CN108770209A - The forming method of printed wiring board profiled holes - Google Patents

The forming method of printed wiring board profiled holes Download PDF

Info

Publication number
CN108770209A
CN108770209A CN201810598080.3A CN201810598080A CN108770209A CN 108770209 A CN108770209 A CN 108770209A CN 201810598080 A CN201810598080 A CN 201810598080A CN 108770209 A CN108770209 A CN 108770209A
Authority
CN
China
Prior art keywords
holes
hole
prebored
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810598080.3A
Other languages
Chinese (zh)
Inventor
董猛
卢重阳
卢根平
汤文波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangxi Cxs Electronics Co Ltd
Original Assignee
Jiangxi Cxs Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangxi Cxs Electronics Co Ltd filed Critical Jiangxi Cxs Electronics Co Ltd
Priority to CN201810598080.3A priority Critical patent/CN108770209A/en
Publication of CN108770209A publication Critical patent/CN108770209A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047Drilling of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Drilling And Boring (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

The invention discloses a kind of forming methods of printed wiring board profiled holes.Include the following steps:In the holes A, reserved place drills out at least two first prebored holes;In the holes B, reserved place drills out at least two second prebored holes;Remainder is drilled out in its reserved place respectively by the hole A, B design shape size, so that the holes A is intersected with the holes B and forms profiled holes.The forming method of printed wiring board profiled holes provided by the invention can prevent bore deformation, and can improve the hole position accuracy of profiled holes.

