CN105682351B - A kind of method for manufacturing printed circuit board and printed circuit board of two-sided plug-in unit - Google Patents
A kind of method for manufacturing printed circuit board and printed circuit board of two-sided plug-in unit Download PDFInfo
- Publication number
- CN105682351B CN105682351B CN201610208225.5A CN201610208225A CN105682351B CN 105682351 B CN105682351 B CN 105682351B CN 201610208225 A CN201610208225 A CN 201610208225A CN 105682351 B CN105682351 B CN 105682351B
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- CN
- China
- Prior art keywords
- copper
- hole
- printed circuit
- clad plate
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a kind of method for manufacturing printed circuit board of two-sided plug-in unit, include the following steps：S1, insert hole is made to two pieces of copper-clad plates respectively；S2, plated through-hole making is carried out to the insert hole of two pieces of copper-clad plates respectively；S3, it presses two pieces of copper-clad plates to form printed circuit board；S4, control deep hole make：The side of a plated through-hole wherein, the top layer copper sheet surface by drilling machine from one of copper-clad plate top layer control deep drilling to another copper-clad plate；S5, be added in controlling deep hole do not cross the control deep hole where copper-clad plate bottom copper sheet electrocondution slurry, so that two plated through-holes is passed through electrocondution slurry electrically conducting and connect.The present invention provides a kind of method for manufacturing printed circuit board of two-sided plug-in unit, can prevent electrocondution slurry from entering in insert hole, realizes two-sided inserting device and electrically conducting.The invention also discloses the printed circuit boards of the method for manufacturing printed circuit board using two-sided plug-in unit.
Description
Technical field
The present invention relates to circuit board more particularly to a kind of method for manufacturing printed circuit board and printed circuit of two-sided plug-in unit
Plate.
Background technology
As electronic product function is stronger and stronger, large scale, plate thickness, the electroplates in hole ability etc. have reached capacity of equipment
The limit so that the processing technology of multilayer printed circuit board is difficult to be promoted, and is brought greatly to the traditional machining processes of multi-layer PCB
Challenge.Therefore there is the circuit board of two-sided plug-in unit, i.e., all carry out plug-in unit at plated-through hole (edge PTH hole) both ends.It is right
For such circuit board when inserting device, electrocondution slurry, which easily flows into, influences aperture and hole depth in edge PTH hole, leads to not realize instrumenter
Part.
Invention content
For overcome the deficiencies in the prior art, one of the objects of the present invention is to provide a kind of printed circuits of two-sided plug-in unit
Board manufacturing method can prevent electrocondution slurry from entering in insert hole, realize two-sided inserting device and electrically conducting.
The second object of the present invention is to provide the printing electricity using the method for manufacturing printed circuit board of the two-sided plug-in unit
Road plate.
An object of the present invention is realized using following technical scheme：
A kind of method for manufacturing printed circuit board of two-sided plug-in unit, includes the following steps：
S1, insert hole is made to two pieces of copper-clad plates respectively；
S2, plated through-hole making is carried out to the insert hole of two pieces of copper-clad plates respectively；
S3, it presses two pieces of copper-clad plates to form printed circuit board；
S4, control deep hole make：The side of a plated through-hole wherein, it is deep from one of copper-clad plate top layer control by drilling machine
It is drilled into the top layer copper sheet surface of another copper-clad plate；
S5, be added in controlling deep hole do not cross the control deep hole where copper-clad plate bottom copper sheet electrocondution slurry, make two metallization
Hole is connected by electrocondution slurry electrically conducting.
Preferably, in step s3, two pieces of copper-clad plates are pressed using prepreg.
Preferably, in step s 5, conductive resin material is filled into control deep hole.
Preferably, in step sl, the opposite insert hole in two positions is drilled out in two pieces of copper-clad plates.
The second object of the present invention is realized using following technical scheme：
Using the printed circuit board of the method for manufacturing printed circuit board of the two-sided plug-in unit, which is characterized in that including first
Copper-clad plate and second copper-clad plate, the first copper-clad plate are fixedly connected with second copper-clad plate；First copper-clad plate and second copper-clad plate difference
Insert hole is offered, and insert hole passes through the copper sheet electricity of the metallize copper sheet, second copper-clad plate that form corresponding and the first copper-clad plate
The logical plated through-hole of conductance；First copper-clad plate offers control deep hole, which is separated by with insert hole, and the control deep hole is from first
The top layer of copper-clad plate extends to the topsheet surface of second copper-clad plate, and electrocondution slurry is filled in the control deep hole, and two plated through-holes are logical
Cross the connection of electrocondution slurry electrically conducting.
Preferably, filled with the resin layer being located on the outside of electrocondution slurry in control deep hole.
Preferably, two insert holes are coaxial.
Compared with prior art, the beneficial effects of the present invention are：
Then the production method of the present invention covers copper by being made respectively in the enterprising row metal hole of two copper-clad plates by two pieces
Plate presses to form a printed circuit board, realizes the two-sided inserting device on the plated through-hole on printed circuit board two sides；Exist later
The other side of one of copper-clad plate increases by a control deep hole by drilling, and control deep hole is deep to another from the top layer control of the copper-clad plate
The top layer copper sheet surface of copper-clad plate, electrocondution slurry is added into plated through-hole, electrocondution slurry and plated through-hole are separated, avoids leading
Plasma-based stream realizes inserting device, while realizing two-sided metallization into the hole depth of influence plated through-hole and aperture in plated through-hole
The electrical connectivity in hole, the production method are simple and easy to operate.
The printed circuit board of the present invention is by electrocondution slurry by two plated through-hole electrically conductings, and conduction property is reliable, institute
The device of inserting is also simple, is securely inserted into plated through-hole, reduces defect rate.
Description of the drawings
Fig. 1 sheets are the structural schematic diagram of printed circuit board of the present invention.
Wherein, the 1, first copper-clad plate；11, insert hole；12, deep hole is controlled；2, second copper-clad plate；3, electrocondution slurry；4, half is solid
Change piece.
Specific implementation mode
In the following, in conjunction with specific implementation mode, the present invention is described further：
A kind of method for manufacturing printed circuit board of two-sided plug-in unit, includes the following steps：
S1, insert hole 11 is made to two pieces of copper-clad plates respectively；
S2, plated through-hole making is carried out to the insert hole 11 of two pieces of copper-clad plates respectively；
S3, it presses two pieces of copper-clad plates to form printed circuit board；
S4, control deep hole 12 make：The side of a plated through-hole wherein, by drilling machine from one of copper-clad plate top layer control
Deep drilling is to the top layer copper sheet surface of another copper-clad plate；
S5, the electrocondution slurry 3 for not crossing the 12 place copper-clad plate bottom copper sheet of control deep hole is added in controlling deep hole 12, makes two gold medals
Categoryization hole is connected by 3 electrically conducting of electrocondution slurry.
In the step S1-S3, the making of insert hole 11 is carried out to two pieces of copper-clad plates and is metallized to insert hole 11
Hole makes, formed two can be used for the insert hole of external devices grafting 11, in the present embodiment, can be bored in two pieces of copper-clad plates
Go out the above-mentioned insert hole 11 of two relative positions, presses to form printed circuit by two pieces of copper-clad plates later, make the printed circuit can
With from two-sided carry out plug-in unit, meanwhile, in the step S4 and S5, the side of the insert hole 11 of a copper-clad plate wherein increases by one
Deep hole 12 is controlled, deep drilling can be just controlled to another block of copper-clad plate top layer copper in the case where not injuring copper sheet surface using drilling machine
The surface of piece；Electrocondution slurry 3 is added into control deep hole 12 later, two plated through-holes pass through copper sheet and 3 shape of electrocondution slurry respectively
At circuit, electrically conducting connection is realized, to realize two-sided plug-in unit, while electrocondution slurry 3 being avoided to flow into plated through-hole, influenced
The hole depth of metallization and aperture；This is simple and easy to make, easy to operate, and can preferably realize the two-sided plug-in unit of printed circuit board.
Wherein, in step S3, prepreg 4 may be used, two pieces of copper-clad plates is pressed, can prevent in bonding processes
Glue overflows；And in step s 5, when electrocondution slurry 3 is added toward control deep hole 12, it can be first filled into conductive resin material, prevent from leading
Plasma-based material 3 is flowed out from pressing place of two copper-clad plates, improves the leakproofness of printed circuit board.
Printed circuit board as shown in Figure 1, including the first copper-clad plate 1 and second copper-clad plate 2, the first copper-clad plate 1 and second
Copper-clad plate 2 is fixedly connected, which can be used immobilising prepreg 4；First copper-clad plate 1 and second copper-clad plate 2 are opened respectively
Equipped with insert hole 11, in the present embodiment, the coaxial arrangement of preferably two insert holes 11, and insert hole 11 by metallize formed it is corresponding with
The plated through-hole of the copper sheet of first copper-clad plate 1, the copper sheet electrically conducting of second copper-clad plate 2, realizes two-sided plug-in unit；First copper-clad plate
1 offers control deep hole 12, which is separated by with insert hole 11, and the control deep hole 12 extends from the top layer of the first copper-clad plate 1
To the topsheet surface of second copper-clad plate 2, electrocondution slurry 3 is filled in the control deep hole 12, two plated through-holes pass through 3 electricity of electrocondution slurry
Conductance, which is led to, to be connect, and conduction property is reliable, and the device inserted is also simple, is securely inserted into plated through-hole, is reduced secondary
Product rate.
Electrocondution slurry 3 is overflowed between the first copper-clad plate 1 and second copper-clad plate 2 in order to prevent, is controlled and is filled in deep hole 12
Resin layer positioned at 3 outside of electrocondution slurry.
It will be apparent to those skilled in the art that technical solution that can be as described above and design, make various other
Corresponding change and deformation, and all these changes and deformation should all belong to the protection domain of the claims in the present invention
Within.
Claims (7)
1. a kind of method for manufacturing printed circuit board of two-sided plug-in unit, which is characterized in that include the following steps：
S1, insert hole is made to two pieces of copper-clad plates respectively；
S2, plated through-hole making is carried out to the insert hole of two pieces of copper-clad plates respectively；
S3, it presses two pieces of copper-clad plates to form printed circuit board；
S4, control deep hole make：The side of a plated through-hole wherein, by drilling machine from one of copper-clad plate top layer control deep drilling to
The top layer copper sheet surface of another copper-clad plate；
S5, be added in controlling deep hole do not cross the control deep hole where copper-clad plate bottom copper sheet electrocondution slurry, keep two plated through-holes logical
Cross the connection of electrocondution slurry electrically conducting.
2. the method for manufacturing printed circuit board of two-sided plug-in unit as described in claim 1, which is characterized in that in step s3, two
Block copper-clad plate is pressed using prepreg.
3. the method for manufacturing printed circuit board of two-sided plug-in unit as described in claim 1, which is characterized in that in step s 5, past
Conductive resin material is filled in control deep hole.
4. the method for manufacturing printed circuit board of two-sided plug-in unit as described in claim 1, which is characterized in that in step sl,
The opposite insert hole in two positions is drilled out in two pieces of copper-clad plates.
5. special using the printed circuit board of any one of the Claims 1 to 4 method for manufacturing printed circuit board of the two-sided plug-in unit
Sign is, including the first copper-clad plate and second copper-clad plate, the first copper-clad plate are fixedly connected with second copper-clad plate；First copper-clad plate and
Second copper-clad plate offers insert hole respectively, and insert hole passes through the copper sheet for forming corresponding and the first copper-clad plate, second of metallizing
The plated through-hole of the copper sheet electrically conducting of copper-clad plate；First copper-clad plate offers control deep hole, which is separated by with insert hole, and
The control deep hole extends to the topsheet surface of second copper-clad plate from the top layer of the first copper-clad plate, and conductive paste is filled in the control deep hole
Material, two plated through-holes are connected by electrocondution slurry electrically conducting.
6. printed circuit board as claimed in claim 5, which is characterized in that filled on the outside of electrocondution slurry in control deep hole
Resin layer.
7. such as printed circuit board described in claim 5 or 6, which is characterized in that two insert holes are coaxial.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610208225.5A CN105682351B (en) | 2016-04-01 | 2016-04-01 | A kind of method for manufacturing printed circuit board and printed circuit board of two-sided plug-in unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610208225.5A CN105682351B (en) | 2016-04-01 | 2016-04-01 | A kind of method for manufacturing printed circuit board and printed circuit board of two-sided plug-in unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105682351A CN105682351A (en) | 2016-06-15 |
| CN105682351B true CN105682351B (en) | 2018-09-25 |
Family
ID=56308310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610208225.5A Active CN105682351B (en) | 2016-04-01 | 2016-04-01 | A kind of method for manufacturing printed circuit board and printed circuit board of two-sided plug-in unit |
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| Country | Link |
|---|---|
| CN (1) | CN105682351B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101848606A (en) * | 2010-04-21 | 2010-09-29 | 华为技术有限公司 | Method for manufacturing printed circuit board and printed circuit board |
| EP2361001A1 (en) * | 2010-02-19 | 2011-08-24 | Endress + Hauser GmbH + Co. KG | Soldering mask for wave soldering and method for selective soldering of individual components of a circuit board in a wave soldering machine |
| CN102196677A (en) * | 2010-03-08 | 2011-09-21 | 深南电路有限公司 | PCB (Printed Circuit Board) double-sided jack machining process |
| CN102686051A (en) * | 2012-06-07 | 2012-09-19 | 杭州华三通信技术有限公司 | Processing method of printed circuit board (PCB) and PCB |
| CN104768326A (en) * | 2015-03-31 | 2015-07-08 | 华为技术有限公司 | Printed circuit board and printed circuit board manufacturing method |
-
2016
- 2016-04-01 CN CN201610208225.5A patent/CN105682351B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2361001A1 (en) * | 2010-02-19 | 2011-08-24 | Endress + Hauser GmbH + Co. KG | Soldering mask for wave soldering and method for selective soldering of individual components of a circuit board in a wave soldering machine |
| CN102196677A (en) * | 2010-03-08 | 2011-09-21 | 深南电路有限公司 | PCB (Printed Circuit Board) double-sided jack machining process |
| CN101848606A (en) * | 2010-04-21 | 2010-09-29 | 华为技术有限公司 | Method for manufacturing printed circuit board and printed circuit board |
| CN102686051A (en) * | 2012-06-07 | 2012-09-19 | 杭州华三通信技术有限公司 | Processing method of printed circuit board (PCB) and PCB |
| CN104768326A (en) * | 2015-03-31 | 2015-07-08 | 华为技术有限公司 | Printed circuit board and printed circuit board manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105682351A (en) | 2016-06-15 |
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