CN107343359A - A kind of processing method of the pcb board mechanical hole of PTFE material - Google Patents

A kind of processing method of the pcb board mechanical hole of PTFE material Download PDF

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Publication number
CN107343359A
CN107343359A CN201710422750.1A CN201710422750A CN107343359A CN 107343359 A CN107343359 A CN 107343359A CN 201710422750 A CN201710422750 A CN 201710422750A CN 107343359 A CN107343359 A CN 107343359A
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CN
China
Prior art keywords
ptfe material
material substrate
hole
drilling
pcb board
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Pending
Application number
CN201710422750.1A
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Chinese (zh)
Inventor
唐殿军
樊廷慧
聂兴培
吴世亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huizhou King Brother Circuit Technology Co Ltd
Shenzhen Jinbaize Electronic Technology Co Ltd
Xian King Brother Circuit Technology Co Ltd
Shenzhen King Brother Electronics Technology Co Ltd
Original Assignee
Huizhou King Brother Circuit Technology Co Ltd
Shenzhen Jinbaize Electronic Technology Co Ltd
Xian King Brother Circuit Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Huizhou King Brother Circuit Technology Co Ltd, Shenzhen Jinbaize Electronic Technology Co Ltd, Xian King Brother Circuit Technology Co Ltd filed Critical Huizhou King Brother Circuit Technology Co Ltd
Priority to CN201710422750.1A priority Critical patent/CN107343359A/en
Publication of CN107343359A publication Critical patent/CN107343359A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention discloses a kind of processing method of the pcb board mechanical hole of PTFE material, comprise the following steps：Sawing sheet → drilling → laser deburring → plasma treatment → high-pressure washing → copper-coating.The present invention mainly returns the burr in the pcb board mechanical hole hole of drilling removal PTFE material using laser, the burr in mechanical hole is set to be carbonized using the high temperature of laser, to reach pore burr removing, ensure the purpose of hole iuuminting, it can so reduce and multiple return drill process and hand inspection step, the processing efficiency of the pcb board mechanical hole of PTFE material is lifted, reduces processing cost.A kind of processing method of the pcb board mechanical hole of PTFE material of the present invention, has and simplifies work flow, reduces processing cost, lifts processing efficiency, ensures the quality of mechanical hole, the advantages that reducing fraction defective.

