CN114916140A - Method for etching PCB board by laser assistance - Google Patents
Method for etching PCB board by laser assistance Download PDFInfo
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- CN114916140A CN114916140A CN202210550393.8A CN202210550393A CN114916140A CN 114916140 A CN114916140 A CN 114916140A CN 202210550393 A CN202210550393 A CN 202210550393A CN 114916140 A CN114916140 A CN 114916140A
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- copper foil
- etching
- etched
- laser
- groove
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- 238000005530 etching Methods 0.000 title claims abstract description 112
- 238000000034 method Methods 0.000 title claims abstract description 37
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 132
- 239000011889 copper foil Substances 0.000 claims abstract description 115
- 238000007639 printing Methods 0.000 claims abstract description 24
- 238000007650 screen-printing Methods 0.000 claims abstract description 20
- 229910052802 copper Inorganic materials 0.000 claims abstract description 17
- 239000010949 copper Substances 0.000 claims abstract description 17
- 238000006087 Brown hydroboration reaction Methods 0.000 claims abstract description 12
- 238000004140 cleaning Methods 0.000 claims abstract description 7
- 238000007788 roughening Methods 0.000 claims abstract description 6
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 10
- 238000005406 washing Methods 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 6
- 239000004677 Nylon Substances 0.000 claims description 5
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 5
- 239000001569 carbon dioxide Substances 0.000 claims description 5
- 229920001778 nylon Polymers 0.000 claims description 5
- 239000007788 liquid Substances 0.000 description 21
- 239000003814 drug Substances 0.000 description 20
- 230000003628 erosive effect Effects 0.000 description 14
- 230000000694 effects Effects 0.000 description 9
- 238000005238 degreasing Methods 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000012466 permeate Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229940079593 drug Drugs 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a method for etching a PCB board by laser assistance, which sequentially comprises the following steps: pasting a dry film on the PCB, then exposing and developing to expose the copper foil area to be etched; performing brown oxidation treatment, namely performing brown oxidation treatment on a copper foil area to be etched; performing laser grooving, namely performing laser grooving at the junction of the dry film and the copper foil area to be etched to form a groove, wherein the groove is located in an area extending 2-4 microns to the copper foil area to be etched at the junction, and the copper foil layer is broken through by laser without damaging a PP layer below the copper foil; removing browning; micro-etching: cleaning and roughening the copper surface in the groove by microetching; printing ink and baking: carrying out screen printing on the groove, and then baking; etching: completely etching the copper foil on the copper foil area to be etched; removing oil and removing film. The invention can reduce the side etching rate and improve the etching precision.
Description
Technical Field
The invention relates to the field of PCBs, in particular to a laser-assisted PCB etching method.
Background
Etching is a key technology for forming circuits on the surface of the PCB, and can be used for reserving a required copper surface by etching away an unnecessary copper surface, wherein the etching is an important process in the manufacture of an inner layer pattern or an outer layer pattern. However, even if the etching solution is sprayed in the current PCB manufacturing process, the chemical solution inevitably permeates to the two sides of the circuit, so that the lateral erosion phenomenon is caused, the etching solution hits the surface of the PCB under the spraying effect, the etching solution is vertically downward, but the chemical solution diffuses to the two sides in the downward microetching process, that is, the etching solution bites copper downward and bites copper to the two sides, so that the copper under the solidified dry film is also affected, so that an engineer sets the circuit to reserve a certain width according to experience, so that the lateral erosion of the etching solution to the circuit can be reduced or avoided, the larger the width or the distance between the circuits is, the larger the reserved space is, the two conditions of incomplete etching and excessive etching are relatively easily balanced, and the etching uniformity is improved; however, if the line width or the line pitch is relatively small, the space that the PCB can take is limited, which makes it difficult to avoid or mitigate the undercut situation.
Along with the development trend of continuous refinement of circuits, if the lateral erosion rate cannot be reduced, the quality of a PCB (printed circuit board) is greatly influenced, a plurality of domestic etching liquid medicines cannot meet the requirement of accurate etching at present, although China has opened the innovation and the development result is obvious, the research and development time is short, the etching accuracy of the domestic etching liquid medicine is still higher than that of the domestic etching liquid medicine, the cost of the foreign etching liquid medicine is high, and compared with the imported expensive etching liquid, the improvement on the process method is better.
