CN101932199A - The perforate processing method of printed base plate - Google Patents
The perforate processing method of printed base plate Download PDFInfo
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- CN101932199A CN101932199A CN2010102175816A CN201010217581A CN101932199A CN 101932199 A CN101932199 A CN 101932199A CN 2010102175816 A CN2010102175816 A CN 2010102175816A CN 201010217581 A CN201010217581 A CN 201010217581A CN 101932199 A CN101932199 A CN 101932199A
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- hole
- base plate
- printed base
- processing
- overlapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/16—Perforating by tool or tools of the drill type
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
- B26F3/06—Severing by using heat
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
Abstract
A kind of perforate processing method of printed base plate, this perforate processing method can effectively be utilized laser and drill bit and not be subject to the overlapping number of substrate and carry out perforate processing accurately, easily, efficiently.In this method, the operation (S10) that on the predetermined position of having implemented, forms all marginal pores (2) that positioning and fixing uses at the circumference of substrate (1) afterwards, the operation (S20) that employing laser carries out the processing of blind hole (5) on the assigned position circumference outside to substrate (1).Then, make each substrate (1) of having processed blind hole thus replace the overlapping workpiece (W) that constitutes overlapping body, and insert the lamination pin by all marginal pores (2) to the workpiece (W) of overlapping body, each substrate (1) is stacked, as to concentrate (workpiece (W)) operation (S30) afterwards, the operation (S40) that adopts diameter (diameter in the hole of the entrance side of expression blind hole (the 5)) drill bit bigger workpiece (W) to be carried out the processing of through hole than the diameter of blind hole (5).
Description
Technical field
The present invention relates to a kind of perforate processing method that is used for printed wiring board (hereinafter to be referred as " printed base plate ") is carried out the printed base plate of high accuracy and the processing of perforate efficiently.
Background technology
Now, when on printed base plate, clamping insulant and being disposed at double-edged conductive layer when being electrically connected, be used for the hole (hereinafter referred to as connecting hole) that is connected with positive and negative conductor layer and to connecting hole internal implementation conductivity coating by printed base plate is offered, thereby positive and negative conductive layer is electrically connected.Along with the miniaturization of in recent years electronic equipment, densification is installed, the size range of about 0.15～0.08mm is adopted in the aperture of the connecting hole on the printed base plate that electronic equipment loaded.This connecting hole adopts drill bit or laser to carry out perforate processing usually.
Fig. 7 adopts drill bit to carry out the key diagram of the workpiece that adds man-hour of connecting hole with prior art, and Fig. 7 (a) is the vertical view of this workpiece, and Fig. 7 (b) is the end view of this workpiece, and Fig. 7 (c) is the partial enlarged drawing of the a-quadrant part of Fig. 7 (b).
If with reference to Fig. 7 (a)～Fig. 7 (c), this printed base plate 1 with the mode of clamping insulating barrier 1z dispose conductor layer 1a in face side, side disposes conductor layer 1b overleaf.Insulating barrier 1z is made of resin 1j and glass fibre 1g.When adopting drill bit that printed base plate 1 is carried out man-hour that adds of connecting hole, in order to improve working (machining) efficiency, commonly used is carries out perforate processing to the overlapping body of overlapping many printed base plate 1.In addition, carrying out perforate with drill bit, to add the connecting hole in man-hour be through hole (through hole).
When the man-hour that adds of offering through hole with drill bit, all marginal pores 2 that processing is used as positioning and fixing on the predetermined position of the circumference of printed base plate 1 insert lamination pin 3 (Japaneses: ス タ Star Network ピ Application) to the overlapping body of overlapping many printed base plates 1.Usually, the cross sectional shape of all marginal pores 2 on plate face direction is circular, and in order to prevent to be offset each other as the folded printed base plate 1 of overlapping body weight, every printed base plate 1 is equipped with above (is two positions at this) all marginal pores 2 in two places.In addition, the external diameter of lamination pin 3 is bigger slightly than the diameter of all marginal pores 2, if lamination pin 3 is inserted all marginal pores 2 and makes their engagings, then can make the overlapping body that formed by stacked many printed base plates 1 (is eight at this) as a workpiece W.As everyone knows, above-mentioned lamination pin 3 also has the effect (for example with reference to patent documentation 1) that is used for workpiece W is positioned the alignment pin of machine table.
