CN112492755A - Method for manufacturing micro solder mask definition bonding pad of lead-free tin-spraying plate - Google Patents
Method for manufacturing micro solder mask definition bonding pad of lead-free tin-spraying plate Download PDFInfo
- Publication number
- CN112492755A CN112492755A CN202011202710.4A CN202011202710A CN112492755A CN 112492755 A CN112492755 A CN 112492755A CN 202011202710 A CN202011202710 A CN 202011202710A CN 112492755 A CN112492755 A CN 112492755A
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- Prior art keywords
- solder mask
- bonding pad
- copper
- lead
- equal
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 112
- 238000005507 spraying Methods 0.000 title claims abstract description 47
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 33
- 238000000034 method Methods 0.000 title claims abstract description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 57
- 229910052802 copper Inorganic materials 0.000 claims abstract description 56
- 239000010949 copper Substances 0.000 claims abstract description 56
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 35
- 238000005530 etching Methods 0.000 claims abstract description 33
- 238000013461 design Methods 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 238000011161 development Methods 0.000 claims abstract description 8
- 238000009713 electroplating Methods 0.000 claims abstract description 8
- 238000007747 plating Methods 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 6
- 230000017525 heat dissipation Effects 0.000 claims abstract description 5
- 230000005587 bubbling Effects 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 4
- 238000006748 scratching Methods 0.000 abstract description 4
- 230000002393 scratching effect Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
Abstract
The invention discloses a method for manufacturing a tiny solder mask defined bonding pad of a lead-free tin-spraying plate, which comprises the following steps: the circuit layer film design is that copper drawing treatment is carried out on the base material bottom copper of the circuit layer, so that the circuit layer is designed as a heat dissipation flower disc; designing a solder mask layer, namely performing electroplating treatment on the circuit layer subjected to copper drawing treatment to form a copper plating layer on the substrate bottom copper to be used as a solder mask defining bonding pad; etching the circuit, and adjusting the etching speed according to the copper thickness; performing solder mask development, compensating the windowing size of a solder mask film, developing the solder mask defined bonding pad, and covering solder mask ink in other areas; and (4) carrying out tin spraying, namely carrying out one-time tin spraying treatment on the solder mask definition bonding pad. The manufacturing method of the tiny solder mask definition bonding pad of the lead-free tin spraying plate enables the solder mask definition bonding pad with the length less than or equal to 12mil to normally realize good tin spraying effect by one-time tin spraying during lead-free tin spraying, can avoid the bad phenomena of scratching, bubbling/peeling of a solder mask layer and the like caused by two-time tin spraying, improves the production efficiency and ensures the product quality.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a method for manufacturing a tiny solder mask defined bonding pad of a lead-free tin-spraying plate of a printed circuit board.
Background
The rapid development of the microelectronic industry and the continuous miniaturization of chip packaging not only promote the development of printed circuit boards towards high density and multilayering, but also make the size of the bonding pad fine. Smaller pads, smaller pitch place more stringent requirements on processes such as solderability of printed circuit boards. For example, the BGA (Ball Grid Array) pad of 0.5Pitch (Pitch refers to the distance between the centers of two "cells" on a board) is usually 10-12mil, while the BGA pad of 0.4Pitch reaches 8mil (about 0.2 mm). At present, in a lead-free tin spraying process, for the condition that a micro solder mask definition bonding pad is not subjected to tin spraying, the problem of poor single-point tin spraying of the micro solder mask definition bonding pad is solved by adopting a tin spraying mode twice.
Therefore, a new manufacturing method is needed to solve the above technical problems.
Disclosure of Invention
The invention aims to solve the technical problem of providing a method for manufacturing a tiny solder mask defining bonding pad of a lead-free tin spraying plate, so that the solder mask defining bonding pad with the length less than or equal to 12mil can meet the good effect of tin spraying by one-time tin spraying normally during lead-free tin spraying, and the poor phenomena of scratching, bubbling/peeling of a solder mask layer and the like caused by two-time tin spraying can be avoided without two-time tin spraying, thereby improving the production efficiency and ensuring the product quality.