Disclosure of Invention
The invention provides a laser-assisted PCB etching method, aiming at solving the problem of high lateral erosion rate in the existing PCB etching.
A method for etching a PCB board by laser assistance sequentially comprises the following steps:
pasting a dry film on the PCB, then exposing and developing to expose a copper foil area to be etched;
brown oxidation treatment, wherein brown oxidation treatment is carried out on a copper foil area to be etched;
performing laser grooving, namely performing laser grooving at the junction of the dry film and the copper foil area to be etched to form a groove, wherein the groove is positioned in an area extending 2-4 microns to the copper foil area to be etched at the junction, and the copper foil layer is punctured by laser without damaging the PP layer below the copper foil;
removing browning;
micro-etching: cleaning and roughening the copper surface in the groove by microetching;
printing ink and baking: carrying out screen printing on the groove, and then baking;
etching: completely etching the copper foil on the copper foil area to be etched;
removing oil and removing film. The side etching rate is reduced, and the etching precision is improved.
Optionally, after the microetching, degreasing and ultrasonic cleaning are carried out, and then ink is applied;
the frequency of the ultrasonic wave is 25-45KHz, and the time is 3-5 min. The ultrasonic cleaning effect is good.
Optionally, the browning treatment is performed at normal temperature, and the browning treatment time is 3-5 minutes. The browning effect is good, and the laser grooving effect is favorably improved.
Optionally, the removing brown oxide comprises removing brown oxide by water washing.
Optionally, the PCB board includes two copper foil layers, and a PP sheet between the copper foil layers.
Optionally, the energy of the laser is 6mj, the pulse width is 10us, and the aperture is 5 mil.
Optionally, the laser is a carbon dioxide laser.
Optionally, in the silk-screen printing, the adopted printing ink is green oil, the temperature of the printing ink is controlled to be 5-10 ℃, and the humidity of the printing ink is 35-45%. Is beneficial to reducing the lateral erosion degree.
Optionally, the silk screen printing adopts a nylon silk screen, and the mesh number of the adopted silk screen is 35-40 meshes.
Optionally, before the browning treatment, the copper foil area to be etched is washed for 1-4 times.
Compared with the prior art, the invention has the beneficial effects that: the invention provides a method for etching a PCB board by laser, which comprises the steps of carrying out laser grooving at the junction of a dry film and a copper foil area to be etched to form a groove, then carrying out screen printing on the groove, separating a copper foil under the dry film from a copper foil in the copper foil area to be etched by the groove, and then etching the copper foil area to be etched, so that the side etching of an etching liquid medicine to the copper foil under the dry film can be greatly reduced, and the etching effect can be improved; the etching precision is improved, the side etching rate is reduced, and the two conditions of incomplete etching and over etching are balanced.
Detailed Description
In order to explain the technical solutions of the present invention in detail, the technical solutions of the embodiments of the present invention will be clearly and completely described below. The described embodiments are only some, but not all embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention without any inventive step, are within the scope of protection of the invention.
Example 1
The embodiment provides a method for etching a PCB board by laser assistance, which sequentially comprises the following steps:
(1) and (3) pasting a dry film on the PCB, then exposing and developing to expose the copper foil area to be etched. Namely, the dry film is covered on the copper foil which is not required to be etched on the surface of the PCB, the copper foil which is required to be etched is exposed, and the exposed area is the area of the copper foil to be etched. The PCB comprises two copper foil layers and a PP sheet between the copper foil layers.
(2) And (4) brown oxidation treatment, namely brown oxidation treatment is carried out on the copper foil area to be etched. The browning treatment is carried out at normal temperature, and the browning treatment time is 3-5 minutes.
(3) And (3) laser grooving, namely performing laser grooving at the junction of the dry film and the copper foil area to be etched to form a groove, wherein the groove is positioned in the region of the junction extending 2-4 microns towards the copper foil area to be etched, namely the groove is positioned on the copper foil area to be etched close to the dry film, the copper foil layer is punctured by laser, and the PP layer below the copper foil is not damaged.
The laser energy is 6mj, the pulse width is 10us, the aperture is 5mil, the laser is adopted for spraying, the copper foil can be broken down, the PP sheet in the middle is not damaged, and a groove sprayed by the laser is generated between the copper foil area to be etched and the dry film. In some embodiments, the laser is a carbon dioxide laser.