Description

The forming method of printed wiring board profiled holes
Technical field
The present invention relates to printed circuit board manufacture technology field, more particularly to a kind of molding side of printed wiring board profiled holes Method.
Background technology
PCB (Printed Circuit Board, printed circuit board), is important electronic unit, is electronic component Supporter is the carrier of electronic component electrical connection.
According to the Functional Design of pcb board, various holes need to be made on pcb board to meet different functional requirements, as buried via hole, Blind hole, through-hole and other profiled holes.In the related technology, profiled holes include mainly even hole, even hole slot, even slot, wherein connecting hole and referring to Circular hole is crossed to form with circular hole, and even hole slot refers to that circular hole is crossed to form with slot, and even slot refers to that slot is crossed to form with slot.This Slot described in text is elongated.
In the prior art, the manufacture craft of profiled holes is as follows:
Lian Kong:It drills successively by circular hole distributing order, which drill point caused by stress deficiency easily occurs and deviate, to go out The phenomenon that existing breaking, and hole is yielding;
Even hole slot:Disposably from one end of slot to other end drilling via formations, then drill out circular hole;The technique will appear slot The partially short phenomenon of flute length;
Even slot:The one of slot of subdrilling, then bore another slot;The boring direction of wherein second slot is that terminal is The intersection of two slots.It is partially short that the technique not only results in slot flute length, and two slot link positions are also easy to produce deformation.
In consideration of it, it is necessary to provide a kind of new pcb board profiled holes moulding process to solve above-mentioned technical problem.
Invention content
The purpose of the present invention is overcoming above-mentioned technical problem, a kind of forming method of printed wiring board profiled holes, energy are provided Bore deformation is prevented, and the hole position accuracy of profiled holes can be improved.
To solve the above-mentioned problems, technical scheme is as follows:
A kind of forming method of printed wiring board profiled holes, includes the following steps:
Step S1, in the holes A, reserved place drills out at least two first prebored holes;
Step S2, in the holes B, reserved place drills out at least two second prebored holes;
Step S3 drills out remainder in its reserved place respectively by the hole A, B design shape size, the holes A is made to intersect with the holes B And form profiled holes.
Further, the holes A, the holes B are respectively circular hole, and the forming method of printed wiring board profiled holes includes the following steps:
Step S1a, in the holes A, reserved place drills out three the first prebored holes, wherein three first prebored holes are triangular in shape Distribution, and first prebored hole is circle;
Step S2a, in the holes B, reserved place drills out three the second prebored holes, wherein three second prebored holes are triangular in shape Distribution, and second prebored hole is circle;
Step S3a drills out remainder in its reserved place respectively by the hole A, B design shape size, the holes A is made to intersect with the holes B Form profiled holes.
Further, first prebored hole and second prebored hole are non-intersecting.
Further, the aperture in the holes A is 4.5-6mm, and the aperture in the holes B is 4.5-6mm.
Further, further include the steps that drilling out burr hole in the holes A, the holes B intersection location.
Further, the holes A are slot, and the holes B are respectively circular hole, and the forming method of printed wiring board profiled holes includes following step Suddenly:
Step S1b, in the holes A, the both ends of reserved place drill out the first prebored hole for defining slot flute length respectively, wherein described the One prebored hole is circular hole;
Step S2b, in the holes B, reserved place drills out three the second prebored holes, wherein three second prebored holes are triangular in shape Distribution, and second prebored hole is circle;
Step S3b drills out remainder in its reserved place respectively by the holes A, the holes B design shape size, makes the holes A and the holes B phase Friendship forms profiled holes.
Further, the aperture in the holes B is 4.5-6mm.
Further, further include the steps that drilling out burr hole in the holes A, the holes B intersection location.
Further, the holes A, the holes B are respectively slot, and the forming method of printed wiring board profiled holes includes the following steps:
Step S1c, in the holes A, the both ends of reserved place drill out the first prebored hole for defining slot flute length respectively, and described first is pre- Drilling is circular hole;
Step S2c, in the holes B, the both ends of reserved place drill out the second prebored hole for defining slot flute length respectively, and described second is pre- Drilling is circle, and one of them described second prebored hole is overlapped with the first prebored hole described in one of them;
Step S3c drills out remainder in its reserved place respectively by the holes A, the holes B design shape size, makes the holes A and the holes B phase Friendship forms profiled holes.
Further, further include the steps that drilling out burr hole in the holes A, the holes B intersection location.
Compared to the prior art, the forming method of printed wiring board profiled holes provided by the invention, advantageous effect are:
One, the forming method of printed wiring board profiled holes provided by the invention, by the way that reserved place drills out at least in the holes A first Two the first prebored holes, in the holes B, reserved place drills out at least two second prebored holes, then the design shape according still further to the hole A, B and Size drills out remainder in its reserved place respectively, so that the holes A is intersected with the holes B and forms profiled holes.First prebored hole is pre- with second The part drilled out first in the holes A, the holes B is realized in drilling, is excluded part break flour with after slim hole, then drill out remainder When can reduce break flour amount, to can be improved hole wall smoothness and hole position accuracy;Pass through the first prebored hole of subdrilling and the second preboring Hole, then boring the hole A, B remainder makes it intersect profiled holes, can reduce the holes A, B bore deformations probability, improve product quality.
