CN112004320B - Circuit board and preparation method thereof - Google Patents

Abstract

The application provides a circuit board and a preparation method thereof. The preparation method of the circuit board comprises the following steps: drilling a tail hole of the plate after drilling; performing routing and milling PTH groove operation; carrying out appearance detection on the circuit board semi-finished product; drilling a foolproof positioning hole at the tail hole of the PTH groove to obtain a second circuit board semi-finished product, wherein the diameter of the drilled foolproof positioning hole is smaller than that of the tail hole of the PTH groove; inserting the first positioning nail into the fool-proof positioning hole, wherein the diameter of the first positioning nail is larger than that of the fool-proof positioning hole, and the diameter of the first positioning nail is smaller than or equal to that of the tail hole of the PTH groove. According to the manufacturing method of the circuit board, the circuit board is prevented from being missed and milling the PTH groove in a dual foolproof mode of detecting the appearance and inserting the foolproof positioning hole according to the first positioning nail, the manufacturing method of the circuit board is simple and strong in practicability, and a jig and a transformation machine for additionally developing the leak-proof milling the PTH groove are not needed.

Description

Circuit board and preparation method thereof

Technical Field

The invention relates to the technical field of circuit boards, in particular to a circuit board and a preparation method thereof.

Background

Various holes and grooves are designed on the printed circuit board, the functions of the printed circuit board are that the printed circuit board meets the functions of electronic component assembly, mold tooling clamping, casing installation and the like, the holes and the grooves are divided into two different attributes, and the holes or the grooves which are plated with copper by chemical plating are provided with copper, which is called PHT (plated through hole). The holes in the PHT are drilled by drilling and are called PHT holes, and the grooves in the PHT are milled by using a computer numerical control precision machining vertical milling method and are called PTH grooves. Due to the complexity of circuit board production, the condition of missed drilling or missed routing and milling is difficult to avoid in the production process, but PTH grooves and PTH holes in PTH are different from NPTH (Non-plated through hole) grooves, electroplated copper is arranged on the inner sides of the PTH grooves and the PTH holes in the PTH, finished products cannot be directly reworked, and once the condition of missed routing and milling of the PTH grooves or missed drilling of the PTH holes occurs in the preorded printed circuit board, the printed circuit board is scrapped. The traditional design of the leakage-proof routing and milling PTH groove mainly adopts manual detection or NPTH groove adding circuit pattern design, and an electric detection method is used for achieving the detection effect of the leakage-proof routing.

Although the existing anti-leakage routing technology is simple in method, the existing anti-leakage routing technology cannot be applied to the preparation process of a circuit board, because copper in a PTH groove needs to be achieved through a copper deposition electroplating mode, if the PTH groove is detected and milled by missing routing in an electrical logging process, the PTH groove can be regarded as a waste product, because the circuit board becomes a small plate when the electrical logging is carried out, rework is carried out through the routing returning milling mode, and the copper cannot be electroplated into the PTH groove wall.

Therefore, it is necessary to solve the problem that when the PTH slot is missed and milled in the circuit board, the circuit board cannot be directly reworked.

Disclosure of Invention

The invention aims to overcome the defects in the prior art and provides a circuit board and a preparation method thereof.

The purpose of the invention is realized by the following technical scheme:

a preparation method of a circuit board comprises the following steps:

cutting to obtain a plate;

drilling the plate;

drilling a tail hole of the plate after drilling;

performing routing and milling PTH groove operation;

performing tail hole routing and milling operation on a PTH groove to obtain a first circuit board semi-finished product;

performing appearance detection on the circuit board semi-finished product, if a tail hole of the PTH groove is detected, preliminarily judging that the PTH groove is not missed, and if the tail hole of the PTH groove is not detected, preliminarily judging that the PTH groove is missed;

drilling a foolproof positioning hole at the tail hole of the PTH groove to obtain a second circuit board semi-finished product, wherein the diameter of the foolproof positioning hole is smaller than that of the tail hole of the PTH groove; and

inserting a first positioning nail into the fool-proof positioning hole, wherein the diameter of the first positioning nail is larger than that of the fool-proof positioning hole, the diameter of the first positioning nail is smaller than or equal to that of a tail hole of the PTH groove, if the first positioning nail can be inserted into the fool-proof positioning hole, the PTH groove is judged not to be missed, and if the first positioning nail cannot be inserted into the fool-proof positioning hole, the PTH groove is judged to be missed.

In one embodiment, the diameter of the foolproof positioning hole is 0.3 mm-0.5 mm.

In one embodiment, the number of the working tail holes is multiple, the diameters of the working tail holes are different, and the operation of drilling the working tail holes is that the working tail holes with the diameters from small to large are sequentially drilled in a straight line.

In one embodiment, the diameter of the first positioning nail is more than 0.5mm and less than or equal to 1.6 mm.

In one embodiment, after the step of drilling the foolproof positioning hole at the tail hole of the PTH groove to obtain the second circuit board semi-finished product and before the step of inserting the positioning pin into the foolproof positioning hole of the circuit board, the manufacturing method further includes:

drilling an auxiliary positioning hole in the second circuit board semi-finished product;

and inserting a second positioning nail into the auxiliary positioning hole.

In one embodiment, before the step of drilling the plate and after the step of cutting, the step of preparing further comprises:

and positioning the plate by using a bolt pin.

In one embodiment, before the step of drilling the tail hole of the drilled plate and after the step of drilling the plate, the preparation method further comprises the steps of:

and removing glue from the plate after drilling.