In order to solve the problems, the technical scheme of the invention is as follows:
a method for manufacturing a micro solder mask defined bonding pad of a lead-free tin-spraying plate comprises the following steps:
the circuit layer film design is that copper drawing treatment is carried out on the base material bottom copper of the circuit layer, so that the circuit layer is designed as a heat dissipation flower disc;
designing a solder mask layer, namely performing electroplating treatment on the circuit layer subjected to copper drawing treatment to form a copper plating layer on the substrate bottom copper to be used as a solder mask defining bonding pad;
etching the circuit, and adjusting the etching speed according to the copper thickness, wherein the relationship between the copper thickness and the etching speed is as follows:
when d is more than or equal to 20um and less than 30um, the etching speed is 5.0-6.0 m/min;
when d is more than or equal to 30um and less than 40um, the etching speed is 4.5-5.0 mm/min;
when d is more than or equal to 40um and less than 50um, the etching speed is 4.0-4.5 mm/min;
when d is more than or equal to 50um and less than 60um, the etching speed is 3.5-4.0 mm/min;
when d is more than or equal to 60um and less than 70um, the etching speed is 2.5-3.0 mm/min;
when d is more than or equal to 70um and less than 105um, the etching speed is 1.5-2.5 mm/min;
wherein d represents the copper thickness of the PCB after electroplating, and is equal to the sum of the base copper thickness of the substrate and the copper plating layer thickness of the solder mask defining bonding pad;
performing solder mask development, compensating the windowing size of a solder mask film, developing the solder mask defined bonding pad, and covering solder mask ink in other areas;
and (4) carrying out tin spraying, namely carrying out one-time tin spraying treatment on the solder mask definition bonding pad.
Further, the length of the solder mask defining bonding pad is less than or equal to 12 mils.
Further, copper drawing processing is carried out on the periphery of the solder mask defining bonding pad, and the distance between the copper drawing position and the solder mask defining bonding pad is 3 mil.
Furthermore, the copper drawing part corresponding to each side of the solder mask defining bonding pad is in an isosceles trapezoid shape.
Furthermore, the length of the lower bottom of the isosceles trapezoid is equivalent to that of the solder mask defining pad, the length of the upper bottom is 6 mils smaller than that of the lower bottom, and the height of the isosceles trapezoid is 3 mils; wherein the upper base is a base side proximate to the solder mask defining pad.
Further, the compensation size of the solder mask windowing is 1.7 mil.
Compared with the prior art, the manufacturing method of the tiny solder mask defined bonding pad of the lead-free tin-spraying plate has the advantages that:
according to the manufacturing method of the tiny solder mask definition bonding pad of the lead-free tin-spraying plate, provided by the invention, the design of the outer layer circuit film is changed, the etching speed is adjusted according to the copper thickness, the windowing size of the solder mask film is compensated, so that the solder mask definition bonding pad with the length of less than or equal to 12 mils can meet the good effect of tin coating by normally spraying tin once during lead-free tin spraying, the tin spraying is not required for two times, the bad phenomena of scratching, bubbling/peeling of a solder mask layer and the like caused by the tin spraying for two times can be avoided, the production efficiency is improved, and the product quality is ensured.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic flow chart of a method for manufacturing a fine solder mask defined bonding pad of a lead-free solder mask according to the present invention;
FIG. 2 is a schematic diagram of a circuit board structure after a circuit layer film design step in the manufacturing method of the lead-free tin-spraying plate micro solder mask defined bonding pad provided by the invention;
FIG. 3 is a schematic diagram of a circuit board structure after a solder mask design step in the method for manufacturing a micro solder mask defined bonding pad of a lead-free solder mask according to the present invention;
FIG. 4 is a schematic structural diagram of a circuit board after a circuit etching step in the method for manufacturing a micro solder mask defined bonding pad of a lead-free solder mask according to the present invention;
FIG. 5 is a schematic structural diagram of a circuit board after a solder mask developing step in the method for manufacturing a micro solder mask defined bonding pad of a lead-free solder mask according to the present invention;
fig. 6 is a schematic structural diagram of the circuit board after the step of tin spraying in the method for manufacturing the micro solder mask defined bonding pad of the lead-free tin-spraying plate provided by the invention.
Detailed Description
In order to make the technical solutions in the embodiments of the present invention better understood and make the above objects, features, and advantages of the present invention more comprehensible, specific embodiments of the present invention are described below with reference to the accompanying drawings.