(4) Removing browning, and removing browning by washing with water.
(5) Micro-etching: and cleaning and roughening the copper surface in the groove by microetching.
(6) Printing ink and baking: the trenches are screen printed and then baked.
The screen printing adopts green oil as the printing ink, the temperature of the printing ink is controlled to be 5-10 ℃, and the humidity of the printing ink is 35-45%. In some embodiments, the screen printing is performed using a nylon screen, and the mesh number of the screen is 35-40.
The grooves are coated with printing ink through screen printing, so that the etching liquid medicine can be prevented from permeating and biting the copper foil below the dry film during subsequent etching, the etching liquid medicine can directly etch the copper foil area to be etched, and the side etching condition is avoided.
(7) Etching: and completely etching away the copper foil on the copper foil area to be etched.
And etching the copper foil area to be etched by using the conventional etching liquid medicine so as to etch the exposed copper surface. Because the grooves are printed with ink, the other side of the grooves is not easy to be etched by etching liquid medicine, namely, the copper foil covered by the dry film is not easy to be etched.
Tests prove that the lateral erosion rate of the PCB with the line width and the line distance of more than 75 microns is less than 5%, and the lateral erosion rate of the PCB with the line width and the line distance of 25-50 microns is about 8%, so that the lateral erosion rate is greatly reduced, the etching uniformity is improved, and the problems of incomplete partial etching and excessive partial etching caused by poor copper plating uniformity are solved.
(8) Removing oil and removing film. And (4) removing oil under an alkaline condition, and removing the dry film.
The embodiment provides a method for assisting PCB etching by laser, wherein laser grooving is carried out at the junction of a dry film and a copper foil area to be etched to form a groove, screen printing is carried out on the groove, the groove separates a copper foil under the dry film from a copper foil in the copper foil area to be etched, and the copper foil area to be etched is subsequently etched, so that the side etching of etching liquid medicine on the copper foil under the dry film can be greatly reduced, the etching effect can be improved, and the two conditions of incomplete etching and excessive etching can be balanced.
Example 2
This embodiment is different from embodiment 1 or embodiment 3 in that: after microetching, degreasing and ultrasonic cleaning are carried out, and then ink is applied. The frequency of the ultrasonic wave is 25-45KHz, and the time is 3-5 min. Therefore, the technical scheme of the embodiment is as follows:
the embodiment provides a method for etching a PCB board by laser assistance, which sequentially comprises the following steps:
(1) and (4) pasting a dry film on the PCB, then exposing and developing to expose the copper foil area to be etched. Namely, the dry film is covered on the copper foil which is not required to be etched on the surface of the PCB, the copper foil which is required to be etched is exposed, and the exposed area is the area of the copper foil to be etched. The PCB comprises two copper foil layers and a PP sheet between the copper foil layers.
(2) And (4) performing brown oxidation treatment, namely performing brown oxidation treatment on the copper foil area to be etched. The browning treatment is carried out at normal temperature, and the browning treatment time is 3-5 minutes.
(3) And (3) laser grooving, namely performing laser grooving at the junction of the dry film and the copper foil area to be etched to form a groove, wherein the groove is positioned in the region of the junction extending 2-4 microns towards the copper foil area to be etched, namely the groove is positioned on the copper foil area to be etched close to the dry film, the copper foil layer is punctured by laser, and the PP layer below the copper foil is not damaged.
The laser energy is 6mj, the pulse width is 10us, the aperture is 5mil, the laser is adopted for spraying, the copper foil can be broken down, the PP sheet in the middle is not damaged, and a groove sprayed by the laser is generated between the copper foil area to be etched and the dry film. In some embodiments, the laser is a carbon dioxide laser.
(4) Removing browning, and removing browning by washing with water.
(5) Micro-etching: and cleaning and roughening the copper surface in the groove by microetching.
(6) Degreasing and ultrasonic cleaning
The frequency of the ultrasonic wave is 25-45KHz, and the time is 3-5 min. Removing impurities and chemical substances remained in the processes of browning and micro-etching.
(7) Printing ink and baking: the trenches are screen printed and then baked.
