CN103596373A - Integrated circuit plate manufacturing method based on copper nitride film - Google Patents
Integrated circuit plate manufacturing method based on copper nitride film Download PDFInfo
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- CN103596373A CN103596373A CN201310546250.0A CN201310546250A CN103596373A CN 103596373 A CN103596373 A CN 103596373A CN 201310546250 A CN201310546250 A CN 201310546250A CN 103596373 A CN103596373 A CN 103596373A
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Abstract
The invention discloses an integrated circuit plate manufacturing method based on a copper nitride film. A layer of copper nitride film is plated on a substrate by using a magnetron sputtering coating method, the copper nitride film is used as a dielectric layer of an etching circuit, copper nitride degrades to generate copper to be attached to the substrate under the action of laser, the copper nitride film on the substrate is cleaned by using a solvent, and the manufacturing of the integrated circuit plate is completed. According to the integrated circuit plate manufacturing method based on the copper nitride film, the low-temperature thermal decomposition characteristic of the copper nitride is applied to the integrated circuit plate, the manufacturing technology of the integrated circuit plate is improved, and the brand new nontoxic integrated circuit plate based on the copper nitride is manufactured.
Description
Technical field
The present invention relates to a kind of integrated circuit board fabrication method, relate in particular to a kind of integrated circuit board fabrication method based on copper nitride film, belong to integrated circuit fields.
Background technology
The making flow process of present surface-mounted integrated circuit is mainly divided into following flow process: be first printed circuit board, drawn circuit board is printed with transfer paper.Next is preliminary treatment copper-clad plate, and is divided into two steps, before this copper-clad plate is cut into the size of circuit board, then with fine sandpaper, the oxide layer on copper-clad plate surface is polished off, to guarantee that when the transfer printing circuit board, the carbon dust on heat-transferring printing paper can firmly be imprinted in copper-clad plate.Transfer printing circuit board with that, corrosion wiring board.The composition of the corrosive liquid of using is here concentrated hydrochloric acid, dense hydrogen peroxide, water, and ratio is 1:2:3.Then according to the thickness of electronic element base pin, select different drill points exactly, give drilling holes on circuit board.Finally wiring board is carried out to preliminary treatment, polish off the ink powder covering in the circuit board, with clear water, wiring board is cleaned up.After water is dry, with rosin, be coated in the one side of circuit, prevent that circuit is oxidized.After these work complete, circuit board has just been successful.The upper corresponding electronic component of welding, switches on again, realizes corresponding function.
Surface-mounted integrated circuit is made in industry, and volume production is crucial fast.Current manufacture craft, flow process is various, and conditional request is higher, and resource consumption is more, exists and pollutes.
Copper nitride Cu
3n is a kind of non-toxic material with special construction and performance, is subject in recent years extensive concern.Copper nitride film is tan semitransparent thin film, very stable in air.Place it in after deliberation humidity and be 95%, temperature is 60 ℃, in air, place after 15 months and almost not have electric property to change with originally comparing.Copper nitride crystal is in metastable state or unstable state phase, and it just can resolve into copper and nitrogen (2Cu in 350 ℃ of left and right situations in a vacuum
3n=6Cu+N
2).
Summary of the invention
The invention provides a kind of integrated circuit board fabrication method, its method step has:
The first step: select that stability is strong, the fire proofing of insulation, smooth surface and flexible is if pcb board material, quartz glass or micarex are substrate, substrate is cut into the size of circuit board, not excessive, to save material.
Second step: after previous step completes, utilize magnetron sputtering coating method to cross one deck copper nitride film on the substrate cutting out, the time of controlling as required plated film regulates film thickness, and the target of sputter is copper target, working gas nitrogen and argon gas.
The 3rd step: after above-mentioned machining, regulate power and the laser radius of laser, according to the circuit diagram designing, irradiated substrate is coated with the relevant position of the one side of copper nitride film, etches needed circuit.
The 4th step: after above-mentioned machining, first wiring board is put in watery hydrochloric acid copper nitride is dissolved, with clear water, wiring board is cleaned up and dried after taking out.
The 5th step: after above-mentioned machining, according to the distribution of boreholes in circuit diagram, select different drill points according to the thickness of electronic element base pin, with rig correspondence position boring on the wiring board making.
The 6th step: select a kind of stable, insulation, transparent coating material to be coated in the one side of circuit, only need very thin one deck, prevent the oxidized and wearing and tearing of circuit, play a protective role.Here the coating material of using can be rosin, rosin is coated in to the one side of circuit, only need very thin one deck, not only prevent that circuit is oxidized, rosin is also good scaling powder simultaneously, and in general, PCB surface rosin can solidify in 24 hours, for accelerating rosin, solidify, can use air-heater heating line plate.After rosin solidifies, standard compliant surface-mounted integrated circuit is just made complete.
Finally, welded on demand the electronic component on plate, energising, function realizes, and a surface-mounted integrated circuit with certain function is made complete.
One of key of the present invention is to utilize the method for magnetron sputtering, take Cu as target on substrate, and N2 is that reacting gas is prepared copper nitride film, is beneficial to large-scale production, and thickness is also controlled.
Another crucial part of the present invention is the lithographic method of circuit: according to the circuit diagram having designed, with the etching route of the pre-set laser beam of computer.The Ear Mucosa Treated by He Ne Laser Irradiation regulating is surperficial to copper nitride film.When temperature reaches 360 left and right, copper nitride Variational Solution Used becomes copper and nitrogen, nitrogen volatilization, and remaining copper is attached to and on substrate, forms conductive copper wire.
The present invention also has a crucial part to be the method that copper cash thickness is controlled: the copper cash thickness that the spot radius by adjusting laser beam regulates and controls to etch is to satisfy the demand.
Example of the present invention provides a kind of, for making surface-mounted integrated circuit new material copper nitride, copper nitride is prepared into film, and its low temperature thermal decomposition characteristic is applied in integrated circuit.
Example of the present invention provides preparation condition and the method for copper nitride film.The film thickness of described copper nitride film can be controlled by changing preparation condition.
Described surface-mounted integrated circuit is mainly divided into three layers, comprises successively substrate-1, sandwich layer-2, coating-3, is respectively ground floor (substrate-orlop), the second layer (sandwich layer-intermediate layer) and the 3rd layer (coating-the superiors) of surface-mounted integrated circuit.Substrate is the basis of surface-mounted integrated circuit, as the carrier of sandwich layer and coating; Sandwich layer is etch layer, be used for etched circuit, utilize copper nitride film prepared by magnetically controlled sputter method as sandwich layer medium, regulate as required watt level and the laser facula radius of laser, by irradiating copper nitride film, make it to occur decomposition reaction, thereby etch required circuit; Coating is to exist as protective layer.
beneficial effect:
Method of the present invention is simple, and cost of manufacture is low, and raw material availability is high, and manufacture craft is simplified greatly, simple to operate, is convenient to control, and production procedure more easily realizes automation.Material requested and manufacture process are all nontoxic, can not work the mischief and to environment to human body.
Accompanying drawing explanation
Fig. 1 is structure principle chart of the present invention.
Fig. 2 is the surface-mounted integrated circuit vertical view that example of the present invention provides.
Fig. 3 is the cross-sectional view of double-face intergrate circuit plate.
Fig. 4 is the side view of multilevel integration plate.
In figure: 1-substrate, 2-sandwich layer, 3-coating, 4-thick copper lines, 5-boring, 6-fine copper wire, 7-bellmouth, 8-symmetric pyramid hole, 9-conductive supporting post, 10-interlayer circuit board.
Embodiment
In order to be illustrated more clearly in the present invention, below in conjunction with the drawings and specific embodiments, describe.
The present invention is a kind of surface-mounted integrated circuit and manufacture method thereof based on copper nitride film, this surface-mounted integrated circuit is mainly divided into three layers, comprise successively substrate 1, sandwich layer 2, coating 3, respectively ground floor (substrate-orlop), the second layer (sandwich layer-intermediate layer) and the 3rd layer (coating-the superiors) of surface-mounted integrated circuit, as shown in Figure 1.
