CN101152674A - Figuration processing method - Google Patents
Figuration processing method Download PDFInfo
- Publication number
- CN101152674A CN101152674A CNA2007101452720A CN200710145272A CN101152674A CN 101152674 A CN101152674 A CN 101152674A CN A2007101452720 A CNA2007101452720 A CN A2007101452720A CN 200710145272 A CN200710145272 A CN 200710145272A CN 101152674 A CN101152674 A CN 101152674A
- Authority
- CN
- China
- Prior art keywords
- mentioned
- throw
- workpiece
- outer peripheral
- peripheral face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003672 processing method Methods 0.000 title claims abstract description 10
- 238000003754 machining Methods 0.000 claims abstract description 10
- 230000002452 interceptive effect Effects 0.000 claims abstract description 3
- 230000002093 peripheral effect Effects 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 2
- 238000011144 upstream manufacturing Methods 0.000 claims description 2
- 238000003801 milling Methods 0.000 abstract description 25
- 238000005520 cutting process Methods 0.000 abstract description 3
- 239000011796 hollow space material Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 24
- 239000000047 product Substances 0.000 description 17
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 238000007514 turning Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P13/00—Making metal objects by operations essentially involving machining but not covered by a single other subclass
- B23P13/02—Making metal objects by operations essentially involving machining but not covered by a single other subclass in which only the machining operations are important
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P17/00—Metal-working operations, not covered by a single other subclass or another group in this subclass
- B23P17/02—Single metal-working processes; Machines or apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B2270/00—Details of turning, boring or drilling machines, processes or tools not otherwise provided for
- B23B2270/54—Methods of turning, boring or drilling not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23B—TURNING; BORING
- B23B41/00—Boring or drilling machines or devices specially adapted for particular work; Accessories specially adapted therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23C—MILLING
- B23C2270/00—Details of milling machines, milling processes or milling tools not otherwise provided for
- B23C2270/20—Milling external areas of components
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Drilling And Boring (AREA)
- Milling Processes (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The object of the present invention is to provide an external form processing method which can not reduce the reliability of the base plate product as product and can improve the machining efficiency. Under the condition that via holes (hollow space section) (1) which is crossing with the fine machining surface of the base plate product (2), a hollow tool bore (8) can be machined in two crossing parts of the fine machining surface (S) and the via hole (1), and the hollow tool bore (8) is interfering with a right rotary drill (7) at a crossing part (D) on one side cutting from the via hole (1) to the base plate product (2). And then, the moving direction (C) of a left rotary milling tool (5) is defined as the direction entering the via hole (1) from the hollow tool bore (8) to machine the fine machining surface (S).
Description
Technical field
The present invention relates to the contour processing method that a kind of use throw forms the profile of workpiece (for example printed base plate).
Background technology
During processing printed substrate, under the state of the bigger printed base plate that contains a plurality of printed base plates (below title base plate product) (below title mother substrate) as goods, carried out the plating processing after perforation processing and the punching, afterwards, base plate product has been cut out from mother substrate (sharp processing).Like this, just can shorten step time in the electroplating work procedure after perforation processing operation and the perforation processing.
In order to improve the reliability of base plate product, by being configured in the dust collect plant of instrument periphery, the cutting powder that produces during with perforation processing and during sharp processing is removed (patent documentation 1) from adding Ministry of worker's periphery.
For multilayer printed board,, form through hole (through hole), and,, be electrically connected at the inner electrodeposited coating that forms of through hole by carrying out electroplating processes when to being configured in insulant graph layer up and down when being electrically connected.
The vertical view of the base plate product when Fig. 2 is sharp processing in the past, the arrow T among the figure represents the direction of rotation of throw, arrow C is represented cutting direction (moving direction of throw).