The screen printing adopts green oil as the printing ink, the temperature of the printing ink is controlled to be 5-10 ℃, and the humidity of the printing ink is 35-45%. In some embodiments, the screen printing is performed using a nylon screen, and the mesh number of the screen is 35-40.
The grooves are coated with printing ink through screen printing, so that the phenomenon that etching liquid medicine permeates and bites the copper foil below the dry film during subsequent etching can be prevented, the etching liquid medicine can directly etch the copper foil area to be etched, and the side etching condition is avoided.
(8) Etching: and completely etching away the copper foil on the copper foil area to be etched.
And etching the copper foil area to be etched by using the conventional etching liquid medicine so as to etch the exposed copper surface. Because the grooves are printed with ink, the other side of the grooves is not easy to be etched by etching liquid medicine, namely, the copper foil covered by the dry film is not easy to be etched.
Tests prove that the lateral erosion rate of the PCB with the line width and the line distance of more than 75 microns is less than 5%, and the lateral erosion rate of the PCB with the line width and the line distance of 25-50 microns is about 8%, so that the lateral erosion rate is greatly reduced, the etching uniformity is improved, and the problems of incomplete partial etching and excessive partial etching caused by poor copper plating uniformity are solved.
(9) Removing oil and removing film. And (4) removing oil under an alkaline condition, and removing the dry film.
The embodiment provides a method for assisting PCB etching by laser, wherein laser grooving is carried out at the junction of a dry film and a copper foil area to be etched to form a groove, screen printing is carried out on the groove, the groove separates a copper foil under the dry film from a copper foil in the copper foil area to be etched, and the copper foil area to be etched is subsequently etched, so that the side etching of etching liquid medicine on the copper foil under the dry film can be greatly reduced, the etching effect can be improved, and the two conditions of incomplete etching and excessive etching can be balanced.
Example 3
This example is different from example 1 and example 2 in that: and before the browning treatment, washing the copper foil area to be etched for 1-4 times. Therefore, the technical solution of this embodiment is:
the embodiment provides a method for etching a PCB board by laser assistance, which sequentially comprises the following steps:
(1) and (3) pasting a dry film on the PCB, then exposing and developing to expose the area of the copper foil to be etched, and cleaning for 1-4 times by adopting pure water. Namely, the dry film is covered on the copper foil which is not required to be etched on the surface of the PCB, the copper foil which is required to be etched is exposed, and the exposed area is the area of the copper foil to be etched. The PCB comprises two copper foil layers and a PP sheet between the copper foil layers. In some embodiments, the washing with pure water is performed 3 times, which is beneficial to improving the subsequent browning effect.
(2) And (4) performing brown oxidation treatment, namely performing brown oxidation treatment on the copper foil area to be etched. The browning treatment is carried out at normal temperature, and the browning treatment time is 3-5 minutes.
(3) And (3) laser grooving, namely performing laser grooving at the junction of the dry film and the copper foil area to be etched to form a groove, wherein the groove is positioned in the region of the junction extending 2-4 microns towards the copper foil area to be etched, namely the groove is positioned on the copper foil area to be etched close to the dry film, the copper foil layer is punctured by laser, and the PP layer below the copper foil is not damaged.
The laser energy is 6mj, the pulse width is 10us, the aperture is 5mil, the laser is adopted for spraying, the copper foil can be broken down, the PP sheet in the middle is not damaged, and a groove sprayed by the laser is generated between the copper foil area to be etched and the dry film. In some embodiments, the laser is a carbon dioxide laser.
(4) Removing browning, and removing browning by washing with water.
(5) Micro-etching: and cleaning and roughening the copper surface in the groove by microetching.
(6) Degreasing and ultrasonic cleaning
The frequency of the ultrasonic wave is 25-45KHz, and the time is 3-5 min. Removing impurities and chemical substances remained in the processes of browning and micro-etching.
(7) Printing ink and baking: the grooves are screen printed and then baked.
The screen printing adopts green oil as printing ink, the temperature of the printing ink is controlled to be 5-10 ℃, and the humidity of the printing ink is 35-45%. In some embodiments, the screen printing is performed using a nylon screen, and the mesh number of the screen is 35-40.
