CN114679842A - Manufacturing method of stepped plate with metalized hole of bonding pad in stepped groove - Google Patents
Manufacturing method of stepped plate with metalized hole of bonding pad in stepped groove Download PDFInfo
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- CN114679842A CN114679842A CN202210205212.8A CN202210205212A CN114679842A CN 114679842 A CN114679842 A CN 114679842A CN 202210205212 A CN202210205212 A CN 202210205212A CN 114679842 A CN114679842 A CN 114679842A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 42
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 64
- 229910052802 copper Inorganic materials 0.000 claims abstract description 64
- 239000010949 copper Substances 0.000 claims abstract description 64
- 238000005553 drilling Methods 0.000 claims abstract description 50
- 238000000034 method Methods 0.000 claims abstract description 50
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 238000007747 plating Methods 0.000 claims abstract description 29
- 239000011347 resin Substances 0.000 claims abstract description 21
- 229920005989 resin Polymers 0.000 claims abstract description 21
- 238000005530 etching Methods 0.000 claims abstract description 19
- 239000003292 glue Substances 0.000 claims abstract description 17
- 238000005520 cutting process Methods 0.000 claims abstract description 12
- 238000009713 electroplating Methods 0.000 claims abstract description 11
- 238000010030 laminating Methods 0.000 claims abstract description 11
- 238000003801 milling Methods 0.000 claims abstract description 11
- 238000000465 moulding Methods 0.000 claims abstract description 9
- 238000003825 pressing Methods 0.000 claims abstract description 8
- 238000000151 deposition Methods 0.000 claims description 8
- 230000008021 deposition Effects 0.000 claims description 8
- 238000004806 packaging method and process Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000004381 surface treatment Methods 0.000 claims description 4
- 238000006087 Brown hydroboration reaction Methods 0.000 claims 1
- 238000001465 metallisation Methods 0.000 description 8
- 238000001764 infiltration Methods 0.000 description 5
- 230000008595 infiltration Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 239000003814 drug Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 230000008719 thickening Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a method for manufacturing a step plate with a metalized hole of a bonding pad in a step groove, which sequentially comprises the following steps of: cutting: cutting two substrates coated with copper on double sides, wherein the copper layers are named as an L1 layer, an L2 layer, an L3 layer and an L4 layer; drilling: respectively drilling through holes on the two substrates; plating a copper plate; plating a hole pattern: windowing and plating holes on the holes A within the range of the preset stepped groove; plating holes: electroplating the hole A; plugging holes with resin; etching the inner layer pattern and the inner layer; and (3) laminating: windowing the PP sheet without flowing glue, wherein the windowing position is the position of the preset stepped groove, and pressing to form a circuit board; outer layer pattern and outer layer etching; secondary drilling: drilling a through hole B, wherein the through hole B is in the range of the preset stepped groove, the through hole B penetrates through the hole A, and hole copper is reserved in the hole A after secondary drilling; molding: and carrying out depth control milling according to the range of a preset stepped groove to obtain a stepped metalized pad. And (5) performing a post-process. The process is easy to control, the manufacturing accuracy is high, and the efficiency and the product performance are improved.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a manufacturing method of a stepped plate with a metalized hole of a bonding pad in a stepped groove.
Background
In order to increase the heat dissipation area of the product and enhance the assembly safety of the components, a concave step groove needs to be manufactured on the PCB to fix the components, the design of the step plate is developed at the end, and the step groove is arranged on the step plate. The manufacture of the fully metallized stepped slot is relatively simpler than the manufacture of the partially metallized stepped slot. The conventional method for manufacturing the step metalized hole bonding pad comprises the following scheme:
the notch cuttype groove department is the real dielectric layer, follows the milling flutes from both sides respectively behind the base plate pressfitting, mills out the notch cuttype groove after, carries out metallization to the notch cuttype groove, carries out the milling flutes once more, but the notch cuttype groove's of this kind of mode preparation precision is low, and the whole metallizations of notch cuttype groove mill partial hole copper again in addition, and the incremental cost, the metallization effect is poor, mills out the notch cuttype groove process and hardly once realize, probably need mill the board many times, and is inefficient.
Disclosure of Invention
In order to solve the problems of low precision and poor quality of the conventional stepped plate containing PTH holes, the invention provides a method for manufacturing a metallized hole stepped plate with a bonding pad in a stepped groove.
