CN112654148A - Manufacturing method of printed circuit board - Google Patents
Manufacturing method of printed circuit board Download PDFInfo
- Publication number
- CN112654148A CN112654148A CN201910955402.XA CN201910955402A CN112654148A CN 112654148 A CN112654148 A CN 112654148A CN 201910955402 A CN201910955402 A CN 201910955402A CN 112654148 A CN112654148 A CN 112654148A
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- groove
- processed
- printed wiring
- wiring board
- plate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a method for manufacturing a printed circuit board, which comprises the following steps: obtaining a plate to be processed; adhering a high-temperature adhesive tape to a preset position of a plate to be processed; carrying out brown oxidation treatment on the plate to be processed; carrying out laser drilling light spot superposition ablation on a plate to be processed to manufacture a step groove, wherein the preset position comprises the groove bottom of the step groove; wherein, the processing parameters of the laser drill in the area of the ablation groove edge are different from the processing parameters of the area in the groove; by the method, the manufactured step groove of the printed circuit board is not limited by the laminated structure, the step depth and the step groove size, the precision is improved, and the product sub-board layer and the PP layer do not need to be grooved, so that the grooving process cost and the gasket purchasing cost are saved.
Description
Technical Field
The invention relates to the technical field of manufacturing of multilayer printed circuit boards, in particular to a manufacturing method of a printed circuit board with a step groove design.
Background
With the continuous development of science and technology, Printed Circuit Boards (PCB) have more and more functions to be realized, which results in more and more complex structures of the PCB, wherein the PCB with the step groove design comes along with the development of the technology.
At present, a method for processing a step groove on a printed circuit board mainly selects a gasket depth control mode for processing, a gasket glue blocking is put into an inner layer core plate groove, then a depth control milling processing mode is used for uncovering to remove the gasket on an outer layer, and finally the step groove is formed.
In the existing step groove processing mode, due to the fact that manual operation is needed for opening covers of a gasket and an outer layer and the precision influence of a controlled deep milling process, the size and the depth of a step groove which can be manufactured are limited to a certain extent, when the depth of the step groove is less than 150 mu m, conventional process processing cannot be used, and the design requirement that the bottom of the step groove leaks to the inner side of a core plate cannot be processed by the existing process.
Disclosure of Invention
The invention provides a manufacturing method of a printed circuit board, which aims to solve the problem that the size, the depth and the lamination of a step groove are limited in the prior art.
In order to solve the above technical problem, the present invention provides a method for manufacturing a printed circuit board, comprising: obtaining a plate to be processed; adhering an upper high temperature adhesive tape to a preset position of the plate to be processed; carrying out brown oxidation treatment on the plate to be processed; performing laser drilling light spot superposition ablation on the plate to be processed to manufacture a step groove, wherein the preset position comprises the groove bottom of the step groove; wherein the laser drill has different processing parameters in the area of the ablated groove edge and the processing parameters in the area of the groove edge.
The method comprises the following steps of: and sticking the high-temperature adhesive tape on the inner-layer circuit board of the plate to be processed, cutting the high-temperature adhesive tape, and removing the redundant high-temperature adhesive tape so as to retain the high-temperature adhesive tape at the preset position on the inner-layer circuit board.
Wherein, wait to process the printed wiring board and be multilayer printed wiring board, it specifically includes to right wait to process the plate and carry out the brown oxidation treatment step: and performing brown oxidation treatment on the outer layer circuit board of the printed circuit board to be processed.
Wherein, still include after the plate to be processed carries out brown ization processing: and carrying out pressing, drilling, electroplating and outer layer pattern manufacturing treatment on the plate to be processed.
Wherein, the laser bores in the regional processing parameter of ablation groove limit and the regional processing parameter difference of inslot specifically includes: the diameter and the distance between the light spots of the laser drill in the area where the groove edge is ablated are smaller than those of the area in the groove; and the light spot superposition times of the laser drill in the area of the ablated groove edge are greater than the light spot superposition times of the area in the groove.
Wherein, the range of the processing parameters specifically comprises: the range of the aperture diameter includes: 2-10 mils; the range of the aperture pitch includes: 2-10 mils; the pulse width range of the laser drill comprises: 4-6; the gun number range of the laser drill comprises: 2-6 times.
