CN104320913A - Method for manufacturing flexible circuit board based on copper nitride film - Google Patents

Method for manufacturing flexible circuit board based on copper nitride film Download PDF

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Publication number
CN104320913A
CN104320913A CN201410497288.8A CN201410497288A CN104320913A CN 104320913 A CN104320913 A CN 104320913A CN 201410497288 A CN201410497288 A CN 201410497288A CN 104320913 A CN104320913 A CN 104320913A
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CN
China
Prior art keywords
copper
copper nitride
nitride film
basement membrane
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410497288.8A
Other languages
Chinese (zh)
Inventor
李兴鳌
杨建波
李潼
吴振利
闫猛
赵建华
黄维
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanjing Post and Telecommunication University
Nanjing University of Posts and Telecommunications
Original Assignee
Nanjing Post and Telecommunication University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanjing Post and Telecommunication University filed Critical Nanjing Post and Telecommunication University
Priority to CN201410497288.8A priority Critical patent/CN104320913A/en
Publication of CN104320913A publication Critical patent/CN104320913A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/085—Using vacuum or low pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Abstract

The invention relates to a method for manufacturing a flexible circuit board based on a copper nitride film. A copper film is nitrided on a base film by a magnetron sputtering method to be used as a dielectric layer of an etching circuit, copper is generated due to copper nitride decomposition under the action of laser irradiation and adhered to a substrate to form a copper wire or copper points, and a copper nitride film on the substrate is dissolved in a solvent, thus completing the manufacture of a flexible circuit board. The low-temperature thermal decomposition property of copper nitride is applied to the flexible circuit board, and the manufacture process of the flexible circuit board is improved so as to manufacture a novel flexible circuit board.

Description

A kind of flexible circuitry board fabrication method based on copper nitride film
Technical field
The present invention relates to a kind of flexible circuitry board fabrication method, particularly relate to a kind of flexible circuitry board fabrication method based on copper nitride film, belong to integrated circuit fields.
Background technology
The Making programme of present flexible circuit board is mainly divided into following flow process: boring, black holes, copper facing, press mold, exposure, development, etching, pressing, printing, stamp, test; Reconnect corresponding electronic component, energising, realizes linkage function.
Industry makes flexible circuit board, can volume production be crucial fast.Current manufacture craft, flow process is various, and conditional request is higher, and resource consumption is more, exists and pollutes.
Copper nitride Cu 3n is a kind of non-toxic material with special construction and performance, is subject to extensive concern in recent years.Copper nitride film is tan semitransparent thin film, very stable in atmosphere.Place it in that humidity is 95% after deliberation, temperature be the placement in atmosphere of 60 DEG C after 15 months compared with originally electric property almost do not change.Copper nitride crystal is in metastable state or unstable state phase, and it just can resolve into copper and nitrogen (2Cu in about 350 DEG C situations in a vacuum 3n=6Cu+N 2).
Summary of the invention
The present invention also provides a kind of double-faced flexible wiring board manufacture method, and its method step has:
The first step: select that stability is strong, insulation, smooth surface and basement membrane as basement membrane, is cut into corresponding size according to demand, to save material by the fire proofing of acid corrosion-resistant such as PI (Polyimide) film.Save the wiring board space shared when applying simultaneously.
Second step: after previous step completes, utilize the basement membrane two sides that magnetron sputtering coating method is cutting out to plate copper nitride film respectively, the time controlling plated film as required regulates film thickness, and the target of sputtering is copper target, working gas nitrogen and argon gas.
3rd step: above-mentioned machine after, regulate power and the laser radius of laser, according to the circuit diagram designed, irradiate the relevant position of copper nitride film on basement membrane, etch required circuit.
4th step: above-mentioned machine after, first wiring board is put in watery hydrochloric acid and copper nitride is dissolved, take out rear clear water and wiring board is cleaned up dry.And then coverlay is as protective layer, for the protection of circuit there being one deck of circuit to add.
5th step: above-mentioned machine after, process to expose corresponding pad to the ad-hoc location of diaphragm.
One of key of the present invention is the method utilizing magnetron sputtering, flexible base film is target with Cu, N 2for reacting gas prepares copper nitride film, be beneficial to large-scale production, and thickness is also controlled.Production stage is greatly reduced while guarantee wiring board flexibility.Simplify production procedure.
Another crucial part of invention is the lithographic method of circuit: according to the circuit diagram designed, with the etching route of the pre-set laser beam of computer.The laser regulated is irradiated to copper nitride film surface.When temperature reaches about 360, copper nitride Variational Solution Used becomes copper and nitrogen, and nitrogen volatilizees, and remaining copper is attached on basement membrane and forms conductive copper wire.
The present invention also has a crucial part to be the method that copper cash thickness controls: the copper cash thickness regulating and controlling to etch by the spot radius of adjusting laser beam is to satisfy the demand.
beneficial effect:
Method of the present invention is simple, and cost of manufacture is low, and raw material availability is high, and manufacture craft simplifies greatly, simple to operate, is convenient to control, and production procedure more easily realizes automation.Material requested and manufacture process are all nontoxic, can not work the mischief and to environment to human body.
Accompanying drawing explanation
Figure l is structure principle chart of the present invention.
Fig. 2 is the flexible circuit board vertical view that example of the present invention provides.
Fig. 3 is the structure principle chart of Double-layer flexible circuit board of the present invention.
In figure: 1-basement membrane; 2,4-sandwich layer; 3,5-coverlay; 6-circuit.
Embodiment
In order to be illustrated more clearly in the present invention, be described below in conjunction with the drawings and specific embodiments.
Flexible circuit board is mainly divided into three layers, comprises basement membrane l, sandwich layer 2, coverlay 3 successively, is the ground floor (basement membrane-orlop) of flexible PCB, the second layer (sandwich layer-intermediate layer) and third layer (coverlay-the superiors) respectively.Basement membrane is the basis of flexible circuit board, as the carrier of sandwich layer and coverlay; Sandwich layer is etch layer, be used for etched circuit, the copper nitride film utilizing magnetically controlled sputter method to prepare, as sandwich layer medium, regulates watt level and the laser facula radius of laser as required, make it decomposition reaction occurs by irradiating copper nitride film, thus etch required circuit; Coverlay exists as protective layer.