Two, the forming method of printed wiring board profiled holes provided by the invention passes through when the holes A or/and the holes B are slot First prebored hole or/and the second prebored hole define its flute length first, then drill out remainder again, can be to avoid in the prior art The partially short problem of slot flute length improves the hole position accuracy of slot.
Three, the forming method of printed wiring board profiled holes provided by the invention, by drilling out and draping over one's shoulders in the holes A, the holes B intersection location Cutting edge of a knife or a sword hole solves the problems, such as that holes intersection burr is serious.
Description of the drawings
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for For those of ordinary skill in the art, without creative efforts, other are can also be obtained according to these attached drawings Attached drawing.
Fig. 1 is the flow diagram of the forming method embodiment 1 of printed wiring board profiled holes provided by the invention;
Fig. 2 is all signals being superimposed that drill during processing special holes using the moulding process of embodiment 1 Figure;
Fig. 3 is the flow diagram of the forming method embodiment 2 of printed wiring board profiled holes provided by the invention;
Fig. 4 is all signals being superimposed that drill during processing special holes using the moulding process of embodiment 2 Figure;
Fig. 5 is the flow diagram of the forming method embodiment 3 of printed wiring board profiled holes provided by the invention;
Fig. 6 is all signals being superimposed that drill during processing special holes using the moulding process of embodiment 3 Figure.
Specific implementation mode
In order to make those skilled in the art more fully understand the technical solution in the embodiment of the present invention, and make the present invention's Above objects, features, and advantages can be more obvious and easy to understand, is further described below to the specific implementation mode of the present invention.
It should be noted that being used to help understand the present invention for the explanation of these embodiments, but do not constitute Limitation of the invention.In addition, as long as technical characteristic involved in the various embodiments of the present invention described below is each other Between do not constitute conflict and can be combined with each other.
A kind of forming method of printed wiring board profiled holes, includes the following steps:
Step S1, in the holes A, reserved place drills out at least two first prebored holes;
Step S2, in the holes B, reserved place drills out at least two second prebored holes;
Step S3 drills out remainder in its reserved place respectively by the hole A, B design shape size, the holes A is made to intersect with the holes B And form profiled holes.
According to the design shape in the holes A, the holes B, above-mentioned forming method is further explained below by way of specific embodiment It states.
Embodiment 1
In the present embodiment, the holes A, the holes B are respectively circular hole.Fig. 1 and Fig. 2 are please referred to, wherein Fig. 1 is provided by the invention The flow diagram of the forming method embodiment 1 of printed wiring board profiled holes;Fig. 2 is the moulding process using embodiment 1 in abnormal shape All schematic diagrames being superimposed that drill during hole machined.
A kind of forming method of printed wiring board profiled holes, includes the following steps:
Step S1a, in the holes A, reserved place drills out three the first prebored holes 11/12/13, wherein three the first prebored holes 11/ 12/13 distribution triangular in shape, and the first prebored hole 11/12/13 is respectively circle;
Specifically, three the first prebored holes 11/12/13 are located in the reserved place of the holes A, and three the first prebored holes 11/12/ It is less than the area in the holes A after 13 area;
Step S2a, in the holes B, reserved place drills out three the second prebored holes 14/15/16, wherein three the second prebored holes 14/ 15/16 distribution triangular in shape, and the second prebored hole 14/15/16 is respectively circle;
Specifically, the holes B are Chong Die with A bore portions, three the second prebored holes 14/15/16 are located in the reserved place of the holes B, and three It is less than the area in the holes B after the area of second prebored hole 14/15/16;Second prebored hole 14/15/16 and the first prebored hole 11/ 12/13 is non-intersecting;
Step S3a drills out remainder in its reserved place respectively by the hole A, B design shape size, the holes A is made to intersect with the holes B Form profiled holes;
Specifically, the holes A remainder 17, the holes B remainder 18 are drilled out successively, to be formed by two circular hole intersection connections The profiled holes of formation.
In the present embodiment, the preferred holes A, the holes B aperture be more than 4.5mm, it is highly preferred that the aperture in the holes A, the holes B is respectively 4.5-6mm。
In order to reduce the burr of A and the holes B intersection location, it is preferred that the forming method of printed wiring board profiled holes further includes Step S4a, in the step of holes A, the holes B intersection location drill out burr hole.As shown in Fig. 2, hole 10,19 indicates that position is intersected in the holes A, the holes B The burr hole set.
According to the forming method of the printed wiring board profiled holes of embodiment 1, makes two circular holes and intersects molding profiled holes, It can prevent the technical problems such as breaking, bore deformation;Using first drilling out prebored hole, then the mode of remainder is drilled out, can be improved and boring Hole position accuracy when remainder is to form the holes A, the holes B, thus prevents bore deformation, improves product quality.
Embodiment 2
In the present embodiment, the holes A are slot, and the holes B are circular hole.Fig. 3, Fig. 4 are please referred to, wherein Fig. 3 provides for the present invention Printed wiring board profiled holes forming method embodiment 2 flow diagram;Fig. 4 is the moulding process using embodiment 2 different All schematic diagrames being superimposed that drill in type hole process.
A kind of forming method of printed wiring board profiled holes, includes the following steps:
Step S1b, in the holes A, the both ends of reserved place drill out the first prebored hole 21/22 for defining slot flute length respectively, wherein the One prebored hole 21/22 is circular hole;
Specifically, the first prebored hole 21/22 is located in the reserved place of the holes A, it is preferred that 21/22 part of the first prebored hole and A Hole is tangent;