If offer the processing of through hole as mentioned above with drill bit, then owing to the roughness of the face of hole inwall can be made as below the 2 μ m, therefore to hole inwall electroplating processes conductivity coating the time, can form the uniform coating of thickness, and conductor layer 1a can be electrically connected reliably with conductor layer 1b.
Fig. 8 adopts laser to carry out the key diagram of the workpiece that adds man-hour of connecting hole with prior art, and Fig. 8 (a) is the vertical view of this workpiece, and Fig. 8 (b) is the partial enlarged drawing of the B area part of Fig. 8 (a).
If with reference to Fig. 8 (a), Fig. 8 (b),, on single printed base plate 1, form the blind hole 5 (Japanese: the I cave is paid at the end) that arrives conductor layer 1b surface from conductor layer 1a then when the man-hour that adds of carrying out connecting hole with laser.When processing blind hole, processing printed one by one substrate 1, but well-known, because hole required time of processing is compared 10～100 times of general shortenings man-hour with adding with drill bit, problem (for example with reference to patent documentation 2) therefore can not take place on process velocity (process time).But, adding man-hour with laser, shown in Fig. 8 (b), owing to the circular cone shape that is shaped as that taper (because of laser beam energy distribution) causes blind hole 5 occurs in the axial direction, the diameter in the many holes than entrance side of the diameter at the bottom of the hole is little.
In addition, at this also is that the situation that printed base plate 1 is provided with all marginal pores 2 has been made illustration, but in the man-hour that adds of carrying out connecting hole with laser, because such printed base plate 1 deviation each other need not take some countermeasures when overlapping many printed base plates 1 were formed overlapping body, therefore also can not establish all marginal pores 2, but utilize additive methods such as telltale mark for example is set that printed base plate 1 is positioned workbench.
Patent documentation 1: the Japan Patent spy opens clear 63-306847 communique
Patent documentation 2: the Japan Patent spy opens the 2002-335063 communique
Fig. 9 is that local the amplification with prior art adopts drill bit the workpiece W of overlapping body to be carried out the cutaway view of the major part that adds man-hour of through hole.
If with reference to Fig. 9, then add man-hour, add to tilt (not shown) with respect to rectilinear direction in the centre or begin crooked situation as shown like that from the centre because of the rigidity effect of overlapping body has axis L, N as the through hole 4 of object man-hour with printed base plate 1 Surface Vertical in perforate when the workpiece W of overlapping body being carried out perforate with drill bit.In this state, thus the precision that the hole site of through hole 4 can take place on the printed base plate 1 of lower floor reduces and can't satisfy the such situation of permissible value.Therefore, the overlapping number that generally reduces the printed base plate 1 of overlapping body carries out perforate processing.For example,, be the precision of the hole site of improving through hole 4, the overlapping number of the printed base plate 1 of overlapping body be controlled to be below four get final product as can be known if under the situation of example as shown in Figure 9.
Particularly, as printed base plate 1, clamp the superficial layer of the resin bed that is mixed with glass fibre and the Copper Foil of back layer and be respectively 18 μ m, and when supposition to thickness of slab be the printed base plate 1 of 0.1mm offer diameter be 0.1mm through hole 4 add man-hour, if desire is controlled to be the precision of the hole site of undermost through hole 4 ± 30 μ m, then overlapping four is the limit.
In a word, in the perforate of carrying out with the drill bit processing of prior art,, therefore exist and to implement the such problem of perforate processing efficiently owing to the overlapping number that need control the printed base plate of overlapping body for the machining accuracy of retaining hole.
Figure 10 adopts laser workpiece (printed base plate 1) to be carried out the amplification view of the major part that adds man-hour on the thickness of slab direction of connecting hole with prior art.