Wherein, to wait to process the plate carry out laser facula stack ablation to still include after making the step groove: and performing drilling dirt removal, sand blasting, outer layer inspection, solder resistance and surface coating treatment on the stepped groove.
Wherein, the treatment mode that the dirt that removes adopted includes: and performing swelling treatment on the step groove by using potassium permanganate liquid medicine.
In order to solve the technical problem, the invention also provides a printed circuit board, wherein the printed circuit board is prepared by the printed circuit board manufacturing method in any one of the technical schemes.
The invention has the beneficial effects that: different from the situation of the prior art, the technical scheme adopted by the invention can solve the problems of limited lamination, limited size and depth of the step groove and the like of the conventional step groove processing method, the step groove precision is improved, meanwhile, the manufacturing method of the step groove does not generate residual glue at the bottom of the groove, the subplate layer and the PP layer of the product do not need to be grooved, and the grooving process cost and the gasket purchase cost can be saved.
Drawings
FIG. 1 is a schematic flow chart of an embodiment of a method for manufacturing a printed wiring board according to the present invention;
FIG. 2 is a schematic flow chart of another embodiment of a method for manufacturing a printed wiring board according to the present invention;
fig. 3 is a schematic structural diagram of a printed wiring board manufactured by the printed wiring board manufacturing method provided by the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, fig. 1 is a schematic flow chart of an embodiment of a method for manufacturing a printed wiring board provided by the present invention, and the method for manufacturing a printed wiring board of the present embodiment includes the following steps:
s11: and obtaining the plate to be processed.
With the continuous development of science and technology, functions of printed circuit boards to be realized are more and more diversified, and the corresponding structures of the printed circuit boards are more and more complex, wherein the printed circuit boards with step groove designs are born.
In the embodiment of the invention, in order to reduce the assembly volume of the printed circuit board or assemble components which need sinking, a step groove needs to be formed in the printed circuit board so as to meet the assembly requirement.
The plate to be processed of the present invention has a need for preparing the step groove.
S12: and adhering a high-temperature adhesive tape at a preset position of the plate to be processed.
In a specific embodiment, the board to be processed is a multilayer circuit board, such as 2 layers, 4 layers, etc., and is not limited herein.
The method comprises the steps of sticking a high-temperature adhesive tape on the whole inner-layer circuit board of a plate to be processed, cutting the high-temperature adhesive tape, tearing off redundant high-temperature adhesive tape, keeping the high-temperature adhesive tape at a preset position on the inner-layer circuit board, and optionally cutting the high-temperature adhesive tape by laser.
The preset position on the inner layer circuit board is the position of the bottom of the step groove required to be formed, and the high-temperature adhesive tape is adhered to the position of the bottom of the groove in advance, so that the pollution loss of a copper layer of the bottom of the groove in the subsequent process can be avoided, the direct drilling and burning of the bottom of the groove by laser in the subsequent laser drilling and burning step can be avoided, and the bottom of the groove is kept flat.
S13: and performing brown oxidation treatment on the plate to be processed.
Performing browning treatment on a plate to be processed, performing browning liquid microetching on the surface of an outer layer circuit board to generate an extremely thin and uniform organic metal conversion film, so that the surface of copper obtains a stable micro uneven surface shape, and meanwhile, generating an organic metal conversion film by an organic additive in the browning liquid and the surface of copper, wherein the film can be effectively embedded into the surface of copper to form a brown grid-shaped conversion layer; therefore, the bonding force between the plates is increased, the plates are browned, and the absorption of the copper surface to laser is increased.
S14: carrying out laser drilling light spot superposition ablation on a plate to be processed to manufacture a step groove, wherein the preset position comprises the groove bottom of the step groove; wherein, the laser drill ablates the processing parameter of the groove edge area and the processing parameter of the groove inner area are different.
The method comprises the steps of performing laser drilling light spot superposition ablation on a plate to be processed, and performing ablation from an outer layer circuit board of the plate to be processed inwards until a required step groove shape is ablated, wherein the laser drilling light spot shape is generally circular, and when a step groove edge area is ablated, the edge part is easy to receive uneven light, so that a phenomenon that a local area is unqualified occurs, therefore, the processing parameters of the laser drilling in the ablation groove edge area are different from those of the groove area, and particularly, the light spot diameter and the light spot interval of the laser drilling in the ablation groove edge area are smaller than those of the groove area; the light spot superposition times of the laser drill in the ablation groove edge area are greater than those of the laser drill in the groove area; so as to ensure that the laser drilling energy received by the bottom of the whole step groove is consistent.