Description

A kind of processing method of the pcb board mechanical hole of PTFE material
Technical field
The present invention relates to the pcb board processing technique field of PTFE material, the pcb board mechanical hole of specially a kind of PTFE material Processing method.
Background technology
PTFE high frequency material characteristic soft textures, Master Cost are more than 10 times of conventional material, and mostly imported material, When carrying out Drilling operation in traditional PTFE high frequency materials, as shown in figure 1, generally comprising the steps：Sawing sheet → drilling → Check → return drilling → inspection → plasma treatment → high-pressure washing → copper-coating；Because material has simultaneously during Drilling operation High-temperature stability, causing to bore nozzle land has residual silk situation, causes chip removal bad, causes hole inner burr residual, or even plug-hole to ask Topic, particularly below 0.2mm milli machines hole, performance is particularly evident, and hole inner burr plug-hole can cause can not gold in rear process hole Categoryization, the situation for causing to scrap by the gross produce, and the processing technology of row industry routine is using multiple mechanical drilling process, auxiliary The mode of hand inspection is found plug-hole and returns the mode of brill again, or even rear yield of doing over again repeatedly can not still ensure, influence efficiency, and Quality can not ensure.
The content of the invention
It is an object of the invention to provide a kind of processing method of the pcb board mechanical hole of PTFE material, processing can be simplified Flow, processing cost is reduced, lift processing efficiency, ensure the quality of mechanical hole, reduce fraction defective.
The present invention can be achieved through the following technical solutions：
A kind of processing method of the pcb board mechanical hole of PTFE material, comprises the following steps：
Step 1：Sawing sheet, the PTFE material sheet material of bulk is placed on cutting apparatus, cuts out and conforms to according to engineering data The fritter PTFE material substrate asked；
Step 2：Drilling, the above-mentioned PTFE material substrate for cutting completion is placed on drilling machine, to PTFE material substrate according to Engineering data requirement is drilled；
Step 3：Laser deburring, the PTFE material substrate that above-mentioned steps two are completed with drilling carry out returning drilling, will complete to drill PTFE material substrate be placed on laser drill board, it is mechanical on the laser beam ablation PTFE material substrate of laser drill to utilize The hole wall in hole, make the high temperature of laser that the burr in hole to be carbonized；
Step 4：Plasma treatment, the PTFE material substrate that above-mentioned completion laser is returned to drilling are put into setting for plasma treatment In standby, plasma treatment is carried out to the hole wall on PTFE material substrate and surface by the gas in equipment, to remove PTFE material The glue residue of substrate hole wall residual and the dust on surface, greasy dirt etc.；
Step 5：High-pressure washing, the PTFE material substrate of above-mentioned completion plasma treatment is cleaned using giant, gone Except dirt remained on PTFE material substrate after above-mentioned steps etc.；
Step 6：Copper-coating, the PTFE material substrate of above-mentioned completion high-pressure washing is subjected to copper-coating, copper-coating is completed PTFE material substrate hole position metallization processes are completed afterwards.
The present invention mainly drills according to Conventional process steps to PTFE material substrate, after the completion of drilling, then uses Mechanical hole hole wall on laser ablation PTFE material substrate, the burr in hole is carbonized using the high temperature of laser, it is ensured that in hole Burr removing, ensure hole iuuminting, then after follow-up plasma treatment, high-pressure washing and copper-coating, can be formed The metallization via hole of good reliability, ensure the reliable electric property of via hole, can so avoid PTFE material substrate from processing Occur plug-hole phenomenon during hole position, reduce the number of the number and hand inspection that return drilling, lift PTFE material substrate processing machine tool The efficiency in hole；And drilling is returned using laser and goes pore burr removing, multiple returning can be avoided to drill to PTFE material substrate Damage, effectively reduce the fraction defective of PTFE material substrate, the quality in lifting PTFE material substrate processing machine tool hole.
Further, the surface treatment before drilling is there are between the step 1 and step 2, completion will be cut PTFE material substrate is placed into surface treatment liquid, and surface treatment liquid is by Na2S2O8And H2SO4Mix, utilize surface treatment Liquid cleans to the surface of PTFE material substrate, removes the anti-oxidation processing protective layer of copper foil surface on PTFE material substrate. The processing method of the pcb board mechanical hole of PTFE material of the present invention, using Na2S2O8And H2SO4Mixed liquor cleaning PTFE material base Plate surface, while can effectively removing the anti-oxidation processing protective layer on PTFE material substrate surface, it is also ensured that PTFE materials Material substrate will not be stretched damage, the fraction defective in reduction PTFE material substrate processing machine tool hole.
Further, when the step 2 drills to PTFE material substrate, starting cutting output is 2.5-3.0mil, is bored 500IPM is not to be exceeded in 300-450SFM, retraction rate in speed control.The processing side of the pcb board mechanical hole of PTFE material of the present invention Method, drilling operation is typically carried out using green bit, to ensure the smoothness of mechanical hole hole wall and cleanliness factor, avoids the dirt on drill bit Thing is adhered on hole wall；And some dirts are also easily made to be adhered in hole wall and difficult for drop-off, shadow using too high retraction rate Ring follow-up electric property of mechanical hole etc..
Further, when the step 3 carries out laser deburring to PTFE material substrate, laser return the aperture of drilling by It is processed according to the size fewer 0.05-0.03mm than foramen primum footpath.The processing method of the pcb board mechanical hole of PTFE material of the present invention, Typically use CO2Laser machine is carried out returning Drilling operation deburring, and laser beam energy should be controlled excessive, due to PTFE material matter Soft, the temperature of laser beam is high, if the aperture that laser returns drilling excessive easily makes the mechanical hole hole wall on PTFE material substrate be heated Deformation, and if laser return drilling aperture it is too small if can not thorough ablation burr, make the mechanical hole hole wall on PTFE material substrate On burr removing it is not thorough and Drilling operation need to be returned again.
Further, when the step 4 carries out plasma gas processing to PTFE material substrate, using plasma gas Cleaning machine, plasma gas is by N2With H2Mix.The processing method of the pcb board mechanical hole of PTFE material of the present invention, using N2 With H2Mixed gas to PTFE material substrate carry out plasma treatment, can effectively remove PTFE material substrate hole wall residual Glue residue, the dust on surface, dirt and the electrostatic such as greasy dirt, improve the adhesive force of PTFE material substrate surface, and then improve The reliability and persistence of PTFE material substrate surface bonding.
Further, when the step 5 carries out copper-coating to PTFE material substrate, PTFE material substrate is put into Cross and copper-coating is carried out in liquid, cross liquid mainly by CuSO4、H2SO4Mixed with HCl.The pcb board machine of PTFE material of the present invention The processing method in tool hole, the metallization work of PTFE material mechanical hole, general CuSO are completed using electroless copper plating mode4Content Control is in 60-100g/L, CuSO4Content is too low to make sedimentation rate slack-off, it is too high then can sedimentation rate it is too fast, crystalline particle is thick Greatly, make plate face and thickness difference in hole excessive；And H2SO4Content general control in 180-220g/L, H2SO4In liquid is crossed Main function is the conductive capability that liquid is crossed in increase, prevents Cu2+Hydrolysis, H2SO4Concentration is too high in liquid is crossed, and crosses liquid capacity of decomposition Difference, too low to make the increase of coating fragility, toughness declines；HCl chlorion can improve the activity of anode, promote anode normally molten Solution, prevent anodic passivity, can also reduce because anodic solution not exclusively caused by copper powder, improve coating light and leveling energy Power, improve quality of coating, HCl content general control is in 30-80mg/L.
The processing method of the pcb board mechanical hole of PTFE material of the present invention, compared with prior art, there is following beneficial effect Fruit：
Firstth, simplify work flow, reduce processing cost, the present invention returns drilling using laser and goes pore burr removing, can be thorough The burr in the pcb board mechanical hole hole of PTFE material is removed, reduces the number and hand inspection number for returning drilling, there is provided Yi Zhongjian The processing method of the pcb board mechanical hole of single economic PTFE material, simplifies work flow, reduces processing cost；
Secondth, processing efficiency is lifted, the present invention can return drilling using laser and go pore burr removing, it is possible to reduce multiple returns brill Hole and hand inspection step, simplify work flow, reduce the time needed for processing, the efficiency of effective lifting processing；
3rd, the quality of mechanical hole is ensured, the present invention returns drilling using laser and goes pore burr removing, can avoid multiple returning brill Damage of the hole to PTFE material substrate, the fraction defective of PTFE material substrate is effectively reduced, lift PTFE material substrate processing machine The quality in tool hole；
4th, fraction defective is reduced, the present invention returns drilling using laser using the present invention and goes pore burr removing, can avoid repeatedly adopting Drilling is returned with drilling machine, and PTFE material substrate is cleaned using chemical mode, plasma treatment and copper-coating, is kept away Exempt from PTFE material substrate to be stretched using excessive machining damage, reduce the bad of PTFE material substrate processing machine tool hole Rate.
Brief description of the drawings
Fig. 1 is the work flow schematic diagram of the pcb board mechanical hole of original PTFE material；
Fig. 2 is the work flow schematic diagram of the pcb board mechanical hole of the PTFE material of the present invention.
Embodiment
In order that those skilled in the art will better understand the technical solution of the present invention, with reference to embodiment and accompanying drawing Product of the present invention is described in further detail.
Embodiment one：
As shown in Fig. 2 the present embodiment realizes the processing of the pcb board mechanical hole of the PTFE material in 0.2mm apertures, including following step Suddenly：
Step 1：Sawing sheet, the PTFE material sheet material of bulk is placed on cutting apparatus, cuts out and conforms to according to engineering data The fritter PTFE material substrate asked, by the surface treatment before being drilled to above-mentioned PTFE material substrate, drilling after the completion of cutting PTFE material substrate need to be placed into surface treatment liquid by preceding surface treatment, and surface treatment liquid is by Na2S2O8And H2SO4Mixing and Into, then the surface of PTFE material substrate is cleaned using surface treatment liquid, remove PTFE material substrate on copper foil table The anti-oxidation processing protective layer in face；
