KR20080029774A - Profile machining method - Google Patents

Profile machining method Download PDF

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KR20080029774A
KR20080029774A KR1020070076756A KR20070076756A KR20080029774A KR 20080029774 A KR20080029774 A KR 20080029774A KR 1020070076756 A KR1020070076756 A KR 1020070076756A KR 20070076756 A KR20070076756 A KR 20070076756A KR 20080029774 A KR20080029774 A KR 20080029774A
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workpiece
processing
hole
rotary tool
circumferential surface
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KR1020070076756A
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Korean (ko)
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KR101400247B1 (en
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신타로 타카하시
히로시 카와사키
카츠노리 토키나가
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히다치 비아 메카닉스 가부시키가이샤
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P13/00Making metal objects by operations essentially involving machining but not covered by a single other subclass
    • B23P13/02Making metal objects by operations essentially involving machining but not covered by a single other subclass in which only the machining operations are important
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P17/00Metal-working operations, not covered by a single other subclass or another group in this subclass
    • B23P17/02Single metal-working processes; Machines or apparatus therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23BTURNING; BORING
    • B23B2270/00Details of turning, boring or drilling machines, processes or tools not otherwise provided for
    • B23B2270/54Methods of turning, boring or drilling not otherwise provided for
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23BTURNING; BORING
    • B23B41/00Boring or drilling machines or devices specially adapted for particular work; Accessories specially adapted therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23CMILLING
    • B23C2270/00Details of milling machines, milling processes or milling tools not otherwise provided for
    • B23C2270/20Milling external areas of components

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Drilling And Boring (AREA)
  • Milling Processes (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

A method of processing an outer profile of a workpiece is provided to improve reliability of product substrate by preventing burr from being generated. In a method of processing an outer profile of a workpiece, when a hollow section(1) crossing the outer peripheral surface(S) of a workpiece exists, a relief hole(8) is formed by using a punching member(7) in a crossing section(D) between a rotating tool and the hollow section such that the relief hole interferes with the outer peripheral surface of the workpiece. When the rotation direction of a blade of the rotating tool follows the movement direction of the rotating tool relative to the outer peripheral surface of the workpiece, the rotating tool enters the hollow section from the relief hole such that the outer peripheral surface of the workpiece is formed.

Description

외형가공방법{PROFILE MACHINING METHOD}External Processing Method {PROFILE MACHINING METHOD}

본 발명은, 회전공구를 이용하여 워크(예컨대, 프린트기판)의 외형을 형성하는 외형가공방법에 관한 것이다.The present invention relates to an external shape processing method for forming an external shape of a work (for example, a printed board) using a rotary tool.

프린트기판을 가공할 경우, 제품이 되는 프린트기판(이하, 「제품기판」이라 함)이 복수 포함되는 커다란 프린트기판(이하, 「모(母) 기판」이라 함)의 상태에서 구멍형성가공 및 구멍형성 후의 도금 가공을 실시한 후, 모기판으로부터 제품기판을 잘라내도록(외형가공) 하고 있다. 이와 같이 하면, 구멍형성가공 공정 및 구멍형성가공 후의 도금공정에서의 준비 시간을 단축할 수 있다.When processing printed boards, hole forming processing and holes in the state of a large printed board (hereinafter referred to as a "substrate") containing a plurality of printed boards (hereinafter referred to as "product boards") that are products After the plating process after forming is performed, the product substrate is cut out from the mother substrate (appearance processing). In this manner, the preparation time in the hole forming processing step and the plating step after the hole forming processing can be shortened.

제품기판의 신뢰성을 향상시키기 위해, 구멍형성가공시 및 외형가공시에 발생하는 파편은 공구의 주변에 배치된 집진장치에 의해 가공부 주변으로부터 제거된다(특허문헌 1).In order to improve the reliability of the product substrate, debris generated at the time of hole forming processing and external processing is removed from the periphery of the processing portion by a dust collecting device arranged around the tool (Patent Document 1).