It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Fig. 1 is a schematic flow chart of a method for manufacturing a fine solder mask defined bonding pad of a lead-free solder mask according to the present invention. The invention provides a method for manufacturing a tiny solder mask defined bonding pad of a lead-free tin-spraying plate, which comprises the following steps:
step S1, circuit layer film design, copper drawing treatment is carried out on the base material bottom copper of the circuit layer, and the circuit layer is designed as a heat dissipation flower disc;
fig. 2 is a schematic diagram of a circuit board structure after a circuit layer film design step in the method for manufacturing a fine solder mask defined bonding pad of a lead-free solder-sprayed board according to the present invention. Copper drawing treatment is carried out on the base copper 1 of the base material, and the copper drawing part exposes the base material layer 2 because the copper layer is drawn away; the copper drawing parts are trapezoidal, each copper drawing part is not connected to form a heat dissipation faceplate structure, and the copper non-drawing parts are used for electroplating to form a solder mask defining bonding pad.
Step S2, designing a solder mask layer, namely, carrying out electroplating treatment on the circuit layer after copper drawing treatment, and forming a copper plating layer on the substrate bottom copper to be used as a solder mask defining pad;
please refer to fig. 3, which is a schematic diagram of a circuit board structure after the solder mask design step in the method for manufacturing a micro solder mask defined bonding pad of the lead-free solder mask according to the present invention. The solder mask defining bonding pad 3 is square and attached to the surface of the substrate bottom copper 1, in the embodiment, the length of the solder mask defining bonding pad 3 is less than or equal to 12mil, and the bonding pad is small.
Specifically, a plurality of solder mask definition pads 3 are respectively attached to the corresponding positions of the bottom copper of the substrate, so that the distance between the solder mask definition pads of the copper drawing position is 3mil, and the copper drawing position is distributed around the solder mask definition pads 3.
In the embodiment, the copper drawing part corresponding to each side of the anti-welding defining bonding pad 3 is in an isosceles trapezoid shape, the length of the lower bottom of the isosceles trapezoid is equal to that of the anti-welding defining bonding pad 3, the length of the upper bottom is 6 mils smaller than that of the lower bottom, and the height of the isosceles trapezoid is 3 mils; wherein the upper bottom is the bottom side close to the solder mask defining bonding pad 3, namely the distance from the upper bottom to the solder mask defining bonding pad 3 is 3 mil; the height of the isosceles trapezoid is the width of the copper-drawing part.
Step S3, etching the circuit, adjusting the etching rate according to the copper thickness, wherein the relationship between the copper thickness and the etching rate is as follows:
when d is more than or equal to 20um and less than 30um, the etching speed is 5.0-6.0 m/min;
when d is more than or equal to 30um and less than 40um, the etching speed is 4.5-5.0 mm/min;
when d is more than or equal to 40um and less than 50um, the etching speed is 4.0-4.5 mm/min;
when d is more than or equal to 50um and less than 60um, the etching speed is 3.5-4.0 mm/min;
when d is more than or equal to 60um and less than 70um, the etching speed is 2.5-3.0 mm/min;
when d is more than or equal to 70um and less than 105um, the etching speed is 1.5-2.5 mm/min;
wherein d represents the copper thickness of the PCB after electroplating, and is equal to the sum of the base copper thickness of the substrate and the copper plating layer thickness of the solder mask defining bonding pad;
fig. 4 is a schematic diagram of a circuit board structure after a circuit etching step in the method for manufacturing a fine solder mask defined bonding pad of a lead-free solder mask according to the present invention. After the circuit is etched, the solder mask defines the bonding pad and the copper part at the bottom of the substrate to form a substrate area.
Step S4, solder mask development, compensation of solder mask film windowing size, development of solder mask definition pads, and coverage of solder mask ink in other areas;
fig. 5 is a schematic diagram of a circuit board structure after solder mask development in the method for manufacturing a fine solder mask defined bonding pad of a lead-free solder mask according to the present invention. In the invention, the compensation of the windowing size of the welding-proof film is adjusted according to a design value, and in the embodiment, the compensation size of the windowing of the welding-proof film is increased by 1.7 mil.
And step S5, spraying tin, and carrying out one-time tin spraying treatment on the solder mask definition bonding pad.
Please refer to fig. 6, which is a schematic diagram of a circuit board structure after the solder-spraying step in the method for manufacturing the micro solder mask defined bonding pad of the lead-free solder-spraying board of the present invention. As can be seen from FIG. 6, after one-time tin spraying treatment process, the solder mask defines that the solder on the bonding pad is full, and the quality requirement can be met.
