CN203057679U - A circuit board combining a soft layer and hard layers - Google Patents
A circuit board combining a soft layer and hard layers Download PDFInfo
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- CN203057679U CN203057679U CN 201220740135 CN201220740135U CN203057679U CN 203057679 U CN203057679 U CN 203057679U CN 201220740135 CN201220740135 CN 201220740135 CN 201220740135 U CN201220740135 U CN 201220740135U CN 203057679 U CN203057679 U CN 203057679U
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Abstract
The utility model discloses a circuit board combining a soft layer and hard layers. The circuit board comprises a soft board layer, two pure glue layers, and two composite hard board layers. The soft board layer is arranged at the middle of the circuit board. The two pure glue layers are pressed on the two sides of the soft board layer, respectively. The two composite hard board layers are pressed on the outer sides of the two pure glue layers, respectively. The composite hard board layer comprises a hard board layer, a pure glue layer, and a copper foil layer which are pressed together from inside to outside. In the technical scheme, prepregs are replaced by the pure glue layers and the combination of a copper foil layer and RCC material is replaced by the composite hard board layers. Therefore, in a processing process, independent block fast pressing technology can be used in order that a product has relatively big advantages in material selection, thickness control of the pure glue layers, quality control, and simple manipulation. A risk of batch quality problem caused by abnormal conventional pressing can be reduced or prevented compared with that of a product in the prior art, and yield and production efficiency of the product can be increased.
Description
Technical field
The utility model relates to the circuit board technology field, is specifically related to a kind of soft or hard combined circuit plate.
Background technology
Soft or hard combined circuit plate commonly used, adopt usually low flow or immobilising prepreg and with the RCC(prg-preg of a glue face, resin+glass fibre) material, form through traditional pressing mode.
Fig. 1 shows a kind of six layers of HDI(High Density Interconnecto, high density interconnect) structure of soft or hard combined circuit plate, comprise the soft board layer that is positioned at the center, be followed successively by layer of prepreg, pure copper foil layer and RCC material on the soft board layer.
The soft or hard combined circuit plate of said structure needs to adopt traditional pressing mode long-time in enormous quantities to process, and occurs the quality problems of property in batches easily, and yields and production efficiency are not high.
The utility model content
The utility model embodiment provides a kind of soft or hard combined circuit plate, occurs batch nature amount problem easily to solve existing soft or hard combined circuit plate, and yields and the not high defective of production efficiency.
A kind of soft or hard combined circuit plate, comprise: the soft board layer that is positioned at the center, be pressed together on two pure glue-lines of soft board layer both sides respectively, and two compound hard board layers that are pressed together on two pure glue-line outsides respectively, described compound hard board layer comprises the hardboard layer that presses together from inside to outside, pure glue-line and copper foil layer.
The utility model embodiment soft or hard combined circuit plate adopts pure glue-line to replace prepreg, replace the combination of copper foil layer and RCC material with the compound hard board layer, thereby, in the course of processing, can adopt the technology of piecemeal independence quick pressing, make product in material selection, pure bondline thickness control, quality control and operate and have greater advantage aspect simple and easy, compared with prior art, can reduce or avoid to improve yield of products and production efficiency because batch nature amount problem risk appears in traditional pressing unusually.
Description of drawings
Fig. 1 is the structural representation of existing soft or hard combined circuit plate;
Fig. 2 is the structural representation of the soft or hard combined circuit plate that provides of the utility model embodiment.
Embodiment
The utility model embodiment provides a kind of soft or hard combined circuit plate, occurs batch nature amount problem easily to solve existing soft or hard combined circuit plate, and yields and the not high defective of production efficiency.Below be elaborated.
Please refer to Fig. 1, the soft or hard combined circuit plate that the utility model embodiment provides, comprise: the soft board layer 110 that is positioned at the center, be pressed together on two pure glue-lines 120 of soft board layer both sides respectively, and two compound hard board layers 130 that are pressed together on two pure glue-line outsides respectively, described compound hard board layer 130 comprises the hardboard layer 1301 that presses together from inside to outside, pure glue-line 120 and copper foil layer 1302.