다층 프린트기판에서 절연물의 상하에 배치된 패턴층을 전기적으로 접속할 경우에는, 관통홀(through hole)(관통구멍)을 형성하고, 도금 처리를 실시함으로써 관통홀의 내부에 도금층을 형성하여 전기적으로 접속한다.In the case of electrically connecting the pattern layers arranged above and below the insulator in a multilayer printed circuit board, through holes (through holes) are formed, and a plating process is performed to form a plating layer inside the through holes and to electrically connect them. .

도 2는 종래의 외형가공시의 제품기판을 나타낸 평면도로서, 도면의 화살표 T는 회전공구의 회전방향을 나타내고, 화살표 C는 절삭방향(회전공구의 이동방향)을 나타낸다.2 is a plan view showing a product substrate in the conventional external machining, the arrow T in the drawing indicates the rotation direction of the rotary tool, the arrow C indicates the cutting direction (moving direction of the rotary tool).

모기판(3)으로부터 잘려져 나온 제품기판(2)의 외주(외형)에는, 외주에 개구되는 관통홀(1; 도시의 경우 반원(半圓) 형상)이 배치되어 있다. 도금층(4)이 형성된 관통홀(1)을 외형가공용의 회전공구(직경이 1~2mm인 것이 많이 이용되고 있다. 이하, 「라우터 비트(5)」라 함)로 절삭하면, 도금층(4)의 일부가 벗겨지는 경우가 많다(이하, 벗겨진 도금층을 「버(burr , 6)」라 한다). 버(6)와 관통홀(1) 단부의 도금층(4)과의 접속은 강고한 것이 아니다. 따라서, 버(6)의 대부분은 가공시에 집진(集塵) 장치에 의해 흡인되지만, 일부는 가공 후에도 도금층(4)에 접속된 상태인 채로 된다. 버(6)는 도전성이기 때문에, 버(6)가 어떠한 원인에 의해 제품기판(2)으로부터 떨어지면, 떨어진 버(6)가 제품기판(2)의 단자 간을 단락(短絡)시키는 경우가 있다. 버(6)는 라우터 비트(5)가 기판 측으로부터 관통홀(1)에 진입하는 측(빠지는 측)의 교차부에 발생하고, 관통홀(1)로부터 기판 측으로 진입하는 측의 교차부에는 발생하지 않는다. 따라서, 종래에는 소위 반전(反轉)가공을 실시하였다.On the outer circumference (outside) of the product substrate 2 cut out from the mother substrate 3, a through hole 1 (semi-circular shape in the case shown in the figure) is opened. When the through-hole 1 in which the plating layer 4 was formed is cut by the rotary tool for external processing (1-2 mm in diameter is used. Hereinafter, it is called "router bit 5"), the plating layer 4 A part of is often peeled off (hereinafter, the peeled plating layer is referred to as "burr 6"). The connection between the burr 6 and the plating layer 4 at the end of the through hole 1 is not rigid. Therefore, most of the burr 6 is attracted by the dust collecting apparatus at the time of processing, but a part remains in the state connected to the plating layer 4 after processing. Since the burr 6 is conductive, if the burr 6 is separated from the product substrate 2 due to any cause, the burr 6 may be short-circuited between the terminals of the product substrate 2. The burr 6 is generated at the intersection of the side where the router bit 5 enters the through-hole 1 from the substrate side (outside), and at the intersection of the side where the router bit 5 enters the through-hole 1 from the substrate side. I never do that. Therefore, the so-called reverse processing was conventionally performed.

도 3은 반전가공의 가공순서를 나타낸 도면이다.3 is a view showing the processing sequence of the reverse machining.