If with reference to Figure 10, when the man-hour that adds of offering connecting hole with laser, process the required time of hole and compare much shorter man-hour with adding with drill bit, but if the energy intensity of laser is made as the value that can cut off glass fibre 1g degree, then can make the excessive fusing of resin 1j, not only can make the surface roughness variation of the inwall of blind hole 5, according to circumstances also can make glass fibre 1g outstanding from the inwall of blind hole 5.If make the surface roughness variation of the inwall of blind hole 5 as mentioned above, then the thickness of the coating that forms in the electroplating processes of conductivity coating has deviation, thereby conductor layer 1a is reduced with the reliability that is electrically connected of conductor layer 1b.
In a word, in the perforate of carrying out with laser of prior art processing, owing to, therefore exist and to implement the such problem of perforate processing easily for the machining accuracy of retaining hole needs the management of the set point of the strict energy intensity that carry out laser.
Summary of the invention
The present invention forms for addressing the above problem invention, its technical problem is to provide a kind of and can effectively utilizes laser and drill bit and be not subject to the overlapping number of substrate and carry out perforate processing accurately, easily, efficiently, and the perforate processing method of the printed base plate of the surface roughness of retaining hole inwall well.
For solving the problems of the technologies described above, the perforate processing method of printed base plate of the present invention is characterised in that to have: adopt laser to carry out first operation of hole processing to the assigned position except the circumference of printed base plate; Thereby with many carried out after the processing of hole printed base plate with the hole axially on form overlapping second operation that forms overlapping body of alignment; And by adopt diameter than the big drill bit of the diameter in hole to a plurality of holes on every printed base plate of overlapping body with along this hole axially make it run through form to carry out perforate processing, thereby on this overlapping body, form the 3rd operation of through hole with this bit diameter.
At this moment, in first operation, adopt laser that printed base plate is carried out the hole first being processed, can also be implemented in the operation that forms all marginal pores that positioning and fixing uses on the predetermined position of circumference of this printed base plate.
In addition, in first operation, can form blind hole to printed base plate by the hole processing of adopting laser, in second operation, the side of exposing that can implement a side that the blind hole of printed base plate is not exposed and blind hole alternately overlaps to form overlapping body with docking mode each other, and by all marginal pore insertion lamination pins of this overlapping body being prevented the operation of the offset of each printed base plate, in the 3rd operation, as perforate processing, can adopt drill bit that the blind hole of overlapping body is run through and form through hole.
In addition, in the 3rd operation, adopting nose angle is that the following drill bit of 110 degree gets final product.
According to the present invention, be not subject to the overlapping number of substrate owing to can effectively utilize laser and drill bit and carry out perforate processing accurately, easily, efficiently, therefore and can keep the surface roughness of hole inwall well, can improve the accurately machined reliability the when surface of hole inwall carried out the electroplating processes of conductivity coating.Promptly, owing to have for to utilize drill bit to carry out with each blind hole be the order of formation of the through hole of object forming the overlapping body that is laminated after the blind hole on each printed base plate through utilizing laser, though process number has increased some than the process number of well-known method, but because even the overlapping number of plies that adds the substrate in man-hour in the perforate of adopting drill bit is the also precision of retaining hole position well more than the twice under the existing situation, therefore just increase needed total time of perforate operation slightly, industrial be favourable.
Description of drawings
Fig. 1 is the flow chart of whole processing sequence of perforate processing method of the printed base plate of the expression embodiment of the invention 1.
Fig. 2 is the key diagram of the workpiece when adopting laser to carry out preceding half operation of processing of connecting hole with the illustrated processing sequence of Fig. 1, Fig. 2 (a) is the vertical view of this workpiece, Fig. 2 (b) is the end view of this workpiece, and Fig. 2 (c) is the partial enlarged drawing of the C area part of Fig. 2 (b).
Fig. 3 is the amplification view of workpiece major part on the thickness of slab direction when adopting drill bit to carry out the later half operation of processing of connecting hole with the illustrated processing sequence of Fig. 1, Fig. 3 (a) is the figure when forming side's through hole, and Fig. 3 (b) is the figure that forms behind two sides' the through hole.
Fig. 4 is the amplification view of major part on the thickness of slab direction of basic structure of first variation of the workpiece of the expression overlapping body that can be applied with the illustrated processing sequence of Fig. 1.
