CN102196677A - PCB (Printed Circuit Board) double-sided jack machining process - Google Patents
PCB (Printed Circuit Board) double-sided jack machining process Download PDFInfo
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- CN102196677A CN102196677A CN 201010119813 CN201010119813A CN102196677A CN 102196677 A CN102196677 A CN 102196677A CN 201010119813 CN201010119813 CN 201010119813 CN 201010119813 A CN201010119813 A CN 201010119813A CN 102196677 A CN102196677 A CN 102196677A
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- hole
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- blind holes
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Abstract
The invention relates to a PCB (Printed Circuit Board) double-sided jack machining process which comprises the following steps of: firstly, arranging a subboard; after laminating the subboard, respectively processing coaxial blinds holes with same sizes on the upper and the lower surfaces of the subboard; then, punching the blind holes to form a first through hole, wherein the upper and the lower blind holes are opposite; electroplating; and finally, removing the electroplating layer on the inner wall of the first through hole to obtain a PCB with a double-sided jack. During use, an IC (Integrated Circuit) chip is inserted into the upper and the lower blind holes of the PCB; and because the inner wall of a second through hole is insulated, the IC chip in the upper and the lower blind holes can not be short-circuited. The lamination is needed once in the invention, the process flow is shortened; the upper and the lower blind holes are aligned accurately, and thereby, the malposition phenomenon of the upper and the lower blind holes of the traditional two subboards during lamination is prevented; and because the integration of the double-sided jack processed by the invention is still a through hole, the problems of liquid medicine hiding, easy oxidization, no coating on the inner wall, and the like because the double-sided jack in the prior art is a blind hole are solved.
Description
Technical field
The invention belongs to pcb board and make the field, relate in particular to the two-sided insert hole processing technology of a kind of pcb board.
Background technology
At present, the IC chip is located on the pcb board, mainly on pcb board, be processed insert hole, the IC chip is inserted in this insert hole get final product then.In the past, general single-sided process insert hole at pcb board, but signal frequency is low, can't satisfy the requirement of high frequency communication, in order to overcome this deficiency, all in the two-sided processing insert hole of pcb board, increase the integrated quantity of IC chip on the pcb board now, after using two-sided plug-in unit, can make signal frequency improve more than 1 times than single face plug-in unit.
The two-sided insert hole processing technology of existing P CB plate is as follows:
(1) as shown in Figure 1, at first, two daughter boards 91,92 are set, daughter board 91,92 is the pcb board of multilayer, respectively two daughter boards 91,92 is carried out lamination, makes between each layer on two daughter boards 91,92 to fit tightly together;
(2) then, as shown in Figure 2, on two daughter boards 91,92, process through hole 911,921 respectively;
(3) then, as shown in Figure 3, one epoxy resin board 93 is set between two daughter boards 91,92, after through hole 911, the 921 contraposition unanimities on two daughter boards 91,92 (being the dead in line of two through hole 911,921), these two daughter boards 91,92 are carried out lamination, because epoxy resin board 93 has viscosity, epoxy resin board 93 can bond together these two daughter boards 91,92, thereby make the pcb board that has two-sided insert hole, simultaneously, because epoxy resin board 93 is an insulation board, it can also prevent to be located at short circuit between the interior IC chip of two-sided insert hole.
Description by the two-sided insert hole processing technology of above-mentioned existing P CB plate as can be known because this technology has laminating technology twice, technological process is long; In the lamination process of step (3), often can have dislocation between two daughter boards 91,92, cause the through hole 911,921 on two daughter boards 91,92 dislocation also to occur, influence the quality of product.Simultaneously, because the two-sided insert hole of the pcb board that finally makes is a blind hole, in follow-up etch process, there is blind hole Tibetan medicine water, easy problem of oxidation, and in follow-up electroplating technology, also exists inwall not electroplate defectives such as metal.
Summary of the invention
The object of the present invention is to provide lamination of a kind of needs and the two-sided insert hole processing technology of the accurate pcb board of two-sided insert hole contraposition.