도 3의 (a)에 나타낸 바와 같이, 우선, 제품기판(2)의 외형(도면에서 1점 쇄선으로 나타낸 지면과 수직인 면. 이하, 「완성면(S)」이라 함)에 대하여 오프셋이 g인 면(이하, 「1차 가공면(F)」이라 함)을 가공한다. 또, 1차 가공면(F)을 가공할 경우에는, 제품기판(2)의 일부를 모기판(3)에 접속시켜 두고, 모기판(3)을 표 리반전시킬 때에 제품기판(2)이 모기판(3)으로부터 벗어나지 않도록 해 둔다.As shown in Fig. 3 (a), first, the offset of the product substrate 2 with respect to the outer shape (surface perpendicular to the ground indicated by the dashed-dotted line in the drawing, hereinafter referred to as the "complete surface S"). The surface which is g (hereinafter, referred to as "primary processing surface F") is processed. In the case of processing the primary working surface F, a part of the product substrate 2 is connected to the mother substrate 3, and when the mother substrate 3 is reversely reversed, the product substrate 2 Do not deviate from the mother board (3).

다음으로, 도 3의 (b)에 나타낸 바와 같이, 모기판(3)을 표리(表裏) 반전시키고, 라우터 비트(5)의 이동방향을 동일하게 하여 완성면(S)을 가공한다. 1차 가공면(F)이 형성된 모기판(3)을 표리 반전시키면, 1차 가공에 의해 발생된 버(6)는 라우터 비트(5)가 관통홀(1)로부터 기판 측으로 진입하는 측에 배치되기 때문에, 도 3의 (c)에 나타낸 바와 같이, 완성면(S)을 형성할 때에 제품기판(2)으로부터 제거된다. 완성가공의 경우에도, 라우터 비트(5)가 제품기판(2) 측으로부터 관통홀(1)에 진입하는 측에는 버(6)가 발생되는 경우가 있지만, 오프셋(g)을 작게(예컨대, 0.05mm)해 두면, 발생되는 버(6)의 크기는 미소하다. 따라서, 발생된 버(6)가 제품기판(2)으로부터 벗어났다고 하더라도 제품기판(2)의 제품으로서의 신뢰성을 저하시키는 경우는 거의 없다.Next, as shown in Fig. 3B, the mother substrate 3 is inverted from the front and back, and the finished surface S is processed by making the movement direction of the router bit 5 the same. When the mother substrate 3 on which the primary processing surface F is formed is inverted from side to side, the burr 6 generated by the primary processing is disposed on the side where the router bit 5 enters the substrate side from the through hole 1. Therefore, as shown in Fig. 3C, when the finished surface S is formed, it is removed from the product substrate 2. Also in the case of finished processing, the burr 6 may be generated on the side where the router bit 5 enters the through hole 1 from the product substrate 2 side, but the offset g is made small (for example, 0.05 mm). In this case, the size of the generated burr 6 is minute. Therefore, even if the generated bur 6 is removed from the product substrate 2, the reliability of the product substrate 2 as a product is hardly deteriorated.

또, 여기서는 라우터 비트(5)가 우회전(정(正)회전)용인 경우에 대해 설명하였지만, 라우터 비트(5)가 좌회전(역(逆)회전)용이어도, 버(6)가 발생되는 위치는 라우터 비트(5)가 모기판(3)으로부터 관통홀(1)로 빠지는 측이다.In addition, although the case where the router bit 5 was for right rotation (forward rotation) was demonstrated here, even if the router bit 5 is for left rotation (reverse rotation), the position where the burr 6 generate | occur | produces is The router bit 5 exits from the mother substrate 3 into the through hole 1.

[특허문헌 1] 일본 특허공개공보 평3(1991)-178707호[Patent Document 1] Japanese Patent Application Laid-Open No. 3 (1991) -178707

그러나, 반전가공을 실시할 경우에는, 가공 테이블로부터 모기판을 떼어내는공정, 모기판을 반전시키는 공정, 반전시킨 모기판을 가공 테이블에 부착시키는 공정이 필요하기 때문에, 준비 시간이 길어진다. 또한, 모기판의 부착 실수에 의해 가공불량이 발생할 우려가 있다.However, in the case of inversion processing, the preparation time is long because a step of removing the mother substrate from the processing table, a step of inverting the mother substrate, and a step of attaching the inverted mother substrate to the processing table are required. In addition, there is a fear that processing defects may occur due to a mistake in attachment of the mother substrate.

본 발명의 목적은, 제품기판의 제품으로서의 신뢰성을 저하시키지 않고, 가공능률을 향상시킬 수 있는, 외형가공방법을 제공하는 데 있다.SUMMARY OF THE INVENTION An object of the present invention is to provide an external shape processing method which can improve processing efficiency without lowering the reliability of a product substrate as a product.

상기 과제를 해결하기 위해, 본 발명은(예컨대 도 1 참조), 회전공구(5)에 의한 절삭가공에 의해 워크(2)의 외주면(S)을 형성하는 외형가공방법으로서, 형성되는 상기 워크의 외주면(S)에 교차하는 공동(空洞)부(1)가 존재할 경우에는, 상기 회전공구(5)가 상기 워크에 대하여 이동하여 상기 워크의 외주면을 형성할 때의 상기 공동부(1)의 상기 회전공구의 이동방향(C) 상류측의 교차부(D)에, 상기 형성되는 워크의 외주면(S)에 간섭하도록 구멍형성수단(7)에 의해 릴리프구멍(8)을 가공하고,MEANS TO SOLVE THE PROBLEM In order to solve the said subject (for example, FIG. 1), this invention is an external shape processing method which forms the outer peripheral surface S of the workpiece | work 2 by the cutting process by the rotary tool 5, Comprising: In the case where the cavity 1 intersects the outer circumferential surface S, the rotary tool 5 moves relative to the workpiece to form the outer circumferential surface of the workpiece. The relief hole 8 is processed by the hole forming means 7 so as to interfere with the outer circumferential surface S of the formed workpiece at the intersection D on the upstream side of the movement direction C of the rotary tool,

그 후, 상기 회전공구(5)의 칼날의 회전방향(T)을 상기 형성되는 워크의 외주면(S)에 대하여 상기 회전공구의 이동방향(C)을 따르도록 한 상태에서, 상기 회전공구(5)를 상기 릴리프구멍(8)으로부터 상기 공동부(1)를 향해 진입하도록 이동시켜, 상기 워크의 외주면을 형성하는 것을 특징으로 한다.Thereafter, the rotary tool 5 in the state in which the rotary direction T of the blade of the rotary tool 5 is along the moving direction C of the rotary tool with respect to the outer peripheral surface S of the formed work. ) Is moved from the relief hole 8 to the cavity 1 so as to form an outer circumferential surface of the workpiece.

바람직하게는, 상기 구멍형성수단이 드릴(7)이며, 상기 릴리프구멍(8)을 가공할 때의 상기 드릴의 칼날의 회전방향(U)이 상기 회전공구(5)의 칼날의 회전방향(T)과 반대가 된다.Preferably, the hole forming means is a drill (7), the rotation direction (U) of the blade of the drill when processing the relief hole (8) is the rotation direction (T) of the blade of the rotary tool (5). Is the opposite of).

또, 괄호안의 부호 등은, 도면과의 대조를 위한 것으로, 이것에 의해 특허청구범위에 어떠한 영향을 미치는 것은 아니다.In addition, the code | symbol in parentheses etc. is for contrast with drawing, and does not have any influence on a claim by this.

본 발명에 따르면, 제품기판의 제품으로서의 신뢰성을 저하시키지 않고, 가공능률을 향상시킬 수 있다.According to the present invention, the processing efficiency can be improved without lowering the reliability of the product substrate as a product.

이하, 본 발명에 대해 구체적으로 설명한다.EMBODIMENT OF THE INVENTION Hereinafter, this invention is demonstrated concretely.