Step S2b, in the holes B, reserved place drills out three the second prebored holes 23/24/25, wherein three the second prebored holes 23/ 24/25 distribution triangular in shape, and the second prebored hole 23/24/25 is circle;
Specifically, the holes B are Chong Die with A bore portions, three the second prebored holes 23/24/25 are located in the reserved place of the holes B, and three It is less than the area in the holes B after the area of second prebored hole 23/24/25;Second prebored hole 23/24/25 and the first prebored hole 21/ 22 is non-intersecting;
Step S3b drills out remainder in its reserved place respectively by the holes A, the holes B design shape size, makes the holes A and the holes B phase Friendship forms profiled holes;
Specifically, the holes A remainder 26, the holes B remainder 27 are drilled out successively, to be formed by slot and circular hole phase commissure The logical profiled holes formed.
In the present embodiment, the aperture in the preferred holes B is more than 4.5mm, it is highly preferred that the aperture in the holes A, the holes B is respectively 4.5- 6mm。
In order to reduce the burr of A and the holes B intersection location, it is preferred that the forming method of printed wiring board profiled holes further includes Step S4b, in the step of holes A, the holes B intersection location drill out burr hole.As shown in figure 4, hole 28,29 indicates that position is intersected in the holes A, the holes B The burr hole set.
In the present embodiment, the first prebored hole 21/22 is drilled out by the both ends first choice in the holes A, to determine the holes A flute length, is made The holes A and the designed size actually drilled out matches;It drills out the second prebored hole 23/24/25 first in the reserved place of the holes B, then bores surplus The hole position accuracy in the holes B can be improved in remaining part point.To which by the special-shaped hole forming method of embodiment 2, slot and circle can be improved The hole position accuracy for the profiled holes that hole intersection connection is formed.
Embodiment 3
In the present embodiment, the holes A, the holes B are respectively slot.Fig. 5, Fig. 6 are please referred to, wherein Fig. 5 is provided by the invention The flow diagram of the forming method embodiment 3 of printed wiring board profiled holes;Fig. 6 is the moulding process using embodiment 3 in abnormal shape All schematic diagrames being superimposed that drill during hole machined.
A kind of forming method of printed wiring board profiled holes, includes the following steps:
Step S1c, in the holes A, the both ends of reserved place drill out the first prebored hole 31/32 for defining slot flute length respectively, and first is pre- Drilling 31/32 is circular hole;
Specifically, the first prebored hole 31/32 is located in the reserved place of the holes A, it is preferred that 31/32 part of the first prebored hole and A Hole is tangent;
Step S2c, in the holes B, the both ends of reserved place drill out the second prebored hole 33/34 for defining slot flute length respectively, and second is pre- Drilling 33/34 is circle, and one of them second prebored hole 34 is overlapped with one of them first prebored hole 32;
Specifically, the first prebored hole 33/34 is located in the reserved place of the holes B, it is preferred that 33/34 part of the second prebored hole and B Hole is tangent;
Step S3c drills out remainder in its reserved place respectively by the holes A, the holes B design shape size, makes the holes A and the holes B phase Friendship forms profiled holes;
Specifically, the holes A remainder 35, the holes B remainder 36 are drilled out successively, to be formed by slot and slot phase commissure The logical profiled holes formed.
In order to reduce the burr of A and the holes B intersection location, it is preferred that the forming method of printed wiring board profiled holes further includes Step S4c, in the step of holes A, the holes B intersection location drill out burr hole.As shown in fig. 6, hole 35 indicates the holes A, the holes B intersection location Burr hole.
In the present embodiment, by drilling out the first prebored hole 31/32 first at the both ends in the holes A, to determine the holes A flute length, make The holes A and the designed size actually drilled out matches;By drilling out the second prebored hole 33/34 first at the both ends in the holes B, to determination The holes B flute length makes the holes B actually drilled out match with designed size, intersects the different of connection formation to which slot can be improved with slot The hole position accuracy of type hole.
Compared to the prior art, the forming method of printed wiring board profiled holes provided by the invention, advantageous effect are:
One, the forming method of printed wiring board profiled holes provided by the invention, by the way that reserved place drills out at least in the holes A first Two the first prebored holes, in the holes B, reserved place drills out at least two second prebored holes, then the design shape according still further to the hole A, B and Size drills out remainder in its reserved place respectively, so that the holes A is intersected with the holes B and forms profiled holes.First prebored hole is pre- with second The part drilled out first in the holes A, the holes B is realized in drilling, is excluded part break flour with after slim hole, then drill out remainder When can reduce break flour amount, to can be improved hole wall smoothness and hole position accuracy;Pass through the first prebored hole of subdrilling and the second preboring Hole, then boring the hole A, B remainder makes it intersect profiled holes, can reduce the holes A, B bore deformations probability, improve product quality.
Two, the forming method of printed wiring board profiled holes provided by the invention passes through when the holes A or/and the holes B are slot First prebored hole or/and the second prebored hole define its flute length first, then drill out remainder again, can be to avoid in the prior art The partially short problem of slot flute length improves the hole position accuracy of slot.
Three, the forming method of printed wiring board profiled holes provided by the invention, by drilling out and draping over one's shoulders in the holes A, the holes B intersection location Cutting edge of a knife or a sword hole solves the problems, such as that holes intersection burr is serious.
Embodiments of the present invention are explained in detail above, but the present invention is not limited to described embodiment. To those skilled in the art, these embodiments are carried out without departing from the principles and spirit of the present invention more Kind change, modification, replacement and modification are still fallen within protection scope of the present invention.