In one embodiment, before the step of inserting the first positioning pin into the foolproof positioning hole, and after the step of drilling the foolproof positioning hole at the tail hole of the PTH groove to obtain the second circuit board semi-finished product, the method further comprises the following steps:

and carrying out copper deposition treatment on the second circuit board semi-finished product.

In one embodiment, before the step of inserting the first positioning pin into the foolproof positioning hole and after the step of performing the copper deposition treatment on the second circuit board semi-finished product, the preparation method further includes:

and carrying out dry film pasting operation on the second circuit board semi-finished product subjected to the copper deposition treatment.

A circuit board is prepared by adopting the circuit board preparation method of any one of the embodiments.

Compared with the prior art, the invention has at least the following advantages:

1. according to the manufacturing method of the circuit board, the holes are drilled firstly, and the working tail holes, the PTH grooves and the tail holes of the PTH grooves are drilled according to the steps, namely various holes and grooves of the area needing copper deposition are prepared firstly, when the PTH grooves are milled in a milling mode due to the conditions of missing of engineering data, missing of processes, cutter breakage of a milling cutter and the like, the shape and the size of the PTH grooves are convenient to observe, and therefore whether the PTH grooves are milled in a milling mode can be judged preliminarily through appearance detection. After judging that the PTH groove is missed, after various inspections are carried out to eliminate factors causing the PTH groove missing, reworking the primary circuit board with the PTH groove missing for corresponding operation, so that the loss caused by copper deposition due to incapability of reworking the formed circuit board is reduced;

2. according to the manufacturing method of the circuit board, the diameter of the first positioning pin is larger than that of the foolproof positioning hole, the diameter of the first positioning pin is smaller than or equal to that of the tail hole of the PTH groove, if the first positioning pin can be inserted into the foolproof positioning hole, the fact that the PTH groove is not missed in routing and milling is judged, if the first positioning pin cannot be inserted into the foolproof positioning hole, the fact that the PTH groove is missed in routing and milling is judged, the situation that small-probability leakage inspection possibly occurs due to manual appearance inspection in the large-batch production process of the circuit board can be avoided, if the circuit board with the PTH groove is missed in routing and milling is judged in the step, the circuit board can be directly reworked and processed, and loss caused by the fact that the formed circuit board cannot be reworked and copper is deposited is reduced;

3. in the circuit board preparation method, the two ways for preventing the circuit board from being milling the PTH groove in a missing manner are adopted, namely, the problem that the circuit board is milling the PTH groove in a missing manner is solved by adopting a double fool-proof way. The circuit board preparation method is simple and strong in practicability, additional development of a leak-proof routing jig and a modification machine are not needed, the preparation operation steps in the circuit board preparation method are consistent with those of a common circuit board preparation process, great changes are not needed to be made to the operation steps of the normal circuit board preparation process, the processing cost of leak-proof routing and milling of PTH grooves in the circuit board preparation process is reduced, the circuit board preparation method is not limited to solving the problem of missing routing and milling of PTH grooves, and the circuit board preparation method is also suitable for solving the problem of missing routing and milling of other slotted holes of the circuit board.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

FIG. 1 is a flow chart of the steps of a method for manufacturing a circuit board according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a circuit board in a circuit board manufacturing method according to an embodiment of the present invention;

fig. 3 is a partially enlarged view of a portion a of the wiring board shown in fig. 2.

Detailed Description

To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

The application provides a preparation method of a circuit board, which comprises the following steps: cutting to obtain a plate; drilling the plate; performing drilling operation on the tail hole of the plate after drilling; performing routing and milling PTH groove operation; performing tail hole routing and milling operation on a PTH groove to obtain a first circuit board semi-finished product; performing appearance detection on the semi-finished product of the circuit board, preliminarily judging whether the PTH slot is missed by routing or milling if the tail hole of the PTH slot is detected, and preliminarily judging whether the PTH slot is missed by routing or milling if the tail hole of the PTH slot is not detected; drilling a foolproof positioning hole at the tail hole of the PTH groove to obtain a second circuit board semi-finished product, wherein the diameter of the foolproof positioning hole is smaller than that of the tail hole of the PTH groove; and inserting the first positioning nail into the foolproof positioning hole, wherein the diameter of the first positioning nail is larger than that of the foolproof positioning hole, the diameter of the first positioning nail is smaller than or equal to that of a tail hole of the PTH groove, if the first positioning nail can be inserted into the foolproof positioning hole, the milling of the PTH groove without milling is judged, and if the first positioning nail can not be inserted into the foolproof positioning hole, the milling of the PTH groove without milling is judged.