The present invention is achieved in that the two-sided insert hole processing technology of a kind of pcb board, may further comprise the steps:
(1) daughter board is set, described daughter board is carried out lamination, make between each layer on the described daughter board to fit tightly together;
(2) process blind hole coaxial, that size is identical respectively at the upper and lower surface of described daughter board;
(3) along the axis of described blind hole, two relative up and down blind holes are punched, form one first through hole, the diameter of described first through hole is than the little 0.3～0.4mm of diameter of described blind hole;
(4) described daughter board is electroplated, made the inwall of the described blind hole and first through hole all electroplate the metal level of 0.01～0.03mm;
(5), process second through hole, so that the metal level on described first through-hole wall is removed than the little 0.15～0.2mm of diameter of blind hole along the axis of described first through hole.
Preferably, in the step (3), the diameter of described first through hole is than the little 0.3mm of diameter of described blind hole.
Preferably, in the step (4), described plating is that copper is electroplated, and described metal level is a copper plate.
Preferably, in the step (5), the diameter of described second through hole is than the little 0.15mm of diameter of described blind hole.
The pcb board that has two-sided insert hole that the present invention makes is inserted in the IC chip in the blind hole up and down of pcb board and gets final product in use, because the insulation of the inwall of second through hole, thereby is located at up and down that the IC chip short circuit phenomenon can not occur in the blind hole.Compare with the existing pcb board that has two-sided insert hole, the present invention only needs a lamination to get final product, and has shortened technological process; Up and down blind hole contraposition of the present invention is accurate, avoided existing two daughter boards when lamination up and down blind hole the phenomenon of dislocation appears, guaranteed the quality of product; In addition, because the two-sided insert hole integral body that the present invention processes is through hole, the two-sided insert hole that has solved prior art is that blind hole causes Tibetan medicine water, easily oxidation, inwall to apply not first-class problem.
Description of drawings
Fig. 1 is the schematic diagram of two daughter boards providing of prior art;
Fig. 2 is the schematic diagram of processing through hole on two daughter boards that prior art provides;
Fig. 3 be prior art provide with two schematic diagrames that daughter board is laminated together;
Fig. 4 is the schematic diagram of a daughter board providing of the embodiment of the invention;
Fig. 5 is the schematic diagram at daughter board upper and lower surface processing blind hole that the embodiment of the invention provides;
Fig. 6 punches the schematic diagram that forms first through hole with two blind holes among Fig. 5;
Fig. 7 is the schematic diagram that the axis of first through hole in Fig. 6 is processed second through hole;
Fig. 8 is the schematic diagram of the pcb board that has two-sided insert hole that finally makes of the present invention.
Embodiment
In order to make purpose of the present invention, technical scheme and advantage clearer,, the present invention is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
The two-sided insert hole processing technology of a kind of pcb board that the embodiment of the invention provides may further comprise the steps:
(1) as shown in Figure 4, a daughter board 1 is set, daughter board 1 is carried out lamination, make between each layer on the daughter board 1 to fit tightly together;
(2) as shown in Figure 5, process blind hole 11 coaxial, that size is identical respectively at the upper and lower surface of daughter board 1, the diameter of blind hole 11 is generally 0.7mm, owing to be the upper and lower surface processing blind hole 11 at a daughter board 1, thereby two relative up and down blind holes 11 are easy to contraposition;
(3) as shown in Figure 6, along the axis of blind hole 11, two relative up and down blind holes 11 are punched, form one first through hole 12, the diameter of first through hole 12 is than the little 0.3～0.4mm of diameter of blind hole 11, and preferably, the diameter of first through hole 12 is than the little 0.3mm of diameter of blind hole 11;
(4) daughter board 1 is electroplated, made the inwall of the blind hole 11 and first through hole 12 all electroplate metal level, metal layer thickness is 0.01～0.03mm, and described plating preferably copper is electroplated, and described metal level is a copper plate;
(5) as shown in Figure 7, along the axis of first through hole 12, process second through hole 13 than the little 0.15～0.2mm of diameter of blind hole 11, preferably, the diameter of second through hole 13 is than the little 0.15mm of diameter of blind hole 11; Compare as can be known by size above-mentioned first through hole 12 and second through hole 13, the diameter of second through hole 13 is than the big 0.1～0.25mm of diameter of first through hole 12, and first through hole, 12 inwall electroplated metal layer thicknesses are 0.01～0.03mm, much smaller than 0.1mm, thereby process second through hole 13 and the metal level of electroplating on first through hole, 12 inwalls all can be removed, make the inwall insulation of second through hole 13, so just made the pcb board (as shown in Figure 8) that has two-sided insert hole.