Claims (10)

1. a kind of forming method of printed wiring board profiled holes, which is characterized in that include the following steps:
Step S1, in the holes A, reserved place drills out at least two first prebored holes;
Step S2, in the holes B, reserved place drills out at least two second prebored holes;
Step S3 drills out remainder in its reserved place respectively by the hole A, B design shape size, the holes A is made to intersect and be formed with the holes B Profiled holes.
2. the forming method of printed wiring board profiled holes according to claim 1, which is characterized in that the holes A, the holes B are respectively The forming method of circular hole, printed wiring board profiled holes includes the following steps:
Step S1a, in the holes A, reserved place drills out three the first prebored holes, wherein three the first prebored hole distributions triangular in shape, And first prebored hole is circle;
Step S2a, in the holes B, reserved place drills out three the second prebored holes, wherein three the second prebored hole distributions triangular in shape, And second prebored hole is circle;
Step S3a drills out remainder in its reserved place respectively by the hole A, B design shape size, the holes A is made to be crossed to form with the holes B Profiled holes.
3. the forming method of printed wiring board profiled holes according to claim 2, which is characterized in that first prebored hole It is non-intersecting with second prebored hole.
4. the forming method of printed wiring board profiled holes according to claim 2, which is characterized in that the aperture in the holes A is The aperture in the hole 4.5-6mm, B is 4.5-6mm.
5. the forming method of printed wiring board profiled holes according to claim 2, which is characterized in that further include in the holes A, B Hole intersection location drills out the step of burr hole.
6. the forming method of printed wiring board profiled holes according to claim 1, which is characterized in that the holes A are slot, the holes B The forming method of respectively circular hole, printed wiring board profiled holes includes the following steps:
Step S1b, in the holes A, the both ends of reserved place drill out the first prebored hole for defining slot flute length respectively, wherein described first is pre- Drilling is circular hole;
Step S2b, in the holes B, reserved place drills out three the second prebored holes, wherein three the second prebored hole distributions triangular in shape, And second prebored hole is circle;
Step S3b drills out remainder in its reserved place respectively by the holes A, the holes B design shape size, the holes A is made to intersect shape with the holes B At profiled holes.
7. the forming method of printed wiring board profiled holes according to claim 6, which is characterized in that the aperture in the holes B is 4.5-6mm。
8. the forming method of printed wiring board profiled holes according to claim 6, which is characterized in that further include in the holes A, B Hole intersection location drills out the step of burr hole.
9. the forming method of printed wiring board profiled holes according to claim 1, which is characterized in that the holes A, the holes B are respectively The forming method of slot, printed wiring board profiled holes includes the following steps:
Step S1c, in the holes A, the both ends of reserved place drill out the first prebored hole for defining slot flute length, first prebored hole respectively For circular hole;
Step S2c, in the holes B, the both ends of reserved place drill out the second prebored hole for defining slot flute length, second prebored hole respectively For circle, and one of them described second prebored hole is overlapped with the first prebored hole described in one of them;
Step S3c drills out remainder in its reserved place respectively by the holes A, the holes B design shape size, the holes A is made to intersect shape with the holes B At profiled holes.
10. the forming method of printed wiring board profiled holes according to claim 9, which is characterized in that further include in the holes A, B Hole intersection location drills out the step of burr hole.
CN201810598080.3A 2018-07-10 2018-07-10 The forming method of printed wiring board profiled holes Pending CN108770209A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810598080.3A CN108770209A (en) 2018-07-10 2018-07-10 The forming method of printed wiring board profiled holes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810598080.3A CN108770209A (en) 2018-07-10 2018-07-10 The forming method of printed wiring board profiled holes