According to the manufacturing method of the circuit board, the holes are drilled firstly, and the tail holes of the working tail hole, the PTH groove and the PTH groove are drilled according to the steps, namely, various holes and grooves in the area needing copper deposition are prepared firstly, when conditions of project data missing, process missing, cutter breakage of a milling cutter and the like exist, and the PTH groove is milled in a missing manner, the shape and the size of the PTH groove are convenient to observe, so that whether the PTH groove is milled in the missing manner or not can be preliminarily judged through appearance detection. After judging that the PTH groove is missed, by various inspections, after factors causing the PTH groove are missed and milled, the primary circuit board with the PTH groove is reworked to carry out corresponding operation, and the loss caused by copper deposition due to incapability of reworking of the formed circuit board is reduced. Because the diameter of first locating pin is greater than the diameter of preventing slow-witted locating hole, and the diameter of first locating pin is less than or equal to the diameter of the tail hole in PTH groove, if first locating pin can insert and prevent slow-witted locating hole, then judge not to leak the gong and mill the PTH groove, if first locating pin can not insert and prevent slow-witted locating hole, then judge to leak the gong and mill the PTH groove, can avoid in the mass production process of circuit board, because the manual work carries out the condition that appearance inspection probably has little probability to leak out the inspection and takes place. And if the circuit board with the PTH groove determined to be missed is subjected to routing and milling in the step, the circuit board is directly reworked and processed, and the loss caused by copper deposition due to incapability of reworking the formed circuit board is reduced. Adopt foretell two kinds to prevent to appear leaking the gong and mill the mode in PTH groove on the circuit board, adopt the dual problem of preventing slow-witted mode realization and preventing that the circuit board from leaking the gong and mill the problem in PTH groove promptly. The circuit board preparation method is simple and strong in practicability, additional development of a leak-proof routing jig and a modification machine are not needed, the preparation operation steps in the circuit board preparation method are consistent with those of a common circuit board preparation process, great changes are not needed to be made to the operation steps of the normal circuit board preparation process, the processing cost of leak-proof routing and milling of PTH grooves in the circuit board preparation process is reduced, the circuit board preparation method is not limited to solving the problem of missing routing and milling of PTH grooves, and the circuit board preparation method is also suitable for solving the problem of missing routing and milling of other slotted holes of the circuit board.

In order to better understand the method for manufacturing a circuit board of the present invention, the following further explains the method for manufacturing a circuit board of the present invention, referring to fig. 1, the method for manufacturing a circuit board of the present application comprises the following steps:

and S100, performing cutting operation to obtain a plate material. It can be understood that each large copper-clad plate material needs to be equally divided into a plurality of small blocks before production, the equal division is called splitting, the large copper-clad plate material forms a plate material after being equally divided, namely, the splitting forms one large copper-clad plate material into the plate material comprising a working edge and a plurality of circuit boards to be processed. According to the invention, through typesetting design, the maximum utilization rate of the copper-clad plate can be obtained, and the working edge can be utilized later, so that the phenomena of milling and milling of conduction grooves of the circuit board prepared by the circuit board can be reduced.

And S200, drilling the plate. It can be understood that the drilling operation is to feed the plate material into the drilling machine for drilling, and the drilling machine needs to input engineering data correspondingly, and set corresponding processes to form holes with various apertures. Specifically, the drilling operation is the basic operation in the circuit board preparation, and the drilling operation on the plate is realized by using the existing machine in the circuit board preparation, so that no additional machine or machine transformation is needed, and the cost of the leakage-proof milling conduction groove of the circuit board is reduced.

And S300, drilling a tail hole of the drilled plate. It can be understood that after the panel veneer is finished drilling operation, can continue to utilize the drilling machine to carry out the operation of drilling the tail hole of work at the work edge of panel veneer, this step utilizes the drilling machine that all will use in the circuit board production can accomplish to need not additionally to increase the machine or reform transform the machine, reduced the hourglass gong of circuit board and milled the cost that the PTH groove detected. And the operation object of boring work tail hole operation is the work limit, can not influence each item performance of circuit board self, has better utilized the work limit that the later stage need be abandoned, makes the leak protection gong of circuit board mill the PTH groove in-process and need not additionally increase leak protection gong tool, has reduced the leak protection gong of circuit board and has milled the cost in PTH groove.

And S400, routing and milling the PTH groove. It can be understood that the routing and milling of the PTH grooves is operated to send the plate material into the computer numerical control precision machine to mill the PTH grooves in a processing and end milling manner, the computer numerical control precision machine needs to correspondingly input engineering data, and a corresponding flow is set to form the PTH grooves 500 in various shapes and sizes. Specifically, the operation of routing and milling the PTH groove is the basic operation in the preparation of the circuit board, and the operation of routing and milling the PTH groove on the plate is realized by using a machine in the preparation of the circuit board, so that additional machines or machine transformation is not needed, and the processing cost of the leakage-proof routing and milling the PTH groove of the circuit board is reduced.

S500, performing routing and milling of a tail hole of a PTH groove to obtain a first circuit board semi-finished product. It can be understood that after the plate material finishes the operation of milling the PTH groove, the computer digital control precision machinery can be continuously utilized to mill the tail hole of the PTH groove on the working edge of the plate material, the computer digital control precision machinery used in the production of the circuit board can be utilized to complete the step, additional machines are not required to be added or modified, and the cost of detecting the missing routing and milling the PTH groove of the circuit board is reduced. And the operation object of the end-hole operation of routing and milling the PTH groove is the working edge, can not influence each item performance of circuit board self, has better utilized the working edge that the later stage need be abandoned, makes the hourglass gong mill the PTH groove inspection in-process need not additionally increase the inspection tool, has reduced the leak protection gong of circuit board and has milled the cost in PTH groove.

S600, appearance detection is carried out on the semi-finished product of the circuit board, if the tail hole of the PTH groove is detected, the fact that the PTH groove is not missed is preliminarily judged, and if the tail hole of the PTH groove is not detected, the fact that the PTH groove is missed is judged. It can be understood that the plate is drilled firstly, and the tail holes of the working tail hole, the PTH groove and the PTH groove are drilled according to the steps, namely, various holes and grooves of the area needing copper deposition are prepared firstly, when the conditions of project data missing, process missing, cutter breakage of a milling cutter and the like exist to cause missing milling of the PTH groove, the shape and the size of the tail hole of the PTH groove are convenient to observe, so that the PTH groove can be judged basically and completely through appearance detection. After judging that the PTH groove is missed, by various inspections, after eliminating factors causing the PTH groove to be missed, the primary circuit board with the PTH groove is reworked to carry out corresponding operation, so that the loss caused by copper deposition due to incapability of reworking of the formed circuit board is reduced.