Basement membrane is the basis of flexible circuit board, as the carrier of sandwich layer and coating; Sandwich layer is etch layer, be used for etched circuit, the copper nitride film utilizing magnetically controlled sputter method to prepare, as sandwich layer medium, regulates watt level and the laser facula radius of laser as required, make it decomposition reaction occurs by irradiating copper nitride film, thus etch required circuit; Coverlay exists as protective layer.Example of the present invention provides a kind of for making flexible circuit board new material copper nitride, copper nitride is prepared into film, and its low temperature thermal decomposition characteristic is applied in integrated circuit.
embodiment 1:
1. select thickness be the PI film of 1mm as basement membrane, be cut into appropriate size as required, the specification of as wide in: long *=2cm*lcm.Adopt reactive radio frequency magnetron sputtering method, basement membrane prepares copper nitride film.The target of sputtering is the high purity copper target of 99. 999%, and the diameter of copper target is 50mm, thickness is 5mm.Distance between target and basement membrane is 17cm, and working gas is the high pure nitrogen of 99. 99% and the high-purity argon gas of 99. 99%, and service quality flowmeter controls respectively.
2. basement membrane is before putting into vacuum chamber, uses acetone, alcohol, deionized water ultrasonic cleaning respectively, is extracted into gas pressure in vacuum lower than 5 × 10-4Pa, and is filled with argon gas pre-sputtering 5min to clean target surface before sputtering.Pass into nitrogen subsequently, control total sputtering pressure at 2Pa, the ratio controlling nitrogen and argon gas is 2/1, and sputtering power controls at l00w to prepare copper nitride film, and sputtering time is l hour.Copper nitride is stable performance at normal temperatures, has low heat decomposition temperature, and non-toxic inexpensive.It in a vacuum about 350 DEG C just can resolve into copper simple substance and realize low temperature metalization, and the copper obtained after decomposing and metallic copper have identical conductive characteristic, and in addition, copper nitride is soluble in acid solution, and copper is not dissolved in acid solution.
3. copper nitride film has prepared rear taking-up, according to the circuit diagram designed, sets the mobile alignment of laser ablation, use laser, regulate power and the laser beam radius of laser according to the wire diameter of circuit, etch required circuit, circuit just obtains required wiring board after finishing.
4. above-mentioned machine after, first wiring board is put in watery hydrochloric acid by copper nitride dissolve, takes out rear clear water and wiring board is cleaned up, water do after, the coverlay of preforming (exposing welding portion) is pressed into the protective layer of one side as circuit of circuit.
5. standard compliant flexible circuit board just makes complete.As shown in Figure 1 and Figure 2.
embodiment 2:
For double-faced flexible wiring board:
1. select thickness be the PI film of 1mm as basement membrane, be cut into appropriate size as required, the specification of as wide in: long *=2cm*lcm.Adopt reactive radio frequency magnetron sputtering method, basement membrane prepares copper nitride film.The target of sputtering is the high purity copper target of 99. 999%, and the diameter of copper target is 50mm, thickness is 5mm.Distance between target and basement membrane is 17cm, and working gas is the high pure nitrogen of 99. 99% and the high-purity argon gas of 99. 99%, and service quality flowmeter controls respectively.
2. basement membrane is before putting into vacuum chamber, uses acetone, alcohol, deionized water ultrasonic cleaning respectively, is extracted into gas pressure in vacuum lower than 5 × 10-4Pa, and is filled with argon gas pre-sputtering 5min to clean target surface before sputtering.Pass into nitrogen subsequently, control total sputtering pressure at 2Pa, the ratio controlling nitrogen and argon gas is 2/1, and sputtering power controls at l00w to prepare copper nitride film, and sputtering time is l hour.One deck copper nitride film is plated again at the reverse side of basement membrane after completing.Copper nitride is stable performance at normal temperatures, has low heat decomposition temperature, and non-toxic inexpensive.It in a vacuum about 350 DEG C just can resolve into copper simple substance and realize low temperature metalization, and the copper obtained after decomposing and metallic copper have identical conductive characteristic, and in addition, copper nitride is soluble in acid solution, and copper is not dissolved in acid solution.
3. copper nitride film has prepared rear taking-up, according to the circuit diagram designed, set the mobile alignment of laser ablation, use laser, power and the laser beam radius of laser is regulated according to the wire diameter of circuit, etch required circuit respectively on two sides, circuit just obtains required wiring board after finishing.
4. above-mentioned machine after, first wiring board is put in watery hydrochloric acid by copper nitride dissolve, takes out rear clear water and wiring board is cleaned up, water do after, the coverlay of preforming (exposing welding portion) is pressed into the protective layer of one side as circuit of circuit.
5. standard compliant flexible circuit board just makes complete.As shown in Figure 3.
Make wiring board as stated above.Unlike in filming process by basement membrane two sides successively plated film.Covered with protective film and step afterwards are also process successively according to the order on wiring board two sides.

Claims (3)

1., based on a flexible circuitry board fabrication method for copper nitride film, it is characterized in that, manufacture method is as follows:
The first step: select that stability is strong, insulation, smooth surface and the fire proofing of acid corrosion-resistant as basement membrane, according to demand, basement membrane is cut into corresponding size;
Second step: utilize magnetron sputtering coating method, plate copper nitride film respectively on the basement membrane two sides cut out, the time controlling plated film as required regulates film thickness, and the target of sputtering is copper target, working gas nitrogen and argon gas;
3rd step: the power and the laser radius that regulate laser, according to the circuit diagram designed, irradiates the relevant position of copper nitride film on basement membrane, etches required circuit;
4th step: be put into by wiring board in watery hydrochloric acid and dissolved by copper nitride, takes out rear clear water and wiring board is cleaned up dries; Add that there being one deck of circuit coverlay is as protective layer.
2. a kind of flexible circuitry board fabrication method based on copper nitride film according to claim 1, is characterized in that the basement membrane in the first step can be PI film.
3. a kind of flexible circuitry board fabrication method based on copper nitride film according to claim 2, it is characterized in that in the 3rd step, laser irradiates copper nitride film on basement membrane, temperature is at 360 DEG C.
CN201410497288.8A 2014-09-25 2014-09-25 Method for manufacturing flexible circuit board based on copper nitride film Pending CN104320913A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410497288.8A CN104320913A (en) 2014-09-25 2014-09-25 Method for manufacturing flexible circuit board based on copper nitride film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410497288.8A CN104320913A (en) 2014-09-25 2014-09-25 Method for manufacturing flexible circuit board based on copper nitride film

Publications (1)

Publication Number Publication Date
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106304659A (en) * 2016-08-28 2017-01-04 广西小草信息产业有限责任公司 A kind of manufacture method of surface-mounted integrated circuit
CN106535502A (en) * 2016-10-17 2017-03-22 奥士康精密电路（惠州）有限公司 Electroplating method of high-aspect ratio circuit board
CN108411271A (en) * 2018-05-18 2018-08-17 杭州电子科技大学信息工程学院 A method of preparing porous nano steel structure
CN109817384A (en) * 2018-12-21 2019-05-28 江苏日久光电股份有限公司 A kind of easier metal grill production method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005123468A (en) * 2003-10-17 2005-05-12 Fujikura Ltd Film for electronic beam irradiation crosslink separation and method for manufacturing flexible printed circuit board using same
CN103596373A (en) * 2013-11-07 2014-02-19 南京邮电大学 Integrated circuit plate manufacturing method based on copper nitride film
CN103596374A (en) * 2013-11-07 2014-02-19 溧阳市江大技术转移中心有限公司 Method for forming conducting line on flexible circuit board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005123468A (en) * 2003-10-17 2005-05-12 Fujikura Ltd Film for electronic beam irradiation crosslink separation and method for manufacturing flexible printed circuit board using same
CN103596373A (en) * 2013-11-07 2014-02-19 南京邮电大学 Integrated circuit plate manufacturing method based on copper nitride film
CN103596374A (en) * 2013-11-07 2014-02-19 溧阳市江大技术转移中心有限公司 Method for forming conducting line on flexible circuit board

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106304659A (en) * 2016-08-28 2017-01-04 广西小草信息产业有限责任公司 A kind of manufacture method of surface-mounted integrated circuit
CN106535502A (en) * 2016-10-17 2017-03-22 奥士康精密电路（惠州）有限公司 Electroplating method of high-aspect ratio circuit board
CN108411271A (en) * 2018-05-18 2018-08-17 杭州电子科技大学信息工程学院 A method of preparing porous nano steel structure
CN109817384A (en) * 2018-12-21 2019-05-28 江苏日久光电股份有限公司 A kind of easier metal grill production method

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CB03 Change of inventor or designer information

Inventor after: Li Xingao

Inventor after: Yang Jianbo

Inventor after: Li Chong

Inventor after: Wu Zhenli

Inventor after: Yan Meng

Inventor after: Zhao Yanghua

Inventor after: Huang Wei

Inventor before: Li Xingao

Inventor before: Yang Jianbo

Inventor before: Li Chong

Inventor before: Wu Zhenli

Inventor before: Yan Meng

Inventor before: Zhao Jianhua

Inventor before: Huang Wei

COR Change of bibliographic data

Free format text: CORRECT: INVENTOR; FROM: LI XINGAO YANG JIANBO LI TONG WU ZHENLI YAN MENG ZHAO JIANHUA HUANG WEI TO: LI XINGAO YANG JIANBO LI TONG WU ZHENLI YAN MENG ZHAO YANGHUA HUANG WEI

RJ01 Rejection of invention patent application after publication

Application publication date: 20150128

RJ01 Rejection of invention patent application after publication