A manufacturing method of a stepped plate with a metalized hole of a bonding pad in a stepped groove sequentially comprises the following steps:
cutting: cutting two substrates coated with copper on double sides, wherein the copper layers are named as an L1 layer, an L2 layer, an L3 layer and an L4 layer;
Drilling: respectively drilling through holes on the two substrates;
plating a copper plate;
plating a hole pattern: windowing and plating holes on the holes A within the range of the preset stepped groove;
plating holes: electroplating the hole A;
resin hole plugging: plugging the drilled holes with resin;
inner layer pattern and inner layer etching: after the circuit patterns on the L2 layer and the L3 layer are manufactured, etching the inner layer;
and (3) laminating: windowing the PP sheet without flowing glue, wherein the windowing position is the position of a preset stepped groove, and then laminating according to the sequence of the L1 layer, the L2 layer, the PP sheet, the L3 layer and the L4 layer to form a circuit board;
outer layer pattern and outer layer etching: after the outer layer pattern is manufactured, outer layer etching is carried out;
secondary drilling: drilling a hole B in the circuit board, wherein the hole B is in the range of the preset stepped groove and penetrates through the hole A, and hole copper is reserved in the hole A after secondary drilling;
molding: carrying out depth control milling according to the range of a preset stepped groove to obtain a stepped metalized pad;
and (5) performing a post-process. The whole manufacturing process is easy to control, the quality and the manufacturing accuracy of products are improved, the efficiency is high, and the problems of copper infiltration and glue overflow can be avoided.
Optionally, the diameter of the through hole B is smaller than the diameter of the hole a.
Optionally, after the pressing, outer layer mechanical drilling and a second copper plate deposition are sequentially performed, wherein the outer layer mechanical drilling is performed to drill a hole in the circuit board, and a through hole C is drilled.
Optionally, the hole a is a through hole of the L3-L4 layer.
Optionally, the plating hole plates the hole copper to a thickness of 100 μm to 150 μm.
Optionally, before the pressing, a browning treatment is performed on the substrate.
Optionally, after the outer layer is etched, the outer layer AOI, the solder mask and the characters are sequentially carried out, and secondary drilling is carried out after the characters are etched.
Optionally, after the secondary drilling, performing surface treatment on the circuit board.
Optionally, the post-process comprises FQC, OQC and packaging.
Optionally, the two substrates are respectively drilled with a plurality of through holes.
Compared with the prior art, the invention has the beneficial effects that: the invention provides a method for manufacturing a stepped plate with a metalized hole of a bonding pad in a stepped groove, which comprises the steps of plugging the hole with resin after the metalized hole is formed, and finally performing forming, so that the problem of copper infiltration in electroplating can be avoided, the problem of glue overflow is also avoided, and the product quality is good; the manufacturing precision of the stepped metalized pad is high, the process is easy to control, and the efficiency and the product performance are improved.
Drawings
Fig. 1 is a schematic flow chart of a method for manufacturing a stepped plate with a pad metallization hole in a stepped groove according to an embodiment of the present invention.
Fig. 2 is a first schematic circuit board diagram of a method for manufacturing a stepped plate with a pad metallization hole in a stepped groove according to an embodiment of the present invention;
fig. 3 is a circuit board schematic diagram ii of a method for manufacturing a stepped board with a pad metallization hole in a stepped groove according to an embodiment of the present invention;
fig. 4 is a third schematic diagram of a circuit board of the method for manufacturing the stepped plate with the pad metallization hole in the stepped groove according to the embodiment of the present invention;
fig. 5 is a fourth schematic circuit board diagram of a method for manufacturing a stepped plate with a pad metallization hole in a stepped groove according to an embodiment of the present invention;
Detailed Description
In order to explain the technical solution of the present invention in detail, the technical solution of the embodiment of the present invention will be clearly and completely described below. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention without any inventive step, are within the scope of protection of the invention.
Example 1:
the embodiment provides a method for manufacturing a stepped plate with a metalized hole of a bonding pad in a stepped groove, which sequentially comprises the following steps of:
Cutting: cutting two substrates coated with copper on double sides, wherein the copper layers are named as an L1 layer 1, an L2 layer 2, an L3 layer 3 and an L4 layer 4; namely, the upper surface copper layer of the first substrate is L1 layer 1, the lower surface copper layer of the first substrate is L2 layer 2, the upper surface copper layer of the second substrate is L3 layer 3, and the lower surface copper layer of the second substrate is L4 layer 4. The range of the stepped groove is preset.
Drilling: and respectively drilling through holes in the two substrates, wherein the number of the through holes is a plurality, the through holes comprise a hole A5 in the range of a preset stepped groove, and the hole A5 is a through hole of the L3-L4 layer 4.