Publications (1)

Publication Number Publication Date
CN108770209A true CN108770209A (en) 2018-11-06

Family

ID=64022528

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810598080.3A Pending CN108770209A (en) 2018-07-10 2018-07-10 The forming method of printed wiring board profiled holes

Country Status (1)

Country Link
CN (1) CN108770209A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111010802A (en) * 2019-12-09 2020-04-14 广合科技(广州)有限公司 L-shaped groove hole machining method based on PCB
CN111669896A (en) * 2020-04-29 2020-09-15 东莞联桥电子有限公司 Processing method of PCB short slotted hole
CN112074091A (en) * 2020-09-10 2020-12-11 黄石星河电路有限公司 Method for processing 8-shaped hole PCB
CN112492755A (en) * 2020-11-02 2021-03-12 江西旭昇电子有限公司 Method for manufacturing micro solder mask definition bonding pad of lead-free tin-spraying plate
CN113473711A (en) * 2021-05-06 2021-10-01 江门崇达电路技术有限公司 Method for removing copper wires in hole of L-shaped groove of PCB
CN114745854A (en) * 2022-04-07 2022-07-12 科惠白井(佛冈)电路有限公司 Drilling method of PCB (printed circuit board)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6891272B1 (en) * 2002-07-31 2005-05-10 Silicon Pipe, Inc. Multi-path via interconnection structures and methods for manufacturing the same
CN201893988U (en) * 2010-10-22 2011-07-06 春焱电子科技(苏州)有限公司 Printed circuit board (PCB)
CN104476616A (en) * 2014-11-07 2015-04-01 梅州市志浩电子科技有限公司 Manufacturing method of slot of printed-circuit board
CN204425769U (en) * 2014-12-24 2015-06-24 特新微电子(东莞)有限公司 A kind of circuit board prebored hole structure
CN205029957U (en) * 2015-09-24 2016-02-10 广州兴森快捷电路科技有限公司 Drilling structure of lamination board
CN105430917A (en) * 2015-11-30 2016-03-23 江门崇达电路技术有限公司 Method for fabricating connected slot in PCB
CN106385766A (en) * 2016-11-02 2017-02-08 深圳市深联电路有限公司 PCB special-shaped hole making method for removing burrs
CN106455323A (en) * 2016-08-31 2017-02-22 奥士康精密电路(惠州)有限公司 Printed circuit board splayed hole burring prevention molding method
CN107466164A (en) * 2017-08-31 2017-12-12 惠州市永隆电路有限公司 A kind of pcb board prebored hole method for overcoming harmomegathus problem