Fig. 5 is the amplification view of major part on the thickness of slab direction of basic structure of second variation of the workpiece of the expression overlapping body that can be applied with the illustrated processing sequence of Fig. 1.
Fig. 6 is the amplification view of major part on the thickness of slab direction of basic structure of the 3rd variation of the workpiece of the expression overlapping body that can be applied with the illustrated processing sequence of Fig. 1.
Fig. 7 adopts drill bit to carry out the key diagram of the workpiece that adds man-hour of connecting hole with prior art, and Fig. 7 (a) is the vertical view of this workpiece, and Fig. 7 (b) is the end view of this workpiece, and Fig. 7 (c) is the partial enlarged drawing of the a-quadrant part of Fig. 7 (b).
Fig. 8 adopts laser to carry out the key diagram of the workpiece that adds man-hour of connecting hole with prior art, and Fig. 8 (a) is the vertical view of this workpiece, and Fig. 8 (b) is the partial enlarged drawing of the B area part of Fig. 8 (a).
Fig. 9 is that local the amplification with prior art adopts drill bit the workpiece of overlapping body to be carried out the cutaway view of the major part that adds man-hour of through hole.
Figure 10 adopts laser workpiece to be carried out the amplification view of the major part that adds man-hour on the thickness of slab direction of connecting hole with prior art.
(symbol description)
1,11,12 printed base plates
2 all marginal pores
3 lamination pins
4 through holes (through hole)
5 blind holes
5a, 5a ' through hole
W, W1～W3 workpiece
Embodiment
Followingly be elaborated with reference to the perforate processing method of accompanying drawing to printed base plate of the present invention.
Fig. 1 is the flow chart of whole processing sequence of perforate processing method of the printed base plate 1 of the expression embodiment of the invention 1.
In this processing sequence, at first carry out the hole first being processed, be implemented in the operation that adopts all marginal pores 2 that drill bit formation positioning and fixing uses on the predetermined position of circumference of this printed base plate 1 at the laser pair printed base plate 1 identical that adopts laser machine with printed base plate structure illustrated in Fig. 7 (a)～Fig. 7 (c).This is the operation (step S10) of printed base plate 1 being carried out the processing in (periphery) hole 2.In addition, this operation is to implement following first operation preparatory process before.
Then, implementing assigned position to printed base plate 1 adopts laser to carry out arriving from conductor layer 1a first operation of hole processing on the surface of conductor layer 1b.But, in first operation, printed base plate 1 is formed blind hole 5 by the hole processing of adopting laser.(in this example, blind hole 5 is circular cone shapes.) this is to utilize laser printed base plate 1 to be carried out the operation (step S20) of the processing of blind hole 5.In addition, to form the diameter that likens to about little 20～30 μ m of diameter of the connecting hole of the appointment of object be practical to the diameter of blind hole 5 (diameter in hole of the entrance side of expression blind hole 5).In addition, when printed base plate 1 being positioned the workbench of laser machine or the man-hour of adding, can be that benchmark is processed with all marginal pores 2.
Then, thus implement will many to have carried out after the processing of hole printed base plate 1 with blind hole 5 axially on overlapping second operation that forms overlapping body of form of aliging.But, in second operation, enforcement with the side of not exposing blind hole 5 of printed base plate 1 and a side of exposing this blind hole 5 with docking mode each other (promptly, will carry out the surface of the printed base plate after the processing of hole and the back side) with docking mode each other thus the overlapped workpiece W that constitutes overlapping body prevents the operation of the offset of each printed base plate 1 by all marginal pores 2 insertion lamination pins to the workpiece W of overlapping body.This is an operation (step S30) many printed base plates are 1 overlapping, that concentrate (workpiece W).
Then, enforcement is processed to carry out perforate along the form that they are run through of these blind holes 5 blind hole 5 on every printed base plate 1 of overlapping body by adopting the nominal diameter drill bit bigger than the diameter of blind hole 5, thereby forms the 3rd operation of the through hole (through hole) with bit diameter on this overlapping body.This is to utilize drill bit workpiece W to be carried out the operation (step S40) of the processing of through hole.In addition, as employed drill bit, for the precision of the hole site of improving through hole (through hole), comparatively it is desirable to adopt nose angle is the following drill bits of 110 degree.