And (3) copper plate deposition: and (5) carrying out copper plate deposition on the two substrates, forming hole copper in the drilled through hole, and thickening the thickness of the copper layer on the surface of the substrate.
Plating a hole pattern: and (3) windowing and plating holes on the holes A5 positioned in the range of the preset stepped groove.
Plating holes: hole a5 is plated to form a plated hole, which plates the hole copper to a thickness of 100-150 μm.
Resin hole plugging: resin plugging of the drilled holes, including resin plugging of hole a 5.
Inner layer pattern and inner layer etching: after the wiring patterns on the L2 layer 2 and the L3 layer 3 were formed, the inner layer was etched.
And (3) laminating: and (3) windowing the PP sheet 6 without flowing glue, wherein the windowing position is a preset step groove position, and then laminating according to the sequence of the L1 layer 1, the L2 layer 2, the PP sheet 6, the L3 layer 3 and the L4 layer 4 to form the circuit board. Referring to fig. 2, after pressing, a cavity is formed in the circuit board because the PP sheet 6 is windowed. The holes A5 are filled with resin, so that the potential quality hazards of electroplating diffusion plating and medicine liquid storage can be avoided. The problem of glue overflow can be avoided by adopting the PP sheet 6 without glue flowing.
Mechanically drilling the outer layer and electrically plating the copper plate II: the outer mechanical drilling holes the circuit board, drilling through holes C8.
Outer layer pattern and outer layer etching: and after the outer layer pattern is manufactured, outer layer etching is carried out.
And after the outer layer is etched, performing outer layer AOI, solder mask and characters in sequence, and performing secondary drilling after the characters. The outer layer AOI ensures the quality of the outer layer line.
Secondary drilling: referring to fig. 3, the circuit board is drilled to form via B7, via B7 is within the predetermined step and via B7 passes through via a5, leaving via copper in via a5 after the second drilling. The diameter of the through hole B7 is smaller than the diameter of the hole a 5. According to the position of the hole A5, the position of the through hole B7 can be accurately determined. So that the step groove obtained subsequently comprises a metallized hole.
Molding: referring to fig. 4-5, depth-controlled milling is performed according to a preset range of a stepped groove to obtain a stepped metalized pad, specifically, a part of the dielectric layer between the layers 2 of L1-L2 is milled, and the length of the milled groove is greater than the diameter of the hole a 5. Because the windowing area of the PP sheet 6 is within the range of the preset stepped groove, and the hole A5 is also within the range of the preset stepped groove, the precision of groove milling is easy to control.
And (3) post-flow: the post-process includes FQC, OQC and packaging. It is understood that the post-process may adopt other conventional processes of the existing PCB manufacturing method, and the present invention is not limited thereto.
In the figure, the copper layer 9 is formed by processing the layers L1, L2, L3 and L4 and the hole.
The embodiment provides a method for manufacturing a stepped plate with a metalized hole of a bonding pad in a stepped groove, which comprises the steps of plugging the hole with resin after the metalized hole is formed, and finally molding, so that the problem of copper infiltration in electroplating can be avoided, the problem of glue overflow is also avoided, and the product quality is good; the manufacturing accuracy of the step metalized pad is high, the process is easy to control, and the efficiency and the product performance are improved.
Example 2
The embodiment provides a method for manufacturing a stepped plate with a metalized hole of a bonding pad in a stepped groove, which sequentially comprises the following steps of:
cutting: cutting two substrates coated with copper on double sides, wherein copper layers are named as an L1 layer 1, an L2 layer 2, an L3 layer 3 and an L4 layer 4; namely, the upper surface copper layer of the first substrate is L1 layer 1, the lower surface copper layer of the first substrate is L2 layer 2, the upper surface copper layer of the second substrate is L3 layer 3, and the lower surface copper layer of the second substrate is L4 layer 4. The range of the stepped groove is preset.
Drilling: and respectively drilling through holes in the two substrates, wherein the number of the through holes is a plurality, the through holes comprise a hole A5 in the range of a preset stepped groove, and the hole A5 is a through hole of the L3-L4 layer 4.
And (3) copper plate deposition: and (5) carrying out copper plate deposition on the two substrates, forming hole copper in the drilled through hole, and thickening the thickness of the copper layer on the surface of the substrate.
Plating a hole pattern: and (4) windowing and plating holes on the holes A5 in the range of the preset stepped groove.
Plating holes: electroplating the hole A5 to form a metalized hole, wherein the plated hole is plated to a hole copper thickness of 100-150 μm.
Resin hole plugging: resin plugging of the drilled holes, including resin plugging of hole a 5.
Inner layer pattern and inner layer etching: after the wiring patterns on the L2 layer 2 and the L3 layer 3 were formed, the inner layer was etched.
And (3) laminating: and (3) windowing the PP sheet 6 without flowing glue, wherein the windowing position is a preset step groove position, and then laminating according to the sequence of the L1 layer 1, the L2 layer 2, the PP sheet 6, the L3 layer 3 and the L4 layer 4 to form the circuit board. Referring to fig. 2, after pressing, a cavity is formed in the circuit board because the PP sheet 6 is windowed. The holes A5 are filled with resin, so that the potential quality hazards of electroplating diffusion plating and medicine liquid storage can be avoided. The problem of glue overflow can be avoided by adopting the PP sheet 6 without glue flowing.
Mechanically drilling the outer layer and electrically plating the copper plate II: the outer mechanical drilling holes the circuit board, drilling through holes C8.
Outer layer pattern and outer layer etching: and after the outer layer pattern is manufactured, outer layer etching is carried out.
And after the outer layer is etched, performing outer layer AOI, solder mask and characters in sequence, and performing secondary drilling after the characters. The outer layer AOI ensures the quality of the outer layer line.
Secondary drilling: referring to fig. 3, the circuit board is drilled to form via B7, via B7 is within the predetermined step and via B7 passes through via a5, leaving via copper in via a5 after the second drilling. The diameter of the through hole B7 is smaller than the diameter of the hole a 5. According to the position of the hole A5, the position of the through hole B7 can be accurately determined. So that the step groove obtained subsequently comprises a metallized hole.
Molding: referring to fig. 4-5, depth-controlled milling is performed according to a preset range of a stepped groove to obtain a stepped metalized pad, specifically, a part of the dielectric layer between the layers 2 of L1-L2 is milled, and the length of the milled groove is greater than the diameter of the hole a 5. Because the windowing area of the PP sheet 6 is within the range of the preset stepped groove, and the hole A5 is also within the range of the preset stepped groove, the precision of groove milling is easy to control.
And (3) post-flow: the post-process includes FQC, OQC and packaging. It is understood that the post-process may adopt other conventional processes of the existing PCB manufacturing method, and the present invention is not limited thereto. In the figure, the copper layer 9 is formed by processing the layers L1, L2, L3 and L4 and the hole.
The present embodiment 2 differs from embodiments 1 and 3 in that: and after secondary drilling, performing surface treatment on the circuit board, and molding the circuit board after the surface treatment.
The embodiment provides a method for manufacturing a stepped plate with a metalized hole of a bonding pad in a stepped groove, which comprises the steps of plugging the hole with resin after the metalized hole is formed, and finally molding, so that the problem of copper infiltration in electroplating can be avoided, the problem of glue overflow is also avoided, and the product quality is good; the manufacturing accuracy of the step metalized pad is high, the process is easy to control, and the efficiency and the product performance are improved.
Example 3
The embodiment provides a method for manufacturing a stepped plate with a metalized hole of a bonding pad in a stepped groove, which sequentially comprises the following steps of:
cutting: cutting two substrates coated with copper on double sides, wherein the copper layers are named as an L1 layer 1, an L2 layer 2, an L3 layer 3 and an L4 layer 4; namely, the upper surface copper layer of the first substrate is L1 layer 1, the lower surface copper layer of the first substrate is L2 layer 2, the upper surface copper layer of the second substrate is L3 layer 3, and the lower surface copper layer of the second substrate is L4 layer 4. The range of the stepped groove is preset.
Drilling: and respectively drilling through holes in the two substrates, wherein the number of the through holes is a plurality, the through holes comprise a hole A5 in the range of a preset stepped groove, and the hole A5 is a through hole of the L3-L4 layer 4.
And (3) copper plate deposition: and (5) carrying out copper plate deposition on the two substrates, forming hole copper in the drilled through hole, and thickening the thickness of the copper layer on the surface of the substrate.
Plating a hole pattern: and (3) windowing and plating holes on the holes A5 positioned in the range of the preset stepped groove.
Plating holes: hole a5 is plated to form a plated hole, which plates the hole copper to a thickness of 100-150 μm.
Resin hole plugging: resin plugging of the drilled holes, including resin plugging of hole a 5.
Inner layer pattern and inner layer etching: after the wiring patterns on the L2 layer 2 and the L3 layer 3 were formed, the inner layer was etched.