Step 2：Drilling, the above-mentioned PTFE material substrate for cutting completion is placed on drilling machine, from processing 0.2mm apertures Green bit, the drill bit for setting drilling machine originates cutting output as 3.0mil, and in 450SFM, retraction rate, which controls, to exist for drilling speed control 500IPM；
Step 3：Laser deburring, the PTFE material substrate that above-mentioned steps two are completed with drilling carry out returning drilling, will complete to drill PTFE material substrate be placed on laser drill board, use CO of the power for 200W2Laser drill, FREQUENCY CONTROL exist 100hz, beam diameter control is in 0.15mm, and after being provided with, ablation is carried out to the mechanical hole on PTFE material substrate, using swashing Burr in hole is carbonized by the high temperature of light；
Step 4：Plasma treatment, the PTFE material substrate that above-mentioned completion laser is returned to drilling are put into plasma gas cleaning In machine, plasma gas is by N2With H2Mix, control N2Flow be 300cc/min, H2Flow be 300cc/min, temperature Spend for 30 DEG C, plasma processing time 45min, for being carried out to the hole wall on PTFE material substrate and surface at plasma Reason, to remove the dust on the glue residue of PTFE material substrate hole wall residual and surface, greasy dirt etc.；
Step 5：High-pressure washing, the PTFE material substrate of above-mentioned completion plasma treatment is cleaned using giant, gone Except dirt remained on PTFE material substrate after above-mentioned steps etc., the drying of PTFE material substrate is sent to after the completion of washing On subsequent processing；
Step 6：Copper-coating, above-mentioned completion high-pressure washing and the PTFE material substrate of drying are subjected to copper-coating, PTFE When material substrate carries out copper-coating, PTFE material substrate is put into cross copper-coating is carried out in liquid, cross liquid mainly by CuSO4、H2SO4Mixed with HCl, wherein controlling CuSO4Content be 100g/L, H2SO4Content be 220g/L, HCl's Content is 80mg/L, after the completion of copper-coating, PTFE material substrate is cleaned and dried, completes the pcb board of PTFE material The processing of mechanical hole.
Embodiment two：
As shown in Fig. 2 the present embodiment realizes the processing of the pcb board mechanical hole of the PTFE material in 0.15mm apertures, including following step Suddenly：
Step 1：Sawing sheet, the PTFE material sheet material of bulk is placed on cutting apparatus, cuts out and conforms to according to engineering data The fritter PTFE material substrate asked, by the surface treatment before being drilled to above-mentioned PTFE material substrate, drilling after the completion of cutting PTFE material substrate need to be placed into surface treatment liquid by preceding surface treatment, and surface treatment liquid is by Na2S2O8And H2SO4Mixing and Into, then the surface of PTFE material substrate is cleaned using surface treatment liquid, remove PTFE material substrate on copper foil table The anti-oxidation processing protective layer in face；
Step 2：Drilling, the above-mentioned PTFE material substrate for cutting completion is placed on drilling machine, from processing 0.15mm apertures Green bit, the drill bit for setting drilling machine originates cutting output as 2.5mil, and in 350SFM, retraction rate, which controls, to exist for drilling speed control 350PM；
Step 3：Laser deburring, the PTFE material substrate that above-mentioned steps two are completed with drilling carry out returning drilling, will complete to drill PTFE material substrate be placed on laser drill board, use CO of the power for 200W2Laser drill, FREQUENCY CONTROL exist 100hz, beam diameter control is in 0.12mm, and after being provided with, ablation is carried out to the mechanical hole on PTFE material substrate, using swashing Burr in hole is carbonized by the high temperature of light；
Step 4：Plasma treatment, the PTFE material substrate that above-mentioned completion laser is returned to drilling are put into plasma gas cleaning In machine, plasma gas is by N2With H2Mix, control N2Flow be 300cc/min, H2Flow be 300cc/min, temperature Spend for 30 DEG C, plasma processing time 45min, for being carried out to the hole wall on PTFE material substrate and surface at plasma Reason, to remove the dust on the glue residue of PTFE material substrate hole wall residual and surface, greasy dirt etc.；
Step 5：High-pressure washing, the PTFE material substrate of above-mentioned completion plasma treatment is cleaned using giant, gone Except dirt remained on PTFE material substrate after above-mentioned steps etc., the drying of PTFE material substrate is sent to after the completion of washing On subsequent processing；
Step 6：Copper-coating, above-mentioned completion high-pressure washing and the PTFE material substrate of drying are subjected to copper-coating, PTFE When material substrate carries out copper-coating, PTFE material substrate is put into cross copper-coating is carried out in liquid, cross liquid mainly by CuSO4、H2SO4It is mixed with HCl, wherein controlling CuSO4Content be 60g/L, H2SO4Content be 180g/L, HCl's contains Measure as 30mg/L, after the completion of copper-coating, PTFE material substrate is cleaned and dried, completes the pcb board machine of PTFE material The processing in tool hole.
The foregoing is only a preferred embodiment of the present invention, not makees any formal limitation to the present invention；It is all The those of ordinary skill of the industry can be shown in by specification accompanying drawing and described above and swimmingly implement the present invention；It is but all Those skilled in the art without departing from the scope of the present invention, using disclosed above technology contents The equivalent variations for a little variation, modification and evolution made, it is the equivalent embodiment of the present invention；It is meanwhile all according to the present invention The variation, modification and evolution of any equivalent variations made to above example of substantial technological etc., still fall within the present invention's Within the protection domain of technical scheme.

Claims (6)

  1. A kind of 1. processing method of the pcb board mechanical hole of PTFE material, it is characterised in that：Comprise the following steps：
    Step 1：Sawing sheet, the PTFE material sheet material of bulk is placed on cutting apparatus, cuts out and conforms to according to engineering data The fritter PTFE material substrate asked；
    Step 2：Drilling, the above-mentioned PTFE material substrate for cutting completion is placed on drilling machine, to PTFE material substrate according to Engineering data requirement is drilled；
    Step 3：Laser deburring, the PTFE material substrate that above-mentioned steps two are completed with drilling carry out returning drilling, will complete to drill PTFE material substrate be placed on laser drill board, it is mechanical on the laser beam ablation PTFE material substrate of laser drill to utilize The hole wall in hole, make the high temperature of laser that the burr in hole to be carbonized；
    Step 4：Plasma treatment, the PTFE material substrate that above-mentioned completion laser is returned to drilling are put into setting for plasma treatment In standby, plasma treatment is carried out to the hole wall on PTFE material substrate and surface by the gas in equipment, to remove PTFE material The glue residue of substrate hole wall residual and the dust on surface, greasy dirt etc.；
    Step 5：High-pressure washing, the PTFE material substrate of above-mentioned completion plasma treatment is cleaned using giant, gone Except dirt remained on PTFE material substrate after above-mentioned steps etc.；
    Step 6：Copper-coating, the PTFE material substrate of above-mentioned completion high-pressure washing is subjected to copper-coating, copper-coating is completed PTFE material substrate hole position metallization processes are completed afterwards.
  2. 2. the processing method of the pcb board mechanical hole of PTFE material according to claim 1, it is characterised in that：The step The surface treatment before drilling is there are between one and step 2, the PTFE material substrate for cutting completion is placed into surface treatment liquid In, surface treatment liquid is by Na2S2O8And H2SO4Mix, the surface of PTFE material substrate is carried out using surface treatment liquid clear Wash, remove the anti-oxidation processing protective layer of the copper foil surface on PTFE material substrate.
  3. 3. the processing method of the pcb board mechanical hole of PTFE material according to claim 1, it is characterised in that：The step When two pairs of PTFE material substrates drill, starting cutting output is 2.5-3.0mil, and drilling speed control is in 300-450SFM, retraction speed 500IPM is not to be exceeded in rate.
  4. 4. the processing method of the pcb board mechanical hole of PTFE material according to claim 1, it is characterised in that：The step When three pairs of PTFE material substrates carry out laser deburring, laser returns the aperture of drilling according to fewer 0.05-0.03mm than foramen primum footpath Size is processed.
  5. 5. the processing method of the pcb board mechanical hole of PTFE material according to claim 1, it is characterised in that：The step When four pairs of PTFE material substrates carry out plasma gas processing, using plasma gas cleaning machine, plasma gas is by N2With H2It is mixed Conjunction forms.
  6. 6. the processing method of the pcb board mechanical hole of PTFE material according to claim 1, it is characterised in that：The step When five pairs of PTFE material substrates carry out copper-coating, PTFE material substrate is put into cross copper-coating is carried out in liquid, cross liquid master Will be by CuSO4、H2SO4Mixed with HCl.
CN201710422750.1A 2017-06-07 2017-06-07 A kind of processing method of the pcb board mechanical hole of PTFE material Pending CN107343359A (en)