S700, drilling a fool-proof positioning hole at the tail hole of the PTH groove to obtain a second circuit board semi-finished product, wherein the diameter of the fool-proof positioning hole is smaller than that of the tail hole of the PTH groove. It can be understood that, equally, after the sheet material accomplished to bore work tail hole operation, can continue to utilize the drilling machine at the work edge of first circuit board semi-manufactured goods, and bore in the position of the tail hole of PTH groove and prevent slow-witted locating hole operation, this step utilizes the drilling machine that all will use in the circuit board production can accomplish to need not additionally to increase the machine or reform transform the machine, reduced the cost that the leak protection gong of circuit board milled the PTH groove. And the operation object of drilling at the position of the tail hole of the PTH groove and preventing slow-witted locating hole operation is the working edge, can not influence each item performance of circuit board self, has better utilized the working edge that the later stage needs to be abandoned, makes the leak protection gong in-process of circuit board need not additionally increase leak protection gong tool, has reduced the leak protection gong of circuit board and has milled the cost in PTH groove. It should be noted that, because the fool-proof positioning hole drill is disposed at the position of the tail hole of the PTH groove, if the PTH groove is not milled in a missing manner, the drill bit should be in an empty drilling state when the drilling machine performs the operation of drilling the fool-proof positioning hole.

S800, inserting the first positioning nail into the foolproof positioning hole, wherein the diameter of the first positioning nail is larger than that of the foolproof positioning hole, the diameter of the first positioning nail is smaller than or equal to that of a tail hole of the PTH groove, if the first positioning nail can be inserted into the foolproof positioning hole, the fact that the PTH groove is not milled in a milling mode is judged, and if the first positioning nail cannot be inserted into the foolproof positioning hole, the fact that the PTH groove is milled in a milling mode is judged. It can be understood that, because the diameter of first locating pin is greater than the diameter of preventing slow-witted locating hole, and the diameter of the tail hole in the diameter less than or equal to PTH groove of first locating pin, if first locating pin can insert and prevent slow-witted locating hole, then can judge not to leak the gong and mill the PTH groove, if first locating pin can not insert and prevent slow-witted locating hole, then can judge to leak the gong and mill the PTH groove, avoided in the mass production process of circuit board, because the artifical condition that carries out the emergence leak-off inspection that appearance inspection probably has little probability takes place. And if the circuit board with the PTH groove determined to be missed is subjected to routing and milling in the step, the circuit board is directly reworked and processed, and the loss caused by copper deposition due to incapability of reworking the formed circuit board is reduced.

According to the manufacturing method of the circuit board, the holes are drilled firstly, and the tail holes of the working tail hole, the PTH groove and the PTH groove are drilled according to the steps, namely, various holes and grooves in the area needing copper deposition are prepared firstly, when conditions of project data missing, process missing, cutter breakage of a milling cutter and the like exist, and the PTH groove is milled in a missing manner, the shape and the size of the PTH groove are convenient to observe, so that whether the PTH groove is milled in the missing manner or not can be preliminarily judged through appearance detection. After judging that the PTH groove is missed, by various inspections, after factors causing the PTH groove are missed and milled, the primary circuit board with the PTH groove is reworked to carry out corresponding operation, and the loss caused by copper deposition due to incapability of reworking of the formed circuit board is reduced. Because the diameter of first locating pin is greater than the diameter of preventing slow-witted locating hole, and the diameter of first locating pin is less than or equal to the diameter of the tail hole in PTH groove, if first locating pin can insert and prevent slow-witted locating hole, then judge not to leak the gong and mill the PTH groove, if first locating pin can not insert and prevent slow-witted locating hole, then judge to leak the gong and mill the PTH groove, can avoid in the mass production process of circuit board, because the manual work carries out the condition that appearance inspection probably has little probability to leak out the inspection and takes place. And if the circuit board with the PTH groove determined to be missed is subjected to routing and milling in the step, the circuit board is directly reworked and processed, and the loss caused by copper deposition due to incapability of reworking the formed circuit board is reduced. Adopt foretell two kinds to prevent to appear leaking the gong and mill the mode in PTH groove on the circuit board, adopt the dual problem of preventing slow-witted mode realization and preventing that the circuit board from leaking the gong and mill the problem in PTH groove promptly. The circuit board preparation method is simple and strong in practicability, additional development of a leak-proof routing jig and a modification machine are not needed, the preparation operation steps in the circuit board preparation method are consistent with those of a common circuit board preparation process, great changes are not needed to be made to the operation steps of the normal circuit board preparation process, the processing cost of leak-proof routing and milling of PTH grooves in the circuit board preparation process is reduced, the circuit board preparation method is not limited to solving the problem of missing routing and milling of PTH grooves, and the circuit board preparation method is also suitable for solving the problem of missing routing and milling of other slotted holes of the circuit board.

In one embodiment, the diameter of the first positioning nail is more than 0.5mm and less than or equal to 1.6 mm. It can be understood that if the PTH groove is milled in the missing routing of the circuit board, the first positioning pin cannot be inserted into the foolproof positioning hole, that is, the hole diameter of the first positioning pin needs to be larger than that of the foolproof positioning hole; if the circuit board is not subjected to routing and milling of the PTH groove, the first positioning pin can be inserted into the PTH groove, namely the hole diameter of the first positioning pin needs to be smaller than the diameter of the minimum hole of the PTH groove; and if the diameter of the positioning nail is too small, the needle is easy to break, so that the diameter of the first positioning nail is more than 0.5mm and less than or equal to 1.6 mm.

