CN111315148A - Rework method for gold plating plate or gold plating plate lead metal infiltration short circuit - Google Patents
Rework method for gold plating plate or gold plating plate lead metal infiltration short circuit Download PDFInfo
- Publication number
- CN111315148A CN111315148A CN202010124136.9A CN202010124136A CN111315148A CN 111315148 A CN111315148 A CN 111315148A CN 202010124136 A CN202010124136 A CN 202010124136A CN 111315148 A CN111315148 A CN 111315148A
- Authority
- CN
- China
- Prior art keywords
- gold
- plated
- short circuit
- lead wire
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 77
- 239000010931 gold Substances 0.000 title claims abstract description 77
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 77
- 238000000034 method Methods 0.000 title claims abstract description 75
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 title claims description 29
- 238000007747 plating Methods 0.000 title claims description 21
- 230000008595 infiltration Effects 0.000 title claims description 10
- 238000001764 infiltration Methods 0.000 title claims description 10
- 229910000679 solder Inorganic materials 0.000 claims abstract description 38
- 238000005530 etching Methods 0.000 claims abstract description 36
- 239000002253 acid Substances 0.000 claims abstract description 31
- 238000004519 manufacturing process Methods 0.000 claims abstract description 26
- 230000035515 penetration Effects 0.000 claims abstract description 8
- 238000004140 cleaning Methods 0.000 claims abstract description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 42
- 150000004678 hydrides Chemical class 0.000 claims description 11
- 238000009792 diffusion process Methods 0.000 claims 1
- 230000008901 benefit Effects 0.000 abstract description 10
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 10
- 239000003814 drug Substances 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 238000010420 art technique Methods 0.000 description 5
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 229940046892 lead acetate Drugs 0.000 description 2
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 2
- LJRGBERXYNQPJI-UHFFFAOYSA-M sodium;3-nitrobenzenesulfonate Chemical compound [Na+].[O-][N+](=O)C1=CC=CC(S([O-])(=O)=O)=C1 LJRGBERXYNQPJI-UHFFFAOYSA-M 0.000 description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
The invention provides a rework method for gold-infiltrated short circuit of a gold-plated plate or a gold-plated plate lead, which comprises the following specific steps: printing solder resist ink on a whole plate → manufacturing an image transfer film 1 → exposing and developing → baking → stripping gold → covering an acid-resistant dry film → manufacturing an image transfer film 2 → exposing and developing → acid etching → removing the dry film → removing the solder resist ink → cleaning → inspecting. The method can effectively and cleanly remove the lead which cannot be etched by the gold penetration, so that the circuit board is not short-circuited any more, the scrapped board can be rescued into a good board again, and the economic benefit of an enterprise is effectively improved.
Description
Technical Field
The invention belongs to the field of circuit board processing methods, and particularly relates to a rework method for gold-plated board or gold-plated board lead gold-infiltrated short circuit.
Background
Gold plating and electroless gold plating have been widely used in circuit board processing. Gold plating, like other electroplating, requires energization and a rectifier. There are many processes, including cyanide-containing and non-cyanide systems. Non-cyanide systems include citric acid type, sulfite type, and the like. Non-cyanide systems are used in the PCB industry. Gold deposition (electroless gold deposition) does not require electrical current to be applied, and gold is deposited on the plate surface by chemical reaction in solution. They have the advantage and disadvantage that the gold can be made very thick, except when the electricity is on, and only for a prolonged period of time, suitable for bonding boards. The chance of abandoning the electrogilding liquid medicine is less than melting gold, but the electrogilding needs whole board to switch on, and is not suitable for making the very young fine circuit. Gold is typically very thin (less than 0.2 microns) and gold has a low purity.
However, both of these two processing techniques have a common disadvantage that the lead is easily subjected to gold infiltration during the processing, and gold is a corrosion-resistant metal, so that the lead cannot be etched away to cause short circuit. Aiming at the circuit boards with defects, how to carry out efficient reworking treatment can enable the circuit boards to meet the requirement for repeated use, and the scrapped boards are changed into good boards again, so that the enterprise benefit is improved, and the problem to be solved in the prior art is solved.
