CN105682351A - Preparation method of printed circuit board capable of realizing double-faced plugging and printed circuit board - Google Patents
Preparation method of printed circuit board capable of realizing double-faced plugging and printed circuit board Download PDFInfo
- Publication number
- CN105682351A CN105682351A CN201610208225.5A CN201610208225A CN105682351A CN 105682351 A CN105682351 A CN 105682351A CN 201610208225 A CN201610208225 A CN 201610208225A CN 105682351 A CN105682351 A CN 105682351A
- Authority
- CN
- China
- Prior art keywords
- copper
- circuit board
- clad plate
- printed circuit
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
Abstract
The invention discloses a preparation method of a printed circuit board capable of realizing double-faced plugging. The method comprises the following steps: S1) preparing a plug-in hole for two copper-clad plates respectively; S2) carrying out plated-through hole preparation on the plug-in holes of the two copper-clad plates respectively; S3) pressing the two copper-clad plates to form a printed circuit board; S4) carrying out depth-control hole preparation: drilling through a drilling machine from the top layer of one copper-clad plate to the surface of the top-layer copper of the other copper-clad plate in a depth control manner at one side of one plated-through hole; and S5) filling conductive slurry in a depth-control hole until the conductive slurry rises beyond the bottom-layer copper of the copper-clad plate to enable the two plated-through holes to be electrically conducted through the conductive slurry. The preparation method of the printed circuit board capable of realizing double-faced plugging can prevent the conductive slurry from entering the plug-in holes, and realize double-faced device plugging and electrical conduction. The invention also discloses the printed circuit board prepared with the preparation method of the printed circuit board capable of realizing double-faced plugging.
Description
Technical field
The present invention relates to circuit board, particularly relate to method for manufacturing printed circuit board and the printed circuit board of a kind of two-sided plug-in unit.
Background technology
Along with electronic product function from strength to strength, large scale, thickness of slab, the electroplates in hole ability etc. have reached the limit of capacity of equipment all so that the processing technique of multilayer printed circuit board is difficult to promote, and the traditional machining processes of multi-layer PCB is brought great challenge. Therefore occur in that the circuit board of two-sided plug-in unit, namely all carry out plug-in unit at plated-through hole (edge PTH hole) two ends. To this type of circuit board when plug-in mounting device, electrocondution slurry easily flows in edge PTH hole affects aperture and hole depth, causes realizing plug-in mounting device.
Summary of the invention
In order to overcome the deficiencies in the prior art, an object of the present invention is in that to provide the method for manufacturing printed circuit board of a kind of two-sided plug-in unit, can prevent electrocondution slurry from entering in insert hole, it is achieved two-sided plug-in mounting device electrically conducting.
The two of the purpose of the present invention are in that to provide the printed circuit board of the method for manufacturing printed circuit board adopting described two-sided plug-in unit.
An object of the present invention realizes by the following technical solutions:
The method for manufacturing printed circuit board of a kind of two-sided plug-in unit, comprises the following steps:
S1, respectively two pieces of copper-clad plates are made insert hole;
S2, respectively the insert hole of described two pieces of copper-clad plates is carried out plated through-hole making;
S3, described two pieces of copper-clad plate pressings are formed printed circuit board;
S4, control deep hole make: the side of a plated through-hole wherein, by the top layer copper sheet surface of rig copper-clad plate top layer control deep drilling from which to another copper-clad plate;
S5, add in control deep hole and do not have the electrocondution slurry of this control deep hole place copper-clad plate bottom copper sheet, make two plated through-holes be connected by electrocondution slurry electrically conducting.
Preferably, in step s3, two pieces of copper-clad plates adopt prepreg to carry out pressing.
Preferably, in step s 5, toward the resin material of filled conductive in control deep hole.
Preferably, in step sl, two pieces of copper-clad plates get out two relative described insert hole in position.
The two of the purpose of the present invention realize by the following technical solutions:
Adopt the printed circuit board of the method for manufacturing printed circuit board of described two-sided plug-in unit, it is characterised in that include the fixing connection of the first copper-clad plate and second copper-clad plate, the first copper-clad plate and second copper-clad plate; First copper-clad plate and second copper-clad plate offer insert hole respectively, and insert hole forms corresponding and the copper sheet of the first copper-clad plate, the copper sheet electrically conducting of second copper-clad plate plated through-hole by metallizing; First copper-clad plate offers control deep hole, this control deep hole and insert hole are separated by, and this control deep hole extends to the topsheet surface of second copper-clad plate from the top layer of the first copper-clad plate, being filled with electrocondution slurry in this control deep hole, two plated through-holes are connected by electrocondution slurry electrically conducting.
Preferably, it is filled with, in control deep hole, the resin bed being positioned at outside electrocondution slurry.
Preferably, two insert hole are coaxial.
Compared to existing technology, the beneficial effects of the present invention is:
Two pieces of copper-clad plate pressings, by making in two enterprising row metal holes of copper-clad plate respectively, are then formed a printed circuit board, it is achieved two-sided plug-in mounting device on the plated through-hole on printed circuit board two sides by the manufacture method of the present invention; The opposite side of one piece of copper-clad plate wherein increases by a control deep hole by holing afterwards, control deep hole is deep to the top layer copper sheet surface of another copper-clad plate from the top layer control of this copper-clad plate, electrocondution slurry is added in plated through-hole, electrocondution slurry and plated through-hole are separated, electrocondution slurry is avoided to flow to the hole depth and aperture affecting plated through-hole in plated through-hole, realizing plug-in mounting device, realize the electrical connectivity in two-sided metallization hole simultaneously, this manufacture method simply and easily operates.
The printed circuit board of the present invention is by electrocondution slurry by two plated through-hole electrically conductings, and its conduction property is reliable, the device of institute's plug-in mounting also simple and easy, be inserted in plated through-hole securely, reduce defect rate.
Accompanying drawing explanation
Fig. 1 is originally the structural representation of printed circuit board of the present invention.
Wherein, the 1, first copper-clad plate; 11, insert hole; 12, control deep hole; 2, second copper-clad plate; 3, electrocondution slurry; 4, prepreg.
Detailed description of the invention
Below, in conjunction with detailed description of the invention, the present invention is described further:
The method for manufacturing printed circuit board of a kind of two-sided plug-in unit, comprises the following steps:
S1, respectively two pieces of copper-clad plates are made insert hole 11;
S2, respectively the insert hole 11 of described two pieces of copper-clad plates is carried out plated through-hole making;
S3, described two pieces of copper-clad plate pressings are formed printed circuit board;
S4, control deep hole 12 make: the side of a plated through-hole wherein, by the top layer copper sheet surface of rig copper-clad plate top layer control deep drilling from which to another copper-clad plate;
S5, add in control deep hole 12 and not have the electrocondution slurry 3 of this control deep hole 12 place copper-clad plate bottom copper sheet, make two plated through-holes by the connection of electrocondution slurry 3 electrically conducting.
In described step S1-S3, two pieces of copper-clad plates carry out insert hole 11 make and insert hole 11 is carried out plated through-hole making, form two insert hole 11 that can be used for external devices grafting, in the present embodiment, the above-mentioned insert hole 11 of two relative positions can be got out in two pieces of copper-clad plates, afterwards two pieces of copper-clad plate pressings are formed printed circuit, make this printed circuit can carry out plug-in unit from two-sided, simultaneously, in described step S4 and S5, the side of the insert hole 11 of a copper-clad plate wherein increases by a control deep hole 12, utilize the rig can when not injuring copper sheet surface, just control deep drilling is to the surface of another block copper-clad plate top layer copper sheet,Electrocondution slurry 3 is added afterwards in control deep hole 12, two plated through-holes form loop respectively through copper sheet and electrocondution slurry 3, it is achieved electrically conducting connects, thus realizing two-sided plug-in unit, avoid electrocondution slurry 3 to flow in plated through-hole simultaneously, affect metallized hole depth and aperture; This is easy to make simply, easily operates, and can realize the two-sided plug-in unit of printed circuit board preferably.
Wherein, in step S3, it is possible to adopt prepreg 4 that two pieces of copper-clad plates are carried out pressing, can prevent glue in bonding processes from overflowing; And in step s 5, when past control deep hole 12 adds electrocondution slurry 3, can first be filled into the resin material of conduction, it is prevented that electrocondution slurry 3 flows out from the pressing of two copper-clad plates, improve the sealing of printed circuit board.
Printed circuit board as shown in Figure 1, including the first copper-clad plate 1 and second copper-clad plate 2, the first copper-clad plate 1 and the fixing connection of second copper-clad plate 2, this connection can adopt immobilising prepreg 4; First copper-clad plate 1 and second copper-clad plate 2 offer insert hole 11 respectively, in the present embodiment, preferably two insert hole 11 are coaxially disposed, and insert hole 11 forms corresponding and the copper sheet of the first copper-clad plate 1, the copper sheet electrically conducting of second copper-clad plate 2 plated through-hole by metallizing, it is achieved two-sided plug-in unit; First copper-clad plate 1 offers control deep hole 12, this control deep hole 12 is separated by with insert hole 11, and this control deep hole 12 extends to the topsheet surface of second copper-clad plate 2 from the top layer of the first copper-clad plate 1, it is filled with electrocondution slurry 3 in this control deep hole 12, two plated through-holes are connected by electrocondution slurry 3 electrically conducting, its conduction property is reliable, the device of institute's plug-in mounting also simple and easy, be inserted in plated through-hole securely, reduce defect rate.
In order to prevent electrocondution slurry 3 from overflowing between the first copper-clad plate 1 and second copper-clad plate 2, it is filled with, in control deep hole 12, the resin bed being positioned at outside electrocondution slurry 3.
It will be apparent to those skilled in the art that can technical scheme as described above and design, make other various corresponding changes and deformation, and all these change and deformation all should belong within the protection domain of the claims in the present invention.
Claims (7)
1. the method for manufacturing printed circuit board of a two-sided plug-in unit, it is characterised in that comprise the following steps:
S1, respectively two pieces of copper-clad plates are made insert hole;
S2, respectively the insert hole of described two pieces of copper-clad plates is carried out plated through-hole making;
S3, described two pieces of copper-clad plate pressings are formed printed circuit board;
S4, control deep hole make: the side of a plated through-hole wherein, by the top layer copper sheet surface of rig copper-clad plate top layer control deep drilling from which to another copper-clad plate;
S5, add in control deep hole and do not have the electrocondution slurry of this control deep hole place copper-clad plate bottom copper sheet, make two plated through-holes be connected by electrocondution slurry electrically conducting.
2. the method for manufacturing printed circuit board of two-sided plug-in unit as claimed in claim 1, it is characterised in that in step s3, two pieces of copper-clad plates adopt prepreg to carry out pressing.
3. the method for manufacturing printed circuit board of two-sided plug-in unit as claimed in claim 1, it is characterised in that in step s 5, the resin material of filled conductive in control deep hole.
4. the method for manufacturing printed circuit board of two-sided plug-in unit as claimed in claim 1, it is characterised in that in step sl, gets out two relative described insert hole in position in two pieces of copper-clad plates.
5. adopt the printed circuit board of the method for manufacturing printed circuit board of two-sided plug-in unit described in any one of Claims 1 to 4, it is characterised in that include the fixing connection of the first copper-clad plate and second copper-clad plate, the first copper-clad plate and second copper-clad plate;First copper-clad plate and second copper-clad plate offer insert hole respectively, and insert hole forms corresponding and the copper sheet of the first copper-clad plate, the copper sheet electrically conducting of second copper-clad plate plated through-hole by metallizing; First copper-clad plate offers control deep hole, this control deep hole and insert hole are separated by, and this control deep hole extends to the topsheet surface of second copper-clad plate from the top layer of the first copper-clad plate, being filled with electrocondution slurry in this control deep hole, two plated through-holes are connected by electrocondution slurry electrically conducting.
6. printed circuit board as claimed in claim 5, it is characterised in that be filled with, in control deep hole, the resin bed being positioned at outside electrocondution slurry.
7. the printed circuit board as described in claim 5 or 6, it is characterised in that two insert hole are coaxial.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610208225.5A CN105682351B (en) | 2016-04-01 | 2016-04-01 | A kind of method for manufacturing printed circuit board and printed circuit board of two-sided plug-in unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610208225.5A CN105682351B (en) | 2016-04-01 | 2016-04-01 | A kind of method for manufacturing printed circuit board and printed circuit board of two-sided plug-in unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105682351A true CN105682351A (en) | 2016-06-15 |
| CN105682351B CN105682351B (en) | 2018-09-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610208225.5A Active CN105682351B (en) | 2016-04-01 | 2016-04-01 | A kind of method for manufacturing printed circuit board and printed circuit board of two-sided plug-in unit |
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| Country | Link |
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| CN (1) | CN105682351B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101848606A (en) * | 2010-04-21 | 2010-09-29 | 华为技术有限公司 | Method for manufacturing printed circuit board and printed circuit board |
| EP2361001A1 (en) * | 2010-02-19 | 2011-08-24 | Endress + Hauser GmbH + Co. KG | Soldering mask for wave soldering and method for selective soldering of individual components of a circuit board in a wave soldering machine |
| CN102196677A (en) * | 2010-03-08 | 2011-09-21 | 深南电路有限公司 | PCB (Printed Circuit Board) double-sided jack machining process |
| CN102686051A (en) * | 2012-06-07 | 2012-09-19 | 杭州华三通信技术有限公司 | Processing method of printed circuit board (PCB) and PCB |
| CN104768326A (en) * | 2015-03-31 | 2015-07-08 | 华为技术有限公司 | Printed circuit board and printed circuit board manufacturing method |
-
2016
- 2016-04-01 CN CN201610208225.5A patent/CN105682351B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2361001A1 (en) * | 2010-02-19 | 2011-08-24 | Endress + Hauser GmbH + Co. KG | Soldering mask for wave soldering and method for selective soldering of individual components of a circuit board in a wave soldering machine |
| CN102196677A (en) * | 2010-03-08 | 2011-09-21 | 深南电路有限公司 | PCB (Printed Circuit Board) double-sided jack machining process |
| CN101848606A (en) * | 2010-04-21 | 2010-09-29 | 华为技术有限公司 | Method for manufacturing printed circuit board and printed circuit board |
| CN102686051A (en) * | 2012-06-07 | 2012-09-19 | 杭州华三通信技术有限公司 | Processing method of printed circuit board (PCB) and PCB |
| CN104768326A (en) * | 2015-03-31 | 2015-07-08 | 华为技术有限公司 | Printed circuit board and printed circuit board manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105682351B (en) | 2018-09-25 |
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