By the method, the laser drilling energy received by the whole groove body of the stepped groove can be consistent by using the mode of sintering the stepped groove by using the laser drill with different processing parameters at different parts, the flatness and the reliability of the groove body are ensured, meanwhile, the manufacturing of the stepped groove is not limited by a laminated structure, the step depth and the step groove size by adopting the laser drilling ablation mode, the step groove depth can be less than 100 micrometers, the step groove width can be less than 3 millimeters, and the product sub-plate layer and the PP layer of the method do not need to be subjected to grooving treatment, so that the grooving process cost and the gasket purchase cost are saved.
Referring to fig. 2, fig. 2 is a schematic flow chart of another embodiment of the printed wiring board manufacturing method of the present invention.
S21: and obtaining the plate to be processed.
In the embodiment of the invention, in order to reduce the assembly volume of the printed circuit board or assemble components needing sinking, a step groove is formed in the printed circuit board to meet the assembly requirement; the plate to be processed of the present invention has a need for preparing the step groove.
S22: and sticking a high-temperature adhesive tape on the inner layer circuit board of the plate to be processed, cutting the high-temperature adhesive tape, and removing the redundant high-temperature adhesive tape so as to retain the high-temperature adhesive tape at the preset position on the inner layer circuit board.
In a specific embodiment, the board to be processed is a multilayer circuit board, such as 2 layers, 4 layers, etc., and is not limited herein.
The method comprises the steps of sticking a high-temperature adhesive tape on the whole inner-layer circuit board of a plate to be processed, cutting the high-temperature adhesive tape, tearing off redundant high-temperature adhesive tape, keeping the high-temperature adhesive tape at a preset position on the inner-layer circuit board, and optionally cutting the high-temperature adhesive tape by laser.
The preset position on the inner layer circuit board is the position of the bottom of the step groove required to be formed, and the high-temperature adhesive tape is adhered to the position of the bottom of the groove in advance, so that the pollution loss of a copper layer of the bottom of the groove in the subsequent process can be avoided, the direct drilling and burning of the bottom of the groove by laser in the subsequent laser drilling and burning step can be avoided, and the bottom of the groove is kept flat.
S23: and performing brown oxidation treatment on the plate to be processed.
The method comprises the following steps of performing browning treatment on a plate to be processed, performing browning liquid microetching on the surface of an outer layer circuit board to generate an extremely thin uniform organic metal conversion film, so that the surface of copper obtains a stable micro uneven surface shape, and meanwhile, generating an organic metal conversion film by an organic additive in browning liquid and the surface of copper, wherein the film can be effectively embedded into the surface of copper to form a brown grid-shaped conversion layer; therefore, the bonding force between the plates is increased, the plates are browned, and the absorption of the copper surface to laser is increased.
S24: and carrying out pressing, drilling, electroplating and outer layer pattern manufacturing treatment on the plate to be processed.
In this embodiment, treat that the processing plate can be multilayer circuit board, treat the processing plate and carry out brown oxidation treatment after, carry out pressfitting to the plate, can melt the characteristic of solidification through the PP board under high temperature, use high temperature high pressure to carry out the pressfitting with multilayer plate, make the PP board after melting get up and fix the adhesion of multilayer plate.
And drilling, electroplating and outer-layer pattern manufacturing treatment are carried out on the pressed plate, so that circuits of circuit boards in the multilayer circuit board are communicated, the conduction function of the circuit board is realized, and various functional requirements of the multilayer circuit board are met.
S25: using CO for the plate to be processed2And the laser drilling machine carries out laser drilling facula superposition ablation to manufacture the step groove.
Performing laser drilling spot superposition ablation on a plate to be processed, performing ablation from an outer layer circuit board of the plate to be processed inwards until a required step groove is ablated,
the laser drill has the advantages that the laser drill is generally circular in light spot shape, when a groove edge area of a step groove is ablated, the edge part is prone to uneven light, and the phenomenon that a local area is unqualified is caused, so that the machining parameters of the laser drill in the groove edge ablation area are different from those of the groove area, and particularly, the light spot diameter and the light spot interval of the laser drill in the groove edge ablation area are smaller than those of the groove area in the groove area; the light spot superposition times of the laser drill in the area of the ablated groove edge are larger than the light spot superposition times of the area in the groove.