Wherein, soft board layer 110 comprises the insulating barrier that is positioned at the center, lays respectively at two line layers of insulating barrier both sides, and covers two coverlays on the line layer outer surface respectively.In the course of processing, this soft board layer 110 at first is produced, and after completing, both side surface all will be passed through roughening treatment, in order to improve adhesion when follow-up pressing.
Compound hard board layer 130 is by hardboard layer 1301, and pure glue-line 120 and copper foil layer 1302 adopt the mode of quick pressing to make.Wherein, described hardboard layer 1301 can be double face copper; The one side towards the inboard of described copper foil layer 1302 is matsurface, and one side toward the outer side then is shiny surface.In the course of processing, the size of hardboard layer 1301 is determined according to the size of soft board layer 110.When determining the size of hardboard layer 1301, consider the harmomegathus data of soft board layer 110.
After soft board layer 110 and compound hard board layer 130 are made, five above-mentioned layer materials are adopted the complete soft or hard combined circuit plate of making of quick pressing mode according to the order of compound hard board layer, pure glue-line, soft board layer, pure glue-line, compound hard board layer.Comprise 6 layer line road figures among this soft or hard combined circuit plate.
To sum up, present embodiment is example with the structure of 6 layers of HDI Rigid Flex, soft or hard combined circuit plate provided by the invention is described, in the practical application, be not limited to 6 layers HDI Rigid Flex, for example, the soft board floor in the 6 floor soft or hard combined circuit plates of present embodiment is not limited to comprise 2 layer line road figures, also can comprise line pattern more than 1 layer or 2 layers; The compound hard board floor also is not limited to comprise 2 layer line road figures, also can comprise line pattern more than 1 layer or 2 layers; To obtain the circuit board of labyrinth more.
After utilizing quick pressing to make complete soft or hard combined circuit plate, can carry out on the surface of soft or hard combined circuit plate and make outer-layer circuit, operations such as processing solder mask.
Below, the manufacture method of the soft or hard combined circuit plate that the utility model embodiment is provided is simply described as follows:
At first, make soft board layer 110, the surface of the coverlay of alligatoring soft board layer 110, and the harmomegathus data of collecting soft board layer 110 afterwards; The harmomegathus data comprise soft board layer 110 complete before and after at the deflection of X-axis and Y direction.
Then, according to the harmomegathus data creating hardboard layer 1301 of soft board layer 110, utilize the quick pressing mode to form compound hard board layer 130 pure copper foil 1302 of hardboard layer 1301, pure glue-line 120 and band matsurface afterwards, the quantity of this compound hard board layer 130 is 2.
At last, with these five sublayer contraposition laminations, utilize quick pressing technology to form a monoblock soft or hard combined circuit plate according to the order of compound hard board layer, pure glue-line, soft board layer, pure glue-line, compound hard board layer again.
What deserves to be explained is that above-mentioned roughening treatment to the soft board laminar surface adopts plasma, alkaline medicinal liquid to sting one or more combination in the kinds of processes such as erosion, mechanical grinding, blasting treatment.Above-mentioned quick pressing refers to that pressing time only needs 5 to 6 minutes short time pressing.
To sum up, the utility model embodiment provides a kind of soft or hard combined circuit plate, in fact this soft or hard combined circuit plate can be divided into four bulks, it is respectively the soft board layer, pure glue-line, hardboard layer and copper foil layer, then adopt the technology of piecemeal independence quick pressing in the manufacturing process, thereby, compared with prior art, the soft or hard combined circuit plate of the utility model embodiment, make product select at material, pure bondline thickness control, quality control and operate simple and easy aspect and have greater advantage, reduce or avoided occurring batch nature amount problem risk unusually because of traditional pressing, improve yield of products and production efficiency, opened up the process technology scope of soft or hard combined circuit plate.
More than soft or hard combined circuit plate that the utility model embodiment is provided be described in detail, but the explanation of above embodiment just is used for helping to understand method of the present utility model and core concept thereof, should not be construed as restriction of the present utility model.Those skilled in the art are in the technical scope that the utility model discloses, and the variation that can expect easily or replacement all should be encompassed within the protection range of the present utility model.