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Cited By (9)

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Publication number Priority date Publication date Assignee Title
CN108174533A (en) * 2017-12-29 2018-06-15 柏承科技(昆山)股份有限公司 Anti- holes Rigid Flex electroplating technology
CN109807477A (en) * 2017-11-22 2019-05-28 广东工业大学 A kind of PCB aperture combined machining method
CN110052674A (en) * 2019-04-29 2019-07-26 苏州亨允晟机电科技有限公司 The hole machined system and processing technology of carbon fibre reinforced composite
CN110225669A (en) * 2019-04-30 2019-09-10 深圳市景旺电子股份有限公司 A method of improving the discoloration of FPC plating nickel on surface steel disc
CN112616251A (en) * 2020-12-08 2021-04-06 深圳市祺利电子有限公司 Manufacturing method of circuit board mounting hole
CN112752405A (en) * 2020-11-12 2021-05-04 惠州市金百泽电路科技有限公司 Processing method of PCB connecting sheet of 5G base station calibration network board
CN112969287A (en) * 2021-01-14 2021-06-15 大连崇达电子有限公司 Method for improving roughness of pore wall of PTFE (polytetrafluoroethylene) material
CN113873758A (en) * 2021-08-27 2021-12-31 珠海杰赛科技有限公司 Processing method for improving interconnection and separation of through holes of PTFE circuit board
CN115003027A (en) * 2022-05-31 2022-09-02 奥士康科技股份有限公司 Deflashing method for teflon material

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CN202738270U (en) * 2012-06-20 2013-02-13 艾威尔电路（深圳）有限公司 Plasma processor for PTFE
CN103200791A (en) * 2013-04-25 2013-07-10 无锡江南计算技术研究所 High-frequency board-holed plating method of glass cloth reinforced PTFE (Poly Tetra Fluoro Ethylene) material

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CN101249589A (en) * 2006-12-19 2008-08-27 鲜宇Id株式会社 Method for removing spike of carrying band
CN202738270U (en) * 2012-06-20 2013-02-13 艾威尔电路（深圳）有限公司 Plasma processor for PTFE
CN103200791A (en) * 2013-04-25 2013-07-10 无锡江南计算技术研究所 High-frequency board-holed plating method of glass cloth reinforced PTFE (Poly Tetra Fluoro Ethylene) material

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109807477A (en) * 2017-11-22 2019-05-28 广东工业大学 A kind of PCB aperture combined machining method
CN109807477B (en) * 2017-11-22 2023-03-31 广东工业大学 Composite processing method for PCB hole
CN108174533A (en) * 2017-12-29 2018-06-15 柏承科技(昆山)股份有限公司 Anti- holes Rigid Flex electroplating technology
CN110052674A (en) * 2019-04-29 2019-07-26 苏州亨允晟机电科技有限公司 The hole machined system and processing technology of carbon fibre reinforced composite
CN110225669A (en) * 2019-04-30 2019-09-10 深圳市景旺电子股份有限公司 A method of improving the discoloration of FPC plating nickel on surface steel disc
CN110225669B (en) * 2019-04-30 2020-08-07 深圳市景旺电子股份有限公司 Method for improving color change of nickel-plated steel sheet on surface of FPC
CN112752405A (en) * 2020-11-12 2021-05-04 惠州市金百泽电路科技有限公司 Processing method of PCB connecting sheet of 5G base station calibration network board
CN112752405B (en) * 2020-11-12 2023-07-25 惠州市金百泽电路科技有限公司 Processing method of PCB connecting sheet of 5G base station calibration network board
CN112616251A (en) * 2020-12-08 2021-04-06 深圳市祺利电子有限公司 Manufacturing method of circuit board mounting hole
CN112969287A (en) * 2021-01-14 2021-06-15 大连崇达电子有限公司 Method for improving roughness of pore wall of PTFE (polytetrafluoroethylene) material
CN113873758A (en) * 2021-08-27 2021-12-31 珠海杰赛科技有限公司 Processing method for improving interconnection and separation of through holes of PTFE circuit board
CN115003027A (en) * 2022-05-31 2022-09-02 奥士康科技股份有限公司 Deflashing method for teflon material
CN115003027B (en) * 2022-05-31 2024-05-17 奥士康科技股份有限公司 Method for removing flash of Teflon material

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