According to the manufacturing method of the tiny solder mask definition bonding pad of the lead-free tin-spraying plate, provided by the invention, the design of the outer layer circuit film is changed, the etching speed is adjusted according to the copper thickness, the windowing size of the solder mask film is compensated, so that the solder mask definition bonding pad with the length of less than or equal to 12 mils can meet the good effect of tin coating by normally spraying tin once during lead-free tin spraying, the tin spraying is not required for two times, the bad phenomena of scratching, bubbling/peeling of a solder mask layer and the like caused by the tin spraying for two times can be avoided, the production efficiency is improved, and the product quality is ensured.
The embodiments of the present invention are described in detail above with reference to the drawings, but the present invention is not limited to the described embodiments. Various changes, modifications, substitutions and alterations to these embodiments will occur to those skilled in the art without departing from the spirit and scope of the present invention.
Claims (6)
1. A method for manufacturing a micro solder mask defined bonding pad of a lead-free tin-spraying plate is characterized by comprising the following steps:
the circuit layer film design is that copper drawing treatment is carried out on the base material bottom copper of the circuit layer, so that the circuit layer is designed as a heat dissipation flower disc;
designing a solder mask layer, namely performing electroplating treatment on the circuit layer subjected to copper drawing treatment to form a copper plating layer on the substrate bottom copper to be used as a solder mask defining bonding pad;
etching the circuit, and adjusting the etching speed according to the copper thickness, wherein the relationship between the copper thickness and the etching speed is as follows:
when d is more than or equal to 20um and less than 30um, the etching speed is 5.0-6.0 m/min;
when d is more than or equal to 30um and less than 40um, the etching speed is 4.5-5.0 mm/min;
when d is more than or equal to 40um and less than 50um, the etching speed is 4.0-4.5 mm/min;
when d is more than or equal to 50um and less than 60um, the etching speed is 3.5-4.0 mm/min;
when d is more than or equal to 60um and less than 70um, the etching speed is 2.5-3.0 mm/min;
when d is more than or equal to 70um and less than 105um, the etching speed is 1.5-2.5 mm/min;
wherein d represents the copper thickness of the PCB after electroplating, and is equal to the sum of the base copper thickness of the substrate and the copper plating layer thickness of the solder mask defining bonding pad;
performing solder mask development, compensating the windowing size of a solder mask film, developing the solder mask defined bonding pad, and covering solder mask ink in other areas;
and (4) carrying out tin spraying, namely carrying out one-time tin spraying treatment on the solder mask definition bonding pad.
2. The method for manufacturing the micro solder mask definition bonding pad of the lead-free solder mask as claimed in claim 1, wherein the length of the solder mask definition bonding pad is less than or equal to 12 mils.
3. The method for manufacturing the micro solder mask definition pad of the lead-free solder mask as claimed in claim 2, wherein the copper drawing process is performed around the solder mask definition pad, and the copper drawing position is 3mil away from the solder mask definition pad.
4. The method of claim 3, wherein the copper portion corresponding to each side of the solder mask defined pad is in the shape of an isosceles trapezoid.
5. The method for manufacturing the micro solder mask defining bonding pad of the lead-free solder mask as claimed in claim 4, wherein the length of the lower base of the isosceles trapezoid is equal to the length of the solder mask defining bonding pad, the length of the upper base is 6mil less than the length of the lower base, and the height of the isosceles trapezoid is 3 mil; wherein the upper base is a base side proximate to the solder mask defining pad.
6. The method for making a micro solder mask definition pad of a lead-free solder mask as claimed in claim 1, wherein the compensation size of the solder mask film windowing is 1.7 mil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011202710.4A CN112492755B (en) | 2020-11-02 | 2020-11-02 | Method for manufacturing micro solder mask definition bonding pad of lead-free tin-spraying plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011202710.4A CN112492755B (en) | 2020-11-02 | 2020-11-02 | Method for manufacturing micro solder mask definition bonding pad of lead-free tin-spraying plate |
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| Publication Number | Publication Date |
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| CN112492755A true CN112492755A (en) | 2021-03-12 |
| CN112492755B CN112492755B (en) | 2022-09-27 |
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| CN112492755B (en) | 2022-09-27 |
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Address after: 331601 Jishui Industrial Park, Jishui County, Ji'an City, Jiangxi Province, on the east side of Jingong Avenue and the south side of Jingong Avenue, Chengxi Industrial Park Patentee after: Jiangxi Xusheng Electronics Co.,Ltd. Country or region after: China Address before: 331600 Jishui Industrial Park, Jishui County, Ji'an City, Jiangxi Province Patentee before: JIANGXI XUSHENG ELECTRONICS Co.,Ltd. Country or region before: China |