In one embodiment, the diameter of the foolproof positioning hole is 0.3 mm-0.5 mm. It can be understood that if the circuit board is missed to be routed and milled the PTH groove, then first pilot pin can not insert in preventing slow-witted locating hole, prevents that the hole diameter of slow-witted locating hole promptly needs to be less than the hole diameter of first pilot pin, and avoids preventing that the aperture of slow-witted locating hole is too little, is difficult to bore, so sets up the diameter of preventing slow-witted locating hole and is 0.3mm ~ 0.5 mm.

In one embodiment, the number of the working tail holes is multiple, the diameters of the working tail holes are different, and the working tail holes are drilled sequentially in a straight line to drill the working tail holes with the diameters from small to large. It can be understood that the circuit board can have drill holes with various apertures, the number of the working tail holes corresponds to the number of the apertures on the circuit board on the engineering data, and the working tail holes are arranged in a straight line according to the diameters of the drill holes from small to large according to the engineering data, so that whether the drill holes are missed or not can be clearly and clearly observed when appearance detection is carried out.

In one embodiment, after the step of drilling the foolproof positioning hole at the tail hole of the PTH groove to obtain the second circuit board semi-finished product and before the step of inserting the positioning pin into the foolproof positioning hole of the circuit board, the manufacturing method further comprises:

firstly, auxiliary positioning holes are drilled on the second circuit board semi-finished product. The operation of inserting the second positioning nail is realized, an auxiliary positioning hole needs to be formed in the circuit board and is used for inserting the second positioning nail, whether the second positioning nail can be inserted into the auxiliary positioning hole or not is further utilized to judge whether deviation occurs in the process of preventing the circuit board from leaking the bolts or not, and the accuracy of judging whether the bolts leak the bolts and mill the PTH groove or not is improved. It should be noted that, likewise, supplementary locating hole also sets up on the work edge, does not influence each item performance of circuit board self, has better utilized the work edge that the later stage needs to be abandoned, makes the leak protection gong in-process of circuit board need not additionally increase leak protection gong tool, has reduced the leak protection gong of circuit board and has milled the cost in PTH groove.

And finally, inserting the second positioning nail into the auxiliary positioning hole. It will be appreciated that when the first pilot pin is inserted into the foolproof pilot hole alone, it may occur that the PTH slot has actually been milled, but because the circuit board moves in the anti-missing routing process of the circuit board, the first positioning nail can not be inserted into the foolproof positioning hole, therefore, the judgment of whether the PTH groove is missed or not milled is not accurate, the operation of inserting the second positioning nail can be used for judging whether the deviation occurs in the process of preventing the PTH groove from being milled, specifically, if the second positioning nail is inserted into the auxiliary positioning hole, the operation can be smoothly carried out, which indicates that the circuit board does not deviate in the process of preventing the PTH groove from being milled, whether the PTH groove of the circuit board is missed in routing or milling can be judged according to whether the first positioning nail can be inserted into the foolproof positioning hole or not, if the second positioning nail can not be inserted into the auxiliary positioning hole, the deviation of the circuit board in the missing-proof routing can be shown, then can not judge whether the circuit board missed the routing and mill PTH groove according to whether first locating pin can insert in preventing slow-witted locating hole. Therefore, the accuracy of judging whether the PTH groove is missed in routing and milling is improved by the operation of inserting the second positioning nail.

In one embodiment, the number of the auxiliary positioning holes is three, and the three auxiliary positioning holes and the fool-proof positioning holes are respectively arranged on the peripheral edge of the second circuit board semi-finished product, so that the positioning accuracy of the circuit board semi-finished product is further improved.

In one embodiment, before the step of performing the drilling operation on the sheet material and after the step of performing the cutting operation, the step of preparing the method further comprises:

and positioning the plate by using the bolt nail. The pin is inserted into the working edge, the corresponding pin hole is drilled in the working edge and matched with the pin to position the plate, and one purpose of inserting the pin into the plate is to prevent the plates from contacting with each other and rubbing with each other when the plates are placed, so that the surfaces of the plates are cut and rubbed to generate powder, and the powder on the circuit board can cause the drilling tool to slip in the drilling process, thereby causing the deviation of the drilled hole and influencing the normal use of the circuit board; the other purpose is to position and fix the plate to prevent the plate from deviating due to the impact force of the drill knife after the plate is sent into the drilling machine, so that the deviation of the drilled hole is caused, and the normal use of the circuit board is influenced. Therefore, the pins are inserted into the plate, so that the accuracy of drilling is improved, and the quality of the circuit board is further improved.

In one embodiment, before the step of drilling the tail hole of the drilled plate, and after the step of drilling the plate, the method further comprises the steps of:

and removing glue from the plate after drilling. After the circuit board is drilled, glue residues often remain in the drilled holes, and if the plate is a multilayer circuit board plate, the glue residues affect the conduction of each layer of circuit, namely the glue residues affect the drilling of the circuit board or the metallization of a PTH (plated through hole) groove, and affect the normal use of the circuit board. Therefore, the plate after drilling is subjected to glue removal, so that the conduction of each layer of circuit of the circuit board is ensured, and the drilling of the circuit board or the metallization of the conduction groove is ensured.