In a specific embodiment, during the laser drilling and burning of the step groove, the laser drilling energy parameters of the groove inner area are as follows: the diameter of a light spot of the laser hole is 8 mils, the distance between the light spots is 4 mils, and the light spots are overlapped to the groove edge area through single light spot overlapping ablation; when regional to the groove limit, the adjustment laser bores the energy, uses 4 mil's facula diameter, 2 mil's facula interval, overlaps twice with the facula simultaneously to guarantee that the laser that whole cell body received bores the energy unanimous, avoid the unqualified phenomenon of local area to take place, wherein, 1mil (mil) 25.39999918 mu m (micron).
At the same time, the copper is utilized to CO2Hardly absorbing character, using CO2The laser drilling machine ablates the plate so as to ablate the plate to the specified copper surface of the inner layer and form a step groove; the step groove manufactured in this embodiment may be square, circular, or irregular, and is not limited herein.
Optionally, when the laser drill performs step groove ablation, the processing parameters of the laser drill can be adjusted according to the model of the PP glass cloth and the number of the PP glass cloth, wherein the processing parameter range is as follows: the range of aperture diameters includes: 2-10 mils; the range of the aperture pitch includes: 2-10 mils; the pulse width range of the laser drill includes: 4-6; the gun number range of the laser drill comprises: 2-6 times to ensure the energy of the laser drill on the whole groove body to be consistent and ensure the flatness and reliability of the groove bottom.
S26: and performing drilling stain removal, sand blasting, outer layer inspection, solder resistance and surface coating treatment on the step groove.
The plate has gluey sediment to remain after laser beam bores the ablation, in this embodiment, uses potassium permanganate liquid medicine to go to bore dirty the processing to the plate, lets the plate carry out "swelling" through potassium permanganate liquid medicine to make the residual gluey sediment behind the laser ablation plate break away from step groove bottom copper sheet.
After the step of removing the drilling dirt on the plate, the plate is subjected to sand blasting treatment to clean dirt and oxides at the bottom of the step groove, so that subsequent components can be better attached to the step groove.
And finally, carrying out outer layer inspection, resistance welding and surface coating treatment on the board, inspecting the quality of the step groove, and finally carrying out resistance welding and surface coating to form a finished product of the printed circuit board with the step groove.
By the method, the laser drilling energy received by the whole groove body of the stepped groove can be consistent by using the mode of sintering the stepped groove by using the laser drill with different processing parameters at different parts, the flatness and the reliability of the groove body are ensured, meanwhile, the manufacturing of the stepped groove can be not limited by a laminated structure, the step depth and the step groove size by adopting the laser drilling ablation mode, the step groove precision is improved, the step groove depth can be smaller than 100 micrometers, the step groove width can be smaller than 3 millimeters, and the product sub-plate layer and the PP layer of the method do not need to be subjected to grooving treatment, so that the grooving process cost and the gasket purchase cost are saved.
Referring to fig. 3, fig. 3 is a schematic structural diagram of a printed circuit board manufactured by the method for manufacturing a printed circuit board according to the present invention.
The printed wiring board 10 includes: the printed circuit board 10 comprises a copper layer 14, an outer layer circuit board 12, an inner layer circuit board 13 and a stepped groove 11, wherein the stepped groove 11 is located inside the outer layer circuit board 12 and penetrates through the outer layer circuit board 12, the groove bottom of the stepped groove 11 is arranged on the copper layer 14 on the inner layer circuit board 13, and the copper layer 14, the outer layer circuit board 12 and the inner layer circuit board 13 are sequentially pressed to form the stepped groove.
The outer layer wiring board 12 is different from the inner layer wiring board 13 only in the position in the present embodiment, and others such as: the material and function are not limited herein.