Printed base plate 1 (the workpiece W of overlapping body) though the processing sequence of perforate processing leave it at that, on the surface of the inwall of through hole (through hole), be formed with conductivity coating by electroplating processes.
Fig. 2 is the key diagram of the workpiece W when adopting laser to carry out preceding half operation of processing of connecting hole with the processing sequence here, Fig. 2 (a) is the vertical view of this workpiece W, Fig. 2 (b) is the end view of this workpiece W, and Fig. 2 (c) is the partial enlarged drawing of the C area part of Fig. 2 (b).
If with reference to Fig. 2 (a), Fig. 2 (b), thereby then as can be known by will many printed base plates 1 overlapping all marginal pores 2 of lamination pin 3 insertions just having been constituted overlapping body.Add man-hour when in above-mentioned first operation, adopting laser to carry out the hole, because the positioning accuracy of blind hole 5 is about ± 10 μ m, therefore shown in Fig. 2 (c), the axis of the blind hole 5 of each printed base plate 1 of the workpiece W of overlapping body roughly is a linearity with stacked direction (direction vertical with printed base plate).In any case the workpiece W of the overlapping body of each printed base plate 1 that becomes one structure by lamination pin 3 is as the object of the perforate processing of adopting drill bit in the 3rd operation.
Fig. 3 is the amplification view of workpiece major part on the thickness of slab direction when adopting drill bit 6 to carry out the later half operation of processing of connecting hole with above-mentioned processing sequence, Fig. 3 (a) is the figure when forming side's through hole (through hole 4), and Fig. 3 (b) is the figure that forms behind two sides' the through hole (through hole 4).
At this, in above-mentioned the 3rd operation, the form that expression utilizes 6 couples of workpiece W of drill bit of equal diameters of bore and the connecting hole of having specified nominal diameter to carry out the processing of through hole 4.If with reference to Fig. 3 (a), then owing to the axis direction perforation of drill bit 6, even therefore on drill bit 6, also bending can occur hardly in the man-hour that adds of carrying out undermost printed base plate 1 along the blind holes 5 of processing on each printed base plate 1.
In this example, though will carry out the surface of the printed base plate after the hole processing and the back side so that docking mode is stacked each other, but be not limited to this, when all marginal pores symmetry that the hole that goes out with laser processing is used with respect to positioning and fixing, also can make the surface and surface, the back side and alternately applying of the back side of carrying out the printed base plate after the processing of hole.But, because therefore the substantive thickening of the thickness of the conductor layer of perforate not under the latter instance has the situation that the hole site precision reduces.
In addition, because the skew (allowed bands about ± 10 μ m) of the location of the axis of the skew of the position of blind hole 5 and drill bit 6, the axis that through hole 4 can occur may not be coaxial situation with the axis of blind hole 5.But, when even the deviation of the axis of the axis of through hole 4 and blind hole 5 increases (when for example the cross sectional shape on the horizontal plane direction is tumbler shape (Japanese: Da grinds shape)) or the part of the inwall of blind hole 5 is not processed and when residual, because the surface roughness of the inwall of through hole 4 forms lessly, therefore substandard products can be do not become yet, the high coating of reliability can be in the electroplating processes of conductivity coating, formed.
(variation 1)
Fig. 4 is the amplification view of major part on the thickness of slab direction of basic structure of first variation of the workpiece of the expression overlapping body that can be applied with above-mentioned processing sequence.
As shown in Figure 4, be in first operation before, to adopt laser to carry out the printed base plate 1 of processing of blind hole 5 and the printed base plate 1 that does not carry out the processing of blind hole 5 is disposed at the structure that the form on top stacks gradually with the printed base plate of the processing of having carried out blind hole 5 at this workpiece W1 of overlapping body.Even with such workpiece W1 is object, also the situation with embodiment 1 is the same, can adopt drill bit 6 to carry out the perforate processing of through hole 4 in the 3rd operation.At this moment, since process time of blind hole 5 in first operation with as among the embodiment 1 as the workpiece W of object to each all printed base plates 1 all carry out blind hole 5 processing situation mutually specific energy reduce half, so can bring up to the working (machining) efficiency till through hole 4 formation.