도 1은 본 발명의 가공순서를 나타낸 설명도로서, (a)는 드릴에 의한 구멍형성공정을 나타낸 도면이며, (b)는 외형가공공정을 나타낸 도면이다.1 is an explanatory view showing the processing procedure of the present invention, (a) is a view showing a hole forming process by a drill, (b) is a view showing an external machining process.

모기판(3)에는 관통홀(1)이 가공되어 있으며, 상기 관통홀(1)의 내주면에는 도금층(4)이 형성되어 있다. 드릴 및 라우터 비트(5)를 회전시키는 프린트기판 가공기의 스핀들은 정회전 및 역회전이 가능하다.A through hole 1 is formed in the mother substrate 3, and a plating layer 4 is formed on an inner circumferential surface of the through hole 1. The spindle of the printed board machine for rotating the drill and router bits 5 can be rotated forward and reverse.

일반적으로, 드릴은 우회전용이 많기 때문에, 여기에서는 우회전용 드릴(7)과, 좌회전용 라우터 비트(5)가 준비되어 있다. 또, 라우터 비트(5)의 경우에는, 우회전용 및 좌회전용 모두 용이하게 입수가능하다.Generally, since a drill has many bypass conversions, the bypass-only drill 7 and the left-only router bit 5 are prepared here. In the case of the router bit 5, both bypass and left turn are easily available.

공정 1. 드릴(7)에 의해 릴리프구멍(8)을 가공한다. Step 1. The relief hole 8 is processed by the drill 7.

드릴(7)이 우회전용이므로, 상기 도 1의 (a)에 나타낸 바와 같이, 릴리프구멍(8)이 완성면(S)과 관통홀(1)의 교차부(D)에 간섭하도록 드릴(7)의 축선(軸線)을 위치결정하고, 모기판(3)에 릴리프구멍(8)을 가공한다. 드릴(7)은 교차부(D) 근방에서 관통홀(1) 측으로부터 모기판(3)을 향해 파고들어가므로 버(6)는 발생하지 않는다. 또, 관통홀(1)의 직경이 가령 0.8mm일 경우에는, 드릴의 직경을 0.8mm, 릴리프구멍(8)이 완성면(S)에 간섭하는 거리(k)를 0.025mm 정도로 하면 된다. 즉, 완성면(S)을 X방향, 완성면(S)에 수직인 방향을 Y방향으로 하고, 교차부(D; 여기서는 도금(4)의 두께는 무시함)를 원점으로 하면, 예컨대, 드릴(7)의 축선(○)을 (0, 0.375)로 정한다. 또, 이 경우, 드릴(7)의 축선(○)의 X좌표는, -0.1 ~ 0.1(바람직하게는 -0.05 ~ 0.05)로 해도 실용상 지장이 없다.Since the drill 7 is for bypass only, as shown in FIG. 1A, the drill 7 causes the relief hole 8 to interfere with the intersection D between the finished surface S and the through hole 1. ), And the relief hole 8 is machined into the mother substrate 3. Since the drill 7 penetrates toward the mother substrate 3 from the through hole 1 side near the intersection portion D, the burr 6 does not occur. In addition, when the diameter of the through hole 1 is 0.8 mm, for example, the diameter of the drill may be 0.8 mm and the distance k at which the relief hole 8 interferes with the finished surface S may be about 0.025 mm. That is, if the finished surface S is the X direction and the direction perpendicular to the finished surface S is the Y direction, and the intersection D (the thickness of the plating 4 is ignored here) is the origin, for example, the drill The axis (○) of (7) is defined as (0, 0.375). In this case, even if the X coordinate of the axis (○) of the drill 7 is -0.1 to 0.1 (preferably -0.05 to 0.05), there is no practical problem.

공정 2. 라우터 비트(5)에 의해 완성면(S; 외형)을 가공한다. Step 2. The finished surface S (outer shape) is processed by the router bit 5.

라우터 비트(5)의 회전방향(T)을 형성되는 워크(2)의 완성면(S)에 대하여 상기 라우터 비트(5)의 이동방향(C)을 따르도록 설정하고, 릴리프구멍(8)이 가공된 교차부(D)에서 라우터 비트(5)가 관통홀(1)에 진입하도록 하여 가공한다. 즉, 상기 도 1의 (b)에 나타낸 바와 같이, 좌회전의 라우터 비트(5)를 오른쪽 방향으로 이동시켜 완성면(S)을 가공한다. 라우터 비트(5)가 관통홀(1)에 진입할 때, 이 부분의 도금층(4)은 이미 제거되어 있으므로, 교차부(D)에 버(6)가 발생하는 경우는 없다. 또한, 교차부(E) 근방에서는 라우터 비트(5)의 칼날이 관통홀(1) 측으로부터 모기판(3)으로 진입하기 때문에, 버(6)는 발생하지 않는다.The rotation direction T of the router bit 5 is set to follow the movement direction C of the router bit 5 with respect to the completed surface S of the work 2 formed, and the relief hole 8 is The router bit 5 enters the through hole 1 at the processed intersection portion D and is machined. That is, as shown in FIG.1 (b), the completion surface S is processed by moving the router bit 5 of left rotation to the right direction. When the router bit 5 enters the through hole 1, since the plating layer 4 of this part has already been removed, the burr 6 does not occur in the intersection portion D. In addition, since the blade of the router bit 5 enters into the mother substrate 3 from the through hole 1 side in the vicinity of the intersection part E, the burr 6 does not generate | occur | produce.

또, 본 실시예에서는 깊이방향으로 k = 0.025mm를 삭제하도록 하였으나, 이 치수에 대해서도, 실용상 문제가 없는 범위 내에서 크거나 혹은 작게 할 수 있다.In the present embodiment, k = 0.025 mm is deleted in the depth direction, but this dimension can be made larger or smaller within a range that is practically not a problem.

또한, 드릴(7)의 직경 혹은 라우터 비트(5)의 직경도 실용상 문제가 없는 범위내에서 변경할 수 있다.In addition, the diameter of the drill 7 or the diameter of the router bit 5 can also be changed within the range which is satisfactory practically.

또한, 좌회전용 드릴(7)을 사용하는 경우에는, 릴리프구멍(8)을 도 1의 (a)에 서의 교차부(E)측에 가공하고, 라우터 비트(5)를 우회전용으로 하는 동시에, 라우터 비트(5)의 이동방향을 오른쪽에서 왼쪽방향으로 하면 된다.In addition, when using the drill 7 for exclusive use of the left rotation, the relief hole 8 is processed to the intersection part E side in FIG.1 (a), and the router bit 5 is made the bypass exclusively, It is sufficient to move the router bit 5 from right to left.

또한, 라우터 비트(5) 대신에 워크(2)를 이동시켜도 된다. 또한, 릴리프구멍(8)의 가공은, 외형가공공정과 동일한 프린트기판 가공기를 이용할 수 있기 때문에, 드릴에 의한 것이 바람직하지만, 반드시 그에 한정되는 것은 아니며, 레이저 가공기 등 다른 구멍형성수단에 의해 가공해도 된다.Alternatively, the work 2 may be moved instead of the router bit 5. In addition, since the process of the relief hole 8 can use the same printed board processing machine as the external processing process, although it is preferable to use a drill, it is not necessarily limited to this, Even if it processes by other hole forming means, such as a laser processing machine, do.

이상 설명한 바와 같이, 본 발명에 따르면, 모기판(3)을 반전시킬 필요가 없기 때문에, 가공능률을 향상시킬 수 있다. 게다가 종래의 반전가공과 달리, 버(6)가 전혀 발생하지 않기 때문에, 제품기판(2)의 신뢰성을 더욱 향상시킬 수 있다.As described above, according to the present invention, since the mother substrate 3 does not need to be inverted, the processing efficiency can be improved. In addition, unlike the conventional reverse machining, since the burr 6 does not occur at all, the reliability of the product substrate 2 can be further improved.

