CN105050323A - Manufacturing technology of high precision circuit board - Google Patents
Manufacturing technology of high precision circuit board Download PDFInfo
- Publication number
- CN105050323A CN105050323A CN201510341098.1A CN201510341098A CN105050323A CN 105050323 A CN105050323 A CN 105050323A CN 201510341098 A CN201510341098 A CN 201510341098A CN 105050323 A CN105050323 A CN 105050323A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- dissolved
- manufacturing technology
- alcohol
- anhydrous alcohol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
Abstract
A manufacturing technology of a high precision circuit board is disclosed. The invention relates to the circuit board manufacturing technology field. The manufacturing technology is characterized in that taking a color chip and anhydrous alcohol, dissolving one color chip in four parts of anhydrous alcohol, and stirring properly till that all the color chip are dissolved; adding several drops of acetocarmine in a dissolved mixture; using crocus paper to polish a copper-clad plate, and then using a contour pen in a plotting instrument to dip into the mixture so as to describe a circuit board; putting the drawn circuit board into dilute nitric acid so as to carry out corrosion; taking out the corroded circuit board and carrying out borehole processing on the circuit board; dipping a cotton ball in the anhydrous alcohol and erasing protective paint; coating rosin water on the circuit board, and using a hot-air blower to dry the circuit board so that the rosin water is solidified; and welding an electronic component. Manufacturing cost is low. The technology is simple and fast and is suitable for a small workshop.
Description
Technical field
The present invention relates to circuit board making technical field, be specifically related to the manufacturing process of high-precision circuit board.
Background technology
The title of circuit board has: wiring board, pcb board, aluminium base, high frequency plate, thick copper coin, impedance plate, PCB, ultra-thin wiring board, ultrathin circuit board, printing (copper lithographic technique) circuit board etc.Circuit board makes circuit miniaturization, visualize, for permanent circuit batch production and optimize electrical appliance layout and play an important role.Circuit board can be described as printed substrate or printed circuit board (PCB), and English name is (PrintedCircuitBoard) PCB.Printed circuit board (PCB) is the supplier of electronic devices and components electrical connection.Its development has the history of more than 100 year; Its design mainly layout design; Adopt the major advantage of circuit board to be the mistake greatly reducing wiring and assembling, improve the gentle productive labor rate of Automated water.
The research of the domestic automatic checkout system to printed circuit board (PCB) approximately starts from mid-term at the beginning of the nineties, also at the early-stage.At present, what the scientific research institutions being engaged in this respect research also compared lacks, and because be subject to the impact of various factors, the research for the automatic optical detecting system of defect of printed circuit board also rests on the level of a relative infancy.Just because of the automatic checkout system of external printed circuit board (PCB) is too expensive, and the domestic automatic checkout equipment also not developing truly printed circuit board (PCB), so the way that domestic most board production producer still adopts artificial magnifying glass or projecting apparatus to check carries out inspection side.Because hand inspection labour intensity is large, eyes easily produce fatigue, and percentage of omisson of examination is very high.And along with electronic product is towards miniaturized, digital development, printed circuit board also towards high density, high accuracy development, adopts the method for desk checking, substantially cannot realize.To more high density and precision circuits plate (0.12 × 0.10mm), cannot check completely.The backwardness of detection means, causes the conforming product rate of current domestic multi-layer sheet (8-12 layer) to be only 50,60%.
The flow process that prior art manufactures circuit board is generally as follows: printed circuit board-cutting copper-clad plate, makes omnidistance diagram---preliminary treatment copper-clad plate---transfer printing circuit board---open circuit potential plate---drilling holes on circuit board---soldering of electronic components of circuit board with photographic plate; And the manufacture craft of this circuit board all also exists certain drawback, such as, can produce a large amount of waste water and pollutant in production process, be unfavorable for environmental protection; What also have is exactly that operating cost is high, the production of the amount of greatly limit.
Summary of the invention
The object of the invention is to the defect for prior art and deficiency, the manufacturing process of the high-precision circuit board providing a kind of structure simple, reasonable in design, its cost of manufacture is low, and simply, fast, is more suitable for small-sized making mill.
For achieving the above object, the technical solution used in the present invention is: its Making programme is as follows:
One, get coating agent which has to be dissolved in alcohol before use and absolute alcohol, its weight ratio is 1: 4, is dissolved in by a coating agent which has to be dissolved in alcohol before use in four parts of absolute alcohols, and agitation as appropriate, until all dissolve;
Two, drip several acetic acid Yang Hong in mixed liquor upon dissolution, make entirety present certain color, stir;
Three, with fine sandpaper, copper-clad plate is polished, the ruling pen in plotter is taked after complete, dip above-mentioned mixed liquor, describe circuit board, owing to ruling pen there being the nut of adjustment stroke weight, stroke weight is adjustable, the lines drawn out like this seem more smooth, evenly, and non-flanged sawtooth, Chinese character and letter etc. can also be write in the blank space of circuit board simultaneously; If retouch wrong, little cotton swab can be utilized, dip a small amount of absolute alcohol, wipe;
Four, drawn circuit board is placed in dust technology carries out corroding (dust technology corrosivity is comparatively strong, notes carrying out safeguard measure during operation);
Five, the circuit board corroded is taken out, boring process is carried out to circuit board;
Six, absolute alcohol is dipped with cotton balls, erasing protective paint;
Seven, circuit board is coated rosin, utilize air-heater to dry circuit board, rosin is solidified;
Eight, soldering of electronic components.
