JPH0537095A - End-plated printed wiring board and its manufacture - Google Patents

Abstract

PURPOSE:To eliminate irregularity of plating layers and peeling of plating layer ends by boring a drilled hole advancing arcuately into the side of an end-plated printed wiring board between the end of each slit and its joint cutting plane. CONSTITUTION:A workboard 10 plated in slits 16 has joints 20 cut by an NC router after drill holes 50 are bored. It follows that drilled holes advancing arcuately into the side of the printed wiring board 22A between plating layers 18A and cutting planes 24A. A drill blade is used for this work to bore holes by advancing in the thickness direction of the workboard 10 with the result that the blade tip cuts the end of a plating layer 18A in the thickness direction. This process enables cutting without peeling the end of a plating layer 18A, and the position of the drill blade is invariable to the workboard 10, so that ends of plating layers 18A can be made regular.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board having an end face plated with copper or the like on the end face, and a method for manufacturing the same.

[0002]

2. Description of the Related Art In a printed wiring board having an electric circuit for processing a high frequency electric signal such as a microwave frequency band, an electric adverse effect which occurs at an end face of the board with an external device such as a casing. In order to prevent this, plating has been conventionally performed on the end surface. That is, this plating (called end face plating) mainly obtains a (magnetic) shield effect in a high frequency region.

FIG. 5 is a view showing a work board in the process of manufacturing this printed wiring board with end face plating, FIG. 6 is a plan view of the printed wiring board, and FIG. 7 is a sectional view taken along line VII-VII thereof.
The work board 10 shown in FIG. 5 has a printed circuit board section 12 and a frame section 14 around the printed circuit board section 12, and is conveyed to various processing steps for forming a circuit pattern of a printed wiring by grasping the frame section 14. For example, processing such as coating of photoresist, exposure, cleaning, etching, plating, and through hole processing is performed.

When the processing of the printed circuit board section 12 is completed,
A plurality of slits 16 are formed along the peripheral edge of the printed wiring portion 12, and plating treatment is applied to the inner periphery of the slit 16 and the vicinity of the peripheral edge portion. These slit processing and plating processing may be performed simultaneously with the processing of through holes and the like. Depending on the plating process, copper plating, gold plating,
A plating layer 18 such as nickel plating is formed.

Next, in the work board 10, the connecting portion 20 between the slits 16 is cut to separate the printed board portion 12 from the frame portion 14 to obtain a printed wiring board 22 shown in FIG. The cut surface of the connecting portion 20 is shown by an imaginary line 24 in FIG. As a result, as shown in FIG. 6, the slit 1
The printed wiring board 22 with the end surface plating is obtained in which the plating layer 18 is formed only on the portions a and b where the 6 was present and the cut surface 24 appears on the other portions. Plating layer 1 here
As shown in FIG. 7, the reference numeral 8 may extend not only to the inner periphery of the slit 16 but also to the vicinity of its periphery so as to be connected to the ground patterns 26 and 28 on the upper and lower surfaces of the printed wiring board 22. .

Conventionally, the cutting of the connecting portion 20 has been performed manually by using a cutter or a file, or by using an NC router. FIG. 8 is a plan view of the vicinity of the cut portion in the case of manual work, and FIG. 9 shows the plating layer near the cut portion of the wiring board 2.
FIG. 10 is a view seen from the end face side of FIG. 2, and FIG.
In the case of manual work, as shown in FIG. 8, a thin disk-shaped rotary blade (for example, a diamond cutter) that rotates at a high speed is inserted from one slit 16 and cut while moving along a cutting surface 24. And then cut surface 2
4 is smoothed with a file.

However, with this manual method, the cut surface 2
4 at the boundary portion c between the plating layer 18 and the plating layer 18
Irregularly scraped off, and as shown in FIG.
There was a case where the end of the blade greatly entered or retreated to the cut surface 24 side. When connecting the plating layer 18 to the ground patterns 26 and 28, the
Since it extends so as to overlap with the ground pattern (see 26 and 28 in FIG. 7) on the lower surface, if the plating layer 18 becomes irregular at the boundary portion c in this way, connection with this ground pattern (26, 28) Becomes unstable, and the cut surface 2
There is a problem that the portions d and e (FIGS. 9 and 10) extending to the fourth side and the upper and lower surfaces of the wiring board 22 are easily separated from the wiring board 22.

Further, FIG. 11 is a plan view showing a cutting process when an NC router is used, and FIG. 12 is a plan view near the cutting portion. The NC router cuts the end face by moving the rotary peripheral surface of a round bar-shaped rotary blade along a cutting line, and this rotary blade cuts the end of one slit 16 as shown by a virtual line in FIG. It is moved in the direction of the arrow toward the other slit 16 in the state of being inserted. This result f
By cutting the part of the
It cuts along with 4.

However, when this NC router is used, when the circumferential surface of the rotary blade comes into contact with the plated portion 18, the end g of the plated portion 18 is easily peeled off as shown in FIG. .

As described above, in the conventional case, the edges of the plating layer 18 are uneven, and the edges of the plating layer are easily peeled off. When incorporated, the problem of unstable electrical characteristics was likely to occur. Further, there is a concern that the peeled portion at the end of the plating layer 18 may fall off when a large impact is applied.

[0011]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and provides an end face plated printed wiring board in which the edges of the plating layer do not become uneven and the edges of the plating layer do not peel off. The purpose is to do. Another object is to provide a manufacturing method thereof.

[0012]

According to the present invention, an object of the present invention is to form a plurality of slits along the outer circumference of a printed board portion on a work board larger than the outer shape of the printed board portion, and to form a plating layer in the slits. In the printed wiring board with end face plating, which cuts the connecting portion between the slits along the outer periphery of the printed circuit board portion, the printed wiring board is arcuately inserted between the end portion of each slit and the cut surface of the connecting portion. This is achieved by a printed wiring board with end face plating, which is characterized in that a drilled hole is formed. Still another object is to form a plurality of slits along the outer circumference of the printed board portion on a work board larger than the outer shape of the printed board portion, form a plating layer on the slits, and then connect the slits to each other. In a method for manufacturing an end-plated printed wiring board that is cut along the outer periphery of a printed circuit board part, the end of the slit is subjected to a drilling process having a diameter larger than the slit width to enter the printed circuit board part side in an arc shape. This is achieved by a method for manufacturing a printed wiring board with an end face plating, which comprises forming a drilled hole and then cutting the connecting portion so as to connect the drilled hole.

[0013]

1 is a plan view of an embodiment of the present invention, FIG. 2 is a plan view showing a drilling step, FIG. 3 is a plan view showing an NC router processing step, and FIG. 4 is an enlarged plan view of an essential part. Is. Since the manufacturing process up to the work board 10 shown in FIG. 5 is the same as the conventional process, the description thereof will not be repeated. Slit 1
The work board 10 after the plating process is performed on 6 is subjected to drilling of the drill hole 50 as shown in FIG.
The drill diameter D used for processing the drill hole 50 is larger than the diameter of the slit 16, that is, the width L, and is positioned so that the drill hole 50 overlaps both inner walls in the width direction near the end of the slit 16. As a result, the peripheral surface of the drill hole 50 enters the printed board portion 12 (see FIG. 5) side in an arc shape.

After drilling holes 50 are formed near both ends of all the slits 16, as shown in FIG.
The connecting portion 20 between the two drilled holes 50 is cut by the NC router. In FIG. 3, the hatched portion is this N
The excision part 52 by a C router is shown. The cutout 52 has the same width L as the slit 16 in this embodiment, and is located on an extension of the centerline M of the slit 16. As a result, as shown in FIG. 1, a drilled hole 50 is formed between the plating layer 18A and the cut surface 24A so as to enter the printed wiring board 22A side in an arc shape.

The drilling with the drilling hole 50 uses a drilling blade having a tip at the tip, and this drilling blade is advanced in the thickness direction with respect to the work board 10 to make a hole. Due to the forward movement, the tip of the blade is plated layer 18
The end of A will be cut in the thickness direction. Therefore, it is possible to cut without peeling the end of the plated layer 18A. Further, since the position of the drill blade does not change with respect to the work board 10, the end surface of the plating layer 18A does not become uneven.

[0016]

As described above, according to the first aspect of the present invention, the inner peripheral surface of the slit (16) and the cut surface (24A) of the connecting portion (20) enter the printed wiring board (22A) side in an arc shape. Since the drilled holes (50) are formed, the edges of the plating layer 18A are neither uneven nor peeled off. As a result, the electrical characteristics of the high frequency circuit are stabilized, and the plating layer does not fall off even when a strong shock is applied, so that the durability and reliability of the circuit device are improved. According to the invention of claim 2, the method for manufacturing the printed wiring board can be obtained.

[0017]

[Brief description of drawings]

FIG. 1 is a plan view of an embodiment of the present invention.

FIG. 2 is a plan view showing drilling.

FIG. 3 is a plan view showing machining of an NC router.

FIG. 4 is an enlarged view of a part thereof.

FIG. 5 is a plan view showing a work board.

FIG. 6 is a plan view of a conventional printed wiring board.

FIG. 7: VII-VII line sectional view

FIG. 8 is an explanatory diagram of a manual cutting process.

FIG. 9 is a view showing the cut surface.

FIG. 10 is a plan view of the same.

FIG. 11 is an explanatory diagram of processing by an NC router.

FIG. 12 is a plan view showing the processing result.

[Explanation of symbols]

10 work boards 12 Printed circuit board 16 slits 18A plating layer 20 ties 22A printed wiring board 24A cut surface 50 drilled holes

Claims (2)

[Claims] 1. A work board, which is larger than the outer shape of a printed circuit board section, is formed with a plurality of slits along the outer circumference of the printed circuit board section, a plating layer is formed on the slits, and then a connecting portion between the slits is printed on the work board. In the printed wiring board with end face plating cut along the outer periphery of the substrate portion, a drilled hole is formed between the end portion of each slit and the cut surface of the connecting portion in an arc shape toward the printed board portion side. A printed wiring board with an end surface plating, which is characterized in that 2. A work board, which is larger than the outer shape of the printed circuit board section, is formed with a plurality of slits along the outer periphery of the printed circuit board section, a plating layer is formed in the slits, and then a connecting portion between the slits is printed on the work board. In a method for manufacturing a printed wiring board with an end face plating that cuts along the outer periphery of a board portion, a drill that makes a drill hole having a diameter larger than this slit width at the end of the slit and enters the printed board portion in an arc shape. A method for manufacturing a printed wiring board with an end surface plating, which comprises forming a processed hole and then cutting the connecting portion so as to connect the drilled hole.