본 발명자는 모기판(3)이 판두께가 0.5mm인 유리 에폭시 수지 기판일 경우, 종래에는 겹침 매수로서 2장이 한도였는데 반해, 본 발명의 경우에는 겹침 매수를 4 ~ 5매로 해도 버(6)가 발생하지 않아, 가공능률을 대폭 향상시킬 수 있음을 확인하였다.In the present invention, when the mother substrate 3 is a glass epoxy resin substrate having a plate thickness of 0.5 mm, conventionally, the limit of two sheets is the number of overlaps, whereas in the case of the present invention, the number of overlaps is 4-5 sheets. Did not occur, it was confirmed that the processing efficiency can be significantly improved.

도 1은 본 발명의 가공순서를 나타낸 설명도이다.1 is an explanatory diagram showing a processing procedure of the present invention.

도 2는 종래의 외형가공시에서의 제품기판의 평면도이다.2 is a plan view of a product substrate in the conventional external machining.

도 3은 종래의 반전가공의 가공순서를 나타낸 도면이다.3 is a view showing a processing procedure of the conventional reverse machining.

* 도면의 주요 부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

1: 관통홀(공동부) 5 : 라우터 비트(회전공구)1: through hole (cavity part) 5: router bit (rotary tool)

7 : 드릴(구멍형성수단) 8 : 릴리프구멍(relief hole)7: Drill (hole forming means) 8: Relief hole

D : 교차부 S : 완성면(외주면) D: Intersection S: Finished Surface (Outer Peripheral)

Claims (3)

회전공구에 의한 절삭가공에 의해 워크의 외주면을 형성하는 외형가공방법으로서,As an external processing method for forming the outer circumferential surface of a workpiece by cutting with a rotary tool, 형성되는 상기 워크의 외주면에 교차하는 공동부(空洞部)가 존재할 경우에는,When there is a cavity intersecting the outer circumferential surface of the formed workpiece, 상기 회전공구가 상기 워크에 대하여 이동하여 상기 워크의 외주면을 형성할 때의 상기 공동부의 상기 회전공구의 이동방향 상류측의 교차부에, 상기 형성되는 워크의 외주면에 간섭하도록 구멍형성수단에 의해 릴리프구멍을 가공하고,Relief by hole-forming means so as to interfere with the outer circumferential surface of the formed workpiece at the intersection of the cavity in the moving direction upstream of the cavity when the rotary tool moves with respect to the work to form the outer circumferential surface of the workpiece. Processing holes, 그 후, 상기 회전공구의 칼날의 회전방향을 상기 형성되는 워크의 외주면에 대하여 상기 회전공구의 이동방향을 따르도록 한 상태에서, 상기 회전공구를 상기 릴리프구멍으로부터 상기 공동부를 향해 진입하도록 이동시켜, 상기 워크의 외주면을 형성하는 것을 특징으로 하는 외형가공방법.Thereafter, the rotary tool is moved so as to enter the cavity from the relief hole in a state in which the rotary direction of the blade of the rotary tool is along the moving direction of the rotary tool with respect to the outer peripheral surface of the formed work. An outer shape processing method characterized by forming an outer circumferential surface of the workpiece. 제 1항에 있어서,The method of claim 1, 상기 구멍형성수단이 드릴이며, 상기 릴리프구멍을 가공할 때의 상기 드릴의 칼날의 회전방향이 상기 회전공구의 칼날의 회전방향과 반대인 외형가공방법.And said hole forming means is a drill, wherein the direction of rotation of the blade of said drill at the time of processing said relief hole is opposite to the direction of rotation of the blade of said rotary tool. 제 1항 또는 제 2항에 있어서,The method according to claim 1 or 2, 상기 공동부의 내주면에 도금이 실시되어 있는 외형가공방법.An appearance processing method in which plating is performed on an inner circumferential surface of the cavity.
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