Substrate is the basis of surface-mounted integrated circuit, as the carrier of sandwich layer and coating; Sandwich layer is etch layer, be used for etched circuit, utilize copper nitride film prepared by magnetically controlled sputter method as sandwich layer medium, regulate as required watt level and the laser facula radius of laser, by irradiating copper nitride film, make it to occur decomposition reaction, thereby etch required circuit; Coating is to exist as protective layer.
embodiment:
Select PCB raw sheet that thickness is 1mm as substrate, be cut into as required appropriate size, the specification of as wide in: long *=2cm*1cm.Adopt reaction radio-frequency magnetron sputter method, on substrate, prepare copper nitride film.The target of sputter is 99.999% high purity copper target, and the diameter of copper target is that 50mm, thickness are 5mm.Distance between target and substrate is 17cm, the high pure nitrogen that working gas is 99.99% and 99.99% high-purity argon gas, and service quality flowmeter is controlled respectively.
Substrate, before putting into vacuum chamber, is used respectively acetone, alcohol, deionized water ultrasonic cleaning, before sputter, gas pressure in vacuum is extracted into lower than 5 * 10-4Pa, and is filled with argon gas pre-sputtering 5min to clean target surface.Pass into subsequently nitrogen, control total sputtering pressure at 2Pa, the ratio of controlling nitrogen and argon gas is 2/1, and sputtering power is controlled at 100w and prepares copper nitride film, and sputtering time is 1 hour.Copper nitride is stable performance at normal temperatures, has low heat decomposition temperature, and non-toxic inexpensive.It just can resolve into copper simple substance and realize low temperature metalization in 350 ℃ of left and right in a vacuum, and the copper and the metallic copper that after decomposing, obtain have identical conductive characteristic, and in addition, copper nitride is to be soluble in acid solution, and copper is not to be dissolved in acid solution.
Copper nitride film has been prepared rear taking-up, according to the circuit diagram designing, sets the mobile alignment of laser ablation, use laser, the power and the laser beam radius that according to the wire diameter of circuit, regulate laser, etch needed circuit, and circuit has just obtained required wiring board after finishing.
According to circuit diagram, with rig correspondence position boring on the wiring board making.According to the thickness of electronic element base pin, select different drill points, when using drill hole of drilling machine, wiring board must be by surely, and it is excessively slow that rig speed can not be left, and in operation rig process, takes care.
After above-mentioned machining, first wiring board is put in watery hydrochloric acid copper nitride is dissolved, after taking out, with clear water, wiring board is cleaned up, after water is dry, rosin is coated in to the one side of circuit, only needs very thin one deck, not only prevent that circuit is oxidized and wear and tear, rosin is also good scaling powder simultaneously, and in general, PCB surface rosin can solidify in 24 hours, for accelerating rosin, solidify, can use air-heater heating line plate, notice that temperature is not too high, general control is advisable with interior at 300 ℃.After rosin solidifies, standard compliant surface-mounted integrated circuit is just made complete.As shown in Figure 2.
Finally, welded on demand the electronic component on plate, energising, function realizes, and a surface-mounted integrated circuit with certain function is made complete.
For the double-face intergrate circuit wiring board with plated-through hole:
Make as stated above after substrate, according to circuit diagram, hole in the position that will be processed into plated-through hole, notes the slightly taper of this hole, be convenient in this hole, to form certain thickness and uniform film and this hole of Ear Mucosa Treated by He Ne Laser Irradiation in follow-up filming process copper nitride is decomposed, the same above-mentioned steps of subsequent handling.Different is by substrate two sides successively plated film in filming process.Double-face intergrate circuit wiring board after making as shown in Figure 3.
For multilevel integration wiring board:
Utilize said method, the single or double integrated circuit board with plated-through hole of making is coupled together and just can realize multilevel integration wiring board with conduction (metal) pillar successively on request, conductive pillar and every layer circuit board can pass through solder bond, as shown in Figure 4.
Claims (3)
1. the integrated circuit board fabrication method based on copper nitride film, its feature comprises the following steps:
Step 1: select substrate, substrate can be fire proofing: pcb board material, quartz glass or micarex;
Step 2: utilize magnetron sputtering coating method to cross one deck copper nitride film on substrate, the time of controlling as required plated film regulates film thickness; The target of sputter is copper target, working gas nitrogen and argon gas;
Step 3: according to circuit diagram, use laser, irradiate the substrate one side relevant position that is coated with copper nitride film, etch needed circuit;
Step 4: wiring board is put in watery hydrochloric acid copper nitride is dissolved, take out only dry.
2. a kind of integrated circuit board fabrication method based on copper nitride film according to claim 1, it is characterized in that: substrate, by circuit diagram requirement boring, two-sided plating copper nitride film, by circuit diagram Ear Mucosa Treated by He Ne Laser Irradiation substrate, is obtained to the double-face intergrate circuit wiring board with plated-through hole.
3. a kind of integrated circuit board fabrication method based on copper nitride film according to claim 1 and 2, is characterized in that multiple vlsi circuitry plate stacks of making form multilevel integration wiring board.
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| CN201310546250.0A CN103596373A (en) | 2013-11-07 | 2013-11-07 | Integrated circuit plate manufacturing method based on copper nitride film |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104320913A (en) * | 2014-09-25 | 2015-01-28 | 南京邮电大学 | Method for manufacturing flexible circuit board based on copper nitride film |
| CN106211599A (en) * | 2016-07-25 | 2016-12-07 | 苏州福莱盈电子有限公司 | A kind of method saving material making wiring board |
| CN106211607A (en) * | 2016-07-25 | 2016-12-07 | 苏州福莱盈电子有限公司 | A kind of circuit board manufacture method simply and easily |
| CN106304659A (en) * | 2016-08-28 | 2017-01-04 | 广西小草信息产业有限责任公司 | A kind of manufacture method of surface-mounted integrated circuit |
| CN106535502A (en) * | 2016-10-17 | 2017-03-22 | 奥士康精密电路（惠州）有限公司 | Electroplating method of high-aspect ratio circuit board |
| CN109219263A (en) * | 2018-09-29 | 2019-01-15 | 江苏芯力特电子科技有限公司 | A kind of manufacture craft of anti-oxidant PCB printed circuit board |
| CN109817384A (en) * | 2018-12-21 | 2019-05-28 | 江苏日久光电股份有限公司 | A kind of easier metal grill production method |
| CN111246662A (en) * | 2018-11-29 | 2020-06-05 | 欣兴电子股份有限公司 | Carrier plate structure and manufacturing method thereof |
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| CN102184888A (en) * | 2011-04-11 | 2011-09-14 | 常州大学 | Multilayer copper interconnection manufacturing method |
| US20120125765A1 (en) * | 2009-07-30 | 2012-05-24 | Tokyo Electron Limited | Plasma processing apparatus and printed wiring board manufacturing method |
| CN103117070A (en) * | 2013-01-08 | 2013-05-22 | 南京邮电大学 | One-time write-in-type two-sided disc based on copper nitride film and manufacturing method thereof |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20120125765A1 (en) * | 2009-07-30 | 2012-05-24 | Tokyo Electron Limited | Plasma processing apparatus and printed wiring board manufacturing method |
| CN102184888A (en) * | 2011-04-11 | 2011-09-14 | 常州大学 | Multilayer copper interconnection manufacturing method |
| CN103117070A (en) * | 2013-01-08 | 2013-05-22 | 南京邮电大学 | One-time write-in-type two-sided disc based on copper nitride film and manufacturing method thereof |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104320913A (en) * | 2014-09-25 | 2015-01-28 | 南京邮电大学 | Method for manufacturing flexible circuit board based on copper nitride film |
| CN106211599A (en) * | 2016-07-25 | 2016-12-07 | 苏州福莱盈电子有限公司 | A kind of method saving material making wiring board |
| CN106211607A (en) * | 2016-07-25 | 2016-12-07 | 苏州福莱盈电子有限公司 | A kind of circuit board manufacture method simply and easily |
| CN106304659A (en) * | 2016-08-28 | 2017-01-04 | 广西小草信息产业有限责任公司 | A kind of manufacture method of surface-mounted integrated circuit |
| CN106535502A (en) * | 2016-10-17 | 2017-03-22 | 奥士康精密电路（惠州）有限公司 | Electroplating method of high-aspect ratio circuit board |
| CN109219263A (en) * | 2018-09-29 | 2019-01-15 | 江苏芯力特电子科技有限公司 | A kind of manufacture craft of anti-oxidant PCB printed circuit board |
| CN111246662A (en) * | 2018-11-29 | 2020-06-05 | 欣兴电子股份有限公司 | Carrier plate structure and manufacturing method thereof |
| CN109817384A (en) * | 2018-12-21 | 2019-05-28 | 江苏日久光电股份有限公司 | A kind of easier metal grill production method |
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Application publication date: 20140219 |