After adopting said structure, beneficial effect of the present invention is: the manufacturing process of high-precision circuit board of the present invention, and it is reasonable in design, and cost of manufacture is low, and simply, fast, is more suitable for small-sized making mill.
Embodiment
The technical scheme that this embodiment adopts is: its Making programme is as follows:
One, get coating agent which has to be dissolved in alcohol before use and absolute alcohol, its weight ratio is 1: 4, is dissolved in by a coating agent which has to be dissolved in alcohol before use in four parts of absolute alcohols, and agitation as appropriate, until all dissolve;
Two, drip several acetic acid Yang Hong in mixed liquor upon dissolution, make entirety present certain color, stir;
Three, with fine sandpaper, copper-clad plate is polished, the ruling pen in plotter is taked after complete, dip above-mentioned mixed liquor, describe circuit board, owing to ruling pen there being the nut of adjustment stroke weight, stroke weight is adjustable, the lines drawn out like this seem more smooth, evenly, and non-flanged sawtooth, Chinese character and letter etc. can also be write in the blank space of circuit board simultaneously; If retouch wrong, little cotton swab can be utilized, dip a small amount of absolute alcohol, wipe;
Four, drawn circuit board is placed in dust technology carries out corroding (dust technology corrosivity is comparatively strong, notes carrying out safeguard measure during operation);
Five, the circuit board corroded is taken out, boring process is carried out to circuit board;
Six, absolute alcohol is dipped with cotton balls, erasing protective paint;
Seven, circuit board is coated rosin, utilize air-heater to dry circuit board, rosin is solidified;
Eight, soldering of electronic components.
Adopt after said structure, this embodiment beneficial effect for: the manufacturing process of the high-precision circuit board described in this embodiment, it is reasonable in design, and cost of manufacture is low, and simply, fast, is more suitable for small-sized making mill.
The above, only in order to technical scheme of the present invention to be described and unrestricted, other amendment that those of ordinary skill in the art make technical scheme of the present invention or equivalently to replace, only otherwise depart from the spirit and scope of technical solution of the present invention, all should be encompassed in the middle of right of the present invention.
Claims (1)
1. the manufacturing process of high-precision circuit board, is characterized in that: its Making programme is as follows:
(1), get coating agent which has to be dissolved in alcohol before use and absolute alcohol, its weight ratio is 1: 4, is dissolved in by a coating agent which has to be dissolved in alcohol before use in four parts of absolute alcohols, and agitation as appropriate, until all dissolve;
(2) drip several acetic acid Yang Hong in mixed liquor, upon dissolution, make entirety present certain color, stir;
(3), with fine sandpaper, copper-clad plate is polished, the ruling pen in plotter is taked after complete, dip above-mentioned mixed liquor, describe circuit board, owing to ruling pen there being the nut of adjustment stroke weight, stroke weight is adjustable, the lines drawn out like this seem more smooth, evenly, and non-flanged sawtooth, Chinese character and letter etc. can also be write in the blank space of circuit board simultaneously; If retouch wrong, little cotton swab can be utilized, dip a small amount of absolute alcohol, wipe;
(4), drawn circuit board is placed in dust technology corrodes;
(5), by the circuit board corroded take out, boring process is carried out to circuit board;
(6), with cotton balls absolute alcohol is dipped, erasing protective paint;
(7), by circuit board coat rosin, utilize air-heater to dry circuit board, rosin is solidified;
(8), soldering of electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510341098.1A CN105050323A (en) | 2015-06-18 | 2015-06-18 | Manufacturing technology of high precision circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510341098.1A CN105050323A (en) | 2015-06-18 | 2015-06-18 | Manufacturing technology of high precision circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105050323A true CN105050323A (en) | 2015-11-11 |
Family
ID=54456382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510341098.1A Pending CN105050323A (en) | 2015-06-18 | 2015-06-18 | Manufacturing technology of high precision circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105050323A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211599A (en) * | 2016-07-25 | 2016-12-07 | 苏州福莱盈电子有限公司 | A kind of method saving material making wiring board |
| CN106211607A (en) * | 2016-07-25 | 2016-12-07 | 苏州福莱盈电子有限公司 | A kind of circuit board manufacture method simply and easily |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1045732A (en) * | 1990-04-14 | 1990-10-03 | 三虹电器有限公司石家庄分公司 | A kind of improved copper-plated picture and preparation method thereof |
| US5358622A (en) * | 1993-03-12 | 1994-10-25 | Firma Korsten & Goossens | Procedure for the production of printed circuit boards provided with pads for the insertion of SMDs |
-
2015
- 2015-06-18 CN CN201510341098.1A patent/CN105050323A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1045732A (en) * | 1990-04-14 | 1990-10-03 | 三虹电器有限公司石家庄分公司 | A kind of improved copper-plated picture and preparation method thereof |
| US5358622A (en) * | 1993-03-12 | 1994-10-25 | Firma Korsten & Goossens | Procedure for the production of printed circuit boards provided with pads for the insertion of SMDs |
Non-Patent Citations (1)
| Title |
|---|
| 俞国林: "电路板制作方法的比较分析", 《科技信息》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211599A (en) * | 2016-07-25 | 2016-12-07 | 苏州福莱盈电子有限公司 | A kind of method saving material making wiring board |
| CN106211607A (en) * | 2016-07-25 | 2016-12-07 | 苏州福莱盈电子有限公司 | A kind of circuit board manufacture method simply and easily |
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Legal Events
| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20151111 |