The pcb board that has two-sided insert hole that the present invention makes is inserted in the IC chip in the blind hole up and down 11 of pcb board and get final product in use, because the insulation of the inwall of second through hole 13, thereby is located at up and down that blind hole 11 interior IC chips short circuit phenomenon can not occur.Compare with the existing pcb board that has two-sided insert hole, the present invention only needs a lamination to get final product, and has shortened technological process; Up and down blind hole 11 contrapositions of the present invention are accurate, avoided existing two daughter boards when lamination up and down blind hole the phenomenon of dislocation appears, guaranteed the quality of product; In addition, because the two-sided insert hole integral body that the present invention processes is through hole, the two-sided insert hole that has solved prior art is that blind hole causes Tibetan medicine water, easily oxidation, inwall to apply not first-class problem.
The above only is preferred embodiment of the present invention, not in order to restriction the present invention, all any modifications of being done within the spirit and principles in the present invention, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (4)
1. two-sided insert hole processing technology of pcb board is characterized in that may further comprise the steps:
(1) daughter board is set, described daughter board is carried out lamination, make between each layer on the described daughter board to fit tightly together;
(2) process blind hole coaxial, that size is identical respectively at the upper and lower surface of described daughter board;
(3) along the axis of described blind hole, two relative up and down blind holes are punched, form one first through hole, the diameter of described first through hole is than the little 0.3～0.4mm of diameter of described blind hole;
(4) described daughter board is electroplated, made the inwall of the described blind hole and first through hole all electroplate the metal level of 0.01～0.03mm;
(5), process second through hole, so that the metal level on described first through-hole wall is removed than the little 0.15～0.2mm of diameter of blind hole along the axis of described first through hole.
2. the two-sided insert hole processing technology of pcb board as claimed in claim 1 is characterized in that: in the step (3), the diameter of described first through hole is than the little 0.3mm of diameter of described blind hole.
3. the two-sided insert hole processing technology of pcb board as claimed in claim 1 is characterized in that: in the step (4), described plating is that copper is electroplated, and described metal level is a copper plate.
4. the two-sided insert hole processing technology of pcb board as claimed in claim 1 is characterized in that: in the step (5), the diameter of described second through hole is than the little 0.15mm of diameter of described blind hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010119813 CN102196677B (en) | 2010-03-08 | 2010-03-08 | PCB (Printed Circuit Board) double-sided jack machining process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010119813 CN102196677B (en) | 2010-03-08 | 2010-03-08 | PCB (Printed Circuit Board) double-sided jack machining process |
Publications (2)
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| CN102196677A true CN102196677A (en) | 2011-09-21 |
| CN102196677B CN102196677B (en) | 2013-03-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201010119813 Active CN102196677B (en) | 2010-03-08 | 2010-03-08 | PCB (Printed Circuit Board) double-sided jack machining process |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104797080A (en) * | 2015-04-20 | 2015-07-22 | 深圳崇达多层线路板有限公司 | Circuit board and through-hole manufacturing method thereof |
| CN105208776A (en) * | 2015-09-06 | 2015-12-30 | 浪潮电子信息产业股份有限公司 | PCB double-face pressure-connecting method |
| CN105307398A (en) * | 2015-10-22 | 2016-02-03 | 深圳崇达多层线路板有限公司 | Technology for preventing liquid from being hidden in rivet hole of multi-laminated multilayer circuit board |
| CN105682351A (en) * | 2016-04-01 | 2016-06-15 | 广州兴森快捷电路科技有限公司 | Preparation method of printed circuit board capable of realizing double-faced plugging and printed circuit board |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06164138A (en) * | 1992-11-27 | 1994-06-10 | Hitachi Telecom Technol Ltd | Single-sided through hole board |
| US20030012004A1 (en) * | 2001-07-10 | 2003-01-16 | Nippon Avionics Co., Ltd. | Printed wiring board having non-through lead mounting hole and manufacturing method of the same |
| CN1638612A (en) * | 2003-12-22 | 2005-07-13 | 株式会社东芝 | Multilayer printed wiring board and producing method thereof |
| CN101160027A (en) * | 2007-10-30 | 2008-04-09 | 日月光半导体制造股份有限公司 | Method of producing circuit board and compound circuit substrates with through-hole plating structure |
| CN101296583A (en) * | 2008-04-24 | 2008-10-29 | 苏州市惠利华电子有限公司 | Method for processing printed circuit board |
| CN101351091A (en) * | 2007-07-16 | 2009-01-21 | 欣兴电子股份有限公司 | Line connection technique and structure thereof |
| CN101640983A (en) * | 2009-09-10 | 2010-02-03 | 深南电路有限公司 | Processing method of printing circuit board blind hole |
-
2010
- 2010-03-08 CN CN 201010119813 patent/CN102196677B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06164138A (en) * | 1992-11-27 | 1994-06-10 | Hitachi Telecom Technol Ltd | Single-sided through hole board |
| US20030012004A1 (en) * | 2001-07-10 | 2003-01-16 | Nippon Avionics Co., Ltd. | Printed wiring board having non-through lead mounting hole and manufacturing method of the same |
| CN1638612A (en) * | 2003-12-22 | 2005-07-13 | 株式会社东芝 | Multilayer printed wiring board and producing method thereof |
| CN101351091A (en) * | 2007-07-16 | 2009-01-21 | 欣兴电子股份有限公司 | Line connection technique and structure thereof |
| CN101160027A (en) * | 2007-10-30 | 2008-04-09 | 日月光半导体制造股份有限公司 | Method of producing circuit board and compound circuit substrates with through-hole plating structure |
| CN101296583A (en) * | 2008-04-24 | 2008-10-29 | 苏州市惠利华电子有限公司 | Method for processing printed circuit board |
| CN101640983A (en) * | 2009-09-10 | 2010-02-03 | 深南电路有限公司 | Processing method of printing circuit board blind hole |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104797080A (en) * | 2015-04-20 | 2015-07-22 | 深圳崇达多层线路板有限公司 | Circuit board and through-hole manufacturing method thereof |
| CN105208776A (en) * | 2015-09-06 | 2015-12-30 | 浪潮电子信息产业股份有限公司 | PCB double-face pressure-connecting method |
| CN105307398A (en) * | 2015-10-22 | 2016-02-03 | 深圳崇达多层线路板有限公司 | Technology for preventing liquid from being hidden in rivet hole of multi-laminated multilayer circuit board |
| CN105307398B (en) * | 2015-10-22 | 2018-06-15 | 深圳崇达多层线路板有限公司 | A kind of anti-technique of multilayer circuit board rivet hole Zang Shui repeatedly pressed |
| CN105682351A (en) * | 2016-04-01 | 2016-06-15 | 广州兴森快捷电路科技有限公司 | Preparation method of printed circuit board capable of realizing double-faced plugging and printed circuit board |
| CN105682351B (en) * | 2016-04-01 | 2018-09-25 | 广州兴森快捷电路科技有限公司 | A kind of method for manufacturing printed circuit board and printed circuit board of two-sided plug-in unit |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102196677B (en) | 2013-03-20 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: SHENNAN CIRCUIT CO., LTD. Free format text: FORMER NAME: SHENZHEN SHENNAN CIRCUITS CO., LTD. |
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| CP01 | Change in the name or title of a patent holder |
Address after: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |