching the high-temperature-resistant PI protective film 5 subjected to the first milling to the electromagnetic shielding film 4; d, milling the high-temperature-resistant PI protective film 5 subjected to bonding for the second time; e, tearing off redundant parts after milling; f, prepressing the attached high-temperature-resistant PI protective film 5 to finish the manufacture of the high-temperature-resistant PI protective film 5; wherein the first time of milling and the second time of milling can adopt the laser mode to realize, effectively guarantee the complete smoothness nature of milling, guarantee the suitable size of high temperature resistant PI protection film 5.
S5, laminating of board layers: pressing the hard board 1 and the soft board 2 according to specific production pressing parameters to complete board layer pressing; wherein, the soft board 2 and the hard board 1 are pressed and fixed through a low flow glue prepreg 6;
s6, product inspection: performing functional and appearance inspection on the product;
s7, tearing the high-temperature-resistant PI protective film 5: after the area of the hard board 1 corresponding to the flexible area is uncovered, the high-temperature-resistant PI protective film 5 in the flexible area is manually torn off. The uncovering can be realized by adopting a laser or V-CUT or depth control milling mode.
In the invention, the electromagnetic shielding film 4 is pressed by the method, new equipment does not need to be introduced, and the cost is effectively saved. Wherein, the electromagnetic shielding film 4 is pressed by a rapid press instead of full pressure, so that the expansion and shrinkage of the soft board 2 can be controlled, and the production time efficiency can be effectively saved. And before the lamination, the high-temperature-resistant PI protective film 5 is attached to the electromagnetic shielding film 4, so that the problem that the electromagnetic shielding film 4 falls off can be effectively solved, the appearance production yield of products is effectively improved, and the quality requirements of customers are met.
The expansion and shrinkage data of the soft board 2 adopting the hot press and baking board process are as follows:
the invention adopts the soft board 2 harmomegathus data of the fast press plus baking plate process as follows:
the data from the two tables above yields: the smaller the above range, the smaller the expansion and contraction. The fast piezoelectric magnetic shielding film 4 is adopted to replace full pressure, so that the expansion and shrinkage of the soft board 2 can be effectively controlled, and the production time efficiency is saved.
In this embodiment, the surfaces of the flexible board 2 and the cover film 3 are roughened by plasma between S2 and S3. Through the arrangement, the surface of the soft board 2 is coarsened, and the bonding force between the soft board 2 and the hard board 1 is increased; meanwhile, the surface of the covering film 3 is coarsened, the binding force between the covering film 3 and the electromagnetic shielding film 4 is increased, the electromagnetic shielding film 4 is effectively prevented from falling off easily, and the binding stability is improved.
In this embodiment, in S3, the electromagnetic shielding film 4 includes a conductive adhesive layer and a resin layer connected in sequence. Through this setting, effectively shield external electromagnetic interference's effect, guarantee good shielding performance, guarantee that the circuit does not receive other signal interference's function.
In this embodiment, the alignment bonding in step c in S3 is performed by fixing and bonding in an electric soldering iron heating manner. Through this setting, guarantee electromagnetic shielding film 4 laminating stability, for follow-up pre-compaction improves accurate nature, guarantee electromagnetic shielding film 4's pressfitting quality.
In the embodiment, the pre-pressing in the step d in the step S3 adopts the temperature of 175-185 ℃; pressure of 100-120
(ii) a The prepressing time is 10-20s. Through the setting of this pre-compaction condition, effectively guarantee stable cohesion between electromagnetic shielding film 4 and the cover membrane 3, effectively prevent the obscission, guarantee the pressfitting quality.
In this embodiment, in S4, the length of the high temperature resistant PI protection film 5 is smaller than the length of the flexible region, and the high temperature resistant PI protection film 5 is centrally disposed in the middle of the flexible region. The distance between one end of the high-temperature-resistant PI protective film 5 and one end of the flexible area is 0.2mm. Through this setting, at the pressfitting in-process, can prevent effectively that high temperature resistant PI protection film 5 from stretching into the rigidity region, guarantee the later stage and tear the smooth and easy nature of high temperature resistant PI protection film 5, and guarantee the production quality of rigid-flex printed circuit board.
In this embodiment, in S4, the first milling and the second milling in steps b and d are performed in a laser manner. Through this setting, effectively guarantee the complete smoothness nature of milling, guarantee high temperature resistant PI protection film 5's suitable size.
In this embodiment, the attaching step c in S4 is performed by fixing an electric iron. Through this setting, effectively with high temperature resistant PI protection film 5 stable laminating on electromagnetic shield membrane 4, guarantee the accurate cutting of milling the second time, guarantee high temperature resistant PI protection film 5's suitable milling size.
In this embodiment, the pre-pressing in step f in S4 is realized by a fast press; the adopted temperature is 175-185 ℃; pressure of 100-120
(ii) a The prepressing time is 400-600s. Through the setting of this pre-compaction condition, effectively guarantee to stabilize cohesion between electromagnetic shielding film 4 and the high temperature resistant PI protection film 5, effectively prevent the phenomenon of droing, guarantee the pressfitting quality, high temperature resistant PI protection film 5 effectively protects electromagnetic shielding film 4 at the later stage soft board 2 and 1 pressfitting in-process of hard board.
A rigid-flex printed circuit board is manufactured according to the electromagnetic shielding film falling control method.
The invention has the beneficial effects that:
through designing the manufacturing method of the rigid-flex printed circuit board, the problems that the mode of pressing the electromagnetic shielding film 4 is expensive or the appearance is difficult to meet the quality requirements of customers are solved, the expansion and shrinkage controllability of the soft board 2 is realized, the production time efficiency is saved, new equipment does not need to be introduced, the cost is saved, the falling problem of the electromagnetic shielding film 4 is effectively improved, the appearance production yield of products is improved, and the quality requirements of customers are met.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art. It should be noted that the technical features not described in detail in the present invention can be implemented by any prior art.
Claims (8)
1. A method for controlling the falling of an electromagnetic shielding film of a rigid-flex printed circuit board is characterized by comprising the following steps:
s1, manufacturing a hard board and a soft board: manufacturing a hard board according to a conventional circuit board process, and waiting for browning and pressing; manufacturing a flexible board according to a conventional circuit board process, and waiting for pressing a covering film;
s2, manufacturing a covering film: a, cutting a covering film and drilling a positioning hole; b, windowing the covering film with the drilled positioning hole; c, attaching the milled covering film to the flexible board; d, pressing the soft board which is attached with the covering film, thereby completing the manufacturing of the covering film;
s3, manufacturing the electromagnetic shielding film: a, cutting an electromagnetic shielding film and drilling a positioning hole; b, windowing the electromagnetic shielding film with the drilled positioning hole; c, attaching the milled electromagnetic shielding film on the covering film in an aligned manner; d, pre-pressing the attached electromagnetic shielding film by a rapid press; e, tearing off the release film on the surface of the electromagnetic shielding film subjected to prepressing, thereby completing the manufacturing of the electromagnetic shielding film;
s4, manufacturing a high-temperature-resistant PI protective film: a, cutting a high-temperature-resistant PI protective film and drilling a positioning hole; b, milling the high-temperature-resistant PI protective film with the drilled positioning hole for the first time; c, attaching the high-temperature-resistant PI protective film subjected to the first milling to the electromagnetic shielding film; d, milling the attached high-temperature-resistant PI protective film for the second time; e, tearing off redundant parts after milling; f, prepressing the attached high-temperature-resistant PI protective film to complete the manufacturing of the high-temperature-resistant PI protective film;
s5, laminating of board layers: pressing the hard board and the soft board according to specific production pressing parameters to complete board layer pressing;
s6, product inspection: performing functional and appearance inspection on the product;
s7, tearing the high-temperature-resistant PI protective film: after a hard plate area corresponding to the flexible area is uncovered, manually tearing off the high-temperature-resistant PI protective film in the flexible area;
in S4, the length of the high-temperature-resistant PI protective film is smaller than that of the flexible area, and the high-temperature-resistant PI protective film is arranged in the middle of the flexible area;
the distance between one end of the high-temperature-resistant PI protective film and one end of the flexible area is 0.1-0.3mm.
2. The method for controlling the falling off of the electromagnetic shielding film of the rigid-flex printed circuit board according to claim 1, wherein the surfaces of the flexible board and the cover film are subjected to plasma roughening treatment between S2 and S3.
3. The method for controlling the falling off of the electromagnetic shielding film of the rigid-flex printed circuit board according to claim 1, wherein in S3, the electromagnetic shielding film comprises a conductive adhesive layer and a resin layer which are connected in sequence.
4. The method for controlling the falling of the electromagnetic shielding film of the rigid-flex printed circuit board according to claim 1, wherein the alignment bonding in the step c in the step S3 is performed by fixed bonding in an electric soldering iron heating manner.
5. The method for controlling the falling off of the electromagnetic shielding film of the rigid-flex printed circuit board according to claim 1, wherein the pre-pressing in the step d in the step S3 is performed at a temperature of 175-185 ℃; the pressure is 100-120 kg.f/cm 2 (ii) a The prepressing time is 10-20s.
6. The method for controlling the falling of the electromagnetic shielding film of the rigid-flex printed circuit board according to claim 1, wherein an electric soldering iron is used for fixing in the step c in the step S4.
7. The method for controlling the falling of the electromagnetic shielding film of the rigid-flex printed circuit board according to claim 1, wherein the pre-pressing in the step f in the step S4 is realized by a fast press; the temperature is 175-185 ℃; the pressure is 100-120 kg.f/cm 2 (ii) a The prepressing time is 400-600s.
8. A rigid-flex printed circuit board, characterized in that the rigid-flex printed circuit board is manufactured by the method for controlling the falling of the electromagnetic shielding films according to any one of claims 1 to 7.
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| CN202211453025.8A CN115666010B (en) | 2022-11-21 | 2022-11-21 | Rigid-flex printed circuit board and electromagnetic shielding film falling control method thereof |
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| CN104320929B (en) * | 2014-11-07 | 2017-08-25 | 双鸿电子(惠州)有限公司 | A kind of preparation method for the printed board that multilayer rigid-flex combines and has resistance requirements |
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| CN106061107B (en) * | 2016-08-08 | 2019-10-25 | 广州杰赛科技股份有限公司 | Has the rigid-flex circuit board and preparation method thereof of electromagnetic shielding film |
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| CN113056101A (en) * | 2021-03-05 | 2021-06-29 | 惠州市金百泽电路科技有限公司 | Secondary processing and pressing method for electromagnetic shielding film |
| CN216491210U (en) * | 2021-11-11 | 2022-05-10 | 深圳市世博通科技有限公司 | Rigid-flex circuit board with electromagnetic shielding film |
| CN114245565A (en) * | 2021-12-23 | 2022-03-25 | 江西荣晖电子有限公司 | Method for manufacturing rigid-flex board electromagnetic shielding film inner paste |
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| CN101686603A (en) * | 2008-09-23 | 2010-03-31 | 上海山崎电路板有限公司 | Manufacturing technology of blind hole plate embedding electronic devices |
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