(variation 2)
Fig. 5 is the amplification view of major part on the thickness of slab direction of basic structure of second variation of the workpiece W2 of the expression overlapping body that can be applied with above-mentioned processing sequence.
As shown in Figure 5, the workpiece W2 of overlapping body at this utilizes laser stacked structure behind the through hole 5a that forms circular cone shape on each printed base plate 11 to replace being formed at the blind hole 5 of each printed base plate 1 in embodiment 1.Promptly, be entrance side (being large-diameter portion in the example at Fig. 5) and concentrate on the form that upper side, outlet side (being minor diameter part in the example at Fig. 5) concentrate on lower side respectively respectively at this through hole 5a of each printed base plate 11 of workpiece W2.
If the workpiece W2 with this structure is an object, then the situation than embodiment 1 more can improve the efficient that adopts drill bit 6 to carry out the perforate processing of through hole 4 in the 3rd operation, also can easily form through hole 4 even therefore further increase the stacked number of each printed base plate 11.
(variation 3)
Fig. 6 is the amplification view of major part on the thickness of slab direction of basic structure of the 3rd variation of the workpiece W3 of the expression overlapping body that can be applied with above-mentioned processing sequence.
As shown in Figure 6, be to be core layer (Japanese: コ ア at this workpiece W3 of overlapping body with a printed base plate 11 that in variation 2, forms
), the interarea side of folk prescription is constituted the printed base plate 12 (combination layer (Japanese: PVC Le De ア Star プ of insulating barrier in its both sides
)) so that conductive layer is stacked with the form that insulating barrier docks each other, the multilayer board of applying.But, in first operation, adopt laser on each combination layer 12, to be formed with through hole 5a ' at this.In the example of Fig. 6, represented to carry out perforate processing from the conductor layer side of each combination layer 12, but be not limited to this with laser, also can adopt laser to form blind hole from the insulating barrier side of each combination layer 12.
Even the workpiece W3 with this structure is an object, also the situation than embodiment 1 more can improve the efficient that adopts drill bit 6 to carry out the perforate processing of through hole 4 in the 3rd operation, also can easily form through hole 4 even therefore further increase the stacked number of each printed base plate 12.
Claims (4)
1. the perforate processing method of a printed base plate is characterized in that having:
Assigned position to printed base plate adopts laser to carry out first operation of hole processing;
Thereby with many carried out after the processing of described hole described printed base plate with described hole axially on overlapping second operation that forms overlapping body of form of alignment; And
By the drill bit that the employing diameter is bigger than the diameter in described hole a plurality of described hole on every described printed base plate of described overlapping body is processed to carry out perforate along the form that described hole is run through in this hole, thereby formation has the 3rd operation of the through hole of described bit diameter on described overlapping body.
2. the perforate processing method of printed base plate as claimed in claim 1, it is characterized in that, in described first operation, adopt described laser that described printed base plate is carried out described hole first being processed, be implemented in the operation that forms all marginal pores that positioning and fixing uses on the predetermined position of circumference of described printed base plate.
3. the perforate processing method of printed base plate as claimed in claim 2 is characterized in that,
In described first operation, by the described hole processing of adopting described laser described printed base plate is formed blind hole,
In second operation, thereby the side that the side that the described blind hole of described printed base plate is not exposed in enforcement and this blind hole are exposed replaces the overlapping described overlapping body that forms with docking mode each other, and insert the operation that the lamination pin prevents the offset of every described printed base plate by described all marginal pores to described overlapping body
In the 3rd operation,, adopt described drill bit that the described blind hole of described overlapping body is run through and form described through hole as described perforate processing.