The grooves are coated with printing ink through screen printing, so that the phenomenon that etching liquid medicine permeates and bites the copper foil below the dry film during subsequent etching can be prevented, the etching liquid medicine can directly etch the copper foil area to be etched, and the side etching condition is avoided.
(8) Etching: and completely etching away the copper foil on the copper foil area to be etched.
And etching the copper foil area to be etched by using the conventional etching liquid medicine so as to etch the exposed copper surface. Because the grooves are printed with ink, the other side of the grooves is not easy to be etched by etching liquid medicine, namely, the copper foil covered by the dry film is not easy to be etched.
Tests prove that the lateral erosion rate of the PCB with the line width and the line distance of more than 75 microns is less than 5%, and the lateral erosion rate of the PCB with the line width and the line distance of 25-50 microns is about 8%, so that the lateral erosion rate is greatly reduced, the etching uniformity is improved, and the problems of incomplete partial etching and excessive partial etching caused by poor copper plating uniformity are solved.
(9) Removing oil and removing film. And (4) removing oil under an alkaline condition, and removing the dry film.
The embodiment provides a method for assisting PCB etching by laser, wherein laser grooving is carried out at the junction of a dry film and a copper foil area to be etched to form a groove, screen printing is carried out on the groove, the groove separates a copper foil under the dry film from a copper foil in the copper foil area to be etched, and the copper foil area to be etched is subsequently etched, so that the side etching of etching liquid medicine on the copper foil under the dry film can be greatly reduced, the etching effect can be improved, and the two conditions of incomplete etching and excessive etching can be balanced.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
In the description of the present invention, it is to be understood that the terms indicating orientation or positional relationship are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus, are not to be construed as limiting the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", and the like refer to the orientation or positional relationship that is conventionally used for the product of the present invention, and are used for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described above, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall fall within the protection scope of the present invention.
Claims (10)
1. A method for etching a PCB board by laser is characterized in that: the method sequentially comprises the following steps:
pasting a dry film on the PCB, then exposing and developing to expose a copper foil area to be etched;
brown oxidation treatment, wherein brown oxidation treatment is carried out on a copper foil area to be etched;
performing laser grooving, namely performing laser grooving at the junction of the dry film and the copper foil area to be etched to form a groove, wherein the groove is located in an area extending 2-4 microns to the copper foil area to be etched at the junction, and the copper foil layer is broken through by laser without damaging a PP layer below the copper foil;
removing browning;
micro-etching: cleaning and roughening the copper surface in the groove by microetching;
printing ink and baking: carrying out screen printing on the groove, and then baking;
etching: completely etching the copper foil on the copper foil area to be etched;
and (4) removing oil and a film.
2. The method of claim 1, wherein the method comprises the following steps: after the microetching, carrying out oil removal and ultrasonic cleaning, and then applying ink;
the frequency of the ultrasonic wave is 25-45KHz, and the time is 3-5 min.
3. The method of claim 1, wherein the method comprises the following steps: the browning treatment is carried out at normal temperature, and the browning treatment time is 3-5 minutes.
4. The method of claim 1, wherein the method comprises the following steps: and removing browning, namely removing browning through water washing.
5. The method of claim 1, wherein the method comprises the following steps: the PCB comprises two copper foil layers and a PP sheet between the copper foil layers.
6. The method of claim 1, wherein the method comprises the following steps: the energy of the laser is 6mj, the pulse width is 10us, and the aperture is 5 mil.
7. A method of laser assisted PCB etching as claimed in claim 1 or claim 6 wherein: the laser adopts carbon dioxide laser.
8. The method of claim 1, wherein the method comprises the following steps: the screen printing adopts green oil as printing ink, the temperature of the printing ink is controlled to be 5-10 ℃, and the humidity of the printing ink is 35-45%.
9. A method of laser assisted PCB etching as claimed in claim 1 or 8 wherein: the silk screen printing adopts a nylon silk screen, and the mesh number of the adopted silk screen is 35-40 meshes.
10. The method of claim 1, wherein the method comprises the following steps: and before the browning treatment, washing the copper foil area to be etched for 1-4 times.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210550393.8A CN114916140A (en) | 2022-05-20 | 2022-05-20 | Method for etching PCB board by laser assistance |
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| CN202210550393.8A CN114916140A (en) | 2022-05-20 | 2022-05-20 | Method for etching PCB board by laser assistance |
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