On the periphery (profile) of the base plate product 2 that from mother substrate 3, cuts out, be equipped with the through hole 1 (being illustrated as semi-circular shape) that is opening in periphery.When the throw of using with sharp processing (adopts the instrument of diameter 1～2mm mostly, is called ' milling cutter 5 ' router bit below.) when the through hole 1 that is formed with electrodeposited coating 4 is cut, then mostly situation be the part of electrodeposited coating 4 can be peeled off (below, the electrodeposited coating that has claimed to be peeled off for ' flash 6 ').Being connected between the electrodeposited coating 4 of flash 6 and through hole 1 end is unstable.So a lot of parts of flash 6 are siphoned away by dust collect plant in process, but some still links to each other with electrodeposited coating 4 after processing.Because flash 6 has electric conductivity,, then can occur causing the problem that is short-circuited between the terminal of base plate product 2 because of the flash 6 that comes off so flash 6 is in case split away off from base plate product 2 for a certain reason sometimes.Flash 6 is to be created in milling cutter 5 to enter into the cross part of a side (passing through side) of through hole 1 from substrate-side, and can not be created in the cross part place that is entered into a side of substrate-side by through hole 1.What therefore, carried out is so-called upset processing in the past.
Figure 3 shows that the processing sequence figure of upset processing.
Shown in figure (a), at first, processing is with respect to the base plate product 2 profiles (face of representing with chain-dotted line among the figure vertical with paper.Be called below ' polished surface S ') and side-play amount is the face (below be called roughing face F) of g.In addition, when processing roughing face F, the part of base plate product 2 also is connected with mother substrate 3, when mother substrate 3 table turning ins are changeed, does not allow base plate product 2 separate from mother substrate 3.
Then, shown in figure (b), mother substrate 3 table turning ins are changeed, and make the moving direction of milling cutter 5 process polished surface S in the same manner.In case the mother substrate 3 that is formed with roughing face F is shown turning in to be changeed, because milling cutter 5 is configured in a side that is entered into substrate-side by through hole 1, so shown in figure (c), 6 of the flashes that is produced in the roughing can be removed from substrate 2 when forming polished surface S.When accurately machined occasion, though being created in milling cutter 5 sometimes, flash 6 enters into a side of through hole 1 by base plate product 2 sides, (for example, 0.05mm), the size of the flash 6 of Chan Shenging will become small like this as long as reduce side-play amount g.Therefore, i.e. the flash 6 of toilet generation splits away off from base plate product 2, also can reduce the reliability as the goods of base plate product 2 hardly.
In addition, though here to milling cutter 5 for the situation of right rotation (just changeing) usefulness is described,, even if milling cutter 5 are anticlockwises (counter-rotating) with in, the position that flash 6 is produced also can be that milling cutter 5 is by the side of mother substrate 3 by through hole 1.
Patent documentation 1: Japanese patent laid-open 3-178707 communique
But, add man-hour overturning, owing to must have: the operation of mother substrate being taken off from workbench, the operation that makes the mother substrate upset and the mother substrate of upset is installed in operation on the workbench, therefore, the time that operation is prepared will be elongated.And, might cause producing the bad problem of processing owing to the installation error of mother substrate.
Summary of the invention
The purpose of this invention is to provide a kind of contour processing method, it can not reduce the reliability as goods of base plate product, and can improve working (machining) efficiency.
In order to solve above-mentioned problem, the present invention (for example with reference to Fig. 1) is the processing method that forms the outer peripheral face S of workpiece 2 by the machining of being undertaken by throw 5, it is characterized in that, under the situation that has the blank part 1 that intersects with formed workpiece outer peripheral face S, move with respect to above-mentioned workpiece at above-mentioned throw 5, when forming the outer peripheral face of above-mentioned workpiece, cross part D in the upstream of the moving direction C of the above-mentioned throw of above-mentioned blank part 1, in the mode that the outer peripheral face S with above-mentioned formed workpiece interferes, process empty tool bore 8 by perforating device 7;
Afterwards, under direction T when the rotation of the sword that makes above-mentioned throw 5 is for the outer peripheral face S of aforementioned formed workpiece, the state identical with the moving direction C of this throw, make throw 5 moving towards the mode that above-mentioned blank part 1 enters, thereby form the outer peripheral face of above-mentioned workpiece from above-mentioned empty tool bore 8.
Preferably, above-mentioned perforating device is a drill bit 7, and when the above-mentioned empty tool bore 8 of processing, the direction of rotation U of the sword of this drill bit is opposite with the direction of rotation T of the sword of above-mentioned throw 5.