Disclosure of Invention
In view of the above, the invention provides a rework method for gold-infiltrated short circuit of a gold-plated board or a gold-plated board lead, which can effectively and cleanly remove the lead which cannot be etched away by infiltrated gold, so that a circuit board is not short-circuited any more, a scrapped board can be rescued into a good board, and the economic benefit of an enterprise is effectively improved.
The technical scheme of the invention is as follows:
a gold plating plate or gold plating plate lead wire gold infiltration short circuit reworking method is characterized by comprising the following specific steps: printing solder resist ink on a whole plate → manufacturing an image transfer film 1 → exposing and developing → baking → stripping gold → covering an acid-resistant dry film → manufacturing an image transfer film 2 → exposing and developing → acid etching → removing the dry film → removing the solder resist ink → cleaning → inspecting.
Further, the whole-board solder mask ink printing process is to print common solder mask ink.
Furthermore, the process for manufacturing the image transfer film 1 is to expose the lead wire to be etched by windowing, and expose 3-7mil more on the gold-plated area, so that the lead wire and the redundant bonding pad are completely exposed, and subsequent rework etching is facilitated.
Further, the baking process is baking for one time at the temperature of 120-170 ℃ for 20-40 min.
Furthermore, the image transfer film manufacturing process 2 is to expose only the lead wires to be etched by windowing, and expose 4-6mil more to the gold-plated area, so that the lead wires and the redundant bonding pads are completely exposed, and subsequent rework etching is facilitated.
Further, the gold stripping process is to strip the gold layer on the exposed lead completely.
Further, the gold stripping process adopts hydride liquid medicine to strip the gold layer. The hydride solution may be achieved using any of the prior art techniques, such as those comprising: the mass concentration of potassium cyanide is 2.5-10 g/L, the mass concentration of lead acetate is 75-225 mg/L, the mass concentration of sodium hydroxide is 225-675 mg/L, and the mass concentration of sodium m-nitrobenzenesulfonate is 145-165 mg/L.
Further, the acid etching process is to etch the lead clean in an acid etching solution. The acid etching solution is a hydrochloric acid system solution.
Further, the dry film removing process is to remove the dry film by using a sodium hydroxide solution.
Further, the solder resist ink removing process is to remove the solder resist ink by using a sodium hydroxide solution at the temperature of 70-90 ℃.
The method can effectively and cleanly remove the lead which cannot be etched by the gold penetration, so that the circuit board is not short-circuited any more, the scrapped board can be rescued into a good board again, and the economic benefit of an enterprise is effectively improved.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
Example 1
A gold plating plate or gold plating plate lead wire gold infiltration short circuit reworking method is characterized by comprising the following specific steps: printing solder resist ink on a whole plate → manufacturing an image transfer film 1 → exposing and developing → baking → stripping gold → covering an acid-resistant dry film → manufacturing an image transfer film 2 → exposing and developing → acid etching → removing the dry film → removing the solder resist ink → cleaning → inspecting.
Further, the whole-board solder mask ink printing process is to print common solder mask ink.
Furthermore, the process for manufacturing the image transfer film 1 is to expose the lead wire to be etched by windowing, and expose 5 mils more to the gold-plated area, so that the lead wire and the redundant bonding pad are completely exposed, and subsequent rework etching is facilitated.
Further, the baking process is to bake for 30min once at 150 ℃.
Furthermore, the image transfer film manufacturing process 2 is to expose only the lead wires to be etched by windowing, and expose 5 mils more to the gold-plated area, so that the lead wires and the redundant bonding pads are completely exposed, and subsequent rework etching is facilitated.
Further, the gold stripping process is to strip the gold layer on the exposed lead completely.
Further, the gold stripping process adopts hydride liquid medicine to strip the gold layer. The hydride solution may be achieved using any of the prior art techniques, such as those comprising: the mass concentration of potassium cyanide is 2.5-10 g/L, the mass concentration of lead acetate is 75-225 mg/L, the mass concentration of sodium hydroxide is 225-675 mg/L, and the mass concentration of sodium m-nitrobenzenesulfonate is 145-165 mg/L.
Further, the acid etching process is to etch the lead clean in an acid etching solution. The acid etching solution is a hydrochloric acid system solution.
Further, the dry film removing process is to remove the dry film by using a sodium hydroxide solution.