4. the perforate manufacturing procedure of printed base plate as claimed in claim 3 is characterized in that, in described the 3rd operation, as described drill bit, adopting nose angle is the following drill bits of 110 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410196030.4A CN103987195B (en) | 2009-06-23 | 2010-06-22 | Boring method for printed substrate |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009148151 | 2009-06-23 | ||
| JP2009-148151 | 2009-06-23 | ||
| JP2010100411A JP5550977B2 (en) | 2009-06-23 | 2010-04-23 | Method for drilling printed circuit boards |
| JP2010-100411 | 2010-04-23 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410196030.4A Division CN103987195B (en) | 2009-06-23 | 2010-06-22 | Boring method for printed substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101932199A true CN101932199A (en) | 2010-12-29 |
Family
ID=43371003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102175816A Pending CN101932199A (en) | 2009-06-23 | 2010-06-22 | The perforate processing method of printed base plate |
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|---|---|
| KR (1) | KR101726714B1 (en) |
| CN (1) | CN101932199A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102861935A (en) * | 2011-07-06 | 2013-01-09 | 邱金和 | Cutting method |
| CN104772607A (en) * | 2015-04-22 | 2015-07-15 | 沈阳航天新光集团有限公司 | Group hole accuracy machining method of liquid engine injector plate |
| CN108372267A (en) * | 2018-01-24 | 2018-08-07 | 厦门市克成五金制品有限公司 | Impulse- free robustness squeezes hole machined technique and end cover for battery cells |
| CN109807477A (en) * | 2017-11-22 | 2019-05-28 | 广东工业大学 | A kind of PCB aperture combined machining method |
| CN109996390A (en) * | 2019-02-26 | 2019-07-09 | 苏州维信电子有限公司 | A kind of production method of the radium-shine through-hole of multi-layer board |
| CN112404478A (en) * | 2020-11-05 | 2021-02-26 | 南京航浦机械科技有限公司 | Self-adaptive drilling device and method for composite material/metal material laminated structure |
| CN117019997A (en) * | 2023-10-08 | 2023-11-10 | 江苏保平信息科技有限公司 | License plate is solid seals and uses perforating device with quick location structure |
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| JPS63306847A (en) * | 1987-06-05 | 1988-12-14 | Hitachi Seiko Ltd | Method and apparatus for fixing printed wiring board |
| JPH0323457A (en) * | 1989-06-20 | 1991-01-31 | Mitsubishi Electric Corp | Phototool |
| JP2002335063A (en) * | 2001-05-09 | 2002-11-22 | Hitachi Via Mechanics Ltd | Method and apparatus for drilling printed board |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102861935A (en) * | 2011-07-06 | 2013-01-09 | 邱金和 | Cutting method |
| CN104772607A (en) * | 2015-04-22 | 2015-07-15 | 沈阳航天新光集团有限公司 | Group hole accuracy machining method of liquid engine injector plate |
| CN109807477A (en) * | 2017-11-22 | 2019-05-28 | 广东工业大学 | A kind of PCB aperture combined machining method |
| CN109807477B (en) * | 2017-11-22 | 2023-03-31 | 广东工业大学 | Composite processing method for PCB hole |
| CN108372267A (en) * | 2018-01-24 | 2018-08-07 | 厦门市克成五金制品有限公司 | Impulse- free robustness squeezes hole machined technique and end cover for battery cells |
| CN109996390A (en) * | 2019-02-26 | 2019-07-09 | 苏州维信电子有限公司 | A kind of production method of the radium-shine through-hole of multi-layer board |
| CN109996390B (en) * | 2019-02-26 | 2022-03-22 | 苏州维信电子有限公司 | Method for manufacturing laser through hole of multilayer board |
| CN112404478A (en) * | 2020-11-05 | 2021-02-26 | 南京航浦机械科技有限公司 | Self-adaptive drilling device and method for composite material/metal material laminated structure |
| CN112404478B (en) * | 2020-11-05 | 2021-10-01 | 南京航浦机械科技有限公司 | Self-adaptive drilling device and method for composite material/metal material laminated structure |
| CN117019997A (en) * | 2023-10-08 | 2023-11-10 | 江苏保平信息科技有限公司 | License plate is solid seals and uses perforating device with quick location structure |
| CN117019997B (en) * | 2023-10-08 | 2023-12-08 | 江苏保平信息科技有限公司 | License plate is solid seals and uses perforating device with quick location structure |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101726714B1 (en) | 2017-04-13 |
| KR20100138755A (en) | 2010-12-31 |
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