In addition, the symbol in the bracket is just in order to contrast the diagram needs, and it does not produce any influence to the scope of claim.
According to the present invention, can not reduce the reliability as goods of base plate product, and can improve working (machining) efficiency.
Description of drawings
Fig. 1 is the schematic diagram of expression processing sequence of the present invention.
The vertical view of the base plate product when Fig. 2 is sharp processing in the past.
Fig. 3 is the schematic diagram of manufacturing procedure of processing of in the past overturning.
Symbol description is as follows:
1... through hole (blank part); 5... milling cutter (throw); 7... drill bit (perforating device); 8... empty tool bore; D... cross part; S... polished surface (outer peripheral face).
The specific embodiment
Below, the present invention is carried out specific description.
Fig. 1 is the schematic diagram of processing sequence of the present invention, wherein schemes the drilling process that (a) expression is punched by drill bit, figure (b) expression sharp processing operation.
On mother substrate 3, process through hole 1, on the inner peripheral surface of this through hole 1, be formed with electrodeposited coating 4.Make the main shaft of the printing substrate processing machine of drill bit and milling cutter 5 rotations can realize forward and reverse.
Generally speaking, drill bit is that right rotation is used mostly, so, just prepared the milling cutter 5 that drill bit 7 that right rotation uses and anticlockwise are used here.In addition, for milling cutter 5, any one that right rotation is used and anticlockwise is used all is easy to obtain.
Because drill bit 7 is right rotation usefulness, so, shown in figure (a), the axis of drill bit 7 is positioned the mode of interfering, the empty tool bore 8 of processing on mother substrate 3 with empty tool bore 8, with the cross part D of polished surface S and through hole 1.Because drill bit 7 is cut mother substrate 3 from through hole 1 side near cross part D, so can not produce flash 6.And when the diameter of through hole 1 for example was 0.8mm, making the diameter of drill bit was 0.8mm, and sky tool bore 8 and the interference distance k of polished surface S are got final product about 0.025mm.That is, making polished surface S is directions X, and the direction vertical with polished surface S is the Y direction, and cross part D (here, ignore and electroplate 4 thickness) is an initial point, for example, the axes O of drill bit 7 can be determined in (0,0.375).In addition, in this case, even if the X coordinate of the axes O of drill bit 7 between-0.1～0.1 (preferably-0.05～0.05), aspect practical also without any obstruction.
The direction mode identical so that the rotation of milling cutter 5 is for the polished surface S of formed workpiece 2 with the moving direction C of this milling cutter 5, set the direction of rotation T of milling cutter 5, and process in the mode that processing is the cross part D of free tool bore 8 to enter through hole 1 with milling cutter 5.That is, shown in figure (b), the milling cutter 5 of anticlockwise is moved to right, process polished surface S.When milling cutter 5 enters through hole 1, because this part electrodeposited coating 4 has been removed, so, can not produce flash 6 at cross part D.And, because the sword of milling cutter 5 enters mother substrate 3 by through hole 1 side near cross part E, so, can not produce flash 6 yet.
In addition, though in this embodiment, on depth direction, cut k=0.025mm,, for this size, aspect practical, in the no problem scope, also can enlarge or dwindle.
And the diameter of the diameter of drill bit 7 or milling cutter 5 in the no problem scope, also can change aspect practical.
In addition, under the situation of the drill bit 7 that uses anticlockwise to use,, and milling cutter 5 is made as right rotation usefulness, the moving direction of milling cutter 5 is made as from right to left gets final product simultaneously as long as the cross part E side in Fig. 1 (a) is processed empty tool bore 8.
In addition, also can replace moving of milling cutter 5, workpiece 2 is moved.And, because the processing of empty tool bore 8 also can be used the printing substrate processing machine identical with the sharp processing operation,, also can use other perforating device such as laser machine to process so, also be not limited thereto although preferably use drill bit to process.
Just as described above, according to the present invention, owing to need not to make mother substrate 3 upsets, so can improve working (machining) efficiency.And, different with upset processing in the past, owing to can not produce flash 6 fully, so can further improve the reliability of base plate product 2.