Further, the solder resist ink removing process is to remove the solder resist ink by using a sodium hydroxide solution at the temperature of 80 ℃.
The method can effectively and cleanly remove the lead which cannot be etched by the gold penetration, so that the circuit board is not short-circuited any more, the scrapped board can be rescued into a good board again, and the economic benefit of an enterprise is effectively improved.
Example 2
A gold plating plate or gold plating plate lead wire gold infiltration short circuit reworking method is characterized by comprising the following specific steps: printing solder resist ink on a whole plate → manufacturing an image transfer film 1 → exposing and developing → baking → stripping gold → covering an acid-resistant dry film → manufacturing an image transfer film 2 → exposing and developing → acid etching → removing the dry film → removing the solder resist ink → cleaning → inspecting.
Further, the whole-board solder mask ink printing process is to print common solder mask ink.
Furthermore, the process for manufacturing the image transfer film 1 is to expose the lead wire to be etched by windowing, and expose 3 mils more to the gold-plated area, so that the lead wire and the redundant bonding pad are completely exposed, and subsequent rework etching is facilitated.
Further, the baking process is to bake for 40min once at 120 ℃.
Furthermore, the image transfer film manufacturing process 2 is to expose only the lead wires to be etched by windowing, and expose 4 mils more to the gold-plated area, so that the lead wires and the redundant bonding pads are completely exposed, and subsequent rework etching is facilitated.
Further, the gold stripping process is to strip the gold layer on the exposed lead completely.
Further, the gold stripping process adopts hydride liquid medicine to strip the gold layer. The hydride solution may be achieved using any of the prior art techniques.
Further, the acid etching process is to etch the lead clean in an acid etching solution. The acid etching solution is a hydrochloric acid system solution.
Further, the dry film removing process is to remove the dry film by using a sodium hydroxide solution.
Further, the solder resist ink removing process is to remove the solder resist ink by using a sodium hydroxide solution at 70 ℃.
The method can effectively and cleanly remove the lead which cannot be etched by the gold penetration, so that the circuit board is not short-circuited any more, the scrapped board can be rescued into a good board again, and the economic benefit of an enterprise is effectively improved.
Example 3
A gold plating plate or gold plating plate lead wire gold infiltration short circuit reworking method is characterized by comprising the following specific steps: printing solder resist ink on a whole plate → manufacturing an image transfer film 1 → exposing and developing → baking → stripping gold → covering an acid-resistant dry film → manufacturing an image transfer film 2 → exposing and developing → acid etching → removing the dry film → removing the solder resist ink → cleaning → inspecting.
Further, the whole-board solder mask ink printing process is to print common solder mask ink.
Furthermore, the process for manufacturing the image transfer film 1 is to expose the lead wire to be etched by windowing, and expose 7 mils more to the gold-plated area, so that the lead wire and the redundant bonding pad are completely exposed, and subsequent rework etching is facilitated.
Further, the baking process is to bake for 20min once at 170 ℃.
Furthermore, the image transfer film manufacturing process 2 is to expose only the lead wires to be etched by windowing, and expose 6 mils more to the gold-plated area, so that the lead wires and the redundant bonding pads are completely exposed, and subsequent rework etching is facilitated.
Further, the gold stripping process is to strip the gold layer on the exposed lead completely.
Further, the gold stripping process adopts hydride liquid medicine to strip the gold layer. The hydride solution may be achieved using any of the prior art techniques.
Further, the acid etching process is to etch the lead clean in an acid etching solution. The acid etching solution is a hydrochloric acid system solution.
Further, the dry film removing process is to remove the dry film by using a sodium hydroxide solution.
Further, the solder resist ink removing process is to remove the solder resist ink by using a sodium hydroxide solution at 90 ℃.
The method can effectively and cleanly remove the lead which cannot be etched by the gold penetration, so that the circuit board is not short-circuited any more, the scrapped board can be rescued into a good board again, and the economic benefit of an enterprise is effectively improved.
Example 4
A gold plating plate or gold plating plate lead wire gold infiltration short circuit reworking method is characterized by comprising the following specific steps: printing solder resist ink on a whole plate → manufacturing an image transfer film 1 → exposing and developing → baking → stripping gold → covering an acid-resistant dry film → manufacturing an image transfer film 2 → exposing and developing → acid etching → removing the dry film → removing the solder resist ink → cleaning → inspecting.