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6891272B1 (en) * 2002-07-31 2005-05-10 Silicon Pipe, Inc. Multi-path via interconnection structures and methods for manufacturing the same
CN201893988U (en) * 2010-10-22 2011-07-06 春焱电子科技(苏州)有限公司 Printed circuit board (PCB)
CN104476616A (en) * 2014-11-07 2015-04-01 梅州市志浩电子科技有限公司 Manufacturing method of slot of printed-circuit board
CN204425769U (en) * 2014-12-24 2015-06-24 特新微电子(东莞)有限公司 A kind of circuit board prebored hole structure
CN205029957U (en) * 2015-09-24 2016-02-10 广州兴森快捷电路科技有限公司 Drilling structure of lamination board
CN105430917A (en) * 2015-11-30 2016-03-23 江门崇达电路技术有限公司 Method for fabricating connected slot in PCB
CN106455323A (en) * 2016-08-31 2017-02-22 奥士康精密电路(惠州)有限公司 Printed circuit board splayed hole burring prevention molding method
CN106385766A (en) * 2016-11-02 2017-02-08 深圳市深联电路有限公司 PCB special-shaped hole making method for removing burrs
CN107466164A (en) * 2017-08-31 2017-12-12 惠州市永隆电路有限公司 A kind of pcb board prebored hole method for overcoming harmomegathus problem

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111010802A (en) * 2019-12-09 2020-04-14 广合科技(广州)有限公司 L-shaped groove hole machining method based on PCB
CN111010802B (en) * 2019-12-09 2021-09-21 广州广合科技股份有限公司 L-shaped groove hole machining method based on PCB
CN111669896A (en) * 2020-04-29 2020-09-15 东莞联桥电子有限公司 Processing method of PCB short slotted hole
CN111669896B (en) * 2020-04-29 2023-10-27 东莞联桥电子有限公司 Processing method of PCB short slot
CN112074091A (en) * 2020-09-10 2020-12-11 黄石星河电路有限公司 Method for processing 8-shaped hole PCB
CN112492755A (en) * 2020-11-02 2021-03-12 江西旭昇电子有限公司 Method for manufacturing micro solder mask definition bonding pad of lead-free tin-spraying plate
CN112492755B (en) * 2020-11-02 2022-09-27 江西旭昇电子有限公司 Method for manufacturing micro solder mask definition bonding pad of lead-free tin-spraying plate
CN113473711A (en) * 2021-05-06 2021-10-01 江门崇达电路技术有限公司 Method for removing copper wires in hole of L-shaped groove of PCB
CN114745854A (en) * 2022-04-07 2022-07-12 科惠白井(佛冈)电路有限公司 Drilling method of PCB (printed circuit board)

Similar Documents

Publication Publication Date Title
CN108770209A (en) The forming method of printed wiring board profiled holes
CN105430917A (en) Method for fabricating connected slot in PCB
CN105792545B (en) Pcb board half bore moulding process
CN105704945B (en) A kind of method and device for realizing PCB via hole
CN109640528B (en) Method for improving PCB back drilling precision
CN102612259A (en) Drilling short slot for printed circuit board
CN106550538A (en) Board structure of circuit and processing method that a kind of metal derby is turned on internal layer circuit
CN103687338A (en) Method for drilling circuit board with high-precision and depth-controlled hole
CN107072067A (en) A kind of manufacture method of the circuit board of groove at side surface
CN106304696B (en) Has the printed wiring board and preparation method thereof that multilayer intersects blind slot
CN102510667A (en) CNC (Computer Numerical Control) board splitting production method without NPTH (Non Plating Through Hole) hole positioning
CN107820365A (en) A kind of PCB processing method and PCB
CN106231821A (en) A kind of four layers of pcb board processing technology
CN205213147U (en) PTH right angle square groove improves structure
CN105704947A (en) Forming process of burr-free printed circuit board (PCB)
CN108200724A (en) A kind of flexible print panel forming method
WO2023179135A1 (en) Residual stub-free via-hole manufacturing method, pcb, electronic device, and storage medium
CN105451469B (en) A kind of preparation method of circuit edge connector
CN102215628B (en) Super-thick circuit board
CN101945532B (en) Contour machining hole for printed circuit board
CN202551489U (en) Printed circuit board bored short slot
CN114423161B (en) PCB processing method and PCB
CN110121236A (en) A kind of double-side plug-in wiring board and manufacturing method
CN108617094A (en) A method of prevent positive and negative drilling dislocation on wiring board from forming stepped hole
CN206674336U (en) A kind of circuit board of groove at side surface

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20181106

RJ01 Rejection of invention patent application after publication