And (3) laminating: and (3) windowing the PP sheet 6 without flowing glue, wherein the windowing position is a preset step groove position, and then laminating according to the sequence of the L1 layer 1, the L2 layer 2, the PP sheet 6, the L3 layer 3 and the L4 layer 4 to form the circuit board. Referring to fig. 2, after pressing, a cavity is formed in the circuit board because the PP sheet 6 is windowed. The holes A5 are filled with resin, so that the potential quality hazards of electroplating diffusion plating and medicine liquid storage can be avoided. The problem of glue overflow can be avoided by adopting the PP sheet 6 without glue flowing.
Mechanically drilling the outer layer and electrically plating the copper plate II: the outer mechanical drilling holes the circuit board, drilling through holes C8.
Outer layer pattern and outer layer etching: and after the outer layer pattern is manufactured, outer layer etching is carried out.
And after the outer layer is etched, performing outer layer AOI, solder mask and characters in sequence, and performing secondary drilling after the characters. The outer layer AOI ensures the quality of the outer layer line.
Secondary drilling: referring to fig. 3, the circuit board is drilled to form a through hole B7, a through hole B7 is within the range of the preset stepped groove, a through hole B7 penetrates through a hole a5, and after secondary drilling, a hole a5 is reserved with hole copper. The diameter of the through hole B7 is smaller than the diameter of the hole a 5. According to the position of the hole A5, the position of the through hole B7 can be accurately determined. So that the step groove obtained subsequently comprises a metallized hole.
Molding: referring to fig. 4-5, depth-controlled milling is performed according to a preset range of a stepped groove to obtain a stepped metalized pad, specifically, a part of the dielectric layer between the layers 2 of L1-L2 is milled, and the length of the milled groove is greater than the diameter of the hole a 5. Because the windowing area of the PP sheet 6 is within the range of the preset stepped groove, and the hole A5 is also within the range of the preset stepped groove, the precision of groove milling is easy to control.
And (3) post-flow: the post-process includes FQC, OQC and packaging. It is understood that the post-process may adopt other conventional processes of the existing PCB manufacturing method, and the present invention is not limited thereto. In the figure, the copper layer 9 is formed by processing an L1 layer, an L2 layer, an L3 layer and an L4 layer or a hole.
The embodiment provides a method for manufacturing a stepped plate with a metalized hole of a bonding pad in a stepped groove, wherein after the metalized hole is formed, resin hole plugging is carried out, and finally, the step plate is formed, so that the problems of electroplating and copper infiltration can be avoided, the problem of glue overflow is also avoided, and the product quality is good; the manufacturing accuracy of the step metalized pad is high, the process is easy to control, and the efficiency and the product performance are improved.
It can be understood that the invention adopts two substrates, and if more than two substrates are adopted, the technical scheme that the principle of manufacturing the stepped metalized bonding pad is the same as that of the invention also belongs to the protection scope of the invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
In the description of the present invention, it is to be understood that the terms indicating an orientation or positional relationship are based on the orientation or positional relationship shown in the drawings only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described above, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall fall within the protection scope of the present invention.
Claims (10)
1. A manufacturing method of a stepped plate with a metalized hole of a bonding pad in a stepped groove is characterized by comprising the following steps: the method sequentially comprises the following steps:
cutting: cutting two substrates coated with copper on double sides, wherein copper layers are named as an L1 layer (1), an L2 layer (2), an L3 layer (3) and an L4 layer (4);
drilling: respectively drilling through holes on the two substrates;
plating a copper plate;
plating a hole pattern: windowing and plating holes are carried out on the holes A (5) located in the range of the preset stepped groove;
plating holes: electroplating the hole A;
resin hole plugging: plugging the drilled holes with resin;
inner layer pattern and inner layer etching: after the circuit patterns on the L2 layer and the L3 layer are manufactured, etching the inner layer;
and (3) laminating: windowing the PP sheet (6) without flowing glue, wherein the windowing position is a preset step groove position, and then laminating according to the sequence of the L1 layer, the L2 layer, the PP sheet, the L3 layer and the L4 layer to form a circuit board;
Outer layer pattern and outer layer etching: after the outer layer graph is manufactured, outer layer etching is carried out;
secondary drilling: drilling a hole B (7) in the circuit board, wherein the hole B is in the range of the preset stepped groove and penetrates through the hole A, and hole copper is reserved in the hole A after secondary drilling;
molding: carrying out depth control milling according to the range of a preset step groove to obtain a step metalized bonding pad;
and (5) performing a post process.
2. The method for manufacturing the stepped plate with the metalized holes of the bonding pads in the stepped groove according to claim 1, wherein the method comprises the following steps: the diameter of the through hole B is smaller than that of the hole A.
3. The method for manufacturing the stepped plate with the metalized holes of the bonding pads in the stepped groove according to claim 1, wherein the method comprises the following steps: and after the pressing, sequentially performing outer-layer mechanical drilling and copper plate deposition, wherein the outer-layer mechanical drilling is used for drilling the circuit board to drill a through hole C (8).
4. The method for manufacturing the stepped plate with the metalized holes of the bonding pads in the stepped groove according to claim 1, wherein the method comprises the following steps: the hole A is a through hole of an L3-L4 layer.
5. The method for manufacturing the stepped plate with the metalized holes of the bonding pads in the stepped groove according to claim 1, wherein the method comprises the following steps: the plating hole plates the hole copper to a thickness of 100-150 μm.
6. The method for manufacturing the stepped plate with the metallized holes of the bonding pads in the stepped groove according to claim 1, is characterized in that: and before pressing, carrying out brown oxidation treatment on the substrate.
7. The method for manufacturing the stepped plate with the metallized holes of the bonding pads in the stepped groove according to claim 1, is characterized in that: and after the outer layer is etched, performing outer layer AOI, solder mask and characters in sequence, and performing secondary drilling after the characters.
8. A method for manufacturing a stepped plate with metallized holes of a bonding pad in a stepped groove according to claim 1 or 5, wherein: and after the secondary drilling, performing surface treatment on the circuit board.
9. The method for manufacturing the stepped plate with the metalized holes of the bonding pads in the stepped groove according to claim 1, wherein the method comprises the following steps: the post-process includes FQC, OQC and packaging.
10. The method for manufacturing the stepped plate with the metalized holes of the bonding pads in the stepped groove according to claim 1, wherein the method comprises the following steps: and respectively drilling through holes in the two substrates, wherein the number of the through holes is a plurality.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210205212.8A CN114679842B (en) | 2022-03-02 | 2022-03-02 | Manufacturing method of stepped plate with metalized holes with bonding pads in stepped grooves |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210205212.8A CN114679842B (en) | 2022-03-02 | 2022-03-02 | Manufacturing method of stepped plate with metalized holes with bonding pads in stepped grooves |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114679842A true CN114679842A (en) | 2022-06-28 |
| CN114679842B CN114679842B (en) | 2024-10-22 |
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Citations (5)
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| US20160150653A1 (en) * | 2013-08-02 | 2016-05-26 | Peking University Founder Group Co., Ltd. | Manufacturing method for back drilling hole in pcb and pcb |
| CN108055787A (en) * | 2017-12-05 | 2018-05-18 | 深圳崇达多层线路板有限公司 | A kind of solder-resisting manufacturing methods of stepped plate |
| CN108966532A (en) * | 2018-08-20 | 2018-12-07 | 深圳崇达多层线路板有限公司 | A kind of production method of three rank HDI plates of the golden finger containing ladder |
| CN109661128A (en) * | 2018-12-20 | 2019-04-19 | 深圳市通为信电路科技有限公司 | A kind of multi-layer PCB board preparation method and multi-layer PCB board |
| WO2021189744A1 (en) * | 2020-03-27 | 2021-09-30 | 广东科翔电子科技股份有限公司 | Preparation method for 77 ghz millimeter wave radar circuit board |
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2022
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160150653A1 (en) * | 2013-08-02 | 2016-05-26 | Peking University Founder Group Co., Ltd. | Manufacturing method for back drilling hole in pcb and pcb |
| CN108055787A (en) * | 2017-12-05 | 2018-05-18 | 深圳崇达多层线路板有限公司 | A kind of solder-resisting manufacturing methods of stepped plate |
| CN108966532A (en) * | 2018-08-20 | 2018-12-07 | 深圳崇达多层线路板有限公司 | A kind of production method of three rank HDI plates of the golden finger containing ladder |
| CN109661128A (en) * | 2018-12-20 | 2019-04-19 | 深圳市通为信电路科技有限公司 | A kind of multi-layer PCB board preparation method and multi-layer PCB board |
| WO2021189744A1 (en) * | 2020-03-27 | 2021-09-30 | 广东科翔电子科技股份有限公司 | Preparation method for 77 ghz millimeter wave radar circuit board |
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| CN114679842B (en) | 2024-10-22 |
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