In one embodiment, before the step of inserting the first positioning pin into the foolproof positioning hole, and after the step of drilling the foolproof positioning hole at the tail hole of the PTH groove to obtain the second circuit board semi-finished product, the preparation method further comprises the following steps:

and carrying out copper deposition treatment on the second circuit board semi-finished product. And the purpose of carrying out copper deposition treatment on the second circuit board semi-finished product is to metallize the PTH groove and the PTH hole, so that the processed circuit board meets the requirements of the electronic component connection carrier.

In one embodiment, before the step of inserting the first positioning pin into the foolproof positioning hole and after the step of performing the copper deposition process on the second circuit board semi-finished product, the preparation method further includes:

and carrying out dry film pasting operation on the second circuit board semi-finished product subjected to the copper deposition treatment. And (3) carrying out dry film pasting operation on the second circuit board semi-finished product subjected to the copper deposition treatment so as to enable the processed circuit board to meet the requirements of the electronic component connection carrier.

In one embodiment, the circuit board after the dry film pasting operation is further subjected to a plating operation, an etching operation and a solder mask ink printing operation. It can be understood that the copper deposition operation, the dry film pasting operation, the electroplating operation, the etching operation and the solder mask printing ink printing operation are all basic operation steps in a general circuit board preparation process, and the purpose of the operation is to enable the processed circuit board to meet various requirements of electronic component connection carriers.

In order to better understand the circuit board manufacturing method of the present invention, the following further explanation is made on the circuit board manufacturing method of the present invention with reference to the circuit board obtained in the manufacturing process, please refer to fig. 1 to 3, and in one embodiment, the circuit board manufacturing method includes the following steps:

firstly, cutting operation is carried out to obtain a plate material. It can be understood that each large copper-clad plate material needs to be equally divided into a plurality of small pieces before production, the equal division is called as material division, the large copper-clad plate material forms a plate material after being equally divided, namely, the material division forms one large copper-clad plate material into the plate material comprising a working edge 100 and a plurality of circuit boards to be processed, the plurality of circuit boards to be processed are arranged in the working edge 100 in a rectangular mode, and the working edge 100 is used for drilling a working tail hole, milling a PTH groove, drilling a fool-proof positioning hole and drilling an auxiliary positioning hole. The working edge 100 is utilized later, so that the phenomena of missing routing and milling PTH grooves of the circuit board prepared by the circuit board are reduced. The circuit board preparation method is realized only by using the existing machine in the circuit board preparation, and no additional machine or machine modification is needed, so that the processing cost of the leakage-proof routing and milling PTH groove of the circuit board is reduced.

The board is then subjected to a drilling operation. After drilling, the PHT holes 300 with various apertures are formed on the circuit board to be processed. Specifically, the operation of drilling the board is the basic operation in the preparation of the circuit board, the operation of drilling the board is realized by using the existing machine in the preparation of the circuit board, no additional machine or machine transformation is needed, and the processing cost of the leakage-proof routing and milling PTH groove of the circuit board is reduced.

And then, performing tail hole drilling operation on the plate after drilling. The working tail holes 400 are drilled on the working edge 100, the number of the working tail holes 400 is multiple, the diameters of the working tail holes 400 are different, and the working tail holes are sequentially arranged in a straight line from small to large according to the diameters. Specifically, the working tail hole 400 is drilled on the working edge 100, and the working edge 100 is utilized to reduce the PTH groove missing phenomenon in the circuit board prepared by the circuit board. And the operation of drilling the working tail hole on the plate after drilling is realized only by using the existing machine in the preparation of the circuit board, and no additional machine or machine transformation is needed, so that the processing cost of the leakage-proof routing and milling PTH groove of the circuit board is reduced.

It will be appreciated that the working tail hole 400 is the last PTH hole drilled by each hole drill, consistent with the sequence of typical circuit board processing steps.

Then, a PTH groove milling operation is performed. PTH groove 500 gong is established on treating the processing circuit board. Specifically, the PTH groove milling operation is an essential operation step in a general circuit board manufacturing process. The operation of milling the PTH groove is realized only by using the existing machine in the preparation of the circuit board, no additional machine is needed to be added or the machine is not needed to be modified, and the cost of milling the PTH groove in the anti-leakage process of the circuit board is reduced.

And then, milling a tail hole of the PTH groove to obtain a first circuit board semi-finished product. The tail hole 600 of the PTH groove is routed on the working edge 100, the tail hole 600 of the PTH groove and the working tail hole 400 are arranged in the same straight line, and the tail hole 600 of the PTH groove is adjacent to the working tail hole 400 with the largest hole diameter. In appearance testing process, the tail-hole 600 and the work tail-hole 400 in PTH groove are same linear arrangement, and the tail-hole 600 in PTH groove sets up adjacent with the biggest work tail-hole 400 in aperture, makes the position of the tail-hole 600 in PTH groove more outstanding, and the shape size of the tail-hole 600 in PTH groove is convenient for observe, is favorable to leaking the preliminary judgement that the gong milled the PTH groove. Specifically, the tail hole 600 of the PTH groove is routed on the working edge 100, and the working edge 100 is reused here, so as to reduce the PTH groove missing routing and milling phenomenon of the circuit board prepared by the circuit board. And the tail hole operation of routing and milling the PTH groove is realized only by utilizing the existing machine in the preparation of the circuit board, no additional machine is needed to be added or the machine is not needed to be modified, and the cost of the leakage-proof routing and milling the PTH groove of the circuit board is reduced.

It can be understood that the tail hole 600 of the PTH groove is a PTH groove finally milled by a drilling tool milling the PTH groove, and the operation sequence of the conventional circuit board processing steps is met.

And then, performing appearance detection on the semi-finished product of the circuit board, preliminarily judging that the PTH groove is not missed to be milled if the tail hole 600 of the PTH groove is detected, and preliminarily judging that the PTH groove is missed to be milled if the tail hole 600 of the PTH groove is not detected. Specifically, the appearance detection of the circuit board semi-finished product is realized only by using the existing machine in the circuit board preparation, no additional machine or machine transformation is needed, and the cost of the leakage-proof routing and milling PTH groove of the circuit board is reduced.

And then, drilling a fool-proof positioning hole at the position of the tail hole 600 of the PTH groove to obtain a second circuit board semi-finished product, wherein the diameter of the drilled fool-proof positioning hole 700 is smaller than that of the tail hole 600 of the PTH groove. Specifically, the fool-proof positioning hole 700 is drilled on the working edge 100, and the working edge 100 is reused here, so as to reduce the PTH groove missing and milling phenomenon of the circuit board prepared by the circuit board. And the operation of drilling the fool-proof positioning hole at the position of the tail hole 600 of the PTH groove is realized only by using the existing drilling machine in the preparation of the circuit board, and no additional machine or machine transformation is needed, so that the cost of milling the PTH groove for preventing the routing of the circuit board is reduced.

And then, carrying out copper deposition treatment on the second circuit board semi-finished product. The purpose of performing copper deposition treatment on the second circuit board semi-finished product is to form hole metallization on the PTH groove 500 and the PTH hole 300, so that the processed circuit board meets the requirements of the electronic component connection carrier. The second circuit board semi-finished product is subjected to copper deposition treatment, only the existing machine in circuit board preparation is utilized to realize the copper deposition treatment, no additional machine or machine transformation is needed, and the processing cost of the leakage-proof routing and milling PTH groove of the circuit board is reduced.

And then, carrying out dry film pasting operation on the second circuit board semi-finished product subjected to the copper deposition treatment. And (3) carrying out dry film pasting operation on the second circuit board semi-finished product subjected to the copper deposition treatment so as to enable the processed circuit board to meet the requirements of the electronic component connection carrier.

Then, the first positioning nail is inserted into the foolproof positioning hole 700, wherein the diameter of the first positioning nail is larger than that of the foolproof positioning hole 700, and the diameter of the first positioning nail is smaller than or equal to that of the tail hole 600 of the PTH groove, if the first positioning nail can be inserted into the foolproof positioning hole 700, it is determined that the PTH groove is not missed, and if the first positioning nail cannot be inserted into the foolproof positioning hole 700, it is determined that the PTH groove is missed. It can be understood that, because the diameter of first locating pin is greater than the diameter of preventing slow-witted locating hole 700, and the diameter of the tail-hole 600 in the diameter less than or equal to PTH groove of first locating pin, if first locating pin can insert and prevent slow-witted locating hole 700, then can judge not to leak the gong and mill the PTH groove, if first locating pin can not insert and prevent slow-witted locating hole 700, then can judge to leak the gong and mill the PTH groove, avoided in the mass production process of circuit board, because the manual work carries out the condition emergence of the emergence hourglass inspection that appearance inspection probably has little probability and takes place. The operation of inserting the first positioning nail into the foolproof positioning hole 700 is realized only by utilizing the existing board milling machine in the circuit board preparation, and the processing cost of the leak-proof board milling PTH groove of the circuit board is reduced without additionally adding a machine or modifying the machine.

And finally, milling the circuit board which is judged not to miss milling the PTH groove. And (3) processing the circuit boards to be processed formed in the cutting process to obtain finished product circuit boards 200 meeting various requirements of electronic component connection carriers for the circuit boards which are determined not to be subjected to routing and milling of PTH grooves, namely separating the finished product circuit boards 200 from the working edge 100, and separating the finished product circuit boards 200 from each other to obtain the mutually separated finished product circuit boards 200 meeting the requirements of customers. The milling operation of the circuit board which judges that the PTH groove is not milled in the routing process is only realized by utilizing the existing machine in the circuit board preparation, and the additional increase of the machine or the modification of the machine is not needed, so that the processing cost of the PTH groove in the routing process is reduced.

It can be understood that in the circuit board manufacturing method of the present invention, two ways of preventing the PTH groove from being missed are adopted, that is, the PTH groove from being missed is prevented from being milled by the circuit board by adopting a dual fool-proof way. The preparation method of the circuit board is simple and strong in practicability, no additional development of a leak-proof routing jig and a modification machine are needed, the preparation operation steps in the preparation method of the circuit board are consistent with the operation steps of a general circuit board preparation process, only simple tail hole drilling operation and tail hole milling operation of a PTH groove are added, no great change is needed to the operation steps of a normal circuit board preparation process, the cost of leak-proof routing and milling the PTH groove in the preparation process of the circuit board is reduced, the preparation method of the circuit board is not limited to the shape of the PTH groove, and the leak-proof routing method can be developed and widely applied to leak-proof routing of the circuit board with special groove holes.

A circuit board is prepared by adopting the circuit board preparation method of any one of the embodiments. The circuit board obtained by the preparation method of the circuit board has less conditions of missing routing and milling PTH grooves, so that the circuit board has higher quality.

Compared with the prior art, the invention has at least the following advantages:

1. according to the manufacturing method of the circuit board, the holes are drilled firstly, and the working tail holes, the PTH grooves and the tail holes of the PTH grooves are drilled according to the steps, namely various holes and grooves of the area needing copper deposition are prepared firstly, when the PTH grooves are milled in a milling mode due to the conditions of missing of engineering data, missing of processes, cutter breakage of a milling cutter and the like, the shape and the size of the PTH grooves are convenient to observe, and therefore whether the PTH grooves are milled in a milling mode can be judged preliminarily through appearance detection. After judging that the PTH groove is missed, after various inspections are carried out to eliminate factors causing the PTH groove missing, reworking the primary circuit board with the PTH groove missing for corresponding operation, so that the loss caused by copper deposition due to incapability of reworking the formed circuit board is reduced;

2. according to the manufacturing method of the circuit board, the diameter of the first positioning pin is larger than that of the foolproof positioning hole, the diameter of the first positioning pin is smaller than or equal to that of the tail hole of the PTH groove, if the first positioning pin can be inserted into the foolproof positioning hole, the fact that the PTH groove is not missed in routing and milling is judged, if the first positioning pin cannot be inserted into the foolproof positioning hole, the fact that the PTH groove is missed in routing and milling is judged, the situation that small-probability leakage inspection possibly occurs due to manual appearance inspection in the large-batch production process of the circuit board can be avoided, if the circuit board with the PTH groove is missed in routing and milling is judged in the step, the circuit board can be directly reworked and processed, and loss caused by the fact that the formed circuit board cannot be reworked and copper is deposited is reduced;

3. in the circuit board preparation method, the two ways for preventing the circuit board from being milling the PTH groove in a missing manner are adopted, namely, the problem that the circuit board is milling the PTH groove in a missing manner is solved by adopting a double fool-proof way. The circuit board preparation method is simple and strong in practicability, additional development of a leak-proof routing jig and a modification machine are not needed, the preparation operation steps in the circuit board preparation method are consistent with those of a common circuit board preparation process, great changes are not needed to be made to the operation steps of the normal circuit board preparation process, the processing cost of leak-proof routing and milling of PTH grooves in the circuit board preparation process is reduced, the circuit board preparation method is not limited to solving the problem of missing routing and milling of PTH grooves, and the circuit board preparation method is also suitable for solving the problem of missing routing and milling of other slotted holes of the circuit board.

The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (9)

1. The preparation method of the circuit board is characterized by comprising the following steps:

cutting to obtain a plate;

drilling the plate;

drilling working tail holes on the plate after drilling, wherein the number of the working tail holes is multiple, the diameters of the working tail holes are different, and the working tail holes with the diameters from small to large are sequentially drilled in a straight line;

performing routing and milling PTH groove operation;

performing tail hole routing and milling operation on a PTH groove to obtain a first circuit board semi-finished product;

performing appearance detection on the circuit board semi-finished product, if a tail hole of the PTH groove is detected, preliminarily judging that the PTH groove is not missed, and if the tail hole of the PTH groove is not detected, preliminarily judging that the PTH groove is missed;

drilling a foolproof positioning hole at the tail hole of the PTH groove to obtain a second circuit board semi-finished product, wherein the diameter of the foolproof positioning hole is smaller than that of the tail hole of the PTH groove; and

inserting a first positioning nail into the fool-proof positioning hole, wherein the diameter of the first positioning nail is larger than that of the fool-proof positioning hole, the diameter of the first positioning nail is smaller than or equal to that of a tail hole of the PTH groove, if the first positioning nail can be inserted into the fool-proof positioning hole, the PTH groove is judged not to be missed, and if the first positioning nail cannot be inserted into the fool-proof positioning hole, the PTH groove is judged to be missed.

2. The method for manufacturing a circuit board according to claim 1, wherein the diameter of the foolproof positioning hole is 0.3mm to 0.5 mm.

3. The method for manufacturing a circuit board according to claim 1, wherein the diameter of the first positioning pin is greater than 0.5mm and less than or equal to 1.6 mm.

4. The method of manufacturing a wiring board according to claim 1, wherein after the step of drilling a foolproof positioning hole at the position of the tail hole of the PTH slot to obtain a second semi-finished wiring board, and before the step of inserting the first positioning hole into the foolproof positioning hole of the wiring board, the method further comprises:

drilling an auxiliary positioning hole in the second circuit board semi-finished product;

and inserting a second positioning nail into the auxiliary positioning hole.

5. The method of manufacturing a wiring board according to claim 1, wherein before the step of drilling the sheet material and after the step of cutting, the method further comprises:

and positioning the plate by using a bolt pin.

6. The method of making a wiring board of claim 5, wherein before the step of drilling the drilled blank into a tail hole and after the step of drilling the blank, the method further comprises:

and removing glue from the plate after drilling.

7. The method for manufacturing a wiring board according to claim 1, wherein before the step of inserting the first positioning pin into the foolproof positioning hole and after the step of drilling the foolproof positioning hole at the position of the tail hole of the PTH groove to obtain the second semi-finished wiring board, the method further comprises the steps of:

and carrying out copper deposition treatment on the second circuit board semi-finished product.

8. The method for manufacturing a circuit board according to claim 7, wherein before the step of inserting the first positioning pin into the foolproof positioning hole and after the step of performing the copper deposition process on the second circuit board semi-finished product, the method further comprises:

and carrying out dry film pasting operation on the second circuit board semi-finished product subjected to the copper deposition treatment.

9. A wiring board characterized by being produced by the wiring board production method according to any one of claims 1 to 8.

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