Further, the whole-board solder mask ink printing process is to print common solder mask ink.
Furthermore, the process for manufacturing the image transfer film 1 is to expose the lead wire to be etched by windowing, and expose 6 mils on the gold-plated area, so that the lead wire and the redundant bonding pad are completely exposed, and subsequent rework etching is facilitated.
Further, the baking process is to bake for 35min once at 140 ℃.
Furthermore, the image transfer film manufacturing process 2 is to expose only the lead wires to be etched by windowing, and expose 5 mils more to the gold-plated area, so that the lead wires and the redundant bonding pads are completely exposed, and subsequent rework etching is facilitated.
Further, the gold stripping process is to strip the gold layer on the exposed lead completely.
Further, the gold stripping process adopts hydride liquid medicine to strip the gold layer. The hydride solution may be achieved using any of the prior art techniques.
Further, the acid etching process is to etch the lead clean in an acid etching solution. The acid etching solution is a hydrochloric acid system solution.
Further, the dry film removing process is to remove the dry film by using a sodium hydroxide solution.
Further, the solder resist ink removing process is to remove the solder resist ink by using a sodium hydroxide solution at the temperature of 85 ℃.
The method can effectively and cleanly remove the lead which cannot be etched by the gold penetration, so that the circuit board is not short-circuited any more, the scrapped board can be rescued into a good board again, and the economic benefit of an enterprise is effectively improved.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art. It should be noted that the technical features not described in detail in the present invention can be implemented by any prior art in the field.
Claims (10)
1. A gold plating plate or gold plating plate lead wire gold infiltration short circuit reworking method is characterized by comprising the following specific steps: printing solder resist ink on a whole plate → manufacturing an image transfer film 1 → exposing and developing → baking → stripping gold → covering an acid-resistant dry film → manufacturing an image transfer film 2 → exposing and developing → acid etching → removing the dry film → removing the solder resist ink → cleaning → inspecting.
2. The rework method of gold plated or plated lead wire gold penetration short circuit as recited in claim 1, wherein the whole-board printing solder resist ink process is printing of general solder resist ink.
3. The rework method of the gold-plated board or the gold-plated board lead wire gold-infiltrated short circuit according to claim 1, wherein the image transfer film 1 manufacturing process is to expose the lead wire to be etched with a window and expose 3-7mil more on the gold-plated area, so that the lead wire and the redundant bonding pad are completely exposed, thereby facilitating the subsequent rework etching.
4. The rework method of gold-infiltrated short circuit of gold-plated board or gold-plated board lead of claim 1, wherein the baking process is performed at 170 ℃ for 20-40min at 120 ℃.
5. The rework method of the gold-plated board or the gold-plated board lead wire gold-infiltrated short circuit according to claim 1, wherein the image transfer film 2 manufacturing process is to expose only the lead wire to be etched with a window and expose 4-6mil more to the gold-plated area, so that the lead wire and the redundant bonding pad are completely exposed, thereby facilitating the subsequent rework etching.
6. The rework method of the gold-plated or plated lead wire gold infiltration short circuit of claim 1, wherein the gold stripping process is to strip the gold layer on the exposed lead wire clean.
7. The rework method of the gold-plated or metallized lead metal penetration short circuit of claim 6, wherein the gold stripping process uses hydride solution for gold layer stripping.
8. The rework method of gold plating or gold plating lead diffusion short circuit of claim 1, wherein the acid etching process is to etch the lead clean in acid etching solution.
9. The rework method of gold-plated or metallized lead wire gold-infiltrated short circuit as recited in claim 1, wherein said dry film removal process is dry film removal using sodium hydroxide solution.