The inventor confirms to know, be under the situation of glass epoxy resin substrate of thickness of slab 0.5mm at mother substrate 3, in the past to greatest extent can be overlapping two pieces, in the present invention, even overlapping 4～5 pieces, can not produce flash 6 yet, thereby can improve working (machining) efficiency significantly.
Claims (3)
1. contour processing method, it is the processing method that forms the outer peripheral face of workpiece by the machining of being undertaken by throw, it is characterized in that, under the situation of the blank part that the outer peripheral face that has with formed above-mentioned workpiece intersects, move relative to above-mentioned workpiece at above-mentioned throw, when forming the outer peripheral face of above-mentioned workpiece, cross part at the moving direction upstream side of the above-mentioned throw of above-mentioned blank part, in the mode of interfering with the outer peripheral face of above-mentioned formed workpiece, process empty tool bore by perforating device, afterwards, direction when the rotation of the sword that makes above-mentioned throw is for the outer peripheral face of aforementioned formed workpiece, under the state identical with the moving direction of this throw, make this throw moving towards the mode that above-mentioned blank part enters, thereby form the outer peripheral face of above-mentioned workpiece from above-mentioned empty tool bore.
2. contour processing method according to claim 1 is characterized in that, above-mentioned perforating device is a drill bit, and when the above-mentioned empty tool bore of processing, the direction of rotation of the sword of this drill bit is opposite with the direction of rotation of the sword of above-mentioned throw.
3. contour processing method according to claim 1 and 2 is characterized in that the inner peripheral surface of above-mentioned blank part has been subjected to plating.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006264361 | 2006-09-28 | ||
| JP2006-264361 | 2006-09-28 | ||
| JP2006264361A JP4293466B2 (en) | 2006-09-28 | 2006-09-28 | Outline processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101152674A true CN101152674A (en) | 2008-04-02 |
| CN101152674B CN101152674B (en) | 2011-10-05 |
Family
ID=39254678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101452720A Expired - Fee Related CN101152674B (en) | 2006-09-28 | 2007-08-17 | Figuration processing method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4293466B2 (en) |
| KR (1) | KR101400247B1 (en) |
| CN (1) | CN101152674B (en) |
| TW (1) | TWI401126B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102244979A (en) * | 2010-05-12 | 2011-11-16 | 柏承科技(昆山)股份有限公司 | Half-hole processing mirror image manufacturing method of printed circuit board |
| CN107175360A (en) * | 2016-03-10 | 2017-09-19 | 无锡深南电路有限公司 | Milling machine and milling machine spindle operation control system |
| CN111432559A (en) * | 2020-03-20 | 2020-07-17 | 江苏苏杭电子有限公司 | Method for processing semicircular copper sinking hole |
| CN112512219A (en) * | 2020-11-25 | 2021-03-16 | 益阳市明正宏电子有限公司 | Copper-containing half groove machining method for PCB |
| CN116329881A (en) * | 2022-12-30 | 2023-06-27 | 福莱盈电子股份有限公司 | Semi-groove product fishing processing method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111451716B (en) * | 2020-03-30 | 2021-07-27 | 海宁弘德机械有限公司 | Rough machining process of crossed arc holes |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61142098A (en) * | 1984-12-17 | 1986-06-28 | 松下電器産業株式会社 | Method of machining printed wiring board |
| JPH058198A (en) * | 1991-07-01 | 1993-01-19 | Ibiden Co Ltd | Method for machining contour of printed board |
| JPH0538611A (en) * | 1991-07-29 | 1993-02-19 | Ibiden Co Ltd | Drilling of printed wiring board |
| JPH0582960A (en) * | 1991-09-20 | 1993-04-02 | Ibiden Co Ltd | Forming method of sectional through-hole in printed wiring board |
| JP2931731B2 (en) * | 1992-12-25 | 1999-08-09 | 田中貴金属工業株式会社 | Processing method of half-hole through hole for printed wiring board |
| JP2572201B2 (en) * | 1994-03-04 | 1997-01-16 | 栄電子工業株式会社 | Method and apparatus for processing small diameter holes in substrate material |
| JPH08181411A (en) * | 1994-12-22 | 1996-07-12 | Sony Corp | Outer shape processing method of printed wiring board |
-
2006
- 2006-09-28 JP JP2006264361A patent/JP4293466B2/en not_active Expired - Fee Related
-
2007
- 2007-07-12 TW TW096125364A patent/TWI401126B/en not_active IP Right Cessation
- 2007-07-31 KR KR1020070076756A patent/KR101400247B1/en not_active IP Right Cessation
- 2007-08-17 CN CN2007101452720A patent/CN101152674B/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102244979A (en) * | 2010-05-12 | 2011-11-16 | 柏承科技(昆山)股份有限公司 | Half-hole processing mirror image manufacturing method of printed circuit board |
| CN107175360A (en) * | 2016-03-10 | 2017-09-19 | 无锡深南电路有限公司 | Milling machine and milling machine spindle operation control system |
| CN107175360B (en) * | 2016-03-10 | 2019-07-26 | 无锡深南电路有限公司 | Milling machine and milling machine spindle operation control system |
| CN111432559A (en) * | 2020-03-20 | 2020-07-17 | 江苏苏杭电子有限公司 | Method for processing semicircular copper sinking hole |
| CN112512219A (en) * | 2020-11-25 | 2021-03-16 | 益阳市明正宏电子有限公司 | Copper-containing half groove machining method for PCB |
| CN116329881A (en) * | 2022-12-30 | 2023-06-27 | 福莱盈电子股份有限公司 | Semi-groove product fishing processing method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008080457A (en) | 2008-04-10 |
| JP4293466B2 (en) | 2009-07-08 |
| TW200817120A (en) | 2008-04-16 |
| KR20080029774A (en) | 2008-04-03 |
| KR101400247B1 (en) | 2014-05-26 |
| TWI401126B (en) | 2013-07-11 |
| CN101152674B (en) | 2011-10-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101152674B (en) | Figuration processing method | |
| KR101687266B1 (en) | Half hole of pcb machining method and the pcb manufactured from the same | |
| US7278806B1 (en) | Two edge deburring tool | |
| CN101902883A (en) | Method for manufacturing microwave high-frequency ceramic circuit board | |
| CN111010802B (en) | L-shaped groove hole machining method based on PCB | |
| CN106231821B (en) | A kind of four layers of pcb board manufacture craft | |
| CN105792545A (en) | PCB half hole forming process | |
| CN105307396B (en) | The manufacturing method of PCB containing square hole | |
| CN114147807A (en) | Method for processing ultrashort slotted hole of circuit board | |
| CN111182731B (en) | Tree core groove processing method and printed circuit board | |
| CN213152457U (en) | FPC board with small slotted hole | |
| CN110418505A (en) | A kind of precision PCB blank plate and its processing molding method | |
| CN104741651A (en) | Method for manufacturing holes in different-material laminated structures through automatic drilling and riveting system | |
| CN201969957U (en) | Composite reamer | |
| CN112512219A (en) | Copper-containing half groove machining method for PCB | |
| CN113043374B (en) | Ultrashort slotted hole processing method for circuit board | |
| JP2006281323A (en) | Burr preventive punch | |
| CN209174966U (en) | A kind of not isometrical counter bore processing cutter | |
| CN208004857U (en) | A kind of rack class pincers worker punching assembled tool | |
| US10730201B2 (en) | Blade chamfer tools | |
| CN112004320B (en) | Circuit board and preparation method thereof | |
| CN210848478U (en) | Gear shaving cutter jig tool | |
| CN215199679U (en) | Machining tool for lathe | |
| JP2013059818A (en) | Method of machining printed circuit board | |
| CN210789376U (en) | Quick chamfer drill bit and drilling machine assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| REG | Reference to a national code |
Ref country code: HK Ref legal event code: DE Ref document number: 1111124 Country of ref document: HK |
|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: VIA MECHANICS LTD. Free format text: FORMER OWNER: HITACHI BIA MACINE CO., LTD. Effective date: 20140219 |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20140219 Address after: Kanagawa Patentee after: Via Mechanics Ltd. Address before: Kanagawa Patentee before: Hitachi Bia Macine Co., Ltd. |
|
| REG | Reference to a national code |
Ref country code: HK Ref legal event code: WD Ref document number: 1111124 Country of ref document: HK |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111005 Termination date: 20170817 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |