CN109862701A - A kind of short method scrapped in reduction pcb board - Google Patents
A kind of short method scrapped in reduction pcb board Download PDFInfo
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- CN109862701A CN109862701A CN201910101712.5A CN201910101712A CN109862701A CN 109862701 A CN109862701 A CN 109862701A CN 201910101712 A CN201910101712 A CN 201910101712A CN 109862701 A CN109862701 A CN 109862701A
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- short
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- scrapped
- pcb board
- copper
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Abstract
The present invention provides a kind of short method scrapped in reduction pcb board, which is characterized in that comprising the following specific steps sawing sheet → pre-treatment → coating → exposure → development → etches → move back film → receipts plate → AOI → brownification；In the sawing sheet technique, need to manage edges of boards copper cloak burr；In the exposure technology, fall former label using alcohol wipe in film modification board mark；In the receipts plate technique, using the film partition cleaned, and clean board transfer carriage before loading board；In the brownification technique, the route of pcb board is face-down when putting plate.The method of the present invention generates copper scale from internal layer to brownification and returns viscous short circuit progress depth dissection, returns viscous various aspects according to copper scale producing cause and production process copper scale and is studied, formulates management-control method, so that short in effectively scrap, improves and produces plate yield, improves the performance of enterprises.
Description
Technical field
The invention belongs to PCB technical fields, and in particular to a method of reduce short in pcb board scrap.
Background technique
The hinge of carrier and circuit signal transmission as various components, has become the pass the most of electronics and IT products
The part of key, quality and the reliability level of quality determine the quality and reliability of whole set equipment.As electronic information produces
The miniaturization of product and the environmental requirement of lead-free and halogen-free, PCB is also to high-level, high-accuracy, high quality, high TG and environmental protection
Direction is developed, and wiring board manufacture difficulty is also higher and higher, the special product of especially some special industries, route distribution, layer
Between distribution, thickness, material have different requirements.
As development in science and technology is swift and violent, requirement of the people for wiring board is higher and higher, and the pcb board number of plies becomes high, route
It is increasingly finer, and finer route it is easier because between line there are copper wire copper scale caused by short circuit, generate internal short-circuit (interior short)
It scraps.
Summary of the invention
In view of this, the present invention provides a kind of short method scrapped in reduction pcb board, the present invention
The technical solution of the present invention is as follows:
A kind of short method scrapped in reduction pcb board, which is characterized in that comprising the following specific steps sawing sheet → pre-treatment → painting
Cloth → exposure → development → etches → moves back film → receipts plate → AOI → brownification；
In the sawing sheet technique, need to manage edges of boards copper cloak burr；
In the exposure technology, fall former label using alcohol wipe in film modification board mark；
In the receipts plate technique, using the film partition cleaned, and clean board transfer carriage before loading board；
In the brownification technique, the route of pcb board is face-down when putting plate.
In the present invention, pass through sawing sheet edges of boards copper burr burr and manage: sawing sheet copper burr burr easily falls copper scale in board transfer carriage,
Subsequent rotating plate copper scale is easily caused to return viscous.
Fall former label using alcohol wipe when modifying board mark by the film: for convenience of subsequent abnormal retrospect, it will usually
Exposure bench number is write in edges of boards region with film pen, change board then needs to indicate before clear when producing item number old film next time
Except indicating again, is struck off and person's handwriting can not be thoroughly removed using the writing of indictments, appeals, etc. when such as removing, easily left filament person's handwriting, lost through DES line
Filamentous copper residual marked position can be left after quarter, such copper wire The book of Changes plate for carrying subprocess friction is easily fallen in partition film, rotating plate
On vehicle or plate face.Therefore label is struck off in the unusable writing of indictments, appeals, etc., need to be clean with alcohol wipe.
Cleaned by film: for film because of edges of boards burr, plate face falls copper scale, and repairing falls copper scale upper copper scale easy to stick, film
Upper copper scale, which easily returns to glue, causes short circuit to plate face.Therefore partition must use the new film cleaned.
It is cleaned by board transfer carriage: going to AOI from internal layer, going to before each loading board of board transfer carriage that brownification uses from AOI needs clearly
The copper wire copper scale of clean clean board transfer carriage avoids copper scale from polluting plate face, film, forms cross contamination.
Put printed line road surface downward by brownification: through it is interior it is short scrap plate analysis, in the intensive item number of route it is short scrap it is especially serious,
Brownification, which puts printed line road surface downward, can effectively prevent to stay copper scale punching can't on the line to be washed off because of Gravity Problem original.
Further, further include interior short characterization processes, the interior short characterization processes comprising the following specific steps move back it is anti-welding →
Line → etching → stripping plate → mill section → is chased after to take pictures.Further, described to move back anti-welding step are as follows: will to be determined as internal short-circuit
PCB is marked on edges of boards and test-strips by model, quantity, then PCB is placed on rack for washing plate, is soaked after fixing
Bubble a period of time in the sodium hydroxide solution that concentration is 5%, temperature is 85 ± 5 DEG C, soaked PCB is then placed on punching
It washes on frame, the tow sides of PCB is first poured with tap water, so that the ink for being attached to pcb board face is expanded with heat and contract with cold and react and take off
It falls, then is rinsed well with giant, finally go over the moisture that hot-air seasoning line dries its surface.Further, print is primary
The PCB soaking time of oil is 40 ± 5min, and print PCB oily twice, which first impregnates, to be taken out flushing after 20min and chemically reacted
Anti-solder ink, be further continued for impregnate 30min.Further, described to chase after line step are as follows: the PCB dried is placed on and chases after line platform
On, show the line map of each layer of the PCB on computers, the test coordinate of input short point shows the two of short circuit on software
The network of a different colours can find the number of plies and general area of short circuit according to the network of display, then mark short circuit
Internal layer circuit line map, and indicate model and the number of plies.Further, the etching step are as follows: mark and line will have been finished
The PCB of road figure loses the table copper and hole copper of light PCB on internal layer DES line with acid etching liquid medicine, until copper etching in hole is clean, then will
PCB surface drying.Further, the stripping plate step are as follows: clean PCB will have been etched and be placed on stripping pallet, according to having indicated
Circuit hierarchy and the total hierarchy selection of PCB to peel off the approximate location of thickness, where finding drawn figure with blade incision plate angle
Then region peels off this layer, the place of two network shorts is found using magnifying glass, irises out label, then be torn into 40mm*
The slice of 40mm, and with chasing after, line is the same to write this item number model and the short-circuit number of plies in slice.Further, the mill section
Step are as follows: the slice for having performed mark is placed on by grinder, will be cut according to polyacrylic thickness difference is covered on short dot
Piece is divided into two classes, first uses the coarse sandpaper of 400# to grind compared with slab covered polyacrylic thickness, then with 800#'s
Sand paper grinding, is finally ground with the fine sandpaper of 1500#, directly uses 1500# for the slice of covered polyacrylic thinner thickness
Fine sandpaper grinding.Further, the step of taking pictures are as follows: before copper face oxidation, ground slice is face-up placed on
Gold is first used 50 times of lookup short dots of dark field, is then checked again with dark field 100 as microscopical shot region, and is risen by adjusting
The reason of nut adjusts image sharpness, is clear that internal short-circuit is dropped, finally takes pictures and saves picture.
The method for testing pcb board internal short-circuit through the invention can find the reason of internal short-circuit occurs for PCB and divide
Responsibility process is scrapped clearly.
The method of the present invention generates copper scale from internal layer to brownification to be returned viscous short circuit and carries out depth dissection, according to copper scale producing cause and
Production process copper scale returns viscous various aspects and is studied, and formulates management-control method, so that short in effectively scrap, improves production plate yield,
Improve the performance of enterprises.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with the embodiment of the present invention, it is clear that retouched
The embodiment stated is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, originally
Field those of ordinary skill every other embodiment obtained without making creative work, belongs to the present invention
The range of protection.
Embodiment 1
A kind of short method scrapped in reduction pcb board, which is characterized in that comprising the following specific steps sawing sheet → pre-treatment → painting
Cloth → exposure → development → etches → moves back film → receipts plate → AOI → brownification；
In the sawing sheet technique, need to manage edges of boards copper cloak burr；
In the exposure technology, fall former label using alcohol wipe in film modification board mark；
In the receipts plate technique, using the film partition cleaned, and clean board transfer carriage before loading board；
In the brownification technique, the route of pcb board is face-down when putting plate.
In the present invention, pass through sawing sheet edges of boards copper burr burr and manage: sawing sheet copper burr burr easily falls copper scale in board transfer carriage,
Subsequent rotating plate copper scale is easily caused to return viscous.
Fall former label using alcohol wipe when modifying board mark by the film: for convenience of subsequent abnormal retrospect, it will usually
Exposure bench number is write in edges of boards region with film pen, change board then needs to indicate before clear when producing item number old film next time
Except indicating again, is struck off and person's handwriting can not be thoroughly removed using the writing of indictments, appeals, etc. when such as removing, easily left filament person's handwriting, lost through DES line
Filamentous copper residual marked position can be left after quarter, such copper wire The book of Changes plate for carrying subprocess friction is easily fallen in partition film, rotating plate
On vehicle or plate face.Therefore label is struck off in the unusable writing of indictments, appeals, etc., need to be clean with alcohol wipe.
Cleaned by film: for film because of edges of boards burr, plate face falls copper scale, and repairing falls copper scale upper copper scale easy to stick, film
Upper copper scale, which easily returns to glue, causes short circuit to plate face.Therefore partition must use the new film cleaned.
It is cleaned by board transfer carriage: going to AOI from internal layer, going to before each loading board of board transfer carriage that brownification uses from AOI needs clearly
The copper wire copper scale of clean clean board transfer carriage avoids copper scale from polluting plate face, film, forms cross contamination.
Put printed line road surface downward by brownification: through it is interior it is short scrap plate analysis, in the intensive item number of route it is short scrap it is especially serious,
Brownification, which puts printed line road surface downward, can effectively prevent to stay copper scale punching can't on the line to be washed off because of Gravity Problem original.
Further, further include interior short characterization processes, the interior short characterization processes comprising the following specific steps move back it is anti-welding →
Line → etching → stripping plate → mill section → is chased after to take pictures.Further, described to move back anti-welding step are as follows: will to be determined as internal short-circuit
PCB is marked on edges of boards and test-strips by model, quantity, then PCB is placed on rack for washing plate, is soaked after fixing
Bubble a period of time in the sodium hydroxide solution that concentration is 5%, temperature is 85 ± 5 DEG C, soaked PCB is then placed on punching
It washes on frame, the tow sides of PCB is first poured with tap water, so that the ink for being attached to pcb board face is expanded with heat and contract with cold and react and take off
It falls, then is rinsed well with giant, finally go over the moisture that hot-air seasoning line dries its surface.Further, print is primary
The PCB soaking time of oil is 40 ± 5min, and print PCB oily twice, which first impregnates, to be taken out flushing after 20min and chemically reacted
Anti-solder ink, be further continued for impregnate 30min.Further, described to chase after line step are as follows: the PCB dried is placed on and chases after line platform
On, show the line map of each layer of the PCB on computers, the test coordinate of input short point shows the two of short circuit on software
The network of a different colours can find the number of plies and general area of short circuit according to the network of display, then mark short circuit
Internal layer circuit line map, and indicate model and the number of plies.Further, the etching step are as follows: mark and line will have been finished
The PCB of road figure loses the table copper and hole copper of light PCB on internal layer DES line with acid etching liquid medicine, until copper etching in hole is clean, then will
PCB surface drying.Further, the stripping plate step are as follows: clean PCB will have been etched and be placed on stripping pallet, according to having indicated
Circuit hierarchy and the total hierarchy selection of PCB to peel off the approximate location of thickness, where finding drawn figure with blade incision plate angle
Then region peels off this layer, the place of two network shorts is found using magnifying glass, irises out label, then be torn into 40mm*
The slice of 40mm, and with chasing after, line is the same to write this item number model and the short-circuit number of plies in slice.Further, the mill section
Step are as follows: the slice for having performed mark is placed on by grinder, will be cut according to polyacrylic thickness difference is covered on short dot
Piece is divided into two classes, first uses the coarse sandpaper of 400# to grind compared with slab covered polyacrylic thickness, then with 800#'s
Sand paper grinding, is finally ground with the fine sandpaper of 1500#, directly uses 1500# for the slice of covered polyacrylic thinner thickness
Fine sandpaper grinding.Further, the step of taking pictures are as follows: before copper face oxidation, ground slice is face-up placed on
Gold is first used 50 times of lookup short dots of dark field, is then checked again with dark field 100 as microscopical shot region, and is risen by adjusting
The reason of nut adjusts image sharpness, is clear that internal short-circuit is dropped, finally takes pictures and saves picture.
The method for testing pcb board internal short-circuit through the invention can find the reason of internal short-circuit occurs for PCB and divide
Responsibility process is scrapped clearly.The present invention is by finding copper scale source of generation；Confirmation copper scale short circuit be copper scale return it is viscous caused by, from source to
Process formulates simple and effective control scheme, and increased costs are less, and improvement is preferable.
The method of the present invention generates copper scale from internal layer to brownification to be returned viscous short circuit and carries out depth dissection, according to copper scale producing cause and
Production process copper scale returns viscous various aspects and is studied, and formulates management-control method, so that short in effectively scrap, improves production plate yield,
Improve the performance of enterprises.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.It is noted that the technical characteristic being not described in detail in the present invention, it can be by appointing
One prior art is realized.
Claims (9)
1. a kind of short method scrapped in reduction pcb board, which is characterized in that comprising the following specific steps sawing sheet → pre-treatment →
Coating → exposure → development → etches → moves back film → receipts plate → AOI → brownification；
In the sawing sheet technique, need to manage edges of boards copper cloak burr；
In the exposure technology, fall former label using alcohol wipe in film modification board mark；
In the receipts plate technique, using the film partition cleaned, and clean board transfer carriage before loading board；
In the brownification technique, the route of pcb board is face-down when putting plate.
2. the short method scrapped in reduction pcb board according to claim 1, which is characterized in that further include interior short detection work
Skill, the interior short characterization processes comprising the following specific steps move back it is anti-welding → chase after line → etching → stripping plate → mill section → and take pictures.
3. the short method scrapped in reduction pcb board according to claim 2, which is characterized in that described to move back anti-welding step are as follows:
It will be determined as the PCB of internal short-circuit, marked on edges of boards and test-strips by model, quantity, PCB is then placed on board-washing
On frame, a period of time in the sodium hydroxide solution that concentration is 5%, temperature is 85 ± 5 DEG C is immersed in after fixing, it then will
Soaked PCB is placed on irrigator stand, and the tow sides of PCB are first poured with tap water, and the ink for being attached to pcb board face occurs
It expands with heat and contract with cold and reacts and fall off, then rinsed well with giant, finally go over the moisture that hot-air seasoning line dries its surface.
4. the short method scrapped in reduction pcb board according to claim 3, which is characterized in that the PCB of the primary oil of print impregnates
Time is 40 ± 5min, and print PCB oily twice takes out the anti-solder ink for rinsing and having chemically reacted after first impregnating 20min,
It is further continued for impregnating 30min.
5. the short method scrapped in reduction pcb board according to claim 3, which is characterized in that described to chase after line step are as follows: will
The PCB dried, which is placed on, to be chased after on line platform, shows the line map of each layer of the PCB on computers, and the test of input short point is sat
Mark shows the network of two different colours of short circuit on software, according to the network of display can find short circuit the number of plies and
General area, then marks the line map of the internal layer circuit of short circuit, and indicates model and the number of plies.
6. the short method scrapped in reduction pcb board according to claim 5, which is characterized in that the etching step are as follows: will
The PCB of mark and line map has been finished on internal layer DES line with the table copper and hole copper of acid etching liquid medicine erosion light PCB, until hole
Copper etching is clean, then PCB surface is dried.
7. the short method scrapped in reduction pcb board according to claim 6, which is characterized in that the stripping plate step are as follows: will
It has etched clean PCB to be placed on stripping pallet, the big of thickness will be peeled off according to the total hierarchy selection of circuit hierarchy and PCB indicated
Position is caused, drawn figure region is found with blade incision plate angle, then this layer is peeled off, finds two using magnifying glass
Label is irised out in the place of network short, then is torn into the slice of 40mm*40mm, and line is the same to write this item number in slice with chasing after
Model and the short-circuit number of plies.
8. the short method scrapped in reduction pcb board according to claim 7, which is characterized in that the mill section step
Are as follows: the slice for having performed mark is placed on by grinder, is divided slice according to polyacrylic thickness difference is covered on short dot
It at two classes, first uses the coarse sandpaper of 400# to grind compared with slab covered polyacrylic thickness, then uses the sand paper of 800#
Grinding is finally ground with the fine sandpaper of 1500#, directly uses 1500# fine sand for the slice of covered polyacrylic thinner thickness
Paper grinding.
9. the short method scrapped in reduction pcb board according to claim 8, which is characterized in that the step of taking pictures are as follows:
Before copper face oxidation, ground slice is face-up placed on gold as microscopical shot region, first with 50 times of dark field lookups
Then short dot is checked again with dark field 100, and adjusts image sharpness by adjusting lifting nut, be clear that inside
The reason of short circuit, finally takes pictures and saves picture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910101712.5A CN109862701A (en) | 2019-02-01 | 2019-02-01 | A kind of short method scrapped in reduction pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910101712.5A CN109862701A (en) | 2019-02-01 | 2019-02-01 | A kind of short method scrapped in reduction pcb board |
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| Publication Number | Publication Date |
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| CN109862701A true CN109862701A (en) | 2019-06-07 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910101712.5A Pending CN109862701A (en) | 2019-02-01 | 2019-02-01 | A kind of short method scrapped in reduction pcb board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111698838A (en) * | 2020-06-19 | 2020-09-22 | 奥士康精密电路（惠州）有限公司 | Method for controlling micro-short of carbon oil plate |
| CN114727505A (en) * | 2022-03-02 | 2022-07-08 | 深圳崇达多层线路板有限公司 | Method for preventing circuit on PCB negative film plate from being broken by collision |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111698838A (en) * | 2020-06-19 | 2020-09-22 | 奥士康精密电路（惠州）有限公司 | Method for controlling micro-short of carbon oil plate |
| CN114727505A (en) * | 2022-03-02 | 2022-07-08 | 深圳崇达多层线路板有限公司 | Method for preventing circuit on PCB negative film plate from being broken by collision |
| CN114727505B (en) * | 2022-03-02 | 2024-03-01 | 深圳崇达多层线路板有限公司 | Method for preventing circuit on PCB negative plate from breaking |
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Application publication date: 20190607 |