10. The rework method of gold-plated board or gold-plated board lead gold-infiltrated short circuit as recited in claim 1, wherein said solder resist ink removing process is to remove solder resist ink using sodium hydroxide solution at 70-90 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010124136.9A CN111315148A (en) | 2020-02-27 | 2020-02-27 | Rework method for gold plating plate or gold plating plate lead metal infiltration short circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010124136.9A CN111315148A (en) | 2020-02-27 | 2020-02-27 | Rework method for gold plating plate or gold plating plate lead metal infiltration short circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111315148A true CN111315148A (en) | 2020-06-19 |
Family
ID=71147778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010124136.9A Pending CN111315148A (en) | 2020-02-27 | 2020-02-27 | Rework method for gold plating plate or gold plating plate lead metal infiltration short circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111315148A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113905533A (en) * | 2021-08-30 | 2022-01-07 | 珠海杰赛科技有限公司 | PCB lead residue processing method and printed circuit board |
| CN114513902A (en) * | 2022-04-19 | 2022-05-17 | 惠州威尔高电子有限公司 | Etching method of gold finger lead and PCB with gold finger |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6022466A (en) * | 1998-07-20 | 2000-02-08 | Unisys Corporation | Process of plating selective areas on a printed circuit board |
| CN103037624A (en) * | 2011-10-09 | 2013-04-10 | 深圳市大族激光科技股份有限公司 | Method of eliminating electroplate lead on ceramic substrate |
| CN109913881A (en) * | 2017-12-13 | 2019-06-21 | 鹏鼎控股(深圳)股份有限公司 | It shells golden liquid and component shells golden method |
-
2020
- 2020-02-27 CN CN202010124136.9A patent/CN111315148A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6022466A (en) * | 1998-07-20 | 2000-02-08 | Unisys Corporation | Process of plating selective areas on a printed circuit board |
| CN103037624A (en) * | 2011-10-09 | 2013-04-10 | 深圳市大族激光科技股份有限公司 | Method of eliminating electroplate lead on ceramic substrate |
| CN109913881A (en) * | 2017-12-13 | 2019-06-21 | 鹏鼎控股(深圳)股份有限公司 | It shells golden liquid and component shells golden method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113905533A (en) * | 2021-08-30 | 2022-01-07 | 珠海杰赛科技有限公司 | PCB lead residue processing method and printed circuit board |
| CN114513902A (en) * | 2022-04-19 | 2022-05-17 | 惠州威尔高电子有限公司 | Etching method of gold finger lead and PCB with gold finger |
| CN114513902B (en) * | 2022-04-19 | 2022-08-05 | 惠州威尔高电子有限公司 | Etching method of gold finger lead and PCB with gold finger |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5235139A (en) | Method for fabricating printed circuits | |
| US5017271A (en) | Method for printed circuit board pattern making using selectively etchable metal layers | |
| JP4253280B2 (en) | Method for manufacturing printed wiring board | |
| US4605471A (en) | Method of manufacturing printed circuit boards | |
| TWI395531B (en) | Printed circuit board, manufacturing method thereof, and semiconductor device | |
| JP4695675B2 (en) | Method for manufacturing printed wiring board | |
| CN111315148A (en) | Rework method for gold plating plate or gold plating plate lead metal infiltration short circuit | |
| US4144118A (en) | Method of providing printed circuits | |
| CN102548231B (en) | Method for manufacturing PCB (Printed Circuit Board) | |
| CN112996267A (en) | Circuit board processing method integrating surface treatment of gold and chemical gold | |
| JP5483658B2 (en) | Wiring board manufacturing method | |
| JP2001110940A (en) | Semiconductor package substrate and manufacturing method thereof | |
| JP2009272571A (en) | Printed circuit board and method of manufacturing the same | |
| JPH06152105A (en) | Manufacture of printed wiring board | |
| JP2009295957A (en) | Method for manufacturing of printed wiring board | |
| JP2009117721A (en) | Wiring board, circuit board and method of manufacturing the same | |
| JP4658100B2 (en) | Printed wiring board and circuit device | |
| JP2006066889A (en) | Printed circuit board, manufacturing method thereof, and semiconductor device | |
| JP2000200963A (en) | Wiring board and its manufacture | |
| JP3630398B2 (en) | Manufacturing method of film carrier tape for mounting electronic components | |
| JPH06169145A (en) | Manufacture of printed wiring board | |
| JPS62230996A (en) | Method for plating aluminum substrate | |
| JP3174356B2 (en) | Printed circuit board manufacturing method | |
| JPH0575238A (en) | Circuit board and its manufacture | |
| JP2913935B2 (en) | Printed circuit board manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200619 |