The printed wiring board 10 is prepared by the method for manufacturing the printed wiring board according to the embodiment, wherein the width of the step groove can be smaller than 3 mm in precision, the depth of the step groove can be smaller than 100 micrometers, the step groove is not limited by the laminated structure, the depth of the step and the size of the step groove, and the product sub-board layer and the PP layer of the printed wiring board do not need to be grooved, so that the grooving process cost and the gasket purchase cost are saved.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A manufacturing method of a printed wiring board is characterized by comprising the following steps:
obtaining a plate to be processed;
adhering an upper high temperature adhesive tape to a preset position of the plate to be processed;
carrying out brown oxidation treatment on the plate to be processed;
performing laser drilling light spot superposition ablation on the plate to be processed to manufacture a step groove, wherein the preset position comprises the groove bottom of the step groove;
wherein the laser drill has different processing parameters in the area of the ablated groove edge and the processing parameters in the area of the groove edge.
2. The method for manufacturing a printed wiring board according to claim 1, wherein the printed wiring board to be processed is a multilayer printed wiring board, and the step of attaching the high-temperature adhesive tape to the predetermined position of the board to be processed comprises:
and sticking the high-temperature adhesive tape on the inner-layer circuit board of the plate to be processed, cutting the high-temperature adhesive tape, and removing the redundant high-temperature adhesive tape so as to retain the high-temperature adhesive tape at the preset position on the inner-layer circuit board.
3. The method for manufacturing the printed wiring board according to claim 1, wherein the printed wiring board to be processed is a multilayer printed wiring board, and the step of performing the browning treatment on the board to be processed specifically comprises:
and performing brown oxidation treatment on the outer layer circuit board of the printed circuit board to be processed.
4. The method for manufacturing a printed wiring board according to claim 1, further comprising, after the browning treatment of the board to be processed:
and carrying out pressing, drilling, electroplating and outer layer pattern manufacturing treatment on the plate to be processed.
5. The method for manufacturing the printed wiring board according to claim 1, wherein the specific steps of the laser drill that the machining parameters of the area at the edge of the ablated groove are different from the machining parameters of the area in the groove include:
the diameter and the distance between the light spots of the laser drill in the area where the groove edge is ablated are smaller than those of the area in the groove;
and the light spot superposition times of the laser drill in the area of the ablated groove edge are greater than the light spot superposition times of the area in the groove.
6. The method for manufacturing a printed wiring board according to claim 5, wherein the range of the processing parameters specifically includes:
the range of the aperture diameter includes: 2-10 mils;
the range of the aperture pitch includes: 2-10 mils;
the pulse width range of the laser drill comprises: 4-6;
the gun number range of the laser drill comprises: 2-6 times.
7. The method of claim 1, wherein the laser drilling spot overlay ablation is performed using CO2And the laser drilling machine carries out light spot superposition ablation.
8. The method for manufacturing the printed wiring board according to claim 1, wherein after the performing laser spot superposition ablation on the board to be processed to manufacture the step groove, the method further comprises:
and performing drilling dirt removal, sand blasting, outer layer inspection, solder resistance and surface coating treatment on the stepped groove.
9. The method for manufacturing a printed wiring board according to claim 8, wherein the desmearing process comprises:
and performing swelling treatment on the step groove by using potassium permanganate liquid medicine.
10. A printed wiring board characterized in that the step groove on the printed wiring board is prepared by the method for manufacturing a printed wiring board according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910955402.XA CN112654148B (en) | 2019-10-09 | 2019-10-09 | Manufacturing method of printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910955402.XA CN112654148B (en) | 2019-10-09 | 2019-10-09 | Manufacturing method of printed circuit board |
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| CN112654148A true CN112654148A (en) | 2021-04-13 |
| CN112654148B CN112654148B (en) | 2022-08-05 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114025484A (en) * | 2021-09-24 | 2022-02-08 | 安捷利美维电子(厦门)有限责任公司 | Method for manufacturing substrate with cross-core board layer groove |
| CN114040572A (en) * | 2021-09-24 | 2022-02-11 | 安捷利美维电子(厦门)有限责任公司 | Manufacturing method of cross-core board layer groove substrate |
| CN114916140A (en) * | 2022-05-20 | 2022-08-16 | 胜宏科技（惠州）股份有限公司 | Method for etching PCB board by laser assistance |
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| CN114916140A (en) * | 2022-05-20 | 2022-08-16 | 胜宏科技（惠州）股份有限公司 | Method for etching PCB board by laser assistance |
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| CN112654148B (en) | 2022-08-05 |
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