Claims (5)
1. a soft or hard combined circuit plate is characterized in that, comprising:
Be positioned at the soft board layer at center, be pressed together on two pure glue-lines of soft board layer both sides respectively, and two compound hard board layers that are pressed together on two pure glue-line outsides respectively, described compound hard board layer comprises the hardboard layer that presses together from inside to outside, pure glue-line and copper foil layer.
2. soft or hard combined circuit plate according to claim 1 is characterized in that:
The one side towards the inboard of described copper foil layer is matsurface.
3. soft or hard combined circuit plate according to claim 1 is characterized in that:
The surface of described soft board layer is through roughening treatment.
4. soft or hard combined circuit plate according to claim 1 is characterized in that:
Described hardboard layer is double face copper.
5. soft or hard combined circuit plate according to claim 1 is characterized in that:
Described soft board layer comprises the insulating barrier that is positioned at the center, lays respectively at two line layers of insulating barrier both sides, and covers two coverlays on the line layer outer surface respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220740135 CN203057679U (en) | 2012-12-28 | 2012-12-28 | A circuit board combining a soft layer and hard layers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220740135 CN203057679U (en) | 2012-12-28 | 2012-12-28 | A circuit board combining a soft layer and hard layers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203057679U true CN203057679U (en) | 2013-07-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220740135 Expired - Lifetime CN203057679U (en) | 2012-12-28 | 2012-12-28 | A circuit board combining a soft layer and hard layers |
Country Status (1)
| Country | Link |
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| CN (1) | CN203057679U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104470198A (en) * | 2014-11-25 | 2015-03-25 | 镇江华印电路板有限公司 | Laminar structure of flexible and rigid PCBs less than four in layer number |
| CN105517356A (en) * | 2015-12-10 | 2016-04-20 | 深圳崇达多层线路板有限公司 | Technical method for improving pressing glue spilling at window position of stepped plate |
| CN105722314A (en) * | 2016-04-20 | 2016-06-29 | 高德（无锡）电子有限公司 | Flexible and hard combination board for preventing fracture of cover plate and uncapping and slicing process thereof |
| CN106455304A (en) * | 2016-11-16 | 2017-02-22 | 苏州市华扬电子股份有限公司 | Flexible-rigid combined plate |
| CN115666010A (en) * | 2022-11-21 | 2023-01-31 | 惠州市金百泽电路科技有限公司 | Rigid-flex printed circuit board and electromagnetic shielding film falling control method thereof |
-
2012
- 2012-12-28 CN CN 201220740135 patent/CN203057679U/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104470198A (en) * | 2014-11-25 | 2015-03-25 | 镇江华印电路板有限公司 | Laminar structure of flexible and rigid PCBs less than four in layer number |
| CN105517356A (en) * | 2015-12-10 | 2016-04-20 | 深圳崇达多层线路板有限公司 | Technical method for improving pressing glue spilling at window position of stepped plate |
| CN105517356B (en) * | 2015-12-10 | 2018-09-04 | 深圳崇达多层线路板有限公司 | A kind of process improving stepped plate windowing position pressing excessive glue |
| CN105722314A (en) * | 2016-04-20 | 2016-06-29 | 高德（无锡）电子有限公司 | Flexible and hard combination board for preventing fracture of cover plate and uncapping and slicing process thereof |
| CN105722314B (en) * | 2016-04-20 | 2019-04-16 | 高德（无锡）电子有限公司 | A kind of Rigid Flex that anti-cover board is broken and its dozen slice process of uncapping |
| CN106455304A (en) * | 2016-11-16 | 2017-02-22 | 苏州市华扬电子股份有限公司 | Flexible-rigid combined plate |
| CN115666010A (en) * | 2022-11-21 | 2023-01-31 | 惠州市金百泽电路科技有限公司 | Rigid-flex printed circuit board and electromagnetic shielding film falling control method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130710 |
